JP5600503B2 - 統計解析方法、基板処理システムおよびプログラム - Google Patents

統計解析方法、基板処理システムおよびプログラム Download PDF

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Publication number
JP5600503B2
JP5600503B2 JP2010154251A JP2010154251A JP5600503B2 JP 5600503 B2 JP5600503 B2 JP 5600503B2 JP 2010154251 A JP2010154251 A JP 2010154251A JP 2010154251 A JP2010154251 A JP 2010154251A JP 5600503 B2 JP5600503 B2 JP 5600503B2
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Japan
Prior art keywords
representative value
data
value data
substrate processing
monitor data
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JP2010154251A
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English (en)
Japanese (ja)
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JP2012018990A (ja
JP2012018990A5 (enExample
Inventor
一秀 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2010154251A priority Critical patent/JP5600503B2/ja
Priority to US13/175,132 priority patent/US9142436B2/en
Priority to CN2011101938966A priority patent/CN102331996A/zh
Publication of JP2012018990A publication Critical patent/JP2012018990A/ja
Publication of JP2012018990A5 publication Critical patent/JP2012018990A5/ja
Application granted granted Critical
Publication of JP5600503B2 publication Critical patent/JP5600503B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Vapour Deposition (AREA)
JP2010154251A 2010-07-06 2010-07-06 統計解析方法、基板処理システムおよびプログラム Active JP5600503B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010154251A JP5600503B2 (ja) 2010-07-06 2010-07-06 統計解析方法、基板処理システムおよびプログラム
US13/175,132 US9142436B2 (en) 2010-07-06 2011-07-01 Statistical analysis method and substrate process system
CN2011101938966A CN102331996A (zh) 2010-07-06 2011-07-05 统计分析方法和衬底处理系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010154251A JP5600503B2 (ja) 2010-07-06 2010-07-06 統計解析方法、基板処理システムおよびプログラム

Publications (3)

Publication Number Publication Date
JP2012018990A JP2012018990A (ja) 2012-01-26
JP2012018990A5 JP2012018990A5 (enExample) 2013-08-15
JP5600503B2 true JP5600503B2 (ja) 2014-10-01

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Family Applications (1)

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JP2010154251A Active JP5600503B2 (ja) 2010-07-06 2010-07-06 統計解析方法、基板処理システムおよびプログラム

Country Status (3)

Country Link
US (1) US9142436B2 (enExample)
JP (1) JP5600503B2 (enExample)
CN (1) CN102331996A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5841336B2 (ja) * 2011-02-08 2016-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および情報管理方法
JP6262137B2 (ja) * 2012-09-26 2018-01-17 株式会社日立国際電気 統合管理システム、管理装置、基板処理装置の情報表示方法及びプログラム
JP6310260B2 (ja) * 2014-01-20 2018-04-11 株式会社荏原製作所 基板処理装置内の複数の処理ユニットを調整するための調整装置、および該調整装置を備えた基板処理装置
US11138306B2 (en) 2016-03-14 2021-10-05 Amazon Technologies, Inc. Physics-based CAPTCHA
EP3539571B1 (en) 2018-03-16 2023-05-31 Critical Innovations, LLC Systems and methods relating to medical applications of synthetic polymer formulations
JP7570822B2 (ja) * 2020-04-28 2024-10-22 キヤノン株式会社 情報処理装置、及び情報処理方法
KR102482167B1 (ko) * 2022-04-27 2022-12-28 주식회사 솔텍크 서브 컴포넌트 모니터링 시스템 및 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2724082B2 (ja) 1992-12-18 1998-03-09 シャープ株式会社 Ｖｌｓｉプロセスのデータ解析支援システム
US6999836B2 (en) * 2002-08-01 2006-02-14 Applied Materials, Inc. Method, system, and medium for handling misrepresentative metrology data within an advanced process control system
JP2004186445A (ja) 2002-12-03 2004-07-02 Omron Corp モデル化装置及びモデル解析方法並びにプロセス異常検出・分類システム及びプロセス異常検出・分類方法並びにモデル化システム及びモデル化方法並びに故障予知システム及びモデル化装置の更新方法
JP2006146459A (ja) * 2004-11-18 2006-06-08 Renesas Technology Corp 半導体デバイスの製造方法および製造システム
JP2006294831A (ja) * 2005-04-11 2006-10-26 Hitachi Kokusai Electric Inc データ収集システム
JP4780715B2 (ja) 2006-08-01 2011-09-28 東京エレクトロン株式会社 サーバ装置およびプログラム
DE102008021558A1 (de) * 2008-04-30 2009-11-12 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System für die Halbleiterprozesssteuerung und Überwachung unter Verwendung von PCA-Modellen mit reduzierter Grösse
CN101621016B (zh) * 2008-07-02 2011-10-05 中芯国际集成电路制造(上海)有限公司 在制造集成电路中用于缺陷检测的方法和系统
CN101739408A (zh) * 2008-11-18 2010-06-16 和舰科技(苏州)有限公司 一种基于半导体测试数据的数据处理方法

Also Published As

Publication number Publication date
US20120010743A1 (en) 2012-01-12
CN102331996A (zh) 2012-01-25
US9142436B2 (en) 2015-09-22
JP2012018990A (ja) 2012-01-26

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