CN102326211A - 制备金属薄膜的方法 - Google Patents
制备金属薄膜的方法 Download PDFInfo
- Publication number
- CN102326211A CN102326211A CN2009801570349A CN200980157034A CN102326211A CN 102326211 A CN102326211 A CN 102326211A CN 2009801570349 A CN2009801570349 A CN 2009801570349A CN 200980157034 A CN200980157034 A CN 200980157034A CN 102326211 A CN102326211 A CN 102326211A
- Authority
- CN
- China
- Prior art keywords
- metal
- group
- metal film
- acid
- ammonium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 74
- 239000010409 thin film Substances 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims description 165
- 239000002184 metal Substances 0.000 claims description 165
- -1 tetrafluoroborate Chemical compound 0.000 claims description 46
- 238000001354 calcination Methods 0.000 claims description 37
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 25
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 239000002105 nanoparticle Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- 229910052763 palladium Inorganic materials 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 9
- 239000002923 metal particle Substances 0.000 claims description 9
- 229910000765 intermetallic Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 150000002431 hydrogen Chemical class 0.000 claims description 6
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 5
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims description 4
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 4
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 4
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical compound OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 claims description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229920002521 macromolecule Chemical group 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 claims description 4
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- SJUCACGNNJFHLB-UHFFFAOYSA-N O=C1N[ClH](=O)NC2=C1NC(=O)N2 Chemical compound O=C1N[ClH](=O)NC2=C1NC(=O)N2 SJUCACGNNJFHLB-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 239000005864 Sulphur Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 150000003868 ammonium compounds Chemical class 0.000 claims description 3
- 239000002585 base Substances 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 claims description 2
- MFWFDRBPQDXFRC-LNTINUHCSA-N (z)-4-hydroxypent-3-en-2-one;vanadium Chemical compound [V].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O MFWFDRBPQDXFRC-LNTINUHCSA-N 0.000 claims description 2
- QYIGOGBGVKONDY-UHFFFAOYSA-N 1-(2-bromo-5-chlorophenyl)-3-methylpyrazole Chemical compound N1=C(C)C=CN1C1=CC(Cl)=CC=C1Br QYIGOGBGVKONDY-UHFFFAOYSA-N 0.000 claims description 2
