CN102331996A - 统计分析方法和衬底处理系统 - Google Patents

统计分析方法和衬底处理系统 Download PDF

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Publication number
CN102331996A
CN102331996A CN2011101938966A CN201110193896A CN102331996A CN 102331996 A CN102331996 A CN 102331996A CN 2011101938966 A CN2011101938966 A CN 2011101938966A CN 201110193896 A CN201110193896 A CN 201110193896A CN 102331996 A CN102331996 A CN 102331996A
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CN2011101938966A
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English (en)
Chinese (zh)
Inventor
浅井一秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
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Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Publication of CN102331996A publication Critical patent/CN102331996A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
CN2011101938966A 2010-07-06 2011-07-05 统计分析方法和衬底处理系统 Pending CN102331996A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-154251 2010-07-06
JP2010154251A JP5600503B2 (ja) 2010-07-06 2010-07-06 統計解析方法、基板処理システムおよびプログラム

Publications (1)

Publication Number Publication Date
CN102331996A true CN102331996A (zh) 2012-01-25

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CN2011101938966A Pending CN102331996A (zh) 2010-07-06 2011-07-05 统计分析方法和衬底处理系统

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US (1) US9142436B2 (enExample)
JP (1) JP5600503B2 (enExample)
CN (1) CN102331996A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5841336B2 (ja) * 2011-02-08 2016-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および情報管理方法
WO2014050808A1 (ja) * 2012-09-26 2014-04-03 株式会社日立国際電気 統合管理システム、管理装置、基板処理装置の情報表示方法及び記録媒体
JP6310260B2 (ja) * 2014-01-20 2018-04-11 株式会社荏原製作所 基板処理装置内の複数の処理ユニットを調整するための調整装置、および該調整装置を備えた基板処理装置
US11138306B2 (en) 2016-03-14 2021-10-05 Amazon Technologies, Inc. Physics-based CAPTCHA
EP3539571B1 (en) 2018-03-16 2023-05-31 Critical Innovations, LLC Systems and methods relating to medical applications of synthetic polymer formulations
JP7570822B2 (ja) * 2020-04-28 2024-10-22 キヤノン株式会社 情報処理装置、及び情報処理方法
KR102482167B1 (ko) * 2022-04-27 2022-12-28 주식회사 솔텍크 서브 컴포넌트 모니터링 시스템 및 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294831A (ja) * 2005-04-11 2006-10-26 Hitachi Kokusai Electric Inc データ収集システム
US20090276077A1 (en) * 2008-04-30 2009-11-05 Richard Good Method and system for semiconductor process control and monitoring by using pca models of reduced size
CN101621016A (zh) * 2008-07-02 2010-01-06 中芯国际集成电路制造(上海)有限公司 在制造集成电路中用于缺陷检测的方法和系统
CN101739408A (zh) * 2008-11-18 2010-06-16 和舰科技(苏州)有限公司 一种基于半导体测试数据的数据处理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2724082B2 (ja) 1992-12-18 1998-03-09 シャープ株式会社 Ｖｌｓｉプロセスのデータ解析支援システム
JP2005535130A (ja) * 2002-08-01 2005-11-17 アプライド マテリアルズ インコーポレイテッド 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体
JP2004186445A (ja) 2002-12-03 2004-07-02 Omron Corp モデル化装置及びモデル解析方法並びにプロセス異常検出・分類システム及びプロセス異常検出・分類方法並びにモデル化システム及びモデル化方法並びに故障予知システム及びモデル化装置の更新方法
JP2006146459A (ja) * 2004-11-18 2006-06-08 Renesas Technology Corp 半導体デバイスの製造方法および製造システム
JP4780715B2 (ja) * 2006-08-01 2011-09-28 東京エレクトロン株式会社 サーバ装置およびプログラム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294831A (ja) * 2005-04-11 2006-10-26 Hitachi Kokusai Electric Inc データ収集システム
US20090276077A1 (en) * 2008-04-30 2009-11-05 Richard Good Method and system for semiconductor process control and monitoring by using pca models of reduced size
CN101621016A (zh) * 2008-07-02 2010-01-06 中芯国际集成电路制造(上海)有限公司 在制造集成电路中用于缺陷检测的方法和系统
CN101739408A (zh) * 2008-11-18 2010-06-16 和舰科技(苏州)有限公司 一种基于半导体测试数据的数据处理方法

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US20120010743A1 (en) 2012-01-12
JP5600503B2 (ja) 2014-10-01
JP2012018990A (ja) 2012-01-26
US9142436B2 (en) 2015-09-22

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Application publication date: 20120125