CN102386107B - 四边扁平无接脚封装方法 - Google Patents
四边扁平无接脚封装方法 Download PDFInfo
- Publication number
- CN102386107B CN102386107B CN201010624721.1A CN201010624721A CN102386107B CN 102386107 B CN102386107 B CN 102386107B CN 201010624721 A CN201010624721 A CN 201010624721A CN 102386107 B CN102386107 B CN 102386107B
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- layer
- connection pads
- metal layer
- conductive connection
- patterned metal
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Links
- 238000000034 method Methods 0.000 title claims abstract description 69
- 238000004806 packaging method and process Methods 0.000 title abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 190
- 229910052751 metal Inorganic materials 0.000 claims abstract description 190
- 238000000059 patterning Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 176
- 238000009940 knitting Methods 0.000 claims description 45
- 238000012856 packing Methods 0.000 claims description 34
- 238000012546 transfer Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 28
- 239000002344 surface layer Substances 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000005022 packaging material Substances 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 description 18
- 238000005516 engineering process Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000003351 Melanosis Diseases 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/28105—Layer connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. layer connectors on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Packaging Frangible Articles (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010624721.1A CN102386107B (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法 |
CN201510048464.4A CN104658923B (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法及其制成的结构 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010276367.8 | 2010-09-01 | ||
CN201010276367 | 2010-09-01 | ||
CN2010102763678 | 2010-09-01 | ||
CN201010624721.1A CN102386107B (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510048464.4A Division CN104658923B (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法及其制成的结构 |
CN201510049628.5A Division CN104658919A (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102386107A CN102386107A (zh) | 2012-03-21 |
CN102386107B true CN102386107B (zh) | 2015-04-01 |
Family
ID=45825395
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010624721.1A Active CN102386107B (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法 |
CN201510048464.4A Active CN104658923B (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法及其制成的结构 |
CN201510049628.5A Pending CN104658919A (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
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CN201510048464.4A Active CN104658923B (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法及其制成的结构 |
CN201510049628.5A Pending CN104658919A (zh) | 2010-09-01 | 2010-12-29 | 四边扁平无接脚封装方法 |
Country Status (1)
Country | Link |
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CN (3) | CN102386107B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI492358B (zh) * | 2012-09-26 | 2015-07-11 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
CN103474358A (zh) * | 2013-09-29 | 2013-12-25 | 华进半导体封装先导技术研发中心有限公司 | 多圈qfn封装引线框架制备方法 |
US9401287B2 (en) * | 2014-02-07 | 2016-07-26 | Altera Corporation | Methods for packaging integrated circuits |
CN108734074B (zh) * | 2017-04-18 | 2022-02-18 | 金佶科技股份有限公司 | 指纹识别方法以及指纹识别装置 |
TWI622151B (zh) * | 2016-12-07 | 2018-04-21 | 矽品精密工業股份有限公司 | 用於半導體封裝的承載基板與其封裝結構,及半導體封裝元件的製作方法 |
CN107564876B (zh) * | 2017-08-30 | 2019-09-27 | 深圳中科四合科技有限公司 | 一种芯片封装结构 |
CN107507781B (zh) * | 2017-08-30 | 2019-09-27 | 深圳中科四合科技有限公司 | 一种芯片封装结构的制备方法 |
CN110581075B (zh) * | 2018-06-08 | 2021-11-02 | 欣兴电子股份有限公司 | 线路载板结构及其制作方法 |
US10888001B2 (en) | 2018-06-08 | 2021-01-05 | Unimicron Technology Corp. | Circuit carrier board structure and manufacturing method thereof |
CN111106018B (zh) * | 2018-10-26 | 2021-08-31 | 深圳市鼎华芯泰科技有限公司 | 一种封装过程中形成金属电极的方法 |
CN111863633B (zh) * | 2019-04-25 | 2022-01-25 | 深圳市鼎华芯泰科技有限公司 | 一种封装载板、封装体及其工艺 |
Citations (2)
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CN1617332A (zh) * | 2003-11-07 | 2005-05-18 | 株式会社巴川制纸所 | 半导体装置制造用粘合薄片、半导体装置及其制造方法 |
CN101656234A (zh) * | 2008-08-21 | 2010-02-24 | 日月光半导体制造股份有限公司 | 先进四方扁平无引脚封装结构及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4251807B2 (ja) * | 2001-12-17 | 2009-04-08 | 株式会社巴川製紙所 | 半導体装置製造用接着シート |
KR100789348B1 (ko) * | 2002-04-29 | 2007-12-28 | 유니셈 (모리셔스) 홀딩스 리미티드 | 부분적으로 패터닝된 리드 프레임 및 이를 제조하는 방법및 반도체 패키징에서 이를 이용하는 방법 |
US7119421B2 (en) * | 2002-06-06 | 2006-10-10 | Koninklijke Philips Electronics N.V. | Quad flat non-leaded package comprising a semiconductor device |
CN1698200A (zh) * | 2003-02-19 | 2005-11-16 | 日立化成工业株式会社 | 半导体用粘着薄膜 ,使用该粘着薄膜的附有粘着薄膜金属板 ,附有该粘着薄膜的配线电路及半导体装置 ,以及半导体装置的制造方法 |
US20080135990A1 (en) * | 2006-12-07 | 2008-06-12 | Texas Instruments Incorporated | Stress-improved flip-chip semiconductor device having half-etched leadframe |
US8471375B2 (en) * | 2007-06-30 | 2013-06-25 | Kinsus Interconnect Technology Corp. | High-density fine line structure and method of manufacturing the same |
TWI372454B (en) * | 2008-12-09 | 2012-09-11 | Advanced Semiconductor Eng | Quad flat non-leaded package and manufacturing method thereof |
-
2010
- 2010-12-29 CN CN201010624721.1A patent/CN102386107B/zh active Active
- 2010-12-29 CN CN201510048464.4A patent/CN104658923B/zh active Active
- 2010-12-29 CN CN201510049628.5A patent/CN104658919A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1617332A (zh) * | 2003-11-07 | 2005-05-18 | 株式会社巴川制纸所 | 半导体装置制造用粘合薄片、半导体装置及其制造方法 |
CN101656234A (zh) * | 2008-08-21 | 2010-02-24 | 日月光半导体制造股份有限公司 | 先进四方扁平无引脚封装结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104658923B (zh) | 2018-08-14 |
CN104658923A (zh) | 2015-05-27 |
CN102386107A (zh) | 2012-03-21 |
CN104658919A (zh) | 2015-05-27 |
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Address after: Taiwan County, Hsinchu, China Hukou Zhongxing village, Guangfu Road, No. 5, building 65 Patentee after: Quncheng Energy Co.,Ltd. Address before: Taiwan County, Hsinchu, China Hukou Zhongxing village, Guangfu Road, No. 5, building 65 Patentee before: ADL Engineering Inc. |
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Address after: 321, Section 2, Guangfu Road, East District, Hsinchu, Taiwan, China, China Patentee after: Quncheng Energy Co.,Ltd. Address before: Taiwan County, Hsinchu, China Hukou Zhongxing village, Guangfu Road, No. 5, building 65 Patentee before: Quncheng Energy Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20240108 Address after: No. 8, Lixing 6th Road, Hsinchu City, Science Industrial Park, Hsinchu City, Taiwan, China, China Patentee after: Taiwan Semiconductor Manufacturing Co.,Ltd. Address before: 321, Section 2, Guangfu Road, East District, Hsinchu, Taiwan, China, China Patentee before: Quncheng Energy Co.,Ltd. |