- QJDGQRSDUWBFJB-UHFFFAOYSA-N 2-hydroxypropanoic acid;tin Chemical compound [Sn].CC(O)C(O)=O QJDGQRSDUWBFJB-UHFFFAOYSA-N 0.000 claims description 2
- RIQGBMGSBMEAER-UHFFFAOYSA-L CO[Zr](Cl)(Cl)OC Chemical compound CO[Zr](Cl)(Cl)OC RIQGBMGSBMEAER-UHFFFAOYSA-L 0.000 claims description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 2
- 229910002651 NO3 Inorganic materials 0.000 claims description 2
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 229910052776 Thorium Inorganic materials 0.000 claims description 2
- 239000007983 Tris buffer Substances 0.000 claims description 2
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 claims description 2
- CHUYYOSIZBKMJD-UHFFFAOYSA-N acetic acid;gold Chemical compound [Au].CC(O)=O CHUYYOSIZBKMJD-UHFFFAOYSA-N 0.000 claims description 2
- 150000004703 alkoxides Chemical class 0.000 claims description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 claims description 2
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 claims description 2
- 239000011609 ammonium molybdate Substances 0.000 claims description 2
- 235000018660 ammonium molybdate Nutrition 0.000 claims description 2
- 229940010552 ammonium molybdate Drugs 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- ZSIQJIWKELUFRJ-UHFFFAOYSA-N azepane Chemical compound C1CCCNCC1 ZSIQJIWKELUFRJ-UHFFFAOYSA-N 0.000 claims description 2
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- VCJWKFXKILKOEU-UHFFFAOYSA-N boric acid;tin Chemical compound [Sn].OB(O)O VCJWKFXKILKOEU-UHFFFAOYSA-N 0.000 claims description 2
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 claims description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 150000007942 carboxylates Chemical class 0.000 claims description 2
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229940011182 cobalt acetate Drugs 0.000 claims description 2
- 229910021446 cobalt carbonate Inorganic materials 0.000 claims description 2
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 claims description 2
- ZOTKGJBKKKVBJZ-UHFFFAOYSA-L cobalt(2+);carbonate Chemical compound [Co+2].[O-]C([O-])=O ZOTKGJBKKKVBJZ-UHFFFAOYSA-L 0.000 claims description 2
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 claims description 2
- 229940116318 copper carbonate Drugs 0.000 claims description 2
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 2
- 229960004643 cupric oxide Drugs 0.000 claims description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 2
- 125000004802 cyanophenyl group Chemical group 0.000 claims description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 2
