WO2019023890A1 - 金属掩膜板缺陷的判断方法和制造设备 - Google Patents
金属掩膜板缺陷的判断方法和制造设备 Download PDFInfo
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- WO2019023890A1 WO2019023890A1 PCT/CN2017/095296 CN2017095296W WO2019023890A1 WO 2019023890 A1 WO2019023890 A1 WO 2019023890A1 CN 2017095296 W CN2017095296 W CN 2017095296W WO 2019023890 A1 WO2019023890 A1 WO 2019023890A1
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- metal mask
- substrate
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- 239000002184 metal Substances 0.000 title claims abstract description 174
- 230000007547 defect Effects 0.000 title claims abstract description 82
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 127
- 230000002159 abnormal effect Effects 0.000 claims abstract description 29
- 238000012360 testing method Methods 0.000 claims abstract description 7
- 230000008439 repair process Effects 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 17
- 238000007689 inspection Methods 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 7
- 230000005856 abnormality Effects 0.000 claims 1
- 230000002950 deficient Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 230000006870 function Effects 0.000 description 7
- 239000003086 colorant Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
Definitions
- the present invention relates to the field of display manufacturing, and in particular to a method and a manufacturing apparatus for determining a defect of a metal mask.
- a full-color organic light-emitting display includes pixels of a plurality of colors, and a light-emitting layer material (such as a red, green, and blue light-emitting layer material) of each color pixel is generally formed by evaporation, in order to prevent light of different colors.
- the layer material is cross-mixed during the formation process, and is vapor-deposited using a metal mask.
- the metal mask may have defects, which may cause the formed pixels to have a yield problem such as color mixing or dark spots. Therefore, how to judge whether the metal mask is defective or not becomes a technical problem to be solved.
- Embodiments of the present invention provide a method and a manufacturing apparatus for determining a defect of a metal mask.
- the present invention provides a method for judging a defect of a metal mask.
- the metal mask is used to bond a pixel substrate to assist the pixel substrate to form a plurality of substrate pixels.
- the determining method includes:
- the defect position of the metal mask is determined according to the abnormal coordinate position of the substrate pixel point and the positional relationship.
- the present invention provides a manufacturing apparatus for determining a defect of a metal mask, the metal mask is used to fit a pixel substrate to assist the pixel substrate to form a plurality of substrate pixels, and the manufacturing apparatus includes a processor.
- the processor is used to:
- the method for judging the defect of the metal mask of the embodiment of the present invention and the manufacturing apparatus utilize the position of the pixel point of the abnormal substrate
- the metal mask can be quickly judged for defects and the defect position of the metal mask can be accurately determined in the presence of defects.
- FIG. 1 is a schematic flow chart of a method for determining a defect of a metal mask according to an embodiment of the present invention
- FIG. 2 is a schematic structural view of a manufacturing apparatus, a metal mask, and a pixel substrate according to an embodiment of the present invention
- FIG. 3 is another schematic flow chart of a method for determining a defect of a metal mask according to an embodiment of the present invention
- FIG. 4 is another schematic structural view of a manufacturing apparatus, a metal mask, and a pixel substrate according to an embodiment of the present invention
- FIG. 5 is still another schematic flowchart of a method for determining a defect of a metal mask according to an embodiment of the present invention
- FIG. 6 is another schematic flow chart of a method for determining a defect of a metal mask according to an embodiment of the present invention.
- FIG. 7 is a schematic flow chart of a method for determining a defect of a metal mask according to an embodiment of the present invention.
- FIG. 8 is another schematic structural view of a manufacturing apparatus, a metal mask, and a pixel substrate according to an embodiment of the present invention
- FIG. 9 is another schematic flow chart of a method for determining a defect of a metal mask according to an embodiment of the present invention.
- FIG. 10 is another schematic structural view of a manufacturing apparatus, a metal mask, and a pixel substrate according to an embodiment of the present invention
- FIG. 11 is a schematic flow chart showing a method for determining a defect of a metal mask according to an embodiment of the present invention
- FIG. 12 is another schematic structural view of a manufacturing apparatus, a metal mask, and a pixel substrate according to an embodiment of the present invention
- FIG. 13 is still another schematic flowchart of a method for determining a defect of a metal mask according to an embodiment of the present invention
- Fig. 14 is a flow chart showing still another method of determining a defect of a metal mask according to an embodiment of the present invention.
- Manufacturing equipment 100 processor 10, mask repairing machine 20, mask defect optical inspection machine 30, lighting machine 40, communication module 50, metal mask 700, pixel substrate 800, substrate pixel 820, and server 900.
- first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
- first is defined
- second feature may include one or more of the described features, either explicitly or implicitly.
- meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
- connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, or may be electrically connected or may communicate with each other; may be directly connected or indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
- the method for determining the defect of the metal mask 700 of the embodiment of the present invention can be applied to the manufacturing apparatus 100.
- the metal mask 700 is used to bond the pixel substrate 800 to assist the pixel substrate 800 in forming a plurality of substrate pixel dots 820.
- the method of judgment includes:
- Step S112 Acquire an image of the metal mask 700, the image including image pixel points;
- Step S114 establishing a positional relationship between the image pixel point and the substrate pixel point 820 in the same reference coordinate system
- Step S116 testing the substrate pixel point 820 to determine whether the substrate pixel point 820 is abnormal and acquiring the coordinate position of the abnormal substrate pixel point 820;
- Step S118 determining the defect position of the metal mask 700 according to the coordinate position and positional relationship of the abnormal substrate pixel point 820.
- the manufacturing apparatus 100 of the embodiment of the present invention can be used to determine defects of the metal mask 700.
- the metal mask 700 is used to bond the pixel substrate 800 to assist the pixel substrate 800 in forming a plurality of substrate pixel dots 820.
- Manufacturing device 100 includes a processor 10 for:
- the defect position of the metal mask 700 is determined based on the coordinate position and positional relationship of the abnormal substrate pixel point 820.
- the determination method of the embodiment of the present invention can be realized by the manufacturing apparatus 100 of the embodiment of the present invention, that is, the steps S112, S114, S116, and S118 can be realized by the manufacturing apparatus 100.
- the method for judging the defect of the metal mask 700 of the embodiment of the present invention and the manufacturing apparatus 100 can quickly determine whether the metal mask 700 is defective by using the position of the abnormal substrate pixel 820, and accurately determine the metal mask in the presence of a defect.
- the defect position of the diaphragm 700 can quickly determine whether the metal mask 700 is defective by using the position of the abnormal substrate pixel 820, and accurately determine the metal mask in the presence of a defect.
- steps S112 and S114 are performed before step S116. It can be understood that in other embodiments, steps S112 and S114 may be performed after step S116, which is not specifically limited herein.
- the pixel substrate 800 can be a glass substrate by forming a layer of luminescent material on the glass substrate to form substrate pixel dots 820.
- the metal mask 700 refers to a metal plate used to form the substrate pixel 820 with the pixel substrate 800.
- the pixel substrate 800 is generally formed by vapor deposition to form the substrate pixel 820 by using the metal mask 700.
- the pixel substrate 800 is disposed, and a plurality of colors of luminescent materials can be formed on the pixel substrate 800 to obtain the pixel substrate 800 of the substrate pixels 820 of a plurality of colors.
- an image of the metal mask 700 is acquired and the positional relationship of the image pixel points and the substrate pixel points 820 is established by the same reference frame.
- the coordinate position of the image pixel point can be directly obtained according to the positional relationship of the same coordinate system and the coordinate position of the substrate pixel point 820, thereby determining the metal mask corresponding to the coordinate position of the image pixel point.
- the position of the board 700 is a defect position, that is, the position of the metal mask 700 corresponding to the coordinate position of the image pixel point may be defective.
- the positional relationship between the image pixel point and the substrate pixel point 820 is established, and the coordinate position of the image pixel point can be quickly obtained according to the obtained coordinate position of the abnormal substrate pixel point 820, thereby being fast. The location of the defect will be obtained. If the positional relationship between the image pixel point and the substrate pixel point 820 is not established under the same reference coordinate system, the coordinate conversion needs to be performed first by the conversion relationship of different reference coordinates, which will increase a lot of unnecessary workload, and the efficiency of obtaining the defect position is compared. low.
- the manufacturing apparatus 100 includes a gripping device (not shown) and an evaporation device (not shown), and the processor 10 controls the gripping device to grasp the metal mask 700 and/or the pixel substrate 800 to The metal mask 700 and the pixel substrate 800 are bonded together, and the substrate pixels are formed by vapor deposition by controlling the vapor deposition device.
- the defect location of the metal mask 700 refers to the area where the defect is present.
- the metal mask 700 is generally a metal plane including a plurality of through holes, and the irregular through holes, the through holes are too large, the through holes are too small, the through holes are too small, and the through holes are too large, etc., which can be regarded as metal masks. Defects in the diaphragm 700.
- the determining method includes:
- Step S122 processing the image to determine whether the metal mask 700 conforms to a preset standard
- Step S124 bonding the pixel substrate 800 with the metal mask 700 to assist the pixel substrate 800 to form a plurality of substrate pixel points 820 when the metal mask 700 conforms to a preset standard;
- Step S126 The metal mask 700 is repaired by the mask repairer 20 when the metal mask 700 does not conform to the preset standard.
- manufacturing apparatus 100 includes a mask repair machine 20 for:
- the pixel substrate 800 is attached by the metal mask 700 to assist the pixel substrate 800 to form a plurality of substrate pixels 820;
- the metal mask 700 is repaired by the mask repair machine 20 when the metal mask 700 does not meet the preset criteria.
- steps S122, S124, and S126 can be implemented by the manufacturing apparatus 100.
- the substrate pixel 820 formed by bonding the pixel substrate 800 with the metal mask 700 may have problems such as dark spots, mixed colors, and the like, and thus is used for assisting formation in the metal mask 700.
- the metal mask 700 conforms to a preset standard. By processing the image of the metal mask 700, it can be judged whether the metal mask 700 conforms to the preset standard. When the metal mask 700 conforms to the preset standard, the metal mask 700 can be used normally, and thus the metal mask can be utilized.
- the metal mask 700 is matched with the pixel substrate 800 to assist in forming a plurality of substrate pixel points 820; when the metal mask 700 does not meet the preset standard, it may be explained that when the metal mask 700 is used, dark spots, mixed colors, and the like may occur on the substrate pixel 820. Therefore, the metal mask 700 can be repaired by the mask repairing machine 20, thereby obtaining the metal mask 700 conforming to the preset standard.
- the preset criteria may be pre-stored in the manufacturing device 100 or pre-set by the user.
- the preset standard may refer to the quality of the metal mask 700. When there are many defects in the metal mask 700, the quality of the metal mask 700 is low, that is, it does not meet the preset standard; the metal mask 700 exists. When there are fewer defects or no defects, the quality of the metal mask 700 is high, that is, it meets the preset standard.
- the mask repairing machine 20 is a machine that can repair the metal mask 700. The mask repairing machine 20 can repair the metal mask 700 by means of cutting, supplementing, or the like, and is not specifically limited herein.
- the determining method includes:
- Step S128 The coordinates of the mask repairing machine 20 are established using the reference coordinate system.
- processor 10 is configured to:
- the coordinates of the mask repair machine 20 are established using a reference coordinate system.
- step S128 can be implemented by the manufacturing apparatus 100.
- the metal mask 700 since the coordinate position of the image pixel point and the coordinate of the mask repairing machine 20 are at the same reference coordinate, if the metal mask 700 is judged to not meet the preset standard after the image is processed, it can be quickly determined according to The coordinate position of the image pixel is obtained at the coordinate position of the mask repairing machine 20, so that the defect position of the metal mask 700 corresponding to the coordinate position of the image pixel point is repaired by the mask repairing machine 20.
- the coordinate position of the substrate pixel point 820 is also at the same reference coordinate, the coordinate position of the substrate pixel point 820, the coordinate position of the image pixel point, and the coordinates of the mask repairing machine 20 share the same reference coordinate system. This can achieve the consistency of the coordinate positions between the three.
- step S126 the method includes:
- Step S132 Return to step S112.
- processor 10 is configured to:
- the step of obtaining an image of the metal mask 700 is returned.
- step S132 can be implemented by the manufacturing apparatus 100.
- the mask repairing machine 20 can be used to repair the metal mask 700, and the mask repairing machine 20 can repair various problems such as repair failure or repair accuracy.
- the degree is insufficient, so that the repaired metal mask 700 may still have more defect positions. Therefore, after the metal mask 700 is repaired by the mask repairing machine 20, the image can be reacquired and the image processed to determine the metal mask.
- the board 700 conforms to the preset standard
- the metal mask 700 is attached to the pixel substrate 800 to assist the pixel substrate 800 to form a plurality of substrate pixel points 820 when the metal mask 700 conforms to a preset standard, and the metal mask 700 does not conform to the metal mask 700.
- the metal mask 700 can be repaired again by the mask repairer 20 when the standard is preset, and can be cycled until the metal mask 700 meets the preset criteria or the metal mask 700 is unrepaired.
- the repair of the metal mask 700 can be cancelled when the number of repairs exceeds a preset number of times.
- the number of repairs is too large, indicating that the defect of the metal mask 700 is too serious, and the quality of the metal mask 700 after repair is too poor, so that the metal mask 700 can be canceled when the number of repairs exceeds the preset number of times. repair.
- the preset number of times may be preset in the manufacturing device 100 or set by the user, and is not specifically limited herein.
- step S112 includes:
- Step S1122 The image is acquired by the mask defect optical inspection machine 30.
- manufacturing apparatus 100 includes a mask defect optical inspection machine 30, and processor 10 is configured to:
- the image is acquired by the mask defect optical inspection machine 30.
- step S1122 can be implemented by the manufacturing apparatus 100.
- the mask defect optical inspection machine 30 refers to a machine that uses optical principles to check whether the metal mask 700 has defects.
- the mask defect optical inspection machine 30 can take an image of the metal mask 700 and then process it.
- the device 10 performs image processing to determine whether the metal mask 700 has a defective position, thereby judging whether the metal mask 700 conforms to a preset standard.
- the inspection of the defect position of the metal mask 700 can also be performed by other methods, such as detecting the pressure of the metal mask 700 through the pressure sensor, thereby determining whether the metal mask 700 is There are methods such as defects, and are not specifically limited herein.
- step S116 includes:
- Step S1162 The substrate pixel point 820 is tested by the lighting machine 40.
- manufacturing apparatus 100 includes a lighting machine 40 for:
- Substrate pixel points 820 are tested using a lighter 40.
- step S1162 can be implemented by the manufacturing apparatus 100.
- the substrate pixel point 820 can be tested by the lighting machine 40 to determine whether the substrate pixel point is abnormal.
- the lighting machine 40 refers to a machine that can illuminate the substrate pixel point 820 to determine whether the substrate pixel point 820 is normal, such as determining whether the substrate pixel point 820 is illuminated by the lighting machine 40 by the principle of image or photoelectric conversion.
- the substrate pixel dot 820 is mixed, and the substrate pixel dot 820 that is not illuminated or has a mixed color problem is an abnormal substrate pixel dot 820, and the substrate pixel dot 820 that is lit without causing color mixing or the like is Normal substrate pixel point 820.
- the substrate pixels 820 of the pixel substrate 800 can be tested by the lighting machine 40 and the coordinate position of the abnormal substrate pixel point 820 can be obtained, and the defect position of the metal mask 700 can be obtained by referring to the coordinate system.
- step S112 includes:
- Step S1124 Receive an image transmitted by the server 900.
- manufacturing device 100 includes a communication module 50 for communicating with server 900, processor 10 for:
- the image transmitted by the server 900 is received through the communication module 50.
- step S1124 can be implemented by the manufacturing apparatus 100.
- an image can be obtained through the communication module 50.
- the processor 10 of the embodiment of the present invention may be applied to the mask repairing machine 20, the mask defect optical inspection machine 30, or the lighting machine 40, that is, the mask repairing machine 20, the mask defect optical inspection machine 30, or the lighting machine.
- 40 includes a processor 10.
- the communication module 50 of the manufacturing apparatus 100 can also be applied to the mask repairing machine 20, the mask defect optical inspection machine 30, or the lighting machine 40, that is, the mask repairing machine 20, the mask defect optical inspection machine 30, or the lighting machine 40 includes communication.
- the lighting machine 40 includes a processor 10 and a communication module 50.
- the lighting machine 40 is sent through the communication module 50
- the image acquisition signal is sent to the server 900, and the server 900 receives the image acquisition signal of the lighting machine 40 and transmits the image to the lighting machine 40.
- the image of the server 900 may originate from the mask repair machine 20, the mask defect optical inspection machine 30, or other image acquisition device, ie, the server 900 receives and stores the image from the mask repair machine 20, the mask defect optical detector 30, or other image acquisition. The image of the device.
- the determining method includes:
- Step S134 repairing the defect position of the metal mask 700 by the mask repairing machine 20 when the metal mask 700 has a defective position.
- manufacturing apparatus 100 includes a mask repair machine 20 for:
- the defect position of the metal mask 700 is repaired by the mask repairer 20 when the metal mask 700 has a defective position.
- step S134 can be implemented by the manufacturing apparatus 100.
