KR101235539B1 - 기상 증착 장치, 리프트오프 증착 장치 및 그 방법 - Google Patents

기상 증착 장치, 리프트오프 증착 장치 및 그 방법 Download PDF

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KR101235539B1
KR101235539B1 KR1020117004961A KR20117004961A KR101235539B1 KR 101235539 B1 KR101235539 B1 KR 101235539B1 KR 1020117004961 A KR1020117004961 A KR 1020117004961A KR 20117004961 A KR20117004961 A KR 20117004961A KR 101235539 B1 KR101235539 B1 KR 101235539B1
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South Korea
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dome shaped
shaped member
axis
wafer
central
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KR20110039373A (ko
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핑 창
그레그 월러스
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페로텍 (유에스에이) 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020117004961A 2009-04-28 2010-04-22 기상 증착 장치, 리프트오프 증착 장치 및 그 방법 Active KR101235539B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21480009P 2009-04-28 2009-04-28
US61/214,800 2009-04-28
US21609309P 2009-05-13 2009-05-13
US61/216,093 2009-05-13
PCT/US2010/031986 WO2010129180A2 (en) 2009-04-28 2010-04-22 Lift-off deposition system featuring a density optimized hula substrate holder in a conical dep0sition chamber

Publications (2)

Publication Number Publication Date
KR20110039373A KR20110039373A (ko) 2011-04-15
KR101235539B1 true KR101235539B1 (ko) 2013-02-21

Family

ID=42992382

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KR1020117004961A Active KR101235539B1 (ko) 2009-04-28 2010-04-22 기상 증착 장치, 리프트오프 증착 장치 및 그 방법

Country Status (11)

