KR101803109B1 - 링 조명을 갖는 다크 필드 검사 시스템 - Google Patents

링 조명을 갖는 다크 필드 검사 시스템 Download PDF

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Publication number
KR101803109B1
KR101803109B1 KR1020127004139A KR20127004139A KR101803109B1 KR 101803109 B1 KR101803109 B1 KR 101803109B1 KR 1020127004139 A KR1020127004139 A KR 1020127004139A KR 20127004139 A KR20127004139 A KR 20127004139A KR 101803109 B1 KR101803109 B1 KR 101803109B1
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inspection system
dark field
beam forming
wafer
light
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KR20120052994A (ko
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규오헹 자오
메디 베즈이라바니
스콧 영
크리스 바스카
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케이엘에이-텐코 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection

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  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020127004139A 2009-07-22 2010-07-16 링 조명을 갖는 다크 필드 검사 시스템 Active KR101803109B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22771309P 2009-07-22 2009-07-22
US61/227,713 2009-07-22
PCT/US2010/042354 WO2011011291A1 (en) 2009-07-22 2010-07-16 Dark field inspection system with ring illumination

Publications (2)

Publication Number Publication Date
KR20120052994A KR20120052994A (ko) 2012-05-24
KR101803109B1 true KR101803109B1 (ko) 2017-11-29

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KR1020127004139A Active KR101803109B1 (ko) 2009-07-22 2010-07-16 링 조명을 갖는 다크 필드 검사 시스템

Country Status (8)

Country Link
US (1) US9176072B2 (enExample)
EP (1) EP2457251A4 (enExample)
JP (2) JP5639169B2 (enExample)
KR (1) KR101803109B1 (enExample)
CN (1) CN102473663B (enExample)
IL (1) IL217178A (enExample)
TW (1) TWI536012B (enExample)
WO (1) WO2011011291A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12422379B2 (en) 2021-10-20 2025-09-23 Lg Energy Solution, Ltd. Side surface inspection device of cylindrical battery

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013539052A (ja) * 2010-10-08 2013-10-17 ダーク フィールド テクノロジーズ、インコーポレーテッド レトロ反射型撮像
US8885148B2 (en) 2011-01-04 2014-11-11 Asml Holding N.V. System and method for design of linear motor for vacuum environment
US9267891B2 (en) * 2011-06-06 2016-02-23 The Regents Of The University Of California Multiplex fluorescent particle detection using spatially distributed excitation
US8995746B2 (en) * 2013-03-15 2015-03-31 KLA—Tencor Corporation Image synchronization of scanning wafer inspection system
CN103245671B (zh) * 2013-05-09 2016-04-13 深圳先进技术研究院 冲压件表面缺陷检测装置及方法
US9747670B2 (en) 2013-06-26 2017-08-29 Kla-Tencor Corporation Method and system for improving wafer surface inspection sensitivity
US9182351B2 (en) 2013-11-26 2015-11-10 Nanometrics Incorporated Optical metrology system for spectral imaging of a sample
US9846122B2 (en) 2013-11-26 2017-12-19 Nanometrics Incorporated Optical metrology system for spectral imaging of a sample
KR102241978B1 (ko) 2014-09-11 2021-04-19 삼성전자주식회사 피검체의 표면 검사 방법 및 이를 수행하기 위한 광학 시스템
US9891177B2 (en) * 2014-10-03 2018-02-13 Kla-Tencor Corporation TDI sensor in a darkfield system
US9395309B2 (en) 2014-10-15 2016-07-19 Exnodes Inc. Multiple angle computational wafer inspection
CN104407453A (zh) * 2014-12-17 2015-03-11 中国电子科技集团公司第三十八研究所 一种光控型可调太赫兹波衰减器及其使用方法
JP6522384B2 (ja) * 2015-03-23 2019-05-29 三菱重工業株式会社 レーザレーダ装置及び走行体
CN106066562B (zh) * 2015-04-21 2020-07-10 康代有限公司 具有扩展的角覆盖范围的检查系统
US10192716B2 (en) * 2015-09-21 2019-01-29 Kla-Tencor Corporation Multi-beam dark field imaging
JP2017198612A (ja) * 2016-04-28 2017-11-02 キヤノン株式会社 検査装置、検査システム、および物品製造方法
US10739275B2 (en) * 2016-09-15 2020-08-11 Kla-Tencor Corporation Simultaneous multi-directional laser wafer inspection
JP7343875B2 (ja) 2017-02-28 2023-09-13 ザ リージェンツ オブ ザ ユニヴァーシティ オブ カリフォルニア マルチモード干渉導波路を用いるオプトフルイディックアナライト検出システム
CN110710072B (zh) * 2017-04-12 2022-07-22 感应光子公司 具有结合光束转向的超小型垂直腔表面发射激光发射器的器件
US11237872B2 (en) 2017-05-23 2022-02-01 Kla-Tencor Corporation Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries
KR102459880B1 (ko) 2017-09-29 2022-10-27 에이에스엠엘 네델란즈 비.브이. 웨이퍼 검사를 위한 고급 전하 컨트롤러에 대한 방법 및 장치
KR101969232B1 (ko) * 2017-10-31 2019-04-17 주식회사 이노비즈 측면 비전 장치
CN107727668B (zh) * 2017-11-03 2023-11-14 浙江科技学院 基于偏振消光的透明介质单面选择成像方法及其装置
CN109973858B (zh) * 2017-12-28 2022-03-08 中国科学院深圳先进技术研究院 一种用于水下暗场成像的照明器
WO2019147730A1 (en) * 2018-01-24 2019-08-01 Corning Incorporated Apparatus and methods for inspecting damage intensity
US20190355110A1 (en) * 2018-05-15 2019-11-21 Camtek Ltd. Cross talk reduction
EP3611569A1 (en) * 2018-08-16 2020-02-19 ASML Netherlands B.V. Metrology apparatus and photonic crystal fiber
US10942135B2 (en) * 2018-11-14 2021-03-09 Kla Corporation Radial polarizer for particle detection
JP7125576B2 (ja) * 2019-02-21 2022-08-25 株式会社 エフケー光学研究所 異物検査装置及び異物検査方法
DE102019125127A1 (de) * 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Bauteilhandhabung, Bauteilinspektion
CN112697794A (zh) * 2019-10-23 2021-04-23 上海微电子装备（集团）股份有限公司 一种掩模版检测装置、光刻设备及掩模版检测方法
US11397153B2 (en) * 2019-12-03 2022-07-26 Kla Corporation Apparatus and method for gray field imaging
US11733172B2 (en) 2020-05-15 2023-08-22 Kla Corporation Apparatus and method for rotating an optical objective
CN112098421B (zh) * 2020-09-15 2022-06-28 上海微电子装备（集团）股份有限公司 暗场检测装置
CN112179909B (zh) * 2020-10-19 2024-09-20 中国工程物理研究院激光聚变研究中心 微型大视场超分辨显微成像装置
WO2022176208A1 (ja) 2021-02-22 2022-08-25 株式会社 ジャパンセル 所定光生成方法、所定光利用方法、所定光を利用したサービス提供方法、測定／イメージング方法、光学特性変換素子、光源部、計測部、測定装置、所定光利用装置およびサービス提供システム
US20240104777A1 (en) * 2022-09-23 2024-03-28 Apple Inc. Camera-alignment-based fault detection for physical components
CN117589790B (zh) * 2023-11-30 2024-07-23 魅杰光电科技(上海)有限公司 暗场照明装置及暗场照明的光学检测系统
CN117538333A (zh) * 2023-12-26 2024-02-09 苏州矽行半导体技术有限公司 镜头阵列和晶圆检测设备
WO2025187232A1 (ja) * 2024-03-04 2025-09-12 パナソニックＩｐマネジメント株式会社 レンズ、光学システム、撮像装置及び検査装置
KR102874969B1 (ko) * 2025-06-24 2025-10-23 주식회사 블루타일랩 워피지 검사를 위한 빔 패턴 분석 장치 및 이를 포함하는 웨이퍼 검사 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005517906A (ja) * 2002-02-11 2005-06-16 ケーエルエー−テンカー テクノロジィース コーポレイション 表面の異常および／または形状を検出するためのシステム
JP2005214978A (ja) * 2004-01-30 2005-08-11 Leica Microsystems Semiconductor Gmbh ウェーハを検査するための装置及び方法
JP2007192759A (ja) * 2006-01-23 2007-08-02 Hitachi High-Technologies Corp 欠陥検査装置およびその方法
JP2007240512A (ja) * 2006-02-08 2007-09-20 Hitachi High-Technologies Corp ウェハ表面欠陥検査装置およびその方法
JP2008046075A (ja) * 2006-08-21 2008-02-28 Omron Corp 光学系、薄膜評価装置および薄膜評価方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5630630A (en) * 1979-08-23 1981-03-27 Hitachi Ltd Foreign matter detector
