CN102237262A - 处理装置、处理系统以及坐标校正方法 - Google Patents

处理装置、处理系统以及坐标校正方法 Download PDF

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Publication number
CN102237262A
CN102237262A CN2011101134762A CN201110113476A CN102237262A CN 102237262 A CN102237262 A CN 102237262A CN 2011101134762 A CN2011101134762 A CN 2011101134762A CN 201110113476 A CN201110113476 A CN 201110113476A CN 102237262 A CN102237262 A CN 102237262A
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CN
China
Prior art keywords
substrate
coordinates
inspection
actual
measurement
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CN2011101134762A
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English (en)
Chinese (zh)
Inventor
菅义明
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Olympus Corp
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Olympus Corp
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Application filed by Olympus Corp filed Critical Olympus Corp
Publication of CN102237262A publication Critical patent/CN102237262A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/004—Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
CN2011101134762A 2010-04-30 2011-04-29 处理装置、处理系统以及坐标校正方法 Pending CN102237262A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010105475A JP5663192B2 (ja) 2010-04-30 2010-04-30 処理装置、座標補正方法および座標補正プログラム
JP2010-105475 2010-04-30

Publications (1)

Publication Number Publication Date
CN102237262A true CN102237262A (zh) 2011-11-09

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ID=44887797

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CN2011101134762A Pending CN102237262A (zh) 2010-04-30 2011-04-29 处理装置、处理系统以及坐标校正方法

Country Status (4)

Country Link
JP (1) JP5663192B2 (https=)
KR (1) KR20110121571A (https=)
CN (1) CN102237262A (https=)
TW (1) TWI519777B (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103075970A (zh) * 2012-12-27 2013-05-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
CN103292709A (zh) * 2013-05-24 2013-09-11 深圳市华星光电技术有限公司 测长机日常检测与自动补正方法
US9080865B2 (en) 2012-12-27 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Orthogonality compensation method for length measurement device and length measurement device using same
CN105047581A (zh) * 2014-04-25 2015-11-11 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
CN106814307A (zh) * 2017-01-10 2017-06-09 深圳鼎缘电子科技有限公司 一种腔体滤波器自动调试方法及系统
CN108226179A (zh) * 2018-01-10 2018-06-29 京东方科技集团股份有限公司 自动光学检测设备的校准方法及自动修复系统
US10106891B2 (en) 2014-04-15 2018-10-23 Hitachi Kokusai Electric Inc. Substrate processing apparatus, non-transitory computer-readable recording medium thereof and semiconductor manufacturing method by employing thereof
CN110111383A (zh) * 2018-05-08 2019-08-09 广东聚华印刷显示技术有限公司 玻璃基板的偏移校正方法、装置和系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112666164B (zh) * 2020-11-23 2023-06-16 上海新时达机器人有限公司 针对多品类混线生产控制柜的机器人视觉检测方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030053676A1 (en) * 2001-09-13 2003-03-20 Atsushi Shimoda Image detection method and its apparatus and defect detection method and its apparatus
JP2005037138A (ja) * 2003-07-15 2005-02-10 Nikon Corp 位置ずれ測定装置
JP2005310833A (ja) * 2004-04-16 2005-11-04 Olympus Corp 基板検査装置および方法
CN101179044A (zh) * 2006-11-07 2008-05-14 中芯国际集成电路制造(上海)有限公司 一种新型晶圆定位偏移纠正方法
JP2009300230A (ja) * 2008-06-12 2009-12-24 Olympus Corp 位置合わせを行う装置、方法、およびプログラム、ならびに基準モデルを作成する装置、方法、およびプログラム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002107137A (ja) * 2000-09-29 2002-04-10 Toshiba Corp 検査ステージの制御方法
JP3903889B2 (ja) * 2001-09-13 2007-04-11 株式会社日立製作所 欠陥検査方法及びその装置並びに撮像方法及びその装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030053676A1 (en) * 2001-09-13 2003-03-20 Atsushi Shimoda Image detection method and its apparatus and defect detection method and its apparatus
JP2005037138A (ja) * 2003-07-15 2005-02-10 Nikon Corp 位置ずれ測定装置
JP2005310833A (ja) * 2004-04-16 2005-11-04 Olympus Corp 基板検査装置および方法
CN101179044A (zh) * 2006-11-07 2008-05-14 中芯国际集成电路制造(上海)有限公司 一种新型晶圆定位偏移纠正方法
JP2009300230A (ja) * 2008-06-12 2009-12-24 Olympus Corp 位置合わせを行う装置、方法、およびプログラム、ならびに基準モデルを作成する装置、方法、およびプログラム

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103075970B (zh) * 2012-12-27 2015-07-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
US9080865B2 (en) 2012-12-27 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Orthogonality compensation method for length measurement device and length measurement device using same
CN103075970A (zh) * 2012-12-27 2013-05-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
CN103292709A (zh) * 2013-05-24 2013-09-11 深圳市华星光电技术有限公司 测长机日常检测与自动补正方法
CN103292709B (zh) * 2013-05-24 2015-09-09 深圳市华星光电技术有限公司 测长机日常检测与自动补正方法
US10106891B2 (en) 2014-04-15 2018-10-23 Hitachi Kokusai Electric Inc. Substrate processing apparatus, non-transitory computer-readable recording medium thereof and semiconductor manufacturing method by employing thereof
CN105047581A (zh) * 2014-04-25 2015-11-11 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
US11104992B2 (en) 2014-04-25 2021-08-31 Kokusai Electric Corporation Substrate processing apparatus, non-transitory computer-readable recording medium thereof and semiconductor manufacturing method by employing thereof
CN106814307A (zh) * 2017-01-10 2017-06-09 深圳鼎缘电子科技有限公司 一种腔体滤波器自动调试方法及系统
CN108226179B (zh) * 2018-01-10 2021-01-22 京东方科技集团股份有限公司 自动光学检测设备的校准方法及自动修复系统
CN108226179A (zh) * 2018-01-10 2018-06-29 京东方科技集团股份有限公司 自动光学检测设备的校准方法及自动修复系统
CN110111383A (zh) * 2018-05-08 2019-08-09 广东聚华印刷显示技术有限公司 玻璃基板的偏移校正方法、装置和系统
CN110111383B (zh) * 2018-05-08 2022-03-18 广东聚华印刷显示技术有限公司 玻璃基板的偏移校正方法、装置和系统

Also Published As

Publication number Publication date
KR20110121571A (ko) 2011-11-07
TWI519777B (zh) 2016-02-01
TW201207382A (en) 2012-02-16
JP5663192B2 (ja) 2015-02-04
JP2011232298A (ja) 2011-11-17

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Application publication date: 20111109