- the metal mask 700 can be repaired when the metal mask 700 has a defective position.
- the above-mentioned judging method can determine whether the metal mask 700 has defects and determine the defect position, so that the mask repairing machine 20 can be used to repair the defect position, thereby reducing or eliminating defects of the metal mask 700, and being convenient.
- the subsequent use of the metal mask 700 is normal.
- the determining method includes:
- Step S136 prompting to replace the metal mask 700 when the metal mask 700 has a defective position.
- processor 10 is configured to:
- the metal mask 700 is prompted to be replaced when the metal mask 700 has a defective position.
- step S136 can be implemented by the manufacturing apparatus 100.
- the metal mask 700 can be prompted to be replaced when the metal mask 700 has a defective position.
- the metal mask 700 may have more defects or a machine that does not have the metal mask 700 repaired in the manufacturing apparatus 100. Therefore, when the metal mask 700 has a defective position, the manufacturing apparatus 100 may issue a prompt, thereby the user It is known that the metal mask 700 has defects, and the metal mask 700 can be replaced. In one embodiment, the manufacturing apparatus 100 prompts to replace the metal mask 700 when the number of repairs exceeds a preset number of times.
- the manufacturing apparatus 100 may include at least one of a display device, an electroacoustic element, and a vibrating element, that is, the manufacturing apparatus 100 includes a display device, or an electroacoustic element, or a vibrating element, or a display device and an electroacoustic element, or a display device And a vibrating element, or an electroacoustic element and a vibrating element, or a display device, an electroacoustic element, and a vibrating element.
- the manufacturing apparatus 100 can be prompted by images, characters, voices, vibrations, and the like. This is not specifically limited.
- a "computer-readable medium” can be any apparatus that can contain, store, communicate, propagate, or transport a program for use in an instruction execution system, apparatus, or device, or in conjunction with the instruction execution system, apparatus, or device.
- computer readable media include the following: electrical connections (electronic devices) having one or more wires, portable computer disk cartridges (magnetic devices), random access memory (RAM), Read only memory (ROM), erasable editable read only memory (EPROM or flash memory), fiber optic devices, and portable compact disk read only memory (CDROM).
- the computer readable medium may even be a paper or other suitable medium on which the program can be printed, as it may be optically scanned, for example by paper or other medium, followed by editing, interpretation or, if appropriate, other suitable The method is processed to obtain the program electronically and then stored in computer memory.
