CN102440084A - 喷射式焊剂涂敷器 - Google Patents

喷射式焊剂涂敷器 Download PDF

Info

Publication number
CN102440084A
CN102440084A CN201080021314XA CN201080021314A CN102440084A CN 102440084 A CN102440084 A CN 102440084A CN 201080021314X A CN201080021314X A CN 201080021314XA CN 201080021314 A CN201080021314 A CN 201080021314A CN 102440084 A CN102440084 A CN 102440084A
Authority
CN
China
Prior art keywords
nozzle
mentioned
solder flux
pcb
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201080021314XA
Other languages
English (en)
Chinese (zh)
Inventor
大清水和宪
高口彰
桥本昇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of CN102440084A publication Critical patent/CN102440084A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1366—Spraying coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Spray Control Apparatus (AREA)
CN201080021314XA 2009-05-14 2010-05-14 喷射式焊剂涂敷器 Pending CN102440084A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-117668 2009-05-14
JP2009117668 2009-05-14
PCT/JP2010/058230 WO2010131751A1 (ja) 2009-05-14 2010-05-14 スプレーフラクサ装置

Publications (1)

Publication Number Publication Date
CN102440084A true CN102440084A (zh) 2012-05-02

Family

ID=43085123

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080021314XA Pending CN102440084A (zh) 2009-05-14 2010-05-14 喷射式焊剂涂敷器

Country Status (3)

Country Link
JP (1) JPWO2010131751A1 (ja)
CN (1) CN102440084A (ja)
WO (1) WO2010131751A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111495684A (zh) * 2014-07-09 2020-08-07 诺信公司 双涂覆器流体分配方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165026A (ja) * 1998-12-01 2000-06-16 Tohoku Koki:Kk フラックス塗布方法、及びこれに用いる装置
CN1530198A (zh) * 2003-03-11 2004-09-22 中华映管股份有限公司 半田设备助焊剂涂布机构与方法
JP2006218337A (ja) * 2005-02-08 2006-08-24 Honda Motor Co Ltd 塗布方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2538702B2 (ja) * 1990-06-28 1996-10-02 日本電気株式会社 噴霧式フラックス塗布装置
JP3069484U (ja) * 1999-12-07 2000-06-23 株式会社弘輝 フラックス塗布装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165026A (ja) * 1998-12-01 2000-06-16 Tohoku Koki:Kk フラックス塗布方法、及びこれに用いる装置
CN1530198A (zh) * 2003-03-11 2004-09-22 中华映管股份有限公司 半田设备助焊剂涂布机构与方法
JP2006218337A (ja) * 2005-02-08 2006-08-24 Honda Motor Co Ltd 塗布方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111495684A (zh) * 2014-07-09 2020-08-07 诺信公司 双涂覆器流体分配方法
US11919020B2 (en) 2014-07-09 2024-03-05 Nordson Corporation Dual applicator fluid dispensing methods and systems

Also Published As

Publication number Publication date
JPWO2010131751A1 (ja) 2012-11-08
WO2010131751A1 (ja) 2010-11-18

Similar Documents

Publication Publication Date Title
EP0652068B1 (en) Improvements in and relating to applying solder flux to a printed circuit board
TWI395628B (zh) 選擇性焊接裝置及方法
JP5326565B2 (ja) フラックス塗布装置及び方法
KR101576138B1 (ko) 유도가열 솔더링 장치
JPWO2010110341A1 (ja) 部分噴流はんだ付け装置及び部分噴流はんだ付け方法
TWM454066U (zh) 自動焊接設備
US20080156851A1 (en) Flux spray atomization and splash control
CN102440084A (zh) 喷射式焊剂涂敷器
US5613633A (en) Solder apparatus and method
JP6687874B2 (ja) 流体吐出装置および流体吐出方法
KR20010029749A (ko) 땜납분류장치 및 납땜방법
JP5535122B2 (ja) フラックス塗布方法、実装基板の製造方法およびフラックス塗布装置
CN101600305B (zh) 一种波峰焊锡机及其波峰喷嘴、锡炉
JPH10314640A (ja) 接着剤の塗布方法および装置
CN101698259A (zh) 一种焊锡喷锡装置
JP2002100857A (ja) フラックス塗布方法、フローはんだ付け方法およびこれらのための装置ならびに電子回路基板
KR20120081662A (ko) 개선된 스프레이 방식의 패턴 형성 장치 및 방법
KR100795385B1 (ko) 리플로우로로부터 발생하는 배기 가스의 냉각 및 청정처리의 부설 장치
KR101414421B1 (ko) 기판의 표면 처리 장치 및 방법
GB2063414A (en) Cleaning of Printed Circuit Boards
JP2001044613A (ja) はんだ噴流装置およびはんだ付け方法
JPH06296074A (ja) 噴流式はんだ付け装置
KR200315473Y1 (ko) 솔더링 머신의 솔더포트 1차분사노즐 구조
KR101681829B1 (ko) 마스크 세척 장치
JP2002368404A (ja) プリント基板の部分はんだ付け方法および部分噴流はんだ槽

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120502