CN102361753A - 一种新型挠性金属箔层叠板及其制造方法 - Google Patents

一种新型挠性金属箔层叠板及其制造方法 Download PDF

Info

Publication number
CN102361753A
CN102361753A CN2010800128683A CN201080012868A CN102361753A CN 102361753 A CN102361753 A CN 102361753A CN 2010800128683 A CN2010800128683 A CN 2010800128683A CN 201080012868 A CN201080012868 A CN 201080012868A CN 102361753 A CN102361753 A CN 102361753A
Authority
CN
China
Prior art keywords
polyimide layer
mentioned
metal foil
flexible
conductive metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800128683A
Other languages
English (en)
Chinese (zh)
Inventor
朴永锡
白银松
金养燮
梁东宝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doosan Corp
Original Assignee
Doosan Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Corp filed Critical Doosan Corp
Publication of CN102361753A publication Critical patent/CN102361753A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y10T428/24975—No layer or component greater than 5 mils thick
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
CN2010800128683A 2009-01-23 2010-01-22 一种新型挠性金属箔层叠板及其制造方法 Pending CN102361753A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2009-0006195 2009-01-23
KR1020090006195A KR101102180B1 (ko) 2009-01-23 2009-01-23 신규 연성 금속박 적층판 및 그 제조방법
PCT/KR2010/000422 WO2010085113A2 (ko) 2009-01-23 2010-01-22 신규 연성 금속박 적층판 및 그 제조방법

Publications (1)

Publication Number Publication Date
CN102361753A true CN102361753A (zh) 2012-02-22

Family

ID=42356341

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800128683A Pending CN102361753A (zh) 2009-01-23 2010-01-22 一种新型挠性金属箔层叠板及其制造方法

Country Status (5)

Country Link
US (1) US20120018197A1 (enExample)
JP (1) JP5814127B2 (enExample)
KR (1) KR101102180B1 (enExample)
CN (1) CN102361753A (enExample)
WO (1) WO2010085113A2 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103514988A (zh) * 2012-12-14 2014-01-15 上海空间电源研究所 一种扁平式双层功率信号传输电缆及其形成方法
CN105103100A (zh) * 2013-04-10 2015-11-25 可隆工业株式会社 聚酰亚胺覆盖基板
CN105856792A (zh) * 2015-04-09 2016-08-17 柏弥兰金属化研究股份有限公司 单面薄型金属基板的制造方法
CN106393876A (zh) * 2015-06-17 2017-02-15 长兴材料工业股份有限公司 金属被覆积层板、其制备方法及其制备软性电路板的方法
CN107079593A (zh) * 2014-10-24 2017-08-18 株式会社斗山 覆盖膜用金属箔层叠体和不包含覆盖膜的多层柔性印刷电路基板
CN110962410A (zh) * 2018-09-28 2020-04-07 日铁化学材料株式会社 覆金属层叠板和电路基板

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
KR101237410B1 (ko) 2011-05-24 2013-02-27 송민화 에프씨씨엘 및 이의 제조방법과 상기 에프씨씨엘을 이용한 안테나
CN102630126B (zh) * 2012-04-01 2014-04-16 松扬电子材料(昆山)有限公司 复合式双面铜箔基板及其制造方法
CN102825861B (zh) * 2012-08-16 2015-07-22 新高电子材料（中山）有限公司 导热双面挠性覆铜板及其制作方法
US20150122532A1 (en) * 2013-11-04 2015-05-07 Teledyne Technologies Incorporated High temperature multilayer flexible printed wiring board
KR101582398B1 (ko) * 2014-01-06 2016-01-05 주식회사 두산 수지 이중층 부착 동박, 이를 포함하는 다층 인쇄 회로 기판 및 그 제조 방법
CN103963386B (zh) * 2014-03-05 2016-05-11 金安国纪科技股份有限公司 金属基覆铜板及其制备方法
CN103963381B (zh) * 2014-03-05 2016-02-17 金安国纪科技股份有限公司 金属基覆铜板及其制备方法
KR101705078B1 (ko) 2015-02-09 2017-02-10 도레이첨단소재 주식회사 양면 금속적층 필름의 제조방법 및 그로부터 제조되는 양면 금속적층 필름
KR101890036B1 (ko) * 2016-11-21 2018-08-22 에스디플렉스(주) 4층 구조의 연성 동박적층판의 제조 방법
US11021606B2 (en) * 2017-09-13 2021-06-01 E I Du Pont De Nemours And Company Multilayer film for electronic circuitry applications
KR102329838B1 (ko) * 2019-04-30 2021-11-22 도레이첨단소재 주식회사 연성 금속박 적층 필름, 이를 포함하는 물품 및 상기 연성 금속박 적층 필름의 제조방법
WO2021040289A1 (ko) * 2019-08-27 2021-03-04 주식회사 두산 연성 금속 적층판, 커버레이 필름, 이를 구비하는 연성 금속복합기판
CN119865974B (zh) * 2025-03-21 2025-07-08 深圳市实锐泰科技有限公司 一种新能源汽车用耐电压柔性电路板的制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975484A (en) * 1985-05-10 1990-12-04 E. I. Du Pont De Nemours And Company Acrylic copolymer composition and adhesive coatings therefrom
KR20010110698A (ko) * 1999-03-26 2001-12-13 센타니 마이클 에이. 다층 적층 및 이를 생성하는 방법
US6548180B2 (en) * 2000-10-02 2003-04-15 Ube Industries, Ltd. Aromatic polyimide film and film laminate
JP2005162878A (ja) * 2003-12-02 2005-06-23 Toyobo Co Ltd ポリイミドフィルム、その製造方法およびそれを用いたベース基板
JP2008130784A (ja) * 2006-11-21 2008-06-05 Toyobo Co Ltd 多層回路基板
US7384683B2 (en) * 2003-09-10 2008-06-10 Unitika Ltd. Substrate for flexible printed wiring board and method for manufacturing the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717543A (en) * 1971-01-13 1973-02-20 Rexham Corp Laminations of polyimide films to like films and/or to metal foils
US4626474A (en) * 1985-06-21 1986-12-02 Stauffer Chemical Company Polyimide film/metal foil lamination
JPS62179583A (ja) * 1986-01-31 1987-08-06 Japan Synthetic Rubber Co Ltd 接着性組成物
JPH01166944A (ja) * 1987-12-24 1989-06-30 Hitachi Chem Co Ltd 両面フレキシブル金属張積層板の製造方法
JPH02301186A (ja) * 1989-05-15 1990-12-13 Nitsukan Kogyo Kk フレキシブル印刷配線基板およびカバーレイフィルム
JPH03133634A (ja) * 1989-10-19 1991-06-06 Toyobo Co Ltd 耐熱性積層体およびその製法
US5103293A (en) * 1990-12-07 1992-04-07 International Business Machines Corporation Electronic circuit packages with tear resistant organic cores
US6268070B1 (en) * 1999-03-12 2001-07-31 Gould Electronics Inc. Laminate for multi-layer printed circuit
US6794031B2 (en) * 2001-09-28 2004-09-21 Ube Industries, Ltd. Cover-lay film and printed circuit board having the same
JP4543314B2 (ja) * 2003-09-01 2010-09-15 東洋紡績株式会社 ポリアミドイミド樹脂、樹脂組成物及びそれを用いた金属張積層体
JP4672505B2 (ja) * 2005-04-13 2011-04-20 信越化学工業株式会社 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
TWI298334B (en) * 2005-07-05 2008-07-01 Chang Chun Plastics Co Ltd Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom
JP4987374B2 (ja) * 2006-07-19 2012-07-25 株式会社有沢製作所 接着シート用樹脂組成物、並びに該組成物を用いたフレキシブルプリント配線板用接着シート
JP2008030329A (ja) * 2006-07-28 2008-02-14 Kitano:Kk 金属箔張積層板の製造方法及びそれにより得られる金属箔張積層板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975484A (en) * 1985-05-10 1990-12-04 E. I. Du Pont De Nemours And Company Acrylic copolymer composition and adhesive coatings therefrom
KR20010110698A (ko) * 1999-03-26 2001-12-13 센타니 마이클 에이. 다층 적층 및 이를 생성하는 방법
US6548180B2 (en) * 2000-10-02 2003-04-15 Ube Industries, Ltd. Aromatic polyimide film and film laminate
US7384683B2 (en) * 2003-09-10 2008-06-10 Unitika Ltd. Substrate for flexible printed wiring board and method for manufacturing the same
JP2005162878A (ja) * 2003-12-02 2005-06-23 Toyobo Co Ltd ポリイミドフィルム、その製造方法およびそれを用いたベース基板
JP2008130784A (ja) * 2006-11-21 2008-06-05 Toyobo Co Ltd 多層回路基板

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103514988A (zh) * 2012-12-14 2014-01-15 上海空间电源研究所 一种扁平式双层功率信号传输电缆及其形成方法
CN103514988B (zh) * 2012-12-14 2016-01-20 上海空间电源研究所 一种扁平式双层功率信号传输电缆及其形成方法
CN105103100A (zh) * 2013-04-10 2015-11-25 可隆工业株式会社 聚酰亚胺覆盖基板
CN105103100B (zh) * 2013-04-10 2019-04-12 可隆工业株式会社 聚酰亚胺覆盖基板
CN107079593B (zh) * 2014-10-24 2019-10-22 株式会社斗山 覆盖膜用金属箔层叠体和不包含覆盖膜的多层柔性印刷电路基板
CN107079593A (zh) * 2014-10-24 2017-08-18 株式会社斗山 覆盖膜用金属箔层叠体和不包含覆盖膜的多层柔性印刷电路基板
CN105856792A (zh) * 2015-04-09 2016-08-17 柏弥兰金属化研究股份有限公司 单面薄型金属基板的制造方法
CN105856792B (zh) * 2015-04-09 2018-02-27 柏弥兰金属化研究股份有限公司 单面薄型金属基板的制造方法
CN106393876B (zh) * 2015-06-17 2019-05-14 长兴材料工业股份有限公司 金属被覆积层板、其制备方法及其制备软性电路板的方法
CN106393876A (zh) * 2015-06-17 2017-02-15 长兴材料工业股份有限公司 金属被覆积层板、其制备方法及其制备软性电路板的方法
US10765008B2 (en) 2015-06-17 2020-09-01 Eternal Materials Co., Ltd. Metal clad laminate, preparation method thereof, and method for preparing flexible circuit board by using the same
CN110962410A (zh) * 2018-09-28 2020-04-07 日铁化学材料株式会社 覆金属层叠板和电路基板
CN110962410B (zh) * 2018-09-28 2023-09-05 日铁化学材料株式会社 覆金属层叠板和电路基板
TWI814908B (zh) * 2018-09-28 2023-09-11 日商日鐵化學材料股份有限公司 覆金屬積層板和電路基板
CN117048152A (zh) * 2018-09-28 2023-11-14 日铁化学材料株式会社 覆金属层叠板的制造方法
CN117067718A (zh) * 2018-09-28 2023-11-17 日铁化学材料株式会社 覆金属层叠板和电路基板
TWI867682B (zh) * 2018-09-28 2024-12-21 日商日鐵化學材料股份有限公司 覆金屬積層板的製造方法

Also Published As

Publication number Publication date
WO2010085113A2 (ko) 2010-07-29
KR101102180B1 (ko) 2012-01-02
JP5814127B2 (ja) 2015-11-17
KR20100086786A (ko) 2010-08-02
US20120018197A1 (en) 2012-01-26
WO2010085113A3 (ko) 2010-11-04
JP2012515671A (ja) 2012-07-12

Similar Documents

Publication Publication Date Title
CN102361753A (zh) 一种新型挠性金属箔层叠板及其制造方法
JP7547109B2 (ja) 樹脂材料及び多層プリント配線板
TWI690578B (zh) 黏著劑組成物、薄膜狀黏著材料、黏著層、黏著薄片、附有樹脂的銅箔、覆銅積層板、可撓性覆銅積層板、印刷線路板、可撓性印刷線路板、多層線路板、印刷電路板及可撓性印刷電路板
CN101522744B (zh) 聚酰胺酰亚胺树脂、粘接剂、挠性基板材料、挠性层叠板及挠性印刷电路板
US8809688B2 (en) Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same
CN108299793A (zh) 树脂组合物
CN111234753B (zh) 一种具有高玻璃化转变温度的胶粘剂组合物及其应用
KR20020066189A (ko) 내열성 조성물
KR20170077826A (ko) 폴리이미드계 접착제
CN106256862A (zh) 树脂组合物
JP2023010737A (ja) 樹脂組成物
JP5019874B2 (ja) 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板
TW202116912A (zh) 樹脂組成物
TW202024224A (zh) 樹脂組成物
JP2020132676A (ja) 樹脂組成物
CN108727837A (zh) 树脂组合物
TW202115168A (zh) 樹脂組成物
JP2009029982A (ja) 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム
CN107079593B (zh) 覆盖膜用金属箔层叠体和不包含覆盖膜的多层柔性印刷电路基板
TW202233757A (zh) 樹脂組成物
JP7135919B2 (ja) 樹脂組成物
JP2006335843A (ja) 熱硬化性樹脂組成物およびその利用
TW202130736A (zh) 樹脂組成物
JP2006117848A (ja) 熱硬化性樹脂組成物およびその利用
WO2022186219A1 (ja) 樹脂組成物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120222