- portions of the invention may be implemented in hardware, software, firmware or a combination thereof.
- multiple steps or methods may be performed by software or firmware stored in a memory and executed by a suitable instruction execution system.
- a suitable instruction execution system For example, if executed in hardware, as in another embodiment, it can be performed by any one of the following techniques or combinations thereof known in the art: having logic gates for performing logic functions on data signals Discrete logic circuits, application specific integrated circuits with suitable combinational logic gates, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.
- each functional unit in each embodiment of the present invention may be integrated into one processing module, or each unit may exist physically separately, or two or more units may be integrated into one module.
- the above integrated modules can be executed in the form of hardware or in the form of software functional modules.
- the integrated module can also be stored in a computer if it is executed in the form of a software function module and sold or used as a stand-alone product. Read in the storage medium.
- the above mentioned storage medium may be a read only memory, a magnetic disk or an optical disk or the like.
Abstract
一种金属掩膜板(700)缺陷的判断方法以及一种用于判断金属掩膜板(700)缺陷的制造设备（100），金属掩膜板(700)用于贴合像素基板(800)以辅助像素基板(800)形成多个基板像素点(820)。判断方法包括步骤：(S112)获取金属掩膜板(700)的图像，图像包括图像像素点；(S114)在同一参考坐标系下，建立图像像素点和基板像素点(820)的位置关系；(S116)测试基板像素点(820)以判断基板像素点(820)是否异常并获取异常的基板像素点(820)的坐标位置；和(S118)根据异常的基板像素点(820)的坐标位置和位置关系确定金属掩膜板(700)的缺陷位置。
Description
本发明涉及显示器制造领域，特别涉及一种金属掩膜板缺陷的判断方法和制造设备。
在相关技术中，全彩有机发光显示器包括多种颜色的像素，每种颜色的像素的发光层材料(如红、绿、蓝发光层材料)一般通过蒸镀方式形成，为了防止不同颜色的发光层材料在形成过程中交叉混色，采用金属掩膜板进行蒸镀。但是，金属掩膜板可能存在缺陷，这会使得形成的像素出现混色或暗点等良率问题。因此，如何判断金属掩膜板是否存在缺陷成为待解决的技术问题。
发明内容
本发明的实施方式提供一种金属掩膜板缺陷的判断方法和制造设备。
本发明提供一种金属掩膜板缺陷的判断方法，所述金属掩膜板用于贴合像素基板以辅助所述像素基板形成多个基板像素点，所述判断方法包括：
获取所述金属掩膜板的图像，所述图像包括图像像素点；
在同一参考坐标系下，建立所述图像像素点和所述基板像素点的位置关系；
测试所述基板像素点以判断所述基板像素点是否异常并获取异常的所述基板像素点的坐标位置；和
根据异常的所述基板像素点的坐标位置和所述位置关系确定所述金属掩膜板的缺陷位置。
本发明提供一种制造设备，用于判断金属掩膜板缺陷，所述金属掩膜板用于贴合像素基板以辅助所述像素基板形成多个基板像素点，所述制造设备包括处理器，所述处理器用于：
获取所述金属掩膜板的图像，所述图像包括图像像素点；
在同一参考坐标系下，建立所述图像像素点和所述基板像素点的位置关系；
测试所述基板像素点以判断所述基板像素点是否异常并获取异常的所述基板像素点的坐标位置；和
根据所述异常的所述基板像素点的坐标位置和所述位置关系确定所述金属掩膜板的缺陷位置。
本发明实施方式的金属掩膜板缺陷的判断方法和制造设备利用异常基板像素点的位置
可快速地判断金属掩膜板是否存在缺陷，并在存在缺陷时，准确地确定金属掩膜板的缺陷位置。
本发明的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实施方式的实践了解到。
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本发明实施方式的金属掩膜板缺陷的判断方法的流程示意图；
图2是本发明实施方式的制造设备、金属掩膜板、像素基板的结构示意图；
图3是本发明实施方式的金属掩膜板缺陷的判断方法的另一个流程示意图；
图4是本发明实施方式的制造设备、金属掩膜板、像素基板的另一个结构示意图；
图5是本发明实施方式的金属掩膜板缺陷的判断方法的再一个流程示意图；
图6是本发明实施方式的金属掩膜板缺陷的判断方法的又一个流程示意图；
图7是本发明实施方式的金属掩膜板缺陷的判断方法的又一个流程示意图；
图8是本发明实施方式的制造设备、金属掩膜板、像素基板的再一个结构示意图；
图9是本发明实施方式的金属掩膜板缺陷的判断方法的又一个流程示意图；
图10是本发明实施方式的制造设备、金属掩膜板、像素基板的又一个结构示意图；
图11是本发明实施方式的金属掩膜板缺陷的判断方法的又一个流程示意图；
图12是本发明实施方式的制造设备、金属掩膜板、像素基板的又一个结构示意图；
图13是本发明实施方式的金属掩膜板缺陷的判断方法的又一个流程示意图；
图14是本发明实施方式的金属掩膜板缺陷的判断方法的又一个流程示意图。
主要元件符号附图说明：
