CN102473663B - 用环形照射的暗场检查系统 - Google Patents
用环形照射的暗场检查系统 Download PDFInfo
- Publication number
- CN102473663B CN102473663B CN201080033782.9A CN201080033782A CN102473663B CN 102473663 B CN102473663 B CN 102473663B CN 201080033782 A CN201080033782 A CN 201080033782A CN 102473663 B CN102473663 B CN 102473663B
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- light
- inspection system
- dark field
- shaping
- field inspection
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- 238000007689 inspection Methods 0.000 title claims abstract description 55
- 238000005286 illumination Methods 0.000 title claims abstract description 41
- 238000007493 shaping process Methods 0.000 claims abstract description 48
- 238000003384 imaging method Methods 0.000 claims abstract description 45
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 6
- 238000003786 synthesis reaction Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 18
- 239000000835 fiber Substances 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 239000013307 optical fiber Substances 0.000 claims description 8
- 230000004075 alteration Effects 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- 230000001427 coherent effect Effects 0.000 claims description 3
- 238000004458 analytical method Methods 0.000 claims description 2
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- 230000000694 effects Effects 0.000 abstract description 8
- 230000003746 surface roughness Effects 0.000 abstract description 4
- 230000007547 defect Effects 0.000 description 20
- 230000010287 polarization Effects 0.000 description 15
- 238000001514 detection method Methods 0.000 description 10
- 230000035945 sensitivity Effects 0.000 description 10
- 238000012935 Averaging Methods 0.000 description 7
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- 230000005619 thermoelectricity Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22771309P | 2009-07-22 | 2009-07-22 | |
| US61/227,713 | 2009-07-22 | ||
| PCT/US2010/042354 WO2011011291A1 (en) | 2009-07-22 | 2010-07-16 | Dark field inspection system with ring illumination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102473663A CN102473663A (zh) | 2012-05-23 |
| CN102473663B true CN102473663B (zh) | 2016-11-09 |
Family
ID=43499363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080033782.9A Active CN102473663B (zh) | 2009-07-22 | 2010-07-16 | 用环形照射的暗场检查系统 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9176072B2 (enExample) |
| EP (1) | EP2457251A4 (enExample) |
| JP (2) | JP5639169B2 (enExample) |
| KR (1) | KR101803109B1 (enExample) |
| CN (1) | CN102473663B (enExample) |
| IL (1) | IL217178A (enExample) |
| TW (1) | TWI536012B (enExample) |
| WO (1) | WO2011011291A1 (enExample) |
Families Citing this family (42)
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| CA2851538A1 (en) * | 2010-10-08 | 2012-04-12 | Dark Field Technologies, Inc. | Retro-reflective imaging |
| US8885148B2 (en) | 2011-01-04 | 2014-11-11 | Asml Holding N.V. | System and method for design of linear motor for vacuum environment |
| US9267891B2 (en) * | 2011-06-06 | 2016-02-23 | The Regents Of The University Of California | Multiplex fluorescent particle detection using spatially distributed excitation |
| US8995746B2 (en) * | 2013-03-15 | 2015-03-31 | KLA—Tencor Corporation | Image synchronization of scanning wafer inspection system |
| CN103245671B (zh) * | 2013-05-09 | 2016-04-13 | 深圳先进技术研究院 | 冲压件表面缺陷检测装置及方法 |
| US9747670B2 (en) | 2013-06-26 | 2017-08-29 | Kla-Tencor Corporation | Method and system for improving wafer surface inspection sensitivity |
| US9182351B2 (en) | 2013-11-26 | 2015-11-10 | Nanometrics Incorporated | Optical metrology system for spectral imaging of a sample |
| US9846122B2 (en) | 2013-11-26 | 2017-12-19 | Nanometrics Incorporated | Optical metrology system for spectral imaging of a sample |
| KR102241978B1 (ko) | 2014-09-11 | 2021-04-19 | 삼성전자주식회사 | 피검체의 표면 검사 방법 및 이를 수행하기 위한 광학 시스템 |
| US9891177B2 (en) * | 2014-10-03 | 2018-02-13 | Kla-Tencor Corporation | TDI sensor in a darkfield system |
| US9395309B2 (en) | 2014-10-15 | 2016-07-19 | Exnodes Inc. | Multiple angle computational wafer inspection |
| CN104407453A (zh) * | 2014-12-17 | 2015-03-11 | 中国电子科技集团公司第三十八研究所 | 一种光控型可调太赫兹波衰减器及其使用方法 |
| JP6522384B2 (ja) * | 2015-03-23 | 2019-05-29 | 三菱重工業株式会社 | レーザレーダ装置及び走行体 |
| CN106066562B (zh) * | 2015-04-21 | 2020-07-10 | 康代有限公司 | 具有扩展的角覆盖范围的检查系统 |
| US10192716B2 (en) | 2015-09-21 | 2019-01-29 | Kla-Tencor Corporation | Multi-beam dark field imaging |
| JP2017198612A (ja) * | 2016-04-28 | 2017-11-02 | キヤノン株式会社 | 検査装置、検査システム、および物品製造方法 |
| US10739275B2 (en) * | 2016-09-15 | 2020-08-11 | Kla-Tencor Corporation | Simultaneous multi-directional laser wafer inspection |
| US20200011795A1 (en) | 2017-02-28 | 2020-01-09 | The Regents Of The University Of California | Optofluidic analyte detection systems using multi-mode interference waveguides |
| WO2018191491A1 (en) | 2017-04-12 | 2018-10-18 | Sense Photonics, Inc. | Emitter structures for ultra-small vertical cavity surface emitting lasers (vcsels) and arrays incorporating the same |
| US11237872B2 (en) | 2017-05-23 | 2022-02-01 | Kla-Tencor Corporation | Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries |
| WO2019063531A1 (en) | 2017-09-29 | 2019-04-04 | Asml Netherlands B.V. | METHOD AND APPARATUS FOR ADVANCED LOAD CONTROL FOR WAFER INSPECTION |
| KR101969232B1 (ko) * | 2017-10-31 | 2019-04-17 | 주식회사 이노비즈 | 측면 비전 장치 |
| CN107727668B (zh) * | 2017-11-03 | 2023-11-14 | 浙江科技学院 | 基于偏振消光的透明介质单面选择成像方法及其装置 |
| CN109973858B (zh) * | 2017-12-28 | 2022-03-08 | 中国科学院深圳先进技术研究院 | 一种用于水下暗场成像的照明器 |
| WO2019147730A1 (en) * | 2018-01-24 | 2019-08-01 | Corning Incorporated | Apparatus and methods for inspecting damage intensity |
| US20190355110A1 (en) * | 2018-05-15 | 2019-11-21 | Camtek Ltd. | Cross talk reduction |
| EP3611569A1 (en) * | 2018-08-16 | 2020-02-19 | ASML Netherlands B.V. | Metrology apparatus and photonic crystal fiber |
| US10942135B2 (en) * | 2018-11-14 | 2021-03-09 | Kla Corporation | Radial polarizer for particle detection |
| CN113490844B (zh) * | 2019-02-21 | 2024-08-16 | Fk光学研究所股份有限公司 | 异物检查装置及异物检查方法 |
| DE102019125127A1 (de) * | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabung, Bauteilinspektion |
| CN112697794A (zh) * | 2019-10-23 | 2021-04-23 | 上海微电子装备（集团）股份有限公司 | 一种掩模版检测装置、光刻设备及掩模版检测方法 |
| US11397153B2 (en) * | 2019-12-03 | 2022-07-26 | Kla Corporation | Apparatus and method for gray field imaging |
| US11733172B2 (en) | 2020-05-15 | 2023-08-22 | Kla Corporation | Apparatus and method for rotating an optical objective |
| CN112098421B (zh) * | 2020-09-15 | 2022-06-28 | 上海微电子装备（集团）股份有限公司 | 暗场检测装置 |
| CN112179909B (zh) * | 2020-10-19 | 2024-09-20 | 中国工程物理研究院激光聚变研究中心 | 微型大视场超分辨显微成像装置 |
| WO2022176208A1 (ja) | 2021-02-22 | 2022-08-25 | 株式会社 ジャパンセル | 所定光生成方法、所定光利用方法、所定光を利用したサービス提供方法、測定／イメージング方法、光学特性変換素子、光源部、計測部、測定装置、所定光利用装置およびサービス提供システム |
| KR102864165B1 (ko) | 2021-10-20 | 2025-09-24 | 주식회사 엘지에너지솔루션 | 원통형 전지 측면 검사 장치 |
| US20240104707A1 (en) * | 2022-09-23 | 2024-03-28 | Apple Inc. | Alignment-based fault detection for physical components |
| CN117589790B (zh) * | 2023-11-30 | 2024-07-23 | 魅杰光电科技(上海)有限公司 | 暗场照明装置及暗场照明的光学检测系统 |
| CN117538333A (zh) * | 2023-12-26 | 2024-02-09 | 苏州矽行半导体技术有限公司 | 镜头阵列和晶圆检测设备 |
| WO2025187232A1 (ja) * | 2024-03-04 | 2025-09-12 | パナソニックＩｐマネジメント株式会社 | レンズ、光学システム、撮像装置及び検査装置 |
| KR102874969B1 (ko) * | 2025-06-24 | 2025-10-23 | 주식회사 블루타일랩 | 워피지 검사를 위한 빔 패턴 분석 장치 및 이를 포함하는 웨이퍼 검사 장치 |
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| JP4996856B2 (ja) * | 2006-01-23 | 2012-08-08 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置およびその方法 |
| JP4908925B2 (ja) * | 2006-02-08 | 2012-04-04 | 株式会社日立ハイテクノロジーズ | ウェハ表面欠陥検査装置およびその方法 |
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| DE102009000528B4 (de) * | 2009-01-30 | 2011-04-07 | Nanophotonics Ag | Inspektionsvorrichtung und -verfahren für die optische Untersuchung von Objektoberflächen, insbesondere von Waferoberflächen |
-
2010
- 2010-07-16 CN CN201080033782.9A patent/CN102473663B/zh active Active
- 2010-07-16 JP JP2012521696A patent/JP5639169B2/ja active Active
- 2010-07-16 EP EP10802700.4A patent/EP2457251A4/en not_active Withdrawn
- 2010-07-16 WO PCT/US2010/042354 patent/WO2011011291A1/en not_active Ceased
- 2010-07-16 KR KR1020127004139A patent/KR101803109B1/ko active Active
- 2010-07-16 US US12/919,760 patent/US9176072B2/en active Active
- 2010-07-22 TW TW099124187A patent/TWI536012B/zh active
-
2011
- 2011-12-25 IL IL217178A patent/IL217178A/en active IP Right Grant
-
2014
- 2014-07-07 JP JP2014140065A patent/JP6072733B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6072733B2 (ja) | 2017-02-01 |
| EP2457251A4 (en) | 2017-11-08 |
| EP2457251A1 (en) | 2012-05-30 |
| US20110169944A1 (en) | 2011-07-14 |
| JP2014222239A (ja) | 2014-11-27 |
| CN102473663A (zh) | 2012-05-23 |
| KR101803109B1 (ko) | 2017-11-29 |
| JP5639169B2 (ja) | 2014-12-10 |
| US9176072B2 (en) | 2015-11-03 |
| IL217178A (en) | 2017-04-30 |
| WO2011011291A1 (en) | 2011-01-27 |
| IL217178A0 (en) | 2012-02-29 |
| KR20120052994A (ko) | 2012-05-24 |
| TW201132960A (en) | 2011-10-01 |
| JP2012533756A (ja) | 2012-12-27 |
| TWI536012B (zh) | 2016-06-01 |
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