CN102113105B - 包括光吸收粘合剂的集成电路 - Google Patents
包括光吸收粘合剂的集成电路 Download PDFInfo
- Publication number
- CN102113105B CN102113105B CN200980130171.3A CN200980130171A CN102113105B CN 102113105 B CN102113105 B CN 102113105B CN 200980130171 A CN200980130171 A CN 200980130171A CN 102113105 B CN102113105 B CN 102113105B
- Authority
- CN
- China
- Prior art keywords
- chip
- substrate
- binding agent
- display
- extinction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 title description 11
- 230000001070 adhesive effect Effects 0.000 title description 11
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 230000008033 biological extinction Effects 0.000 claims abstract description 27
- 239000011230 binding agent Substances 0.000 claims abstract description 26
- 238000009434 installation Methods 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000006229 carbon black Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000031700 light absorption Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003870 refractory metal Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7449008P | 2008-06-20 | 2008-06-20 | |
US61/074,490 | 2008-06-20 | ||
PCT/NL2009/050366 WO2009154464A1 (en) | 2008-06-20 | 2009-06-19 | An integrated circuit comprising light absorbing adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102113105A CN102113105A (zh) | 2011-06-29 |
CN102113105B true CN102113105B (zh) | 2015-08-19 |
Family
ID=41432779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980130171.3A Expired - Fee Related CN102113105B (zh) | 2008-06-20 | 2009-06-19 | 包括光吸收粘合剂的集成电路 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110147902A1 (zh) |
EP (1) | EP2304782A1 (zh) |
CN (1) | CN102113105B (zh) |
TW (1) | TWI427746B (zh) |
WO (1) | WO2009154464A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5967836B2 (ja) * | 2012-03-14 | 2016-08-10 | 日本特殊陶業株式会社 | セラミック基板およびその製造方法 |
TWI572062B (zh) * | 2014-09-02 | 2017-02-21 | 億光電子工業股份有限公司 | 發光元件及顯示裝置 |
TWI624083B (zh) * | 2014-09-02 | 2018-05-11 | 億光電子工業股份有限公司 | 發光元件及顯示裝置 |
EP3419050A1 (en) | 2017-06-23 | 2018-12-26 | ams International AG | Radiation-hardened package for an electronic device and method of producing a radiation-hardened package |
JP7206489B2 (ja) * | 2019-03-07 | 2023-01-18 | ミツミ電機株式会社 | 光学モジュール及び光学式エンコーダ |
KR102336286B1 (ko) * | 2020-06-30 | 2021-12-08 | 한국전자기술연구원 | 반도체칩 실장방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5685939A (en) * | 1995-03-10 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
US6304736B1 (en) * | 1997-05-23 | 2001-10-16 | Matsushita Electric Industrial Co., Ltd. | LCD with a diffusing sheet having diffusing and absorbing areas |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3298110B2 (ja) * | 1991-04-03 | 2002-07-02 | セイコーエプソン株式会社 | 異方性導電接着剤及びその接合方法 |
JP4448617B2 (ja) * | 1998-07-01 | 2010-04-14 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
JP3356079B2 (ja) * | 1998-10-12 | 2002-12-09 | ソニーケミカル株式会社 | 遮光性異方性導電性接着フィルム及び液晶表示素子 |
TWI229929B (en) * | 2001-01-29 | 2005-03-21 | Ube Industries | Underfill material for COF mounting and electronic components |
US20050247916A1 (en) * | 2004-05-06 | 2005-11-10 | Mccormick Demetrius | Compositions for use in electronics devices |
WO2006115142A1 (ja) * | 2005-04-22 | 2006-11-02 | Matsushita Electric Industrial Co., Ltd. | 固体撮像素子およびその製造方法ならびに光導波路形成装置 |
CN101681038B (zh) * | 2006-10-19 | 2011-10-19 | 创造者科技有限公司 | 可卷式或可绕式显示装置的顺光照明 |
US7605477B2 (en) * | 2007-01-25 | 2009-10-20 | Raytheon Company | Stacked integrated circuit assembly |
-
2009
- 2009-06-19 US US12/999,938 patent/US20110147902A1/en not_active Abandoned
- 2009-06-19 CN CN200980130171.3A patent/CN102113105B/zh not_active Expired - Fee Related
- 2009-06-19 EP EP09766882A patent/EP2304782A1/en not_active Withdrawn
- 2009-06-19 WO PCT/NL2009/050366 patent/WO2009154464A1/en active Application Filing
- 2009-06-22 TW TW098121079A patent/TWI427746B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5685939A (en) * | 1995-03-10 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
US6304736B1 (en) * | 1997-05-23 | 2001-10-16 | Matsushita Electric Industrial Co., Ltd. | LCD with a diffusing sheet having diffusing and absorbing areas |
Also Published As
Publication number | Publication date |
---|---|
WO2009154464A1 (en) | 2009-12-23 |
US20110147902A1 (en) | 2011-06-23 |
EP2304782A1 (en) | 2011-04-06 |
TW201017833A (en) | 2010-05-01 |
CN102113105A (zh) | 2011-06-29 |
TWI427746B (zh) | 2014-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: CREATOR TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: KONINKL PHILIPS ELECTRONICS NV Effective date: 20110720 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: EINDHOVEN, NETHERLANDS TO: BREDA, NETHERLANDS |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20110720 Address after: Holland buleda Applicant after: Creator Technology B. V. Address before: Holland Ian Deho Finn Applicant before: Koninkl Philips Electronics NV |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160419 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Electronics Co., Ltd. Address before: Holland buleda Patentee before: Creator Technology B. V. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20190619 |