制造设备100、处理器10、遮罩修补机20、遮罩缺陷光学检查机30、点灯机40、通信模块50、金属掩膜板700、像素基板800、基板像素点820、服务器900。
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、
“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通信；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
请一并参阅图1和图2，本发明实施方式的金属掩膜板700缺陷的判断方法可以用于制造设备100。金属掩膜板700用于贴合像素基板800以辅助像素基板800形成多个基板像素点820。判断方法包括：
步骤S112：获取金属掩膜板700的图像，图像包括图像像素点；
步骤S114：在同一参考坐标系下，建立图像像素点和基板像素点820的位置关系；
步骤S116：测试基板像素点820以判断基板像素点820是否异常并获取异常的基板像素点820的坐标位置；和
步骤S118：根据异常的基板像素点820的坐标位置和位置关系确定金属掩膜板700的缺陷位置。
请再次参阅图2，本发明实施方式的制造设备100可以用于判断金属掩膜板700缺陷。金属掩膜板700用于贴合像素基板800以辅助像素基板800形成多个基板像素点820。制造设备100包括处理器10，处理器10用于：
获取金属掩膜板700的图像，图像包括图像像素点；
在同一参考坐标系下，建立图像像素点和基板像素点820的位置关系；
测试基板像素点820以判断基板像素点820是否异常并获取异常的基板像素点820的坐标位置；和
根据异常的基板像素点820的坐标位置和位置关系确定金属掩膜板700的缺陷位置。
也即是说，本发明实施方式的判断方法可以由本发明实施方式的制造设备100实现，也即是说，步骤S112、S114、S116和S118可以由制造设备100实现。
本发明实施方式的金属掩膜板700缺陷的判断方法和制造设备100利用异常基板像素点820的位置可快速地判断金属掩膜板700是否存在缺陷，并在存在缺陷时，准确地确定金属掩膜板700的缺陷位置。
在本发明实施方式中，步骤S112和S114在步骤S116之前执行，可以理解，在其他实施方式中，步骤S112和S114可以在步骤S116之后执行，在此不做具体限定。
在某些实施方式中，像素基板800可以是玻璃基板，通过在玻璃基板上形成发光材料层以形成基板像素点820。
在某些实施方式中，金属掩膜板700是指用来配合像素基板800形成基板像素点820的金属板，例如像素基板800一般通过蒸镀形成基板像素点820，通过将金属掩膜板700贴合像素基板800设置，可以将多种颜色的发光材料形成在像素基板800上，从而获得多种颜色的基板像素点820的像素基板800。
在某些实施方式中，获取金属掩膜板700的图像，并通过在同一参考坐标系下，建立图像像素点和基板像素点820的位置关系。如此，在获得异常的基板像素点820时，可以根据同一坐标系的位置关系和基板像素点820的坐标位置直接获得图像像素点的坐标位置，从而判断图像像素点的坐标位置对应的金属掩膜板700的位置为缺陷位置，即图像像素点的坐标位置对应的金属掩膜板700的位置可能存在缺陷。
需要说明的是，在同一参考坐标系下，建立图像像素点和基板像素点820的位置关系，可以快速地根据获得的异常的基板像素点820的坐标位置获得图像像素点的坐标位置，从而快速地将获得缺陷位置。若不在同一参考坐标系下建立图像像素点和基板像素点820的位置关系，则需要通过不同参考坐标的转换关系先进行坐标转换，会增加很多不必要的工作量，并且缺陷位置的获得效率比较低。
在某些实施方式中，制造设备100包括抓取装置(图未示)和蒸镀装置(图未示)，处理器10控制抓取装置抓取金属掩膜板700和/或像素基板800以贴合金属掩膜板700和像素基板800，再通过控制蒸镀装置蒸镀形成基板像素点。
在某些实施方式中，金属掩膜板700的缺陷位置是指存在缺陷的区域。金属掩膜板700一般为包含多个通孔的金属平面，不规矩的通孔、通孔过大、通孔过小、通孔量太少、通孔量太多等都可视作金属掩膜板700的缺陷。
请一并参阅图3和图4，在某些实施方式中，判断方法包括：
步骤S122：处理图像以判断金属掩膜板700是否符合预设标准；
步骤S124：在金属掩膜板700符合预设标准时利用金属掩膜板700贴合像素基板800以辅助像素基板800形成多个基板像素点820；和
步骤S126：在金属掩膜板700不符合预设标准时利用遮罩修补机20修补金属掩膜板700。
请再次参阅图4，在某些实施方式中，制造设备100包括遮罩修补机20，处理器10用于：
处理图像以判断金属掩膜板700是否符合预设标准；
在金属掩膜板700符合预设标准时利用金属掩膜板700贴合像素基板800以辅助像素基板800形成多个基板像素点820；和
在金属掩膜板700不符合预设标准时利用遮罩修补机20修补金属掩膜板700。
也即是说，步骤S122、S124和S126可以由制造设备100实现。
如此，可以确保金属掩膜板700能够正常使用。
具体地，在金属掩膜板700存在缺陷时，利用金属掩膜板700贴合像素基板800形成的基板像素点820会存在暗点、混色等问题，因此在金属掩膜板700用于辅助形成基板像素点820之前，可以先判断金属掩膜板700是否符合预设标准。通过处理金属掩膜板700的图像可以判断金属掩膜板700是否符合预设标准，在金属掩膜板700符合预设标准时，说明金属掩膜板700能够正常使用，因此可以利用金属掩膜板700贴合像素基板800以辅助形成多个基板像素点820；在金属掩膜板700不符合预设标准时，说明使用金属掩膜板700时可能会造成基板像素点820出现暗点、混色等问题，因此可以利用遮罩修补机20修补金属掩膜板700，从而获得符合预设标准的金属掩膜板700。
在某些实施方式中，预设标准可以预先保存在制造设备100中或由用户预先设置。预设标准可以是指金属掩膜板700的品质，在金属掩膜板700存在较多缺陷时，说明金属掩膜板700的品质低，即不符合预设标准；在金属掩膜板700存在较少缺陷或没有缺陷时，说明金属掩膜板700的品质高，即符合预设标准。此外，遮罩修补机20是指可以对金属掩膜板700进行修补的机器，遮罩修补机20可以通过切除、增补等方式对金属掩膜板700进行修补，在此不做具体限定。
请参阅图5，在某些实施方式中，判断方法包括：
步骤S128：利用参考坐标系建立遮罩修补机20的坐标。
请再次参阅图4，在某些实施方式中，处理器10用于：
利用参考坐标系建立遮罩修补机20的坐标。
也即是说，步骤S128可以由制造设备100实现。
如此，在处理图像后判断金属掩膜板700不符合预设标准时，可以快速地获取图像像
素点对应的金属掩膜板700的缺陷位置。
具体地，由于图像像素点的坐标位置和遮罩修补机20的坐标是处于同一参考坐标下，因此，在处理图像后，若判断金属掩膜板700不符合预设标准，则可以快速地根据图像像素点的坐标位置获得遮罩修补机20的坐标位置，从而利用遮罩修补机20对图像像素点的坐标位置对应的金属掩膜板700的缺陷位置进行修补。
需要说明的是，由于基板像素点820的坐标位置也处于相同的参考坐标下，因此，基板像素点820的坐标位置、图像像素点的坐标位置和遮罩修补机20的坐标共用同一参考坐标系，这能够实现三者之间坐标位置的一致。
请参阅图6，在某些实施方式中，步骤S126后包括：
步骤S132：返回步骤S112。
请再次参阅图4，在某些实施方式中，处理器10用于：
返回获取金属掩膜板700的图像的步骤。
也即是说，步骤S132可以由制造设备100实现。
如此，可以判断修补后的金属掩膜板700是否符合预设标准。
具体地，在金属掩膜吧700不符合预设标准时，可以利用遮罩修补机20修补金属掩膜板700，由于遮罩修补机20修补可能存在的各种问题，如修补失败或者修补的精准度不够，导致修补后的金属掩膜板700可能还存在较多的缺陷位置，因此，在利用遮罩修补机20修补金属掩膜板700后，可以重新获取图像并处理图像以判断金属掩膜板700是否符合预设标准，在金属掩膜板700符合预设标准时利用金属掩膜板700贴合像素基板800以辅助像素基板800形成多个基板像素点820，在金属掩膜板700不符合预设标准时可以再次利用遮罩修补机20修补金属掩膜板700，可以如此一直循环，直到金属掩膜板700符合预设标准或取消对金属掩膜板700进行修复。
在某些实施方式中，当修复次数超过预设次数时，可以取消对金属掩膜板700进行修复。修复次数过多，说明金属掩膜板700的缺陷太严重，并且容易导致修复后的金属掩膜板700质量太差，因此在修复次数超过预设次数时，可以取消对金属掩膜板700进行修复。需要说明的是，预设次数可以预设在制造设备100中或由用户设置，在此不做具体限定。
请一并参阅图7和图8，在某些实施方式中，步骤S112包括：
步骤S1122：利用遮罩缺陷光学检查机30获取图像。
请再次参阅图8，在某些实施方式中，制造设备100包括遮罩缺陷光学检查机30，处理器10用于：
利用遮罩缺陷光学检查机30获取图像。
也即是说，步骤S1122可以由制造设备100实现。
如此，可以直接、快速地获得图像。
具体地，遮罩缺陷光学检查机30是指利用光学原理来检查金属掩膜板700是否具有缺陷的机器，比如遮罩缺陷光学检查机30可以通过拍摄金属掩膜板700的图像，再通过处理器10进行图像处理判断金属掩膜板700是否存在缺陷位置，从而判断金属掩膜板700是否符合预设标准。
可以理解，在其他实施方式中，也可以利用其他方式实现对金属掩膜板700的缺陷位置的检查，比如通过压力传感器检测金属掩膜板700各处的压力，从而确定金属掩膜板700是否存在缺陷等方式，在此不做具体限定。
请一并参阅图9和图10，在某些实施方式中，步骤S116包括：
步骤S1162：利用点灯机40测试基板像素点820。
请再次参阅图10，在某些实施方式中，制造设备100包括点灯机40，处理器10用于：
利用点灯机40测试基板像素点820。
也即是说，步骤S1162可以由制造设备100实现。
如此，可以通过点灯机40测试基板像素点820，从而判断基板像素点是否异常。
具体地，点灯机40是指可以利用将基板像素点820点亮以判断基板像素点820是否正常的机器，比如通过图像或光电转换的原理判断基板像素点820是否被点灯机40点亮，在被点亮时可以判断基板像素点820是否混色，不被点亮或者出现混色等问题的基板像素点820为异常的基板像素点820，被点亮且不出现混色等问题的基板像素点820为正常的基板像素点820。通过点灯机40可以测试像素基板800的各个基板像素点820并获得异常的基板像素点820的坐标位置，再通过参考坐标系获得金属掩膜板700的缺陷位置。
请一并参阅图11和图12，在某些实施方式中，步骤S112包括：
步骤S1124：接收服务器900发送的图像。
请再次参阅图12，在某些实施方式中，制造设备100包括用于与服务器900通信的通信模块50，处理器10用于：
通过通信模块50接收服务器900发送的图像。
也即是说，步骤S1124可以由制造设备100实现。
如此，可以通过通信模块50获得图像。
具体地，本发明实施方式的处理器10可以应用于遮罩修补机20、遮罩缺陷光学检查机30或点灯机40中，即遮罩修补机20、遮罩缺陷光学检查机30或点灯机40包括处理器10。制造设备100的通信模块50也可应用于遮罩修补机20、遮罩缺陷光学检查机30或点灯机40中，即遮罩修补机20、遮罩缺陷光学检查机30或点灯机40包括通信模块50。在某些实施方式中，点灯机40包括处理器10和通信模块50。点灯机40通过通信模块50发
送图像获取信号给服务器900，服务器900接收点灯机40的图像获取信号后将图像发送给点灯机40。服务器900的图像可以来源于遮罩修补机20、遮罩缺陷光学检测机30或其他图像采集装置，即服务器900接收并存储来自遮罩修补机20、遮罩缺陷光学检测机30或其他图像采集装置的图像。
请参阅图13，在某些实施方式中，判断方法包括：
步骤S134：在金属掩膜板700存在缺陷位置时利用遮罩修补机20修补金属掩膜板700的缺陷位置。
请再次参阅4，在某些实施方式中，制造设备100包括遮罩修补机20，处理器10用于：
在金属掩膜板700存在缺陷位置时利用遮罩修补机20修补金属掩膜板700的缺陷位置。
也即是说，步骤S134可以由制造设备100实现。
如此，可以在金属掩膜板700存在缺陷位置时对金属掩膜板700进行修补。
具体地，通过上述的判断方法可以判断金属掩膜板700是否存在缺陷并确定缺陷位置，从而可以利用遮罩修补机20对缺陷位置进行修补，进而减少或消除金属掩膜板700的缺陷，方便后续金属掩膜板700的正常使用。
请参阅图14，在某些实施方式中，判断方法包括：
步骤S136：在金属掩膜板700存在缺陷位置时提示更换金属掩膜板700。
请再次参阅图2，在某些实施方式中，处理器10用于：
在金属掩膜板700存在缺陷位置时提示更换金属掩膜板700。
也即是说，步骤S136可以由制造设备100实现。
如此，可以在金属掩膜板700存在缺陷位置时提示更换金属掩膜板700。
具体地，金属掩膜板700可能存在较多缺陷或制造设备100中不具备修补金属掩膜板700的机器，因此在金属掩膜板700存在缺陷位置时，制造设备100可以发出提示，从而用户可以知道金属掩膜板700存在缺陷，进而可以更换金属掩膜板700。在一个实施例中，当修复次数超过预设次数时，制造设备100提示更换金属掩膜板700。
可以理解，制造设备100可以包括显示装置、电声元件和振动元件中的至少一个，即制造设备100包括显示装置，或电声元件，或振动元件，或显示装置和电声元件，或显示装置和振动元件，或电声元件和振动元件，或显示装置、电声元件和振动元件。这样制造设备100可以通过图像、文字、语音、振动等方式进行提示。在此不做具体限定。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书
中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
