CN104716062A - 晶圆重复性光刻缺陷检查分析方法、系统及晶圆生产方法 - Google Patents
晶圆重复性光刻缺陷检查分析方法、系统及晶圆生产方法 Download PDFInfo
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- CN104716062A CN104716062A CN201310676313.4A CN201310676313A CN104716062A CN 104716062 A CN104716062 A CN 104716062A CN 201310676313 A CN201310676313 A CN 201310676313A CN 104716062 A CN104716062 A CN 104716062A
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- 230000007547 defect Effects 0.000 title claims abstract description 454
- 238000000034 method Methods 0.000 title claims abstract description 110
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 235000012431 wafers Nutrition 0.000 title abstract 10
- 238000000206 photolithography Methods 0.000 title abstract 6
- 230000003252 repetitive effect Effects 0.000 title abstract 6
- 238000001259 photo etching Methods 0.000 claims abstract description 80
- 238000004458 analytical method Methods 0.000 claims abstract description 79
- 238000007689 inspection Methods 0.000 claims description 67
- 230000002950 deficient Effects 0.000 claims description 17
- 238000002203 pretreatment Methods 0.000 claims description 5
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 4
- 238000010835 comparative analysis Methods 0.000 abstract 1
- 238000000386 microscopy Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005457 optimization Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000000428 dust Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000007476 Maximum Likelihood Methods 0.000 description 1
- 206010052428 Wound Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310676313.4A CN104716062B (zh) | 2013-12-12 | 2013-12-12 | 晶圆重复性光刻缺陷检查分析方法、系统及晶圆生产方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310676313.4A CN104716062B (zh) | 2013-12-12 | 2013-12-12 | 晶圆重复性光刻缺陷检查分析方法、系统及晶圆生产方法 |
Publications (2)
Publication Number | Publication Date |
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CN104716062A true CN104716062A (zh) | 2015-06-17 |
CN104716062B CN104716062B (zh) | 2017-08-04 |
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Family Applications (1)
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CN201310676313.4A Expired - Fee Related CN104716062B (zh) | 2013-12-12 | 2013-12-12 | 晶圆重复性光刻缺陷检查分析方法、系统及晶圆生产方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104716062B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107768267A (zh) * | 2017-10-20 | 2018-03-06 | 上海华力微电子有限公司 | 重复性缺陷的筛选方法 |
CN110223929A (zh) * | 2019-05-07 | 2019-09-10 | 徐州鑫晶半导体科技有限公司 | 确定晶圆缺陷来源的方法 |
CN117666297A (zh) * | 2024-01-31 | 2024-03-08 | 合肥晶合集成电路股份有限公司 | 光刻图形量测检测方法及其系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008002935A (ja) * | 2006-06-22 | 2008-01-10 | Tokyo Seimitsu Co Ltd | 外観検査方法及び外観検査装置 |
CN101738400A (zh) * | 2008-11-14 | 2010-06-16 | 中芯国际集成电路制造(上海)有限公司 | 判断晶圆表面重复缺陷的方法及装置 |
CN102129164A (zh) * | 2010-01-15 | 2011-07-20 | 中芯国际集成电路制造(上海)有限公司 | 掩膜版缺陷的判断方法及判断系统 |
-
2013
- 2013-12-12 CN CN201310676313.4A patent/CN104716062B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008002935A (ja) * | 2006-06-22 | 2008-01-10 | Tokyo Seimitsu Co Ltd | 外観検査方法及び外観検査装置 |
CN101738400A (zh) * | 2008-11-14 | 2010-06-16 | 中芯国际集成电路制造(上海)有限公司 | 判断晶圆表面重复缺陷的方法及装置 |
CN102129164A (zh) * | 2010-01-15 | 2011-07-20 | 中芯国际集成电路制造(上海)有限公司 | 掩膜版缺陷的判断方法及判断系统 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107768267A (zh) * | 2017-10-20 | 2018-03-06 | 上海华力微电子有限公司 | 重复性缺陷的筛选方法 |
CN107768267B (zh) * | 2017-10-20 | 2020-04-10 | 上海华力微电子有限公司 | 重复性缺陷的筛选方法 |
CN110223929A (zh) * | 2019-05-07 | 2019-09-10 | 徐州鑫晶半导体科技有限公司 | 确定晶圆缺陷来源的方法 |
CN110223929B (zh) * | 2019-05-07 | 2022-01-04 | 徐州鑫晶半导体科技有限公司 | 确定晶圆缺陷来源的方法 |
CN117666297A (zh) * | 2024-01-31 | 2024-03-08 | 合肥晶合集成电路股份有限公司 | 光刻图形量测检测方法及其系统 |
CN117666297B (zh) * | 2024-01-31 | 2024-06-11 | 合肥晶合集成电路股份有限公司 | 光刻图形量测检测方法及其系统 |
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Publication number | Publication date |
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CN104716062B (zh) | 2017-08-04 |
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Effective date of registration: 20180606 Address after: 315800 No. 155 West Mount Lu Road, Ningbo Free Trade Zone, Zhejiang Patentee after: NINGBO BYD SEMICONDUCTOR Co.,Ltd. Address before: 518118 BYD Road, Pingshan New District, Shenzhen, Guangdong 3009 Patentee before: BYD Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20191211 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: 315800 No. 155 West Mount Lu Road, Ningbo Free Trade Zone, Zhejiang Patentee before: NINGBO BYD SEMICONDUCTOR Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. |
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Effective date of registration: 20201224 Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Patentee after: NINGBO BYD SEMICONDUCTOR Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Patentee after: NINGBO BYD SEMICONDUCTOR Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. Patentee before: NINGBO BYD SEMICONDUCTOR Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170804 |