CN102144046B - 2-苯甲基-4-(3，4-二氯苯基)-5-甲基咪唑化合物 - Google Patents

2-苯甲基-4-(3，4-二氯苯基)-5-甲基咪唑化合物 Download PDF

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Publication number
CN102144046B
CN102144046B CN200980134515.8A CN200980134515A CN102144046B CN 102144046 B CN102144046 B CN 102144046B CN 200980134515 A CN200980134515 A CN 200980134515A CN 102144046 B CN102144046 B CN 102144046B
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CN
China
Prior art keywords
dichlorophenyl
methylimidazole
compound
hydrochloric acid
acid salt
Prior art date
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CN200980134515.8A
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English (en)
Chinese (zh)
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CN102144046A (zh
Inventor
村井孝行
平尾浩彦
高作康司
宫崎真幸
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Shikoku Chemicals Corp
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Shikoku Chemicals Corp
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Publication of CN102144046A publication Critical patent/CN102144046A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/64—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
CN200980134515.8A 2008-09-03 2009-09-02 2-苯甲基-4-(3，4-二氯苯基)-5-甲基咪唑化合物 Active CN102144046B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2008-225632 2008-09-03
JP2008225632 2008-09-03
JP2009130022 2009-05-29
JP2009-130022 2009-05-29
JP2009140655A JP5484795B2 (ja) 2008-09-03 2009-06-12 ２−ベンジル−４−（３，４−ジクロロフェニル）−５−メチルイミダゾール化合物
JP2009-140655 2009-06-12
PCT/JP2009/065616 WO2010027077A1 (fr) 2008-09-03 2009-09-02 Composé de 2-benzyl-4-(3,4-dichlorophényl)-5-méthylimidazole

Publications (2)

Publication Number Publication Date
CN102144046A CN102144046A (zh) 2011-08-03
CN102144046B true CN102144046B (zh) 2014-02-26

Family

ID=41323603

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980134515.8A Active CN102144046B (zh) 2008-09-03 2009-09-02 2-苯甲基-4-(3，4-二氯苯基)-5-甲基咪唑化合物

Country Status (6)

Country Link
JP (1) JP5484795B2 (fr)
KR (1) KR101602978B1 (fr)
CN (1) CN102144046B (fr)
MY (1) MY158638A (fr)
TW (1) TWI507395B (fr)
WO (1) WO2010027077A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5260208B2 (ja) * 2008-09-22 2013-08-14 四国化成工業株式会社 ２−（２，４−ジクロロベンジル）−４−（ハロゲン化フェニル）イミダゾール化合物
JP5260367B2 (ja) * 2008-09-26 2013-08-14 四国化成工業株式会社 ２−（クロロベンジル）−４−フェニルイミダゾール化合物
JP5615227B2 (ja) * 2011-05-23 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5615233B2 (ja) * 2011-06-20 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0627499A1 (fr) * 1993-05-10 1994-12-07 Shikoku Chemicals Corporation Agent de traitement de surfaces en cuivre ou ses alliages
CN1761773A (zh) * 2003-03-19 2006-04-19 四国化成工业株式会社 新型咪唑化合物及其利用
EP1194144B1 (fr) * 1999-05-25 2006-11-02 Affinium Pharmaceuticals, Inc. Composes antibacteriens

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3277025B2 (ja) * 1993-05-10 2002-04-22 四国化成工業株式会社 銅及び銅合金の表面処理剤
JPH06329635A (ja) * 1993-05-24 1994-11-29 Shikoku Chem Corp 新規イミダゾール化合物
JP3311858B2 (ja) * 1994-03-08 2002-08-05 四国化成工業株式会社 銅及び銅合金の表面処理剤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0627499A1 (fr) * 1993-05-10 1994-12-07 Shikoku Chemicals Corporation Agent de traitement de surfaces en cuivre ou ses alliages
EP1194144B1 (fr) * 1999-05-25 2006-11-02 Affinium Pharmaceuticals, Inc. Composes antibacteriens
CN1761773A (zh) * 2003-03-19 2006-04-19 四国化成工业株式会社 新型咪唑化合物及其利用

Also Published As

Publication number Publication date
CN102144046A (zh) 2011-08-03
KR20110050663A (ko) 2011-05-16
TWI507395B (zh) 2015-11-11
JP5484795B2 (ja) 2014-05-07
MY158638A (en) 2016-10-31
TW201010982A (en) 2010-03-16
KR101602978B1 (ko) 2016-03-11
WO2010027077A1 (fr) 2010-03-11
JP2011006323A (ja) 2011-01-13

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