流程图中或在此以其他方式描述的任何过程或方法描述可以被理解为，表示包括一个或更多个用于执行特定逻辑功能或过程的步骤的可执行指令的代码的模块、片段或部分，并且本发明的优选实施方式的范围包括另外的执行，其中可以不按所示出或讨论的顺序，包括根据所涉及的功能按基本同时的方式或按相反的顺序，来执行功能，这应被本发明的实施方式所属技术领域的技术人员所理解。
在流程图中表示或在此以其他方式描述的逻辑和/或步骤，例如，可以被认为是用于执行逻辑功能的可执行指令的定序列表，可以具体执行在任何计算机可读介质中，以供指令执行系统、装置或设备(如基于计算机的系统、包括处理器的系统或其他可以从指令执行系统、装置或设备取指令并执行指令的系统)使用，或结合这些指令执行系统、装置或设备而使用。就本说明书而言，"计算机可读介质"可以是任何可以包含、存储、通信、传播或传输程序以供指令执行系统、装置或设备或结合这些指令执行系统、装置或设备而使用的装置。计算机可读介质的更具体的示例(非穷尽性列表)包括以下：具有一个或多个布线的电连接部(电子装置)，便携式计算机盘盒(磁装置)，随机存取存储器(RAM)，只读存储器(ROM)，可擦除可编辑只读存储器(EPROM或闪速存储器)，光纤装置，以及便携式光盘只读存储器(CDROM)。另外，计算机可读介质甚至可以是可在其上打印所述程序的纸或其他合适的介质，因为可以例如通过对纸或其他介质进行光学扫描，接着进行编辑、解译或必要时以其他合适方式进行处理来以电子方式获得所述程序，然后将其存储在计算机存储器中。
应当理解，本发明的各部分可以用硬件、软件、固件或它们的组合来执行。在上述实施方式中，多个步骤或方法可以用存储在存储器中且由合适的指令执行系统执行的软件或固件来执行。例如，如果用硬件来执行，和在另一实施方式中一样，可用本领域公知的下列技术中的任一项或他们的组合来执行：具有用于对数据信号执行逻辑功能的逻辑门电路的离散逻辑电路，具有合适的组合逻辑门电路的专用集成电路，可编程门阵列(PGA)，现场可编程门阵列(FPGA)等。
本技术领域的普通技术人员可以理解执行上述实施方法携带的全部或部分步骤是可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，该程序在执行时，包括方法实施方式的步骤之一或其组合。
此外，在本发明各个实施方式中的各功能单元可以集成在一个处理模块中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个模块中。上述集成的模块既可以采用硬件的形式执行，也可以采用软件功能模块的形式执行。所述集成的模块如果以软件功能模块的形式执行并作为独立的产品销售或使用时，也可以存储在一个计算机可
读取存储介质中。
上述提到的存储介质可以是只读存储器，磁盘或光盘等。尽管上面已经示出和描述了本发明的实施方式，可以理解的是，上述实施方式是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施方式进行变化、修改、替换和变型。
Claims (18)
- 一种金属掩膜板缺陷的判断方法，其特征在于，所述金属掩膜板用于贴合像素基板以辅助所述像素基板形成多个基板像素点，所述判断方法包括：获取所述金属掩膜板的图像，所述图像包括图像像素点；在同一参考坐标系下，建立所述图像像素点和所述基板像素点的位置关系；测试所述基板像素点以判断所述基板像素点是否异常并获取异常的所述基板像素点的坐标位置；和根据异常的所述基板像素点的坐标位置和所述位置关系确定所述金属掩膜板的缺陷位置。
- 如权利要求1所述的判断方法，其特征在于，所述判断方法包括：处理所述图像以判断所述金属掩膜板是否符合预设标准；在所述金属掩膜板符合所述预设标准时利用所述金属掩膜板贴合所述像素基板以辅助所述像素基板形成所述多个基板像素点；和在所述金属掩膜板不符合所述预设标准时利用遮罩修补机修补所述金属掩膜板。
- 如权利要求2所述的判断方法，其特征在于，所述判断方法包括：利用所述参考坐标系建立所述遮罩修补机的坐标。
- 如权利要求2所述的判断方法，其特征在于，所述在所述金属掩膜板不符合所述预设标准时利用遮罩修补机修复所述金属掩膜板后包括：返回所述获取所述金属掩膜板的图像的步骤。
- 如权利要求1所述的判断方法，其特征在于，所述获取所述金属掩膜板的图像包括：利用遮罩缺陷光学检查机获取所述图像。
- 如权利要求1所述的判断方法，其特征在于，所述测试所述基板像素点以判断所述基板像素点是否异常并获取异常的所述基板像素点的坐标位置包括：利用点灯机测试所述基板像素点。
- 如权利要求1所述的判断方法，其特征在于，所述获取所述金属掩膜板的图像包括：接收服务器发送的所述图像。
- 如权利要求1所述的判断方法，其特征在于，所述判断方法包括：在所述金属掩膜板存在所述缺陷位置时利用遮罩修补机修补所述金属掩膜板的所述缺陷位置。
- 如权利要求1所述的判断方法，其特征在于，所述判断方法包括：在所述金属掩膜板存在所述缺陷位置时提示更换所述金属掩膜板。
- 一种制造设备，用于判断金属掩膜板缺陷，其特征在于，所述金属掩膜板用于贴 合像素基板以辅助所述像素基板形成多个基板像素点，所述制造设备包括处理器，所述处理器用于：获取所述金属掩膜板的图像，所述图像包括图像像素点；在同一参考坐标系下，建立所述图像像素点和所述基板像素点的位置关系；测试所述基板像素点以判断所述基板像素点是否异常并获取异常的所述基板像素点的坐标位置；和根据所述异常的所述基板像素点的坐标位置和所述位置关系确定所述金属掩膜板的缺陷位置。
- 如权利要求10所述的制造设备，其特征在于，所述制造设备包括遮罩修补机，所述处理器用于：处理所述图像以判断所述金属掩膜板是否符合预设标准；在所述金属掩膜板符合所述预设标准时利用所述金属掩膜板贴合所述像素基板以辅助所述像素基板形成所述多个基板像素点；和在所述金属掩膜板不符合所述预设标准时利用所述遮罩修补机修补所述金属掩膜板。
- 如权利要求11所述的制造设备，其特征在于，所述处理器用于：利用所述参考坐标系建立所述遮罩修补机的坐标。
- 如权利要求11所述的制造设备，其特征在于，所述处理器用于：返回所述获取所述金属掩膜板的图像的步骤。
- 如权利要求10所述的制造设备，其特征在于，所述制造设备包括遮罩缺陷光学检查机，所述处理器用于：利用所述遮罩缺陷光学检查机获取所述图像。
- 如权利要求10所述的制造设备，其特征在于，所述制造设备包括点灯机，所述处理器用于：利用点灯机测试所述基板像素点。
- 如权利要求15所述的制造设备，其特征在于，所述制造设备包括用于与服务器通信的通信模块，所述处理器用于：通过所述通信模块接收所述服务器发送的所述图像。
- 如权利要求10所述的制造设备，其特征在于，所述制造设备包括遮罩修补机，所述处理器用于：在所述金属掩膜板存在所述缺陷位置时利用所述遮罩修补机修补所述金属掩膜板的所述缺陷位置。
- 如权利要求10所述的制造设备，其特征在于，所述处理器用于：在所述金属掩膜板存在所述缺陷位置时提示更换所述金属掩膜板。
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