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 claims description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 230000014509 gene expression Effects 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 150000002391 heterocyclic compounds Chemical group 0.000 claims description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- RXPAJWPEYBDXOG-UHFFFAOYSA-N hydron;methyl 4-methoxypyridine-2-carboxylate;chloride Chemical compound Cl.COC(=O)C1=CC(OC)=CC=N1 RXPAJWPEYBDXOG-UHFFFAOYSA-N 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 claims description 2
- XHQSLVIGPHXVAK-UHFFFAOYSA-K iron(3+);octadecanoate Chemical compound [Fe+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XHQSLVIGPHXVAK-UHFFFAOYSA-K 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 239000011572 manganese Substances 0.000 claims description 2
- RGVLTEMOWXGQOS-UHFFFAOYSA-L manganese(2+);oxalate Chemical compound [Mn+2].[O-]C(=O)C([O-])=O RGVLTEMOWXGQOS-UHFFFAOYSA-L 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- HZPNKQREYVVATQ-UHFFFAOYSA-L nickel(2+);diformate Chemical compound [Ni+2].[O-]C=O.[O-]C=O HZPNKQREYVVATQ-UHFFFAOYSA-L 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 229910052762 osmium Inorganic materials 0.000 claims description 2
- PZKNFJIOIKQCPA-UHFFFAOYSA-N oxalic acid palladium Chemical compound [Pd].OC(=O)C(O)=O PZKNFJIOIKQCPA-UHFFFAOYSA-N 0.000 claims description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 claims description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 150000003053 piperidines Chemical class 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 2
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 claims description 2
- 229920000083 poly(allylamine) Polymers 0.000 claims description 2
- GGHDAUPFEBTORZ-UHFFFAOYSA-N propane-1,1-diamine Chemical compound CCC(N)N GGHDAUPFEBTORZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- 150000003233 pyrroles Chemical class 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 125000003944 tolyl group Chemical group 0.000 claims description 2
- NESLVXDUKMNMOG-UHFFFAOYSA-N triethoxy-(propyltetrasulfanyl)silane Chemical compound CCCSSSS[Si](OCC)(OCC)OCC NESLVXDUKMNMOG-UHFFFAOYSA-N 0.000 claims description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims description 2
- WGIWBXUNRXCYRA-UHFFFAOYSA-H trizinc;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WGIWBXUNRXCYRA-UHFFFAOYSA-H 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 229910001935 vanadium oxide Inorganic materials 0.000 claims description 2
- 239000011746 zinc citrate Substances 0.000 claims description 2
- 235000006076 zinc citrate Nutrition 0.000 claims description 2
- 229940068475 zinc citrate Drugs 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- SQCOSTXWIKPXIY-UHFFFAOYSA-M CCCCCCCCCCCC[Au]S Chemical compound CCCCCCCCCCCC[Au]S SQCOSTXWIKPXIY-UHFFFAOYSA-M 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 17
- 238000000576 coating method Methods 0.000 abstract description 17
- 238000007639 printing Methods 0.000 abstract description 17
- 150000004696 coordination complex Chemical class 0.000 abstract 1
- 239000010408 film Substances 0.000 description 100
- 238000002360 preparation method Methods 0.000 description 40
- 229920002799 BoPET Polymers 0.000 description 38
- 238000002310 reflectometry Methods 0.000 description 35
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 28
- 150000001875 compounds Chemical class 0.000 description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- 229910052709 silver Inorganic materials 0.000 description 11
- 239000004332 silver Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 206010013786 Dry skin Diseases 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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Abstract
本发明涉及一种形成金属薄膜的方法,具体涉及一种由下述步骤制备的金属薄膜:将含有有机金属络合物的金属油墨涂覆或印刷于基片上,然后在进行焙烧工序的同时,平行进行必要的压力工序。所述方法不仅能够改善膜性能如导电率、反射率和厚度均匀性等,还能显著缩短形成金属薄膜的时间。这些优势使金属薄膜能够高效优质地制备。
Description
技术领域
本发明涉及一种制备金属膜的方法,更具体地,涉及一种通过将含有有机金属络合物的金属油墨涂覆或印刷于基片上,然后在必要地煅烧过程(procedure)中平行进行必需的压力工序(pressure process)制备金属膜的方法。
背景技术
因为在电子部件电路中铅的使用受到了限制,在低阻性金属线路、印刷电路板(PCB)、柔性印刷电路板(FPC)、射频识别(RFID)标签的天线和电磁屏蔽,以及如离子显示屏(PDP)、薄膜晶体管-液晶显示器(TFT-LCD)、有机发光二极管(OLED)、柔性显示器、有机薄膜晶体管(OTFT)等新领域存在对金属膜图案的需要,以及在简单地形成电极方面很有用处,近来金属膜越来越受到人们的关注。
根据一般的方法,金属膜的形成是通过沉积或溅射金属或旋转涂覆含金属的油墨而形成金属层,通过曝光和显影实施光致抗蚀处理而形成所需的图案,然后进行蚀刻直接生产金属膜。然而,上述方法需要进行复杂的处理且不适合形成多层图案。而且,上述方法存在的问题是,由于基片大小的增加使真空沉积设备的发展受到限制,以及在形成图案的时间过程中产生多余物质而导致环境污染。
近来,为克服这些问题,日本专利申请案公开号No.2004-221006(200485)和No.2004-273205(2004.9.30)公开了用纳米微粒、金属粉或金属片、粘结剂用树脂或溶剂制备金属糊剂,或Chem Mater,15,2208(2003)、日本专利申请案公开号No.Hei 11-319538、日本专利申请案公开号No.Hei 2004-256757和美国专利No.4,762,560公开了金属化合物如硝酸银、四氯金酸或硫酸铜与其它化合物在水溶液或有机溶剂中反应而形成胶体或纳米微粒。但是,这些方法因导致高生产成本、稳定性降低、需要复杂的工艺和高煅烧温度而不能适用于各种基片。此外,韩国专利No.2005-0061285公开了一种形成金属图案的方法,其通过使用光催化化合物在基片上形成潜在的图案,然后用所需金属进行电镀。然而,这个方法中潜在图案的活化时间很短,不适合于连续处理。
为了解决上述的缺点,可在形成金属图案后,实施热加压工序。例如,韩国专利No.2002-0081822描述了通过热处理煅烧金属印刷图案,然后进行热加压工序。然而,这个方法仍然存在的问题在于在形成金属膜过程中对金属增密受到限制。
发明内容
技术问题
本发明的一个目的是提供一种制备导电金属膜的方法,其通过将含有有机金属络合物的金属油墨涂覆或印刷于基片上,然后在煅烧过程的一个特定步骤中平行进行必要的压力工序。
本发明的另一个目的是提供一种形成金属图案的方法,该方法能够改善膜性能如导电率、反射率和厚度均匀性等,并且通过在煅烧过程的一个特定步骤中平行进行必要的压力工序而显著缩短形成金属膜的时间。
技术方案
本发明提供一种采用高效方法制备的优质金属膜,该方法更够改善薄膜的性能并且显著缩短形成金属膜的时间。
本发明提供一种制备金属膜的方法,其能够改善膜性能如导电率、反射率和厚度均匀性等,而且能够显著缩短形成金属膜的时间。
下文中将更加详细地描述本发明。
在一般方面,本发明制备金属膜的方法包括:a)将含有有机金属络合物的金属油墨涂覆或印刷于基片上;以及b)在通过煅烧金属油墨而形成金属微粒的过程中,平行进行压力工序,从而形成导电金属膜。
步骤a)中含有有机金属络合物的金属油墨涂覆或印刷于基片上,是将含有有机金属络合物的金属油墨涂覆或印刷于基片上。使用含有机金属络合物的金属油墨的一个原因是在用于形成金属膜的金属微粒于煅烧过程中成为颗粒状的步骤中需要进行压力工序。另一个原因是含有有机金属络合物的金属油墨的优点在于其在溶剂中具有优异的稳定性和良好的可溶性而使得能够形成金属图案,且其能在相对低的温度下溶解,有助于金属图案的形成。
对有机金属络合物的种类没有特别的限制,例如,任何作为一种有机金属可存在于在金属油墨中并能在煅烧过程中通过溶解有机物质而形成金属微粒的有机金属络合物都可用于实现本发明的目的。
特别地,优选使用含有具有特定结构的有机金属络合物的金属油墨,其公开于由本发明发明人递交的韩国专利申请No.2005-34371,因为使用该金属油墨产生的金属膜具有均匀的厚度、优异的导电率和低的煅烧温度,且煅烧后除导电材料外不会留下残余物质。
上述含有有机金属络合物的金属油墨是通过使金属化合物和至少一种下述化合物反应制备的:基于氨基甲酸铵的化合物、基于碳酸铵的化合物和基于碳酸氢铵的化合物,形成金属[基于氨基甲酸铵的化合物、基于碳酸铵的化合物或基于碳酸氢铵的化合物]络合物,从而制备该含有有机金属络合物的金属油墨。同样的制备方法也适用于本发明。
所述含有有机金属络合物的金属油墨包括一种有机金属络合物,所述有机金属络合物通过使由下述化学式1表示的至少一种金属或金属化合物与由下述化学式2、3或4表示的至少一种铵化合物反应而获得:
[化学式1]
MnX
其中,M为金属或金属合金;n为1至10的整数;且X不存在或为至少一种选自下组的取代基:氢、铵、氧、硫、卤素、氰基、氰酸盐、碳酸盐、硝酸盐、亚硝酸盐、硫酸盐、磷酸盐、硫氰酸盐、氯酸盐、高氯酸盐、四氟硼酸盐、乙酰丙酮化物、巯基、酰胺、醇盐、羧酸盐及它们的衍生物。
其中,R1、R2、R3、R4、R5和R6各自独立地选自下组:氢,取代或未取代的C1-C30脂肪族或环状脂肪族烷基、芳基或芳烷基,高分子化合物基团,杂环化合物基团,以及它们的衍生物;且R1和R2或R4和R5彼此相连形成环。
作为一个具体的实施例,当n为1且X不存在时,化学式1的化合物可表示金属如Au、Cu、Zn、Ni、Co、Pd、Pt、Ti、V、Mn、Fe、Cr、Zr、Nb、Mo、W、Ru、Cd、Ta、Re、Os、Ir、Al、Ga、Ge、In、Sn、Sb、Pb、Bi、Sm、Eu、Ac、Th等或它们的合金,在其它情况下,化学式1的化合物可表示金属化合物,例如,氧化铜、氧化锌、氧化钒、硫化镍、氯化钯、碳酸铜、氯化铁、氯化金、氯化镍、氯化钴、硝酸铋、乙酰丙酮钒、醋酸钴、乳酸锡、草酸锰、醋酸金、草酸钯、2-乙基己酸铜、硬脂酸铁、甲酸镍、钼酸铵、柠檬酸锌、醋酸铋、氰化铜、碳酸钴、氯化铂、四氯金酸、钛酸四丁酯、二甲氧基二氯化锆、异丙醇铝、四氟硼酸锡、甲醇钽、十二烷基巯基金(dodecylmercapto gold)和乙酰丙酮铟(acetylaetatee indium)或它们的衍生物。但是,化学式1的化合物并不仅限于此。
在化学式2、3或4中,R1至R6各自的特定实例可包括:氢、甲基、乙基、丙基、异丙基、丁基、异丁基、戊基、己基、乙基己基、庚基、辛基、异辛基、壬基、癸基、十二烷基、十六烷基、十八烷基、二十二烷基(docodecyl)、环丙基、环戊基、环己基、烯丙基、羟基、甲氧基、羟乙基、甲氧基乙基、2-羟丙基、甲氧基丙基、氰乙基、乙氧基、丁氧基、己氧基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、六亚甲基亚胺、吗啉、哌啶、哌嗪、乙二胺、丙二胺、己二胺、三乙烯二胺、吡咯、咪唑、吡啶、羧甲基、三甲氧基甲硅烷基丙基、三乙氧基甲硅烷基丙基、苯基、甲氧基苯基、氰基苯基、苯氧基、甲苯基、苄基和它们的衍生物,以及高分子化合物如聚烯丙胺或聚乙烯亚胺及其衍生物,但不仅限于此。
更具体地,化学式2的基于氨基甲酸铵的化合物的实例可包括:氨基甲酸铵、乙氨基甲酸乙铵、异丙氨基甲酸异丙铵、正丁氨基甲酸正丁铵、异丁氨基甲酸异丁铵、叔丁氨基甲酸叔丁铵、2-乙基己氨基甲酸2-乙基己铵、十八烷基氨基甲酸十八烷基铵、2-甲氧基乙氨基甲酸2-甲氧基乙铵、2-氰基乙氨基甲酸2-氰基乙铵、二丁氨基甲酸二丁铵、二(十八烷基)氨基甲酸二(十八烷基)铵、甲基癸基氨基甲酸甲基癸铵、六亚甲基亚氨基氨基甲酸六亚甲基亚氨基铵、吗啉氨基甲酸吗啉、乙基己氨基甲酸吡啶、异丙氨基甲酸三乙烯二铵、苄氨基甲酸苄铵、三乙氧基甲硅烷基丙氨基甲酸三乙氧基甲硅烷基丙铵等。化学式3的基于碳酸铵的化合物的实例可包括:碳酸铵、乙基碳酸乙铵、异丙基碳酸异丙铵、正丁基碳酸正丁铵、异丁基碳酸异丁铵、叔丁基碳酸叔丁铵、2-乙基己基碳酸2-乙基己铵、2-甲氧基乙基碳酸2-甲氧基乙铵、2-氰基乙基碳酸2-氰基乙铵、十八烷基碳酸十八烷基铵、二丁基碳酸二丁铵、二(十八烷基)碳酸二(十八烷基)铵、甲基癸基碳酸甲基癸铵、六亚甲基亚氨基碳酸六亚甲基亚氨基铵、吗啉碳酸吗啉铵、苄基碳酸苄铵、三乙氧基甲硅烷基丙基碳酸三乙氧基甲硅烷基丙铵、异丙基碳酸三乙烯二铵等。化学式4的基于碳酸盐的化合物的实例可包括:碳酸氢铵、异丙基碳酸氢铵、叔丁基碳酸氢铵、2-乙基己基碳酸氢铵、2-甲氧基乙基碳酸氢铵、2-氰基乙基碳酸氢铵、二(十八烷基)碳酸氢铵、碳酸氢吡啶、碳酸氢三乙铵等。
有机金属络合物是通过使上述制备的基于氨基甲酸铵、基于碳酸铵或基于碳酸氢铵的化合物与金属或金属化合物反应而制备。本发明所用的油墨组合物可包括上述有机金属络合物和金属或非金属化合物,或者可包括其中一种或多种的混合物以及,如果必要,可包括添加剂如溶剂、稳定剂、分散剂、粘结剂树脂、脱模剂、还原剂、表面活性剂、润湿剂、触变剂或均化剂。
金属油墨中所含的溶剂可选自:水、醇、乙二醇、醋酸盐、乙醚、酮,以及脂肪族烃、芳香族烃或卤代烃类的溶剂,更具体地,可为选自下组中的至少一种:水、甲醇、乙醇、异丙醇、1-甲氧基丙醇、丁醇、乙基己醇、松油醇、乙二醇、甘油、乙酸乙酯、乙酸丁酯、甲氧基丙基乙酸酯、卡必醇乙酸酯、乙基卡必醇乙酸酯、甲基溶纤剂、丁基溶纤剂、乙醚、四氢呋喃、二噁烷、甲基乙基酮、丙酮、二甲基甲酰胺、1-甲基-2-吡咯烷酮、二甲亚砜、己烷、庚烷、十二烷、石蜡油、松香水、苯、甲苯、二甲苯、氯仿、二氯甲烷、四氯化碳和乙腈。
对于本发明所用的基片,可使用满足本发明特性的任何基片。该基片的实例可包括:塑料类如聚酰亚胺(PI)、聚对苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚醚砜(PES)、尼龙、聚四氟乙烯(PTFE)、聚醚醚酮(PEEK)、聚乙烯醇(PVA)、聚乙烯(PE)、聚丙烯(PP)、聚碳酸酯(PC)、聚芳酯(PAR)等,树脂类如各种丙烯酸、尿烷、氟、环氧有机硅、乙烯树脂等,橡胶材料如丁基橡胶、氯丁橡胶、SBR、EPR、SIS橡胶等,各种陶瓷材料如玻璃、二氧化硅、氧化铝、三氧化钛、氧化锆、二氧化铈、粘土、石头、滑石、云母等,各种金属或合金如铝、铜、镍、铁、锌、不锈钢、黄铜等,非金属或金属盐化合物如碳、石墨、碳纳米管、硅、硫磺、盐、硫酸钡等,各种纸如合成纸、照相纸、包装纸、瓦楞纸等,以及由这些材料构成的各种复合材料,但不仅限于此。此外,该基片的形式或形状的实例可包括:粉末、薄片、珠子、球、纤维、膜、箔、片状、芯片、杆状、线状、针状、晶须等,但不仅限于此。
根据油墨的物理性质和基片的类型,涂覆或印刷该含有有机金属络合物的金属油墨的方法可包括:例如,旋转涂布、辊涂、喷涂、浸涂、流涂、刮刀涂布、吻合涂布、模压涂布、刮板涂布、滴涂、喷墨印刷、胶版印刷、丝网印刷、移印、凹版印刷、柔版印刷、模板印刷、盖印、静电印刷、平版印刷、流化床涂布、原子层沉积(ALD)、化学气相沉积(CVD)、物理气相沉积(PVD)、等离子涂布、静电涂布、电沉积涂布等。可不受具体限制地使用任何适于本发明的方法。
同时,在使用上述方法涂覆或印刷时,涂覆或印刷的厚度优选,但不限于,1纳米至100微米,更优选为10-50微米。可通过调节金属油墨的浓度、印刷量或印刷速度而控制其印刷厚度。
在通过煅烧金属油墨而形成金属微粒的过程中,平行进行压力工序,从而形成导电金属膜,是指将金属油墨涂覆或印刷于基片上,然后,在煅烧工序中当金属微粒形成时,平行进行压力工序从而形成金属膜的步骤。
对于煅烧方法,在涂覆或印刷后可使用氧化或还原处理或者热处理,热空气、微波、红外线、紫外线、电子射线、激光等。通过平行进行压力工序如在煅烧工序中加压或解压而形成导电金属膜。
对于在涂覆或印刷后的煅烧工序中施加压力的具体方法,可以使用任何直接或间接施加压力的方法,例如可使用气体如空气或氮气的加压法,使用传送带、辊轴或压力机的压制法,使用真空室的方法,气体喷射法等。
所述压力工序可优选在涂覆或印刷金属油墨后的煅烧工序进行中,更优选在挥发性液体被大部分清除时实施,这样由于该压力工序可使得金属膜的形状不会扩散或散开。例如,当通过旋转涂布将透明的银络合物油墨涂覆后,接着在120℃或以上温度的热空气干燥箱中煅烧,在本发明的金属油墨制备方法中,构成该有机金属络合物的挥发性溶剂和物质在室温下是稳定的,而随着温度的升高它们被挥发或分解,最终形成纳米微粒。这些纳米微粒通过一个互相烧结过程形成大的颗粒,最终当它们成为金属膜时通过表面等离子共振而呈现出颜色。在本发明中,其颜色按顺序主要呈现为棕色-蓝色-黄色-银色。也就是说,在银微粒形成时呈现棕色,而在煅烧过程中显示颜色的变化取决于颗粒的大小,最终银颗粒的增大结束而呈现出银色。
这样,当金属微粒形成时,与压力工序在煅烧工序完成后实施相比,该煅烧工序最后与压力工序平行实施,从而得到的金属膜因其致密的金属结构而具有优异的导电率,且因其均匀的表面粗糙度而具有优异的反射率。这些效果的主要原因被认为是源于一个事实,即该压力工序有助于煅烧工序中产生的或此前就存在于金属油墨中的金属纳米微粒迅速且必然地互相烧结,从而产生最大化的协同效应。
该压力工序的温度为50至600℃,优选为80至500℃,更优选为100至500℃,考虑到基片的性能,在此范围内基片和金属膜不会受到损坏。此外,为使金属膜均匀,优选于上述范围内在低温和高温下分2或3个阶段实施该压力工序。例如,优选于80至150℃温度下实施该压力工序5秒,或于150至300℃温度下实施该压力工序15秒。该压力工序可通过使用加压工序或解压工序,或者使用加压工序和解压工序两者来实施。考虑到基片的性能,该加压工序或解压工序的压力水平可在基片和金属膜不受到损坏的温度范围内,但该加压工序的压强水平范围为1Kg/cm2至5000Kg/cm2,而该解压工序的压强水平范围为102托至10-6托。
该煅烧的金属膜厚度受到很大限制,但其可为0.005至20微米,优选为0.01至15微米,更优选为0.05至5微米。
金属膜的厚度、导电率、反射率、表面粗糙度、粘合强度等可以通过调节压力工序的温度、压力和处理时间而控制。
有益效果
如上所述,根据本发明,当金属微粒形成时通过最终与压力工序平行进行煅烧工序而形成的金属膜,其因致密的金属结构而具有优异的导电率,且因均匀的表面粗糙度而具有优异的反射率,因为该压力工序有助于煅烧工序中产生的或此前就存在于金属油墨中的金属纳米微粒迅速进行互相烧结。
而且,本发明制备导电金属膜的方法可改善膜性能如导电率、反射率和厚度均匀性等,并且显著缩短形成金属膜的时间。
附图说明
图1所示为根据实施例1通过平行进行压力工序而制备的金属膜表面的SEM图;以及
图2所示为根据比较例1通过仅进行煅烧工序而制备的金属膜表面的SEM图。
具体实施方式
下面将结合实施例更加详细地描述本发明。但是,下列实施例仅用于说明本发明,因而并不限制本发明的权利要求。
[制备例1]金属油墨1的制备
将2-乙基己氨基甲酸2-乙基己铵和丁氨基甲酸丁铵以摩尔比7∶3混合的34.89g(129.8毫摩尔)粘性液体置于带有搅拌器的250mLSchlenk烧瓶中,然后向其中加入12.03g(51.92毫摩尔)氧化银(奥德里奇(Aldrich)公司生产)。于室温搅拌2小时使所得混合物进行反应。随着反应进行,最初为黑色的浆液变淡产生络合物,最终得到46.92g透明液体状黄色银络合物,热重量分析(TGA)结果显示其银含量为23.65wt%。用IPA稀释该银络合物溶液制得金属油墨溶液1,其银含量为10wt%,粘度为14cps。
[制备例2]金属油墨2的制备
将58.93g制备例1制备的金属油墨和41.07g银纳米微粒(Ferro公司生产)置于带有搅拌器的250mL Schlenk烧瓶中,然后首先于室温下搅拌30分钟。该搅拌过的液体再通过三杆辊式捏合机搅拌,从而制得金属油墨,其银含量为55wt%,粘度为6000cps(Brook Field DV Ⅱpro(博力飞粘度计),15转子(spindle),50rpm)。
[制备例3]金属油墨3的制备
在带有搅拌器的250mL Schlenk烧瓶里,将1.00g(7.71毫摩尔)氯化镍(II)六水合物溶解于5.00mL水溶液中,然后将由5.83g(19.27毫摩尔)2-乙基己氨基甲酸2-乙基己铵粘性液体溶于10.00mL苯中形成的溶液加入到该氯化镍(II)水溶液中。于室温剧烈搅拌2小时使所得混合物进行反应。随着反应进行,该反应混合物由起初的绿色浆液变为白色浆液。反应完成后,无色透明的水溶液相和绿色透明的有机溶剂相彼此分开。仅提取有机溶剂相,然后在真空条件下除去所有溶剂,从而得到4.73g深绿色镍络合物,热重量分析(TGA)结果显示其镍含量为14.54wt%。用IPA稀释该镍络合物溶液制得金属油墨溶液3,其镍含量为10wt%,粘度为17cps。
[制备例4]制备金属油墨4