US4740079A (en) 1984-10-29 1988-04-26 Hitachi, Ltd. Method of and apparatus for detecting foreign substances
JPS61104243A (ja) 1984-10-29 1986-05-22 Hitachi Ltd 異物検出方法及びその装置
JPH02175090A (ja) * 1988-12-27 1990-07-06 Isamu Miyamoto レーザビーム成形装置
JPH0432067A (ja) 1990-05-28 1992-02-04 Mitsubishi Electric Corp 磁気記録再生装置
JPH0432067U (enExample) * 1990-07-12 1992-03-16
JPH0682376A (ja) * 1992-09-03 1994-03-22 Toshiba Corp 表面検査装置
JP3593375B2 (ja) * 1995-02-07 2004-11-24 株式会社日立製作所 微小欠陥検出方法及びその装置
WO1996039619A1 (en) * 1995-06-06 1996-12-12 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen
US6064517A (en) * 1996-07-22 2000-05-16 Kla-Tencor Corporation High NA system for multiple mode imaging
US5717518A (en) 1996-07-22 1998-02-10 Kla Instruments Corporation Broad spectrum ultraviolet catadioptric imaging system
US5953130A (en) * 1997-01-06 1999-09-14 Cognex Corporation Machine vision methods and apparatus for machine vision illumination of an object
US6366690B1 (en) * 1998-07-07 2002-04-02 Applied Materials, Inc. Pixel based machine for patterned wafers
US7136159B2 (en) 2000-09-12 2006-11-14 Kla-Tencor Technologies Corporation Excimer laser inspection system
US6538730B2 (en) * 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
AU2002343339A1 (en) * 2001-09-05 2003-03-18 Genicon Sciences Corporation Apparatus for reading signals generated from resonance light scattered particle labels
US6532064B1 (en) * 2001-10-16 2003-03-11 Baader-Canpolar Inc. Automatic inspection apparatus and method for simultaneous detection of anomalies in a 3-dimensional translucent object
US7046353B2 (en) 2001-12-04 2006-05-16 Kabushiki Kaisha Topcon Surface inspection system
US7106432B1 (en) * 2002-09-27 2006-09-12 Kla-Tencor Technologies Corporation Surface inspection system and method for using photo detector array to detect defects in inspection surface
WO2004031754A1 (en) 2002-09-30 2004-04-15 Applied Materials Israel, Ltd. Dark field inspection system
US20040156539A1 (en) * 2003-02-10 2004-08-12 Asm Assembly Automation Ltd Inspecting an array of electronic components
US7227984B2 (en) 2003-03-03 2007-06-05 Kla-Tencor Technologies Corporation Method and apparatus for identifying defects in a substrate surface by using dithering to reconstruct under-sampled images
US7365834B2 (en) * 2003-06-24 2008-04-29 Kla-Tencor Technologies Corporation Optical system for detecting anomalies and/or features of surfaces
US7433031B2 (en) 2003-10-29 2008-10-07 Core Tech Optical, Inc. Defect review system with 2D scanning and a ring detector
US7319229B2 (en) 2003-12-29 2008-01-15 Kla-Tencor Technologies Corporation Illumination apparatus and methods
JP4751617B2 (ja) 2005-01-21 2011-08-17 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
KR100663365B1 (ko) * 2005-07-18 2007-01-02 삼성전자주식회사 내부에 적어도 한 쌍의 빔 경로들을 갖는 렌즈 유니트를구비하는 광학적 검사장비들 및 이를 사용하여 기판의 표면결함들을 검출하는 방법들
JP4988224B2 (ja) * 2006-03-01 2012-08-01 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
JP2008002932A (ja) * 2006-06-22 2008-01-10 Tokyo Seimitsu Co Ltd 試料撮像装置及び試料の照明方法
US20080297786A1 (en) * 2007-05-31 2008-12-04 Hitachi High-Technologies Corporation Inspecting device and inspecting method
US7986412B2 (en) * 2008-06-03 2011-07-26 Jzw Llc Interferometric defect detection and classification
DE102009000528B4 (de) * 2009-01-30 2011-04-07 Nanophotonics Ag Inspektionsvorrichtung und -verfahren für die optische Untersuchung von Objektoberflächen, insbesondere von Waferoberflächen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005517906A (ja) * 2002-02-11 2005-06-16 ケーエルエー−テンカー テクノロジィース コーポレイション 表面の異常および／または形状を検出するためのシステム
JP2005214978A (ja) * 2004-01-30 2005-08-11 Leica Microsystems Semiconductor Gmbh ウェーハを検査するための装置及び方法
JP2007192759A (ja) * 2006-01-23 2007-08-02 Hitachi High-Technologies Corp 欠陥検査装置およびその方法
JP2007240512A (ja) * 2006-02-08 2007-09-20 Hitachi High-Technologies Corp ウェハ表面欠陥検査装置およびその方法
JP2008046075A (ja) * 2006-08-21 2008-02-28 Omron Corp 光学系、薄膜評価装置および薄膜評価方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12422379B2 (en) 2021-10-20 2025-09-23 Lg Energy Solution, Ltd. Side surface inspection device of cylindrical battery

Also Published As

Publication number Publication date
KR20120052994A (ko) 2012-05-24
EP2457251A4 (en) 2017-11-08
JP6072733B2 (ja) 2017-02-01
CN102473663B (zh) 2016-11-09
IL217178A (en) 2017-04-30
WO2011011291A1 (en) 2011-01-27
US20110169944A1 (en) 2011-07-14
JP2012533756A (ja) 2012-12-27
CN102473663A (zh) 2012-05-23
TWI536012B (zh) 2016-06-01
JP2014222239A (ja) 2014-11-27
EP2457251A1 (en) 2012-05-30
US9176072B2 (en) 2015-11-03
TW201132960A (en) 2011-10-01
JP5639169B2 (ja) 2014-12-10
IL217178A0 (en) 2012-02-29

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