TWI519777B - Processing device, processing system and coordinate correction method - Google Patents

Processing device, processing system and coordinate correction method Download PDF

Info

Publication number
TWI519777B
TWI519777B TW100113161A TW100113161A TWI519777B TW I519777 B TWI519777 B TW I519777B TW 100113161 A TW100113161 A TW 100113161A TW 100113161 A TW100113161 A TW 100113161A TW I519777 B TWI519777 B TW I519777B
Authority
TW
Taiwan
Prior art keywords
inspection
measurement
substrate
coordinates
sample
Prior art date
Application number
TW100113161A
Other languages
English (en)
Chinese (zh)
Other versions
TW201207382A (en
Inventor
菅義明
Original Assignee
奧林巴斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奧林巴斯股份有限公司 filed Critical 奧林巴斯股份有限公司
Publication of TW201207382A publication Critical patent/TW201207382A/zh
Application granted granted Critical
Publication of TWI519777B publication Critical patent/TWI519777B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/004—Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
TW100113161A 2010-04-30 2011-04-15 Processing device, processing system and coordinate correction method TWI519777B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010105475A JP5663192B2 (ja) 2010-04-30 2010-04-30 処理装置、座標補正方法および座標補正プログラム

Publications (2)

Publication Number Publication Date
TW201207382A TW201207382A (en) 2012-02-16
TWI519777B true TWI519777B (zh) 2016-02-01

Family

ID=44887797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100113161A TWI519777B (zh) 2010-04-30 2011-04-15 Processing device, processing system and coordinate correction method

Country Status (4)

Country Link
JP (1) JP5663192B2 (https=)
KR (1) KR20110121571A (https=)
CN (1) CN102237262A (https=)
TW (1) TWI519777B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103075970B (zh) * 2012-12-27 2015-07-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
US9080865B2 (en) 2012-12-27 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Orthogonality compensation method for length measurement device and length measurement device using same
CN103292709B (zh) * 2013-05-24 2015-09-09 深圳市华星光电技术有限公司 测长机日常检测与自动补正方法
JP5808454B1 (ja) 2014-04-25 2015-11-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
CN105047581A (zh) * 2014-04-25 2015-11-11 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
CN106814307B (zh) * 2017-01-10 2020-05-12 深圳鼎缘电子科技有限公司 一种腔体滤波器自动调试方法及系统
CN108226179B (zh) * 2018-01-10 2021-01-22 京东方科技集团股份有限公司 自动光学检测设备的校准方法及自动修复系统
CN110111383B (zh) * 2018-05-08 2022-03-18 广东聚华印刷显示技术有限公司 玻璃基板的偏移校正方法、装置和系统
CN112666164B (zh) * 2020-11-23 2023-06-16 上海新时达机器人有限公司 针对多品类混线生产控制柜的机器人视觉检测方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002107137A (ja) * 2000-09-29 2002-04-10 Toshiba Corp 検査ステージの制御方法
JP3903889B2 (ja) * 2001-09-13 2007-04-11 株式会社日立製作所 欠陥検査方法及びその装置並びに撮像方法及びその装置
US7127098B2 (en) * 2001-09-13 2006-10-24 Hitachi, Ltd. Image detection method and its apparatus and defect detection method and its apparatus
JP4207689B2 (ja) * 2003-07-15 2009-01-14 株式会社ニコン 位置ずれ測定装置
JP2005310833A (ja) * 2004-04-16 2005-11-04 Olympus Corp 基板検査装置および方法
CN100547757C (zh) * 2006-11-07 2009-10-07 中芯国际集成电路制造(上海)有限公司 一种新型晶圆定位偏移纠正方法
JP2009300230A (ja) * 2008-06-12 2009-12-24 Olympus Corp 位置合わせを行う装置、方法、およびプログラム、ならびに基準モデルを作成する装置、方法、およびプログラム

Also Published As

Publication number Publication date
KR20110121571A (ko) 2011-11-07
TW201207382A (en) 2012-02-16
JP5663192B2 (ja) 2015-02-04
JP2011232298A (ja) 2011-11-17
CN102237262A (zh) 2011-11-09

Similar Documents

Publication Publication Date Title
TWI519777B (zh) Processing device, processing system and coordinate correction method
TWI784018B (zh) 用於使用半導體製造程序中之深度學習預測缺陷及臨界尺寸之系統及方法
US20080144922A1 (en) Pattern alignment method, pattern inspection apparatus, and pattern inspection system
US7898653B2 (en) Foreign matter inspection apparatus
US20090259337A1 (en) Robot Position Calibration Tool (RPCT)
US20160292839A1 (en) Inspection method, inspection apparatus, and inspection system
CN103180691A (zh) 形状测定装置、形状测定方法、构造物的制造方法及程序
US10901391B1 (en) Multi-scanning electron microscopy for wafer alignment
JP5154527B2 (ja) 異物検査装置
US20140294283A1 (en) Inspection method and inspection apparatus
CN109580658A (zh) 检查方法及检查装置
JP2008153572A (ja) 異物検査装置
TW202205370A (zh) 程序控制之晶粒內度量衡方法及系統
JP6903133B2 (ja) 複数イメージ粒子検出のシステム及び方法
TWI688840B (zh) 用於識別基板上之高度異常或污染物之方法、感測器、微影設備及電腦程式產品
JP4860294B2 (ja) 電子顕微鏡
US6968288B2 (en) Method for detection of photolithographic defocus
TW201841081A (zh) 度量衡工具及使用度量衡工具的方法
JP4959381B2 (ja) パターン測定方法、及び電子顕微鏡
JP2007206085A (ja) 位置検出装置及び位置検出方法、露光装置並びにデバイス製造方法
CN100559280C (zh) 一种物镜检验装置以及方法
CN118393416A (zh) 一种晶圆测试用探针台的校准方法及装置
US20020009219A1 (en) Wafer pattern observation method and device
KR100553710B1 (ko) 반도체 웨이퍼를 검사하는 검사 시스템 및 검사 방법
KR102178046B1 (ko) 패턴 평가 장치

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees