CN102129164A - 掩膜版缺陷的判断方法及判断系统 - Google Patents
掩膜版缺陷的判断方法及判断系统 Download PDFInfo
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- CN102129164A CN102129164A CN2010100228749A CN201010022874A CN102129164A CN 102129164 A CN102129164 A CN 102129164A CN 2010100228749 A CN2010100228749 A CN 2010100228749A CN 201010022874 A CN201010022874 A CN 201010022874A CN 102129164 A CN102129164 A CN 102129164A
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- defective
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8877—Proximity analysis, local statistics
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Signal Processing (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN2010100228749A CN102129164B (zh) | 2010-01-15 | 2010-01-15 | 掩膜版缺陷的判断方法及判断系统 |
US13/007,556 US8312395B2 (en) | 2010-01-15 | 2011-01-14 | Automatic identification of systematic repeating defects in semiconductor production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010100228749A CN102129164B (zh) | 2010-01-15 | 2010-01-15 | 掩膜版缺陷的判断方法及判断系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102129164A true CN102129164A (zh) | 2011-07-20 |
CN102129164B CN102129164B (zh) | 2012-08-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2010100228749A Active CN102129164B (zh) | 2010-01-15 | 2010-01-15 | 掩膜版缺陷的判断方法及判断系统 |
Country Status (2)
Country | Link |
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US (1) | US8312395B2 (zh) |
CN (1) | CN102129164B (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104465433A (zh) * | 2013-09-23 | 2015-03-25 | 中芯国际集成电路制造(上海)有限公司 | 重复性缺陷的分析方法 |
CN104716062A (zh) * | 2013-12-12 | 2015-06-17 | 比亚迪股份有限公司 | 晶圆重复性光刻缺陷检查分析方法、系统及晶圆生产方法 |
CN105093814A (zh) * | 2014-05-21 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 一种掩膜版雾化控制方法及装置 |
CN105960702A (zh) * | 2014-02-06 | 2016-09-21 | 科磊股份有限公司 | 基于从标准参考图像确定的属性的缺陷检测及分类 |
CN108037142A (zh) * | 2017-12-04 | 2018-05-15 | 江苏维普光电科技有限公司 | 基于图像灰度值的掩膜版光学缺陷检测方法 |
CN108286034A (zh) * | 2017-01-10 | 2018-07-17 | 大日本印刷株式会社 | 蒸镀掩模、蒸镀掩模装置的制造方法以及蒸镀掩模的制造方法 |
CN109239953A (zh) * | 2018-11-07 | 2019-01-18 | 成都中电熊猫显示科技有限公司 | 掩膜版的处理系统 |
CN109313391A (zh) * | 2016-05-12 | 2019-02-05 | Asml荷兰有限公司 | 基于位移的重叠或对准 |
WO2019023890A1 (zh) * | 2017-07-31 | 2019-02-07 | 深圳市柔宇科技有限公司 | 金属掩膜板缺陷的判断方法和制造设备 |
CN110660694A (zh) * | 2018-06-28 | 2020-01-07 | 应用材料以色列公司 | 基于系统缺陷的半导体晶片的引导式检验 |
CN115485628A (zh) * | 2020-05-04 | 2022-12-16 | 科磊股份有限公司 | 图样检查的重复缺陷检测 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8555229B2 (en) * | 2011-06-02 | 2013-10-08 | International Business Machines Corporation | Parallel solving of layout optimization |
CN104465434B (zh) * | 2013-09-23 | 2017-07-11 | 中芯国际集成电路制造(上海)有限公司 | 缺陷分析法 |
JP6475176B2 (ja) * | 2016-02-25 | 2019-02-27 | 株式会社日立ハイテクノロジーズ | 欠陥観察装置 |
US10318700B2 (en) | 2017-09-05 | 2019-06-11 | International Business Machines Corporation | Modifying a manufacturing process of integrated circuits based on large scale quality performance prediction and optimization |
US11122680B2 (en) * | 2019-03-18 | 2021-09-14 | International Business Machines Corporation | Passive methods of loose die identification |
US11810284B2 (en) * | 2020-08-21 | 2023-11-07 | Kla Corporation | Unsupervised learning for repeater-defect detection |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5240866A (en) | 1992-02-03 | 1993-08-31 | At&T Bell Laboratories | Method for characterizing failed circuits on semiconductor wafers |
US5544256A (en) | 1993-10-22 | 1996-08-06 | International Business Machines Corporation | Automated defect classification system |
US5665609A (en) | 1995-04-21 | 1997-09-09 | Sony Corporation | Prioritizing efforts to improve semiconductor production yield |
US5991699A (en) | 1995-05-04 | 1999-11-23 | Kla Instruments Corporation | Detecting groups of defects in semiconductor feature space |
US7307712B2 (en) * | 2002-10-28 | 2007-12-11 | Asml Netherlands B.V. | Method of detecting mask defects, a computer program and reference substrate |
US9002497B2 (en) * | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
US7339388B2 (en) * | 2003-08-25 | 2008-03-04 | Tau-Metrix, Inc. | Intra-clip power and test signal generation for use with test structures on wafers |
CN100416761C (zh) * | 2004-11-02 | 2008-09-03 | 力晶半导体股份有限公司 | 验证光掩模的方法 |
US7570796B2 (en) * | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
US7676077B2 (en) * | 2005-11-18 | 2010-03-09 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
CN101210932B (zh) | 2006-12-27 | 2011-07-13 | 中芯国际集成电路制造(上海)有限公司 | 一种可提高缺陷检验可靠性的方法 |
CN101251712A (zh) * | 2008-03-25 | 2008-08-27 | 上海宏力半导体制造有限公司 | 一种半导体制造工艺中的掩模版图验证方法 |
-
2010
- 2010-01-15 CN CN2010100228749A patent/CN102129164B/zh active Active
-
2011
- 2011-01-14 US US13/007,556 patent/US8312395B2/en active Active
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104465433A (zh) * | 2013-09-23 | 2015-03-25 | 中芯国际集成电路制造(上海)有限公司 | 重复性缺陷的分析方法 |
CN104465433B (zh) * | 2013-09-23 | 2017-05-17 | 中芯国际集成电路制造(上海)有限公司 | 重复性缺陷的分析方法 |
CN104716062A (zh) * | 2013-12-12 | 2015-06-17 | 比亚迪股份有限公司 | 晶圆重复性光刻缺陷检查分析方法、系统及晶圆生产方法 |
CN104716062B (zh) * | 2013-12-12 | 2017-08-04 | 比亚迪股份有限公司 | 晶圆重复性光刻缺陷检查分析方法、系统及晶圆生产方法 |
CN105960702A (zh) * | 2014-02-06 | 2016-09-21 | 科磊股份有限公司 | 基于从标准参考图像确定的属性的缺陷检测及分类 |
CN105960702B (zh) * | 2014-02-06 | 2019-06-07 | 科磊股份有限公司 | 基于从标准参考图像确定的属性的缺陷检测及分类 |
US10127652B2 (en) | 2014-02-06 | 2018-11-13 | Kla-Tencor Corp. | Defect detection and classification based on attributes determined from a standard reference image |
CN105093814A (zh) * | 2014-05-21 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 一种掩膜版雾化控制方法及装置 |
CN105093814B (zh) * | 2014-05-21 | 2019-08-13 | 中芯国际集成电路制造(上海)有限公司 | 一种掩膜版雾化控制方法及装置 |
CN109313391A (zh) * | 2016-05-12 | 2019-02-05 | Asml荷兰有限公司 | 基于位移的重叠或对准 |
CN108286034A (zh) * | 2017-01-10 | 2018-07-17 | 大日本印刷株式会社 | 蒸镀掩模、蒸镀掩模装置的制造方法以及蒸镀掩模的制造方法 |
CN108286034B (zh) * | 2017-01-10 | 2020-06-02 | 大日本印刷株式会社 | 蒸镀掩模、蒸镀掩模装置的制造方法以及蒸镀掩模的制造方法 |
WO2019023890A1 (zh) * | 2017-07-31 | 2019-02-07 | 深圳市柔宇科技有限公司 | 金属掩膜板缺陷的判断方法和制造设备 |
CN108037142A (zh) * | 2017-12-04 | 2018-05-15 | 江苏维普光电科技有限公司 | 基于图像灰度值的掩膜版光学缺陷检测方法 |
CN110660694A (zh) * | 2018-06-28 | 2020-01-07 | 应用材料以色列公司 | 基于系统缺陷的半导体晶片的引导式检验 |
CN110660694B (zh) * | 2018-06-28 | 2020-11-20 | 应用材料以色列公司 | 基于系统缺陷的半导体晶片的引导式检验 |
CN109239953A (zh) * | 2018-11-07 | 2019-01-18 | 成都中电熊猫显示科技有限公司 | 掩膜版的处理系统 |
CN109239953B (zh) * | 2018-11-07 | 2021-03-05 | 成都中电熊猫显示科技有限公司 | 掩膜版的处理系统 |
CN115485628A (zh) * | 2020-05-04 | 2022-12-16 | 科磊股份有限公司 | 图样检查的重复缺陷检测 |
CN115485628B (zh) * | 2020-05-04 | 2024-02-20 | 科磊股份有限公司 | 图样检查的重复缺陷检测 |
Also Published As
Publication number | Publication date |
---|---|
CN102129164B (zh) | 2012-08-22 |
US20120023464A1 (en) | 2012-01-26 |
US8312395B2 (en) | 2012-11-13 |
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Owner name: SEMICONDUCTOR MANUFACTURING (BEIJING) INTERNATIONA Effective date: 20121102 |
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Effective date of registration: 20121102 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |