CN102343443A - 具有刀具的加工装置 - Google Patents

具有刀具的加工装置 Download PDF

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Publication number
CN102343443A
CN102343443A CN2011102040620A CN201110204062A CN102343443A CN 102343443 A CN102343443 A CN 102343443A CN 2011102040620 A CN2011102040620 A CN 2011102040620A CN 201110204062 A CN201110204062 A CN 201110204062A CN 102343443 A CN102343443 A CN 102343443A
Authority
CN
China
Prior art keywords
cutter
turning
machined object
chuck table
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011102040620A
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English (en)
Chinese (zh)
Inventor
波冈伸一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN102343443A publication Critical patent/CN102343443A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
CN2011102040620A 2010-07-23 2011-07-20 具有刀具的加工装置 Pending CN102343443A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-165699 2010-07-23
JP2010165699A JP2012024885A (ja) 2010-07-23 2010-07-23 バイト工具を備えた加工装置

Publications (1)

Publication Number Publication Date
CN102343443A true CN102343443A (zh) 2012-02-08

Family

ID=45542719

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011102040620A Pending CN102343443A (zh) 2010-07-23 2011-07-20 具有刀具的加工装置

Country Status (4)

Country Link
JP (1) JP2012024885A (ko)
KR (1) KR20120010194A (ko)
CN (1) CN102343443A (ko)
TW (1) TW201209902A (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481459B (zh) * 2012-07-20 2015-04-21 Hon Hai Prec Ind Co Ltd 具有非迴轉曲面之工件
CN105023870A (zh) * 2014-04-25 2015-11-04 中国科学院苏州纳米技术与纳米仿生研究所 晶片定位机构
CN109382766A (zh) * 2017-08-10 2019-02-26 株式会社迪思科 加工装置
CN109560015A (zh) * 2017-09-27 2019-04-02 东和株式会社 加工装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5881480B2 (ja) * 2012-03-07 2016-03-09 株式会社ディスコ バイト切削方法
JP5945182B2 (ja) * 2012-07-23 2016-07-05 株式会社ディスコ バイト切削装置
JP5921373B2 (ja) * 2012-07-27 2016-05-24 株式会社ディスコ バイト切削装置
JP6403601B2 (ja) * 2015-02-16 2018-10-10 株式会社ディスコ 加工装置
CN108817504A (zh) * 2018-07-13 2018-11-16 芜湖若科自动化科技有限公司 一种便于冷却的铝型材切割装置
JP2020131406A (ja) * 2019-02-25 2020-08-31 株式会社ディスコ 加工方法
TW202126408A (zh) 2020-01-02 2021-07-16 財團法人工業技術研究院 毛邊清除裝置
CN114985806B (zh) * 2022-08-01 2022-10-28 江苏伦肯智能科技有限公司 一种下料清洗一体化的铣床

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425309A (ja) * 1990-05-18 1992-01-29 Genichi Sato 切削方法およびそれに用いる装置
JP2000094267A (ja) * 1998-09-21 2000-04-04 Enshu Ltd 窒素ガス雰囲気下による加工システム
CN2574830Y (zh) * 2002-08-27 2003-09-24 胡丽华 可程控喷嘴结构
CN1491773A (zh) * 1996-02-15 2004-04-28 株式会社泽塔平和 切削机床和磨床中冷却液的分离和回收的装置
JP2004303855A (ja) * 2003-03-31 2004-10-28 Disco Abrasive Syst Ltd 切削装置
JP2005327838A (ja) * 2004-05-13 2005-11-24 Disco Abrasive Syst Ltd 板状物に形成された電極の加工装置
JP2006181700A (ja) * 2004-12-28 2006-07-13 Disco Abrasive Syst Ltd 切削装置及び被加工物の切削方法
CN101058154A (zh) * 2006-02-14 2007-10-24 李美子 移动式切削油供应装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4243364B2 (ja) * 1998-03-24 2009-03-25 株式会社ディスコ 切削方法
JP2008221388A (ja) * 2007-03-12 2008-09-25 Jatco Ltd 機械加工用冷却剤供給装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425309A (ja) * 1990-05-18 1992-01-29 Genichi Sato 切削方法およびそれに用いる装置
CN1491773A (zh) * 1996-02-15 2004-04-28 株式会社泽塔平和 切削机床和磨床中冷却液的分离和回收的装置
JP2000094267A (ja) * 1998-09-21 2000-04-04 Enshu Ltd 窒素ガス雰囲気下による加工システム
CN2574830Y (zh) * 2002-08-27 2003-09-24 胡丽华 可程控喷嘴结构
JP2004303855A (ja) * 2003-03-31 2004-10-28 Disco Abrasive Syst Ltd 切削装置
JP2005327838A (ja) * 2004-05-13 2005-11-24 Disco Abrasive Syst Ltd 板状物に形成された電極の加工装置
JP2006181700A (ja) * 2004-12-28 2006-07-13 Disco Abrasive Syst Ltd 切削装置及び被加工物の切削方法
CN101058154A (zh) * 2006-02-14 2007-10-24 李美子 移动式切削油供应装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481459B (zh) * 2012-07-20 2015-04-21 Hon Hai Prec Ind Co Ltd 具有非迴轉曲面之工件
CN105023870A (zh) * 2014-04-25 2015-11-04 中国科学院苏州纳米技术与纳米仿生研究所 晶片定位机构
CN105023870B (zh) * 2014-04-25 2017-12-01 中国科学院苏州纳米技术与纳米仿生研究所 晶片定位机构
CN109382766A (zh) * 2017-08-10 2019-02-26 株式会社迪思科 加工装置
CN109560015A (zh) * 2017-09-27 2019-04-02 东和株式会社 加工装置
CN109560015B (zh) * 2017-09-27 2023-06-02 东和株式会社 加工装置

Also Published As

Publication number Publication date
JP2012024885A (ja) 2012-02-09
TW201209902A (en) 2012-03-01
KR20120010194A (ko) 2012-02-02

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Application publication date: 20120208