在带有搅拌器的250mL Schlenk烧瓶里,将1.00g(5.64毫摩尔)氯化钯溶解于5.00mL水溶液中,然后将由1.71g(16.92毫摩尔)2-乙基己氨基甲酸2-乙基己铵粘性液体溶于5.00mL乙酸乙酯中形成的溶液加入到该氯化钯(II)水溶液中。于室温剧烈搅拌2小时使所得混合物进行反应。随着反应进行,该反应混合物由起初的红色浆液变为无色浆液。反应完成后,无色透明的水溶液相和无色透明的有机溶剂相彼此分开。仅提取有机溶剂相,然后在真空条件下除去所有溶剂,从而得到2.22g透明的黄色钯络合物,热重量分析(TGA)结果显示其钯含量为10.08wt%。用甲醇稀释该钯络合物溶液制得金属油墨溶液4,其钯含量为8.5wt%,粘度为25cps。
[实施例1]
为了制备导电金属膜,准备好5cm乘以5cm用于金属箔的PET膜。然后,用乙醇将PET膜表面的灰尘除去,将该PET膜置于烘箱内于50℃干燥5分钟。将5ml制备例1制备的金属油墨1应用于该PET膜上,用旋转涂布机以500rpm旋转20秒,从而将该PET膜表面涂布。所得的PET膜于130℃进行热处理工序7秒,期间在金属膜呈现蓝色时使用20Kg/cm2的热压缩机以140℃平行进行加压工序45秒,从而最终制备出完成了煅烧工序的银金属膜。所制备金属膜的薄层电阻和反射率结果如表1所示。
[比较例1]
为了制备导电金属膜,准备好5cm乘以5cm的PET膜。然后,用乙醇将PET膜表面的灰尘除去,将该PET膜置于烘箱内50℃干燥5分钟。将5ml制备例1制备的金属油墨1应用于该PET膜上,用旋转涂布机以500rpm旋转20秒,从而将该PET膜表面涂布。所得的PET膜于150℃进行热处理工序3分钟,从而制得银金属膜。然后,使用20Kg/cm2的热压缩机以140℃进行热加压45秒,从而制得银金属膜。用SEM验证所制备金属膜的表面,其薄层电阻和反射率结果如图1和表1所示。
[表1]
颜色1 | 薄层电阻2(Ω/□) | 反射率3(%) | |
实施例1 | 蓝色 | 0.31 | 99.47 |
比较例1 | 银色 | 0.40 | 96.01 |
1.开始压力工序时金属膜的颜色
2.形成金属膜后的导电率(测量设备:CMT-SR/1000N/4探头型)
3.形成金属膜后的反射率(测量设备:Cary5000 UV-Vis-NIR光谱仪)
如图1和表1所示,在煅烧工序期间进行的该压力工序,有助于煅烧工序中产生的或此前就存在于金属油墨中的金属纳米微粒迅速且必然地互相烧结,从而制备出优质的金属膜,其因致密的金属结构使薄层电阻降低了0.1,且因均匀的表面粗糙度使反射率增加了3.4%。
[实施例2]
为制备导电金属膜,准备好玻璃片。然后,用乙醇将玻璃片表面的灰尘除去,将该玻璃片置于烘箱内50℃干燥5分钟。使用400-目的丝网印刷将制备例2制备的金属油墨2印刷于该玻璃片上。将该玻璃基片于130℃进行热处理工序10分钟,期间在金属膜呈现黄色时使用70Kg/cm2的热压缩机以150℃对该玻璃片进行热压30秒,从而最终制备出煅烧后的金属膜。用SEM验证所制备金属膜的表面,其薄层电阻和反射率结果如表2所示。
[比较例2]
为制备导电金属膜,准备好玻璃片。然后,用乙醇将玻璃片表面的灰尘去除,将该玻璃片置于烘箱内50℃干燥5分钟。使用400-目的丝网印刷将制备例2制备的金属油墨2印刷于该玻璃片上。将该玻璃基片于150℃煅烧3分钟而制备银金属膜。然后,使用70Kg/cm2的热压缩机以150℃对该银金属膜进行热压30秒,从而最终制备出金属膜。所制备金属膜的薄层电阻和反射率结果如表2所示。
[表2]
颜色1 | 导电率2(Ω/□) | 反射率3(%) | |
实施例2 | 黄色 | 0.12 | 90.94 |
比较例2 | 银色 | 0.29 | 60.23 |
1.开始压力工序时金属膜的颜色
2.形成金属膜后的导电率(测量设备:CMT-SR/1000N/4探头型)
3.形成金属膜后的反射率(测量设备:Cary5000 UV-Vis-NIR光谱仪)
如表2所示,在煅烧工序期间进行的压力工序,有助于煅烧工序中产生的或此前就存在于金属油墨中的金属纳米微粒迅速且必然地互相烧结,从而制备出优质的金属膜,其因致密的金属结构使薄层电阻降低了0.17,且因均匀的表面粗糙度使反射率增加了30%。
[实施例3]用传送带压缩机制备的金属膜的导电率和反射率
对进行压力工序(传送带压缩机)的导电金属膜的物理性质、薄层电阻和反射率进行测量。为制备导电金属膜,准备好宽300mm、长200mm的PET膜,然后,使用微凹版涂布机以20m/s的速度将制备例1制备的金属油墨1印刷于其上。所得PET膜于130℃进行热处理工序7秒,期间在金属膜呈现蓝色时使用40Kg/cm2的传送带压缩机以150℃进行热加压工序30秒,从而最终制备出完成了煅烧工序的银金属膜。所制备金属膜的薄层电阻和反射率结果如表3所示。
[实施例4]用真空干燥箱制备的金属膜的导电率和反射率
对进行过压力工序(真空烘箱)的导电金属膜的物理性质、薄层电阻和反射率进行测量。为制备导电金属膜,准备好5cm乘以5cm的PET膜以制备金属箔。然后,用乙醇将PET膜表面的灰尘去除,将该PET膜置于烘箱内50℃干燥5分钟。将5ml制备例1制备的金属油墨1应用于该PET膜上,旋转涂布机以500rpm旋转20秒,从而将该PET膜表面涂布。所得的PET膜于130℃进行热处理工序7秒,期间在金属膜呈现蓝色时使用10-3托的真空烘箱以150℃平行进行加压工序50秒,从而最终制备出完成了煅烧工序的银金属膜。所制备金属膜的薄层电阻和反射率结果如表3所示。
[实施例5]用充氮室制备的金属膜的导电率和反射率
对进行过压力工序(充氮室)的导电金属膜的物理性质、薄层电阻和反射率进行测量。为制备导电金属膜,准备好5cm乘以5cm的PET膜以制备金属箔。然后,用乙醇将PET膜表面的灰尘去除,将该PET膜置于烘箱内50℃干燥5分钟。将5ml制备例1制备的金属油墨1应用于该PET膜上,旋转涂布机以500rpm旋转20秒,从而将该PET膜表面涂布。所得的PET膜于130℃进行热处理工序6秒,期间在金属膜呈现蓝色时使用压强为50Kg/cm2的充氮室以150℃平行进行加压工序40秒,从而最终制备出完成了煅烧工序的银金属膜。所制备金属膜的薄层电阻和反射率结果如表3所示。
[表3]
颜色1 | 薄层电阻2(Ω/□) | 反射率3(%) | |
实施例3 | 蓝色 | 0.25 | 99.50 |
实施例4 | 蓝色 | 0.35 | 98.20 |
实施例5 | 蓝色 | 0.30 | 98.70 |
