TWI442450B - 遷移功能區域的方法，發光二極體陣列，發光二極體列印頭，以及發光二極體列印機 - Google Patents

遷移功能區域的方法，發光二極體陣列，發光二極體列印頭，以及發光二極體列印機 Download PDF

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Publication number
TWI442450B
TWI442450B TW099105837A TW99105837A TWI442450B TW I442450 B TWI442450 B TW I442450B TW 099105837 A TW099105837 A TW 099105837A TW 99105837 A TW99105837 A TW 99105837A TW I442450 B TWI442450 B TW I442450B
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TW
Taiwan
Prior art keywords
substrate
layer
functional
region
separation
Prior art date
Application number
TW099105837A
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English (en)
Chinese (zh)
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TW201034050A (en
Inventor
米原隆夫
高井康好
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佳能股份有限公司
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Application filed by 佳能股份有限公司 filed Critical 佳能股份有限公司
Publication of TW201034050A publication Critical patent/TW201034050A/zh
Application granted granted Critical
Publication of TWI442450B publication Critical patent/TWI442450B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW099105837A 2009-03-04 2010-03-01 遷移功能區域的方法，發光二極體陣列，發光二極體列印頭，以及發光二極體列印機 TWI442450B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009050012A JP2010205943A (ja) 2009-03-04 2009-03-04 機能性領域の移設方法、ｌｅｄアレイ、ｌｅｄプリンタヘッド、及びｌｅｄプリンタ

Publications (2)

Publication Number Publication Date
TW201034050A TW201034050A (en) 2010-09-16
TWI442450B true TWI442450B (zh) 2014-06-21

Family

ID=42246291

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105837A TWI442450B (zh) 2009-03-04 2010-03-01 遷移功能區域的方法，發光二極體陣列，發光二極體列印頭，以及發光二極體列印機

Country Status (5)

Country Link
US (1) US8415230B2 (enExample)
JP (1) JP2010205943A (enExample)
CN (1) CN102341243B (enExample)
TW (1) TWI442450B (enExample)
WO (1) WO2010100882A1 (enExample)

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CN102903804B (zh) * 2011-07-25 2015-12-16 财团法人工业技术研究院 发光元件的转移方法以及发光元件阵列
US9306117B2 (en) 2011-07-25 2016-04-05 Industrial Technology Research Institute Transfer-bonding method for light emitting devices
JP2014532307A (ja) * 2011-09-30 2014-12-04 マイクロリンク デバイシズ，インコーポレーテッド エピタキシャルリフトオフによって製造される発光ダイオード
DE102012024599B4 (de) * 2011-12-20 2020-07-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung mit optisch transparenten und funktionalen Bauelementen
KR102139681B1 (ko) * 2014-01-29 2020-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법
CN104880846B (zh) * 2015-06-15 2018-07-24 京东方科技集团股份有限公司 柔性基板及其制作方法、显示装置
JP6245239B2 (ja) * 2015-09-11 2017-12-13 日亜化学工業株式会社 半導体レーザ素子の製造方法
US10068888B2 (en) * 2015-12-21 2018-09-04 Hong Kong Beida Jade Bird Display Limited Making semiconductor devices with alignment bonding and substrate removal
US10325893B2 (en) * 2016-12-13 2019-06-18 Hong Kong Beida Jade Bird Display Limited Mass transfer of micro structures using adhesives
CN107170876A (zh) * 2017-05-27 2017-09-15 南方科技大学 一种Micro LED显示器件的制备方法
CN108122814B (zh) * 2017-10-27 2021-04-23 江西乾照光电有限公司 一种led芯片中led芯粒的分选转移方法
TWI881580B (zh) * 2018-06-22 2025-04-21 晶元光電股份有限公司 具有發光二極體陣列之顯示器及其製造方法
DE102020102952B4 (de) * 2020-02-05 2024-09-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur selektion von halbleiterbauelementen
FR3108777A1 (fr) * 2020-03-24 2021-10-01 Commissariat à l'Energie Atomique et aux Energies Alternatives procede de fabrication d’une structure semiconductrice par report de vignettes sur un substrat support
US11545474B2 (en) * 2020-05-11 2023-01-03 Semileds Corporation Method and system for transferring alignment marks between substrate systems
CN112968079B (zh) * 2020-07-08 2022-05-13 重庆康佳光电技术研究院有限公司 发光单元、显示背板及其制作方法和芯片及其转移方法
KR20220050674A (ko) * 2020-10-16 2022-04-25 삼성전자주식회사 마이크로 발광 소자 어레이 및 그 제조 방법
JP7633089B2 (ja) * 2021-05-19 2025-02-19 株式会社ジャパンディスプレイ 表示装置の製造方法
DE102023101327A1 (de) * 2023-01-19 2024-07-25 Ams-Osram International Gmbh Transferverfahren zum transferieren von elektronischen bauelementen und elektronische anordnung
FR3158372B1 (fr) 2024-01-17 2025-12-05 Scintil Photonics Dispositif photonique comprenant une couche de composants disposée sur un substrat support et procédé de préparation d’un tel dispositif photonique

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Also Published As

Publication number Publication date
JP2010205943A (ja) 2010-09-16
US20110311276A1 (en) 2011-12-22
US8415230B2 (en) 2013-04-09
CN102341243A (zh) 2012-02-01
CN102341243B (zh) 2015-07-01
WO2010100882A1 (en) 2010-09-10
TW201034050A (en) 2010-09-16

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