Country Link
US (1) US8926755B2 (enExample)
EP (1) EP2425033B1 (enExample)
JP (1) JP5774579B2 (enExample)
KR (1) KR101235539B1 (enExample)
CN (1) CN102405302B (enExample)
CA (1) CA2757872C (enExample)
MY (1) MY160386A (enExample)
RU (1) RU2538064C2 (enExample)
SG (1) SG175247A1 (enExample)
TW (1) TWI503432B (enExample)
WO (1) WO2010129180A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD664172S1 (en) * 2009-11-16 2012-07-24 Applied Materials, Inc. Dome assembly for a deposition chamber
US8647437B2 (en) * 2010-05-31 2014-02-11 Ci Systems (Israel) Ltd. Apparatus, tool and methods for depositing annular or circular wedge coatings
US9920418B1 (en) * 2010-09-27 2018-03-20 James Stabile Physical vapor deposition apparatus having a tapered chamber
TW201215694A (en) * 2010-10-11 2012-04-16 Hon Hai Prec Ind Co Ltd Correction plate for coating and coating device using same
KR20120096788A (ko) * 2011-02-23 2012-08-31 삼성전자주식회사 외관 기구물의 표면 코팅 방법 및 표면 코팅 장치
CN103014617B (zh) * 2011-09-22 2014-05-14 株式会社新柯隆 薄膜形成装置
US9281231B2 (en) 2011-10-12 2016-03-08 Ferrotec (Usa) Corporation Non-contact magnetic drive assembly with mechanical stop elements
US9373534B2 (en) 2012-09-05 2016-06-21 Industrial Technology Research Institute Rotary positioning apparatus with dome carrier, automatic pick-and-place system, and operating method thereof
US9082801B2 (en) * 2012-09-05 2015-07-14 Industrial Technology Research Institute Rotatable locating apparatus with dome carrier and operating method thereof
CN104532194B (zh) * 2014-12-29 2017-05-10 深圳大学 激光沉积薄膜制备装置
JP6019310B1 (ja) * 2015-04-16 2016-11-02 ナルックス株式会社 蒸着装置及び蒸着装置による成膜工程を含む製造方法
FR3058424B1 (fr) * 2016-11-10 2022-06-10 Bnl Eurolens Installation de depot par evaporation d'un revetement sur des articles
EP3366805B1 (en) * 2017-02-24 2022-01-12 Satisloh AG Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses, and heating device for it
WO2019105671A1 (en) * 2017-11-30 2019-06-06 Evatec Ag Evaporation chamber and system
US10109517B1 (en) * 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
CN110760809B (zh) * 2019-11-13 2020-07-28 北京航空航天大学 一种用于电子束物理气相沉积制备热障涂层的夹持装置
CN116364614A (zh) * 2021-12-27 2023-06-30 南昌中微半导体设备有限公司 一种晶圆传输装置、气相沉积系统及使用方法
TWI876706B (zh) * 2023-11-27 2025-03-11 江蘇智芯達科技有限公司 半導體封裝的電磁波遮罩膜蒸鍍裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217132A (ja) * 2001-01-23 2002-08-02 Sony Corp 真空蒸着装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3128205A (en) * 1961-09-11 1964-04-07 Optical Coating Laboratory Inc Apparatus for vacuum coating
US3643625A (en) 1969-10-07 1972-02-22 Carl Herrmann Associates Inc Thin-film deposition apparatus
US3858547A (en) 1973-12-14 1975-01-07 Nils H Bergfelt Coating machine having an adjustable rotation system
JPS5812268U (ja) * 1981-07-15 1983-01-26 日本電気ホームエレクトロニクス株式会社 蒸着装置
JPS58128724A (ja) 1982-01-27 1983-08-01 Hitachi Ltd ウエハ反転装置
JPS5976875A (ja) * 1982-10-22 1984-05-02 Hitachi Ltd マグネトロン型スパッタ装置とそれに用いるターゲット
JPS63149369A (ja) 1986-12-10 1988-06-22 Sumitomo Electric Ind Ltd 蒸着方法
DE4025659A1 (de) * 1990-08-14 1992-02-20 Leybold Ag Umlaufraedergetriebe mit einem raedersatz, insbesondere fuer vorrichtungen zum beschichten von substraten
JPH07122132B2 (ja) * 1990-11-01 1995-12-25 松下電器産業株式会社 薄膜形成方法および薄膜形成装置
RU2165999C2 (ru) * 1991-01-30 2001-04-27 Научно-исследовательский институт молекулярной электроники Способ формирования защитных покрытий графитовых подложкодержателей и устройство для его осуществления
JPH04318932A (ja) 1991-04-17 1992-11-10 Clarion Co Ltd 金属パターン形成方法
JPH0521670A (ja) 1991-07-12 1993-01-29 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクの製造方法および製造装置
RU2019573C1 (ru) * 1992-04-10 1994-09-15 Государственный научно-исследовательский, проектный и конструкторский институт сплавов и обработки цветных металлов Способ непрерывного селективного нанесения покрытия на ленточную основу в вакууме
JPH05326507A (ja) * 1992-05-18 1993-12-10 Clarion Co Ltd 電極または配線形成方法
JP2885616B2 (ja) * 1992-07-31 1999-04-26 株式会社東芝 半導体装置およびその製造方法
JPH08120443A (ja) 1994-10-21 1996-05-14 Fuji Elelctrochem Co Ltd リフトオフによる膜パターン形成方法
JP2836518B2 (ja) 1995-02-28 1998-12-14 日本電気株式会社 蒸着装置
FR2733253B1 (fr) 1995-04-24 1997-06-13 Commissariat Energie Atomique Dispositif pour deposer un materiau par evaporation sur des substrats de grande surface
JPH108242A (ja) 1996-06-17 1998-01-13 Toshiba Corp 真空蒸着装置
JPH10298752A (ja) * 1997-04-26 1998-11-10 Anelva Corp 低圧遠隔スパッタ装置及び低圧遠隔スパッタ方法
US6364956B1 (en) * 1999-01-26 2002-04-02 Symyx Technologies, Inc. Programmable flux gradient apparatus for co-deposition of materials onto a substrate
US6547939B2 (en) * 2001-03-29 2003-04-15 Super Light Wave Corp. Adjustable shadow mask for improving uniformity of film deposition using multiple monitoring points along radius of substrate
TW591202B (en) * 2001-10-26 2004-06-11 Hermosa Thin Film Co Ltd Dynamic film thickness control device/method and ITS coating method
US20030180462A1 (en) * 2002-03-19 2003-09-25 Temescal, A Unit Of The Boc Group, Inc. Planetary lift-off vapor deposition system
CN2716283Y (zh) * 2004-07-21 2005-08-10 范维海 高效式真空镀膜旋转支架
RU2308538C1 (ru) * 2006-06-19 2007-10-20 Общество с ограниченной ответственностью научно-производственная фирма "ЭЛАН-ПРАКТИК" Установка для нанесения многослойных покрытий с периодической структурой методом магнетронного распыления

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217132A (ja) * 2001-01-23 2002-08-02 Sony Corp 真空蒸着装置

Also Published As

Publication number Publication date
CA2757872C (en) 2019-03-26
US20100272893A1 (en) 2010-10-28
RU2538064C2 (ru) 2015-01-10
EP2425033A2 (en) 2012-03-07
JP5774579B2 (ja) 2015-09-09
US8926755B2 (en) 2015-01-06
WO2010129180A2 (en) 2010-11-11
MY160386A (en) 2017-03-15
WO2010129180A3 (en) 2011-03-31
RU2011138995A (ru) 2013-06-10
KR20110039373A (ko) 2011-04-15
JP2012525503A (ja) 2012-10-22
TWI503432B (zh) 2015-10-11
TW201103996A (en) 2011-02-01
EP2425033A4 (en) 2013-03-20
CA2757872A1 (en) 2010-11-11
CN102405302B (zh) 2016-09-14
EP2425033B1 (en) 2014-09-24
CN102405302A (zh) 2012-04-04
SG175247A1 (en) 2011-11-28

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