CN102341243B - 功能区域的转印方法、led阵列、led打印机头和led打印机 - Google Patents

功能区域的转印方法、led阵列、led打印机头和led打印机 Download PDF

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Publication number
CN102341243B
CN102341243B CN201080009990.5A CN201080009990A CN102341243B CN 102341243 B CN102341243 B CN 102341243B CN 201080009990 A CN201080009990 A CN 201080009990A CN 102341243 B CN102341243 B CN 102341243B
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CN
China
Prior art keywords
substrate
layer
functional
led
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080009990.5A
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English (en)
Chinese (zh)
Other versions
CN102341243A (zh
Inventor
米原隆夫
高井康好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102341243A publication Critical patent/CN102341243A/zh
Application granted granted Critical
Publication of CN102341243B publication Critical patent/CN102341243B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
CN201080009990.5A 2009-03-04 2010-03-01 功能区域的转印方法、led阵列、led打印机头和led打印机 Expired - Fee Related CN102341243B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009050012A JP2010205943A (ja) 2009-03-04 2009-03-04 機能性領域の移設方法、ｌｅｄアレイ、ｌｅｄプリンタヘッド、及びｌｅｄプリンタ
JP2009-050012 2009-03-04
PCT/JP2010/001379 WO2010100882A1 (en) 2009-03-04 2010-03-01 Method for transferring functional regions, led array, led printer head, and led printer

Publications (2)

Publication Number Publication Date
CN102341243A CN102341243A (zh) 2012-02-01
CN102341243B true CN102341243B (zh) 2015-07-01

Family

ID=42246291

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080009990.5A Expired - Fee Related CN102341243B (zh) 2009-03-04 2010-03-01 功能区域的转印方法、led阵列、led打印机头和led打印机

Country Status (5)

Country Link
US (1) US8415230B2 (enExample)
JP (1) JP2010205943A (enExample)
CN (1) CN102341243B (enExample)
TW (1) TWI442450B (enExample)
WO (1) WO2010100882A1 (enExample)

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JP5590837B2 (ja) * 2009-09-15 2014-09-17 キヤノン株式会社 機能性領域の移設方法
US9306117B2 (en) 2011-07-25 2016-04-05 Industrial Technology Research Institute Transfer-bonding method for light emitting devices
CN102903804B (zh) * 2011-07-25 2015-12-16 财团法人工业技术研究院 发光元件的转移方法以及发光元件阵列
EP2761677B1 (en) * 2011-09-30 2019-08-21 Microlink Devices, Inc. Light emitting diode fabricated by epitaxial lift-off
DE102012024599B4 (de) * 2011-12-20 2020-07-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung mit optisch transparenten und funktionalen Bauelementen
KR102139681B1 (ko) * 2014-01-29 2020-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법
CN104880846B (zh) * 2015-06-15 2018-07-24 京东方科技集团股份有限公司 柔性基板及其制作方法、显示装置
JP6245239B2 (ja) * 2015-09-11 2017-12-13 日亜化学工業株式会社 半導体レーザ素子の製造方法
US10068888B2 (en) * 2015-12-21 2018-09-04 Hong Kong Beida Jade Bird Display Limited Making semiconductor devices with alignment bonding and substrate removal
US10325893B2 (en) * 2016-12-13 2019-06-18 Hong Kong Beida Jade Bird Display Limited Mass transfer of micro structures using adhesives
CN107170876A (zh) * 2017-05-27 2017-09-15 南方科技大学 一种Micro LED显示器件的制备方法
CN108122814B (zh) * 2017-10-27 2021-04-23 江西乾照光电有限公司 一种led芯片中led芯粒的分选转移方法
TWI881580B (zh) * 2018-06-22 2025-04-21 晶元光電股份有限公司 具有發光二極體陣列之顯示器及其製造方法
DE102020102952B4 (de) 2020-02-05 2024-09-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur selektion von halbleiterbauelementen
FR3108777A1 (fr) * 2020-03-24 2021-10-01 Commissariat à l'Energie Atomique et aux Energies Alternatives procede de fabrication d’une structure semiconductrice par report de vignettes sur un substrat support
US11545474B2 (en) * 2020-05-11 2023-01-03 Semileds Corporation Method and system for transferring alignment marks between substrate systems
CN112968079B (zh) * 2020-07-08 2022-05-13 重庆康佳光电技术研究院有限公司 发光单元、显示背板及其制作方法和芯片及其转移方法
KR20220050674A (ko) * 2020-10-16 2022-04-25 삼성전자주식회사 마이크로 발광 소자 어레이 및 그 제조 방법
JP7633089B2 (ja) * 2021-05-19 2025-02-19 株式会社ジャパンディスプレイ 表示装置の製造方法
DE102023101327A1 (de) * 2023-01-19 2024-07-25 Ams-Osram International Gmbh Transferverfahren zum transferieren von elektronischen bauelementen und elektronische anordnung
FR3158372B1 (fr) 2024-01-17 2025-12-05 Scintil Photonics Dispositif photonique comprenant une couche de composants disposée sur un substrat support et procédé de préparation d’un tel dispositif photonique

Citations (3)

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CN1501493A (zh) * 2002-11-13 2004-06-02 ������������ʽ���� 具有半导体薄膜的组合半导体装置
US6913985B2 (en) * 2003-06-20 2005-07-05 Oki Data Corporation Method of manufacturing a semiconductor device
WO2008050901A1 (en) * 2006-10-27 2008-05-02 Canon Kabushiki Kaisha Semiconductor member, semiconductor article manufacturing method, and led array using the manufacturing method

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US5042709A (en) 1990-06-22 1991-08-27 International Business Machines Corporation Methods and apparatus for precise alignment of objects
FR2781925B1 (fr) 1998-07-30 2001-11-23 Commissariat Energie Atomique Transfert selectif d'elements d'un support vers un autre support
JP4701537B2 (ja) * 2001-05-16 2011-06-15 ソニー株式会社 素子の転写方法及び画像表示装置の製造方法
JP2003174041A (ja) 2001-12-06 2003-06-20 Seiko Epson Corp 素子の実装方法、電子機器、フラットパネルディスプレイ、システムインパッケージ型ｉｃおよびオプティカルエレクトリカルｉｃ
JP2003258210A (ja) 2001-12-27 2003-09-12 Canon Inc 表示装置及びその製造方法
JP2004047691A (ja) * 2002-07-11 2004-02-12 Seiko Epson Corp 半導体装置の製造方法、電気光学装置、及び電子機器
JP4370796B2 (ja) 2003-04-08 2009-11-25 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法及び電子機器
JP4315742B2 (ja) 2003-06-20 2009-08-19 株式会社沖データ 半導体薄膜の製造方法及び半導体装置の製造方法
JP4488702B2 (ja) * 2003-07-30 2010-06-23 株式会社沖データ 半導体装置の製造方法
JP2005108943A (ja) * 2003-09-29 2005-04-21 Oki Data Corp 半導体ウェハ及びこれを用いた半導体装置の製造方法
JP4672329B2 (ja) * 2003-10-22 2011-04-20 株式会社沖データ 半導体装置、及び、それを用いたｌｅｄプリントヘッド、画像形成装置、半導体装置の製造方法
JP5030388B2 (ja) * 2004-03-22 2012-09-19 株式会社半導体エネルギー研究所 薄膜集積回路の作製方法
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CN1501493A (zh) * 2002-11-13 2004-06-02 ������������ʽ���� 具有半导体薄膜的组合半导体装置
US6913985B2 (en) * 2003-06-20 2005-07-05 Oki Data Corporation Method of manufacturing a semiconductor device
WO2008050901A1 (en) * 2006-10-27 2008-05-02 Canon Kabushiki Kaisha Semiconductor member, semiconductor article manufacturing method, and led array using the manufacturing method

Also Published As

Publication number Publication date
TWI442450B (zh) 2014-06-21
US20110311276A1 (en) 2011-12-22
CN102341243A (zh) 2012-02-01
TW201034050A (en) 2010-09-16
JP2010205943A (ja) 2010-09-16
WO2010100882A1 (en) 2010-09-10
US8415230B2 (en) 2013-04-09

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Granted publication date: 20150701

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CF01 Termination of patent right due to non-payment of annual fee