1.开始压力工序时金属膜的颜色
2.形成金属膜后的导电率(测量设备:CMT-SR/1000N/4探头型)
3.形成金属膜后的反射率(测量设备:Cary5000 UV-Vis-NIR光谱仪)
如表3所验证,考虑到基片的特性而选择合适的压力工序,在实施例3-6中该压力工序通过加压或解压使得金属膜各自因其致密金属结构而具有0.3或更小的薄层电阻,同样,不考虑根据基片特性的压力工序差异,其反射率为98%或更高。
[实施例6]
对于根据含有有机金属络合物的金属油墨种类有关压力工序的金属膜的薄层电阻和反射率进行测量。为制备导电金属膜,准备好5cm乘以5cm的PET膜。然后,用乙醇将PET膜表面的灰尘除去,将该PET膜置于烘箱内50℃干燥5分钟。将5ml制备例3制备的金属油墨3应用于该PET膜上,用旋转涂布机以500rpm旋转20秒,从而将该PET膜表面涂布。所得的PET膜于130℃进行热处理工序12秒,期间在金属膜呈现灰色时使用压强为70Kg/cm2的热压缩机以150℃进行热加压工序30秒,从而最终制备出完成了煅烧工序的灰色金属膜。所制备金属膜的薄层电阻和反射率结果如表4所示。
[实施例7]
对于根据含有有机金属络合物的金属油墨种类有关压力工序的金属膜的薄层电阻和反射率进行测量。为制备导电金属膜,准备好5cm乘以5cm的PET膜。然后,用乙醇将PET膜表面的灰尘去除,将该PET膜置于烘箱内50℃干燥5分钟。将5ml制备例4制备的金属油墨4应用于该PET膜上,用旋转涂布机以500rpm旋转20秒,从而将该PET膜表面涂布。所得的PET膜于130℃进行热处理工序10秒,期间在金属膜呈现深灰色时使用压强为70Kg/cm2的热压缩机以150℃进行热加压工序30秒,从而最终制备出完成了煅烧工序的灰色金属膜。所制备金属膜的薄层电阻和反射率结果如表4所示。
[表4]
颜色1 | 薄层电阻2(Ω/□) | 反射率3(%) | |
实施例6 | 灰色 | 1.5 | 75.25 |
实施例7 | 深灰色 | 1.9 | 73.39 |
1.开始压力工序时金属膜的颜色
2.形成金属膜后的导电率(测量设备:CMT-SR/1000N/4探头型)
3.形成金属膜后的反射率(测量设备:Cary5000 UV-Vis-NIR光谱仪)
如表4所验证,甚至在使用通过使金属化合物如氯化钯和氯化镍与氨基甲酸铵类化合物如乙基氨基甲酸乙基铵反应得到的有机金属络合物时,通过平行进行压力工序而制备的金属膜的导电率和反射率都很优异。
Claims (9)
1.一种制备金属膜的方法,其特征在于,包括:
a)将含有有机金属络合物的金属油墨涂覆或印刷于基片上;以及
b)于步骤(a)之后,在通过煅烧金属油墨而形成金属微粒的过程中,平行进行压力工序,从而形成导电金属薄膜。
2.根据权利要求1所述的方法,其特征在于,所述压力工序通过至少一种选自下述的方法实施:使用气体的加压法,使用传送带、辊轴或压力机的压制法,以及使用真空室的方式。
3.根据权利要求2所述的方法,其特征在于,所述压力工序采用加压工序或解压工序,或采用加压和解压两道工序。
4.根据权利要求3所述的方法,其特征在于,所述加压工序在1Kg/cm2至5000Kg/cm2的压强下实施。
5.根据权利要求3所述的方法,其中所述解压工序在102托至10-6托的压强下实施。
6.根据权利要求1所述的方法,其特征在于,所述有机金属络合物是通过使由下述化学式1表示的至少一种金属或金属化合物与由下述化学式2、3或4表示的至少一种铵化合物反应而获得:
[化学式1]
MnX
其中,M为金属或金属合金;n为1至10的整数;且X不存在或为至少一种选自下组的取代基:氢、铵、氧、硫、卤素、氰基、氰酸盐、碳酸盐、硝酸盐、亚硝酸盐、硫酸盐、磷酸盐、硫氰酸盐、氯酸盐、高氯酸盐、四氟硼酸盐、乙酰丙酮化物、巯基、酰胺、醇盐、羧酸盐及它们的衍生物。
[化学式2]
其中,R1、R2、R3、R4、R5和R6各自独立地选自下组:氢,取代或未取代的C1-C30脂肪族或环状脂肪族烷基、芳基或芳烷基,高分子化合物基团,杂环化合物基团,以及它们的衍生物;且R1和R2或R4和R5彼此相连形成环。
7.根据权利要求6所述的方法,其特征在于,所述金属或金属化合物包括至少一种选自下组的组分:Au、Cu、Zn、Ni、Co、Pd、Pt、Ti、V、Mn、Fe、Cr、Zr、Nb、Mo、W、Ru、Cd、Ta、Re、Os、Ir、Al、Ga、Ge、In、Sn、Sb、Pb、Bi、Sm、Eu、Ac、Th、氧化铜、氧化锌、氧化钒、硫化镍、氯化钯、碳酸铜、氯化铁、氯化金、氯化镍、氯化钴、硝酸铋、乙酰丙酮钒、醋酸钴、乳酸锡、草酸锰、醋酸金、草酸钯、2-乙基己酸铜、硬脂酸铁、甲酸镍、钼酸铵、柠檬酸锌、醋酸铋、氰化铜、碳酸钴、氯化铂、四氯金酸、钛酸四丁酯、二甲氧基二氯化锆、异丙醇铝、四氟硼酸锡、甲醇钽、十二烷基巯基金和乙酰丙酮铟。
8.根据权利要求6所述的方法,其特征在于,所述铵化合物的R1至R6包括至少一种选自下组的基团:氢、甲基、乙基、丙基、异丙基、丁基、异丁基、戊基、己基、乙基己基、庚基、辛基、异辛基、壬基、癸基、十二烷基、十六烷基、十八烷基、二十二烷基、环丙基、环戊基、环己基、烯丙基、羟基、甲氧基、羟乙基、甲氧基乙基、2-羟丙基、甲氧基丙基、氰乙基、乙氧基、丁氧基、己氧基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、六亚甲基亚胺、吗啉、哌啶、哌嗪、乙二胺、丙二胺、己二胺、三乙烯二胺、吡咯、咪唑、吡啶、羧甲基、三甲氧基甲硅烷基丙基、三乙氧基甲硅烷基丙基、苯基、甲氧基苯基、氰基苯基、苯氧基、甲苯基、苄基和它们的衍生物,以及高分子化合物如聚烯丙胺或聚乙烯亚胺及其衍生物。
9.根据权利要求1所述的方法,其特征在于,所述形成金属微粒的过程是当有机金属络合物被还原形成金属纳米微粒的时刻或金属纳米微粒形成的过程。
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CN113924629B (zh) * | 2019-06-12 | 2024-04-09 | 京都一来电子化学股份有限公司 | 导电性膏体组合物 |
CN110648844A (zh) * | 2019-09-26 | 2020-01-03 | 浙江星隆电子材料有限公司 | 一种金属化薄膜的制备方法 |
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