CN102405302B - 特征在于锥形沉积室中密度优化的hula衬底支架的剥离沉积系统 - Google Patents

特征在于锥形沉积室中密度优化的hula衬底支架的剥离沉积系统 Download PDF

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Publication number
CN102405302B
CN102405302B CN201080016830.3A CN201080016830A CN102405302B CN 102405302 B CN102405302 B CN 102405302B CN 201080016830 A CN201080016830 A CN 201080016830A CN 102405302 B CN102405302 B CN 102405302B
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dome shape
dome
axle
evaporation source
shape part
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CN201080016830.3A
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Chinese (zh)
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CN102405302A (zh
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P·常
G·华莱士
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Magnetic Fluid Technology (usa) Corp
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Magnetic Fluid Technology (usa) Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201080016830.3A 2009-04-28 2010-04-22 特征在于锥形沉积室中密度优化的hula衬底支架的剥离沉积系统 Active CN102405302B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21480009P 2009-04-28 2009-04-28
US61/214,800 2009-04-28
US21609309P 2009-05-13 2009-05-13
US61/216,093 2009-05-13
PCT/US2010/031986 WO2010129180A2 (en) 2009-04-28 2010-04-22 Lift-off deposition system featuring a density optimized hula substrate holder in a conical dep0sition chamber

Publications (2)

Publication Number Publication Date
CN102405302A CN102405302A (zh) 2012-04-04
CN102405302B true CN102405302B (zh) 2016-09-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080016830.3A Active CN102405302B (zh) 2009-04-28 2010-04-22 特征在于锥形沉积室中密度优化的hula衬底支架的剥离沉积系统

Country Status (11)

Country Link
US (1) US8926755B2 (enExample)
EP (1) EP2425033B1 (enExample)
JP (1) JP5774579B2 (enExample)
KR (1) KR101235539B1 (enExample)
CN (1) CN102405302B (enExample)
CA (1) CA2757872C (enExample)
MY (1) MY160386A (enExample)
RU (1) RU2538064C2 (enExample)
SG (1) SG175247A1 (enExample)
TW (1) TWI503432B (enExample)
WO (1) WO2010129180A2 (enExample)

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USD664172S1 (en) * 2009-11-16 2012-07-24 Applied Materials, Inc. Dome assembly for a deposition chamber
US8647437B2 (en) * 2010-05-31 2014-02-11 Ci Systems (Israel) Ltd. Apparatus, tool and methods for depositing annular or circular wedge coatings
US9920418B1 (en) * 2010-09-27 2018-03-20 James Stabile Physical vapor deposition apparatus having a tapered chamber
TW201215694A (en) * 2010-10-11 2012-04-16 Hon Hai Prec Ind Co Ltd Correction plate for coating and coating device using same
KR20120096788A (ko) * 2011-02-23 2012-08-31 삼성전자주식회사 외관 기구물의 표면 코팅 방법 및 표면 코팅 장치
CN103014617B (zh) * 2011-09-22 2014-05-14 株式会社新柯隆 薄膜形成装置
US9281231B2 (en) 2011-10-12 2016-03-08 Ferrotec (Usa) Corporation Non-contact magnetic drive assembly with mechanical stop elements
US9373534B2 (en) 2012-09-05 2016-06-21 Industrial Technology Research Institute Rotary positioning apparatus with dome carrier, automatic pick-and-place system, and operating method thereof
US9082801B2 (en) * 2012-09-05 2015-07-14 Industrial Technology Research Institute Rotatable locating apparatus with dome carrier and operating method thereof
CN104532194B (zh) * 2014-12-29 2017-05-10 深圳大学 激光沉积薄膜制备装置
JP6019310B1 (ja) * 2015-04-16 2016-11-02 ナルックス株式会社 蒸着装置及び蒸着装置による成膜工程を含む製造方法
FR3058424B1 (fr) * 2016-11-10 2022-06-10 Bnl Eurolens Installation de depot par evaporation d'un revetement sur des articles
EP3366805B1 (en) * 2017-02-24 2022-01-12 Satisloh AG Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses, and heating device for it
WO2019105671A1 (en) * 2017-11-30 2019-06-06 Evatec Ag Evaporation chamber and system
US10109517B1 (en) * 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
CN110760809B (zh) * 2019-11-13 2020-07-28 北京航空航天大学 一种用于电子束物理气相沉积制备热障涂层的夹持装置
CN116364614A (zh) * 2021-12-27 2023-06-30 南昌中微半导体设备有限公司 一种晶圆传输装置、气相沉积系统及使用方法
TWI876706B (zh) * 2023-11-27 2025-03-11 江蘇智芯達科技有限公司 半導體封裝的電磁波遮罩膜蒸鍍裝置

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US4547279A (en) * 1982-10-22 1985-10-15 Hitachi, Ltd. Sputtering apparatus
CN2716283Y (zh) * 2004-07-21 2005-08-10 范维海 高效式真空镀膜旋转支架
US20080216741A1 (en) * 2001-10-26 2008-09-11 Hermosa Thin Film Co., Ltd. Dynamic film thickness control system/method and its utilization

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US20080216741A1 (en) * 2001-10-26 2008-09-11 Hermosa Thin Film Co., Ltd. Dynamic film thickness control system/method and its utilization
CN2716283Y (zh) * 2004-07-21 2005-08-10 范维海 高效式真空镀膜旋转支架

Also Published As

Publication number Publication date
CA2757872C (en) 2019-03-26
US20100272893A1 (en) 2010-10-28
RU2538064C2 (ru) 2015-01-10
EP2425033A2 (en) 2012-03-07
JP5774579B2 (ja) 2015-09-09
US8926755B2 (en) 2015-01-06
WO2010129180A2 (en) 2010-11-11
MY160386A (en) 2017-03-15
WO2010129180A3 (en) 2011-03-31
RU2011138995A (ru) 2013-06-10
KR20110039373A (ko) 2011-04-15
KR101235539B1 (ko) 2013-02-21
JP2012525503A (ja) 2012-10-22
TWI503432B (zh) 2015-10-11
TW201103996A (en) 2011-02-01
EP2425033A4 (en) 2013-03-20
CA2757872A1 (en) 2010-11-11
EP2425033B1 (en) 2014-09-24
CN102405302A (zh) 2012-04-04
SG175247A1 (en) 2011-11-28

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