CN102113099B - 一种沉积低介电常数膜层的方法 - Google Patents

一种沉积低介电常数膜层的方法 Download PDF

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Publication number
CN102113099B
CN102113099B CN200980130954.1A CN200980130954A CN102113099B CN 102113099 B CN102113099 B CN 102113099B CN 200980130954 A CN200980130954 A CN 200980130954A CN 102113099 B CN102113099 B CN 102113099B
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dielectric constant
chamber
organosilicon compounds
porogen
low dielectric
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Chinese (zh)
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CN102113099A (zh
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任康树
亚历山德罗斯·T·迪莫斯
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical Vapour Deposition (AREA)
CN200980130954.1A 2008-07-31 2009-07-28 一种沉积低介电常数膜层的方法 Expired - Fee Related CN102113099B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/183,915 US7989033B2 (en) 2007-07-12 2008-07-31 Silicon precursors to make ultra low-K films with high mechanical properties by plasma enhanced chemical vapor deposition
US12/183,915 2008-07-31
PCT/US2009/051983 WO2010014626A2 (en) 2008-07-31 2009-07-28 Novel silicon precursors to make ultra low-k films with high mechanical properties by plasma enhanced chemical vapor deposition

Publications (2)

Publication Number Publication Date
CN102113099A CN102113099A (zh) 2011-06-29
CN102113099B true CN102113099B (zh) 2013-06-12

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Country Link
US (1) US7989033B2 (enExample)
JP (1) JP5312588B2 (enExample)
KR (1) KR101139593B1 (enExample)
CN (1) CN102113099B (enExample)
TW (1) TWI388685B (enExample)
WO (1) WO2010014626A2 (enExample)

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JP2011254041A (ja) * 2010-06-04 2011-12-15 Renesas Electronics Corp 半導体装置
US20120121823A1 (en) * 2010-11-12 2012-05-17 Applied Materials, Inc. Process for lowering adhesion layer thickness and improving damage resistance for thin ultra low-k dielectric film
US9054110B2 (en) 2011-08-05 2015-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Low-K dielectric layer and porogen
KR102053350B1 (ko) * 2013-06-13 2019-12-06 삼성전자주식회사 저유전율 절연층을 가진 반도체 소자를 형성하는 방법
US10453675B2 (en) * 2013-09-20 2019-10-22 Versum Materials Us, Llc Organoaminosilane precursors and methods for depositing films comprising same
CN105720005B (zh) * 2014-12-04 2019-04-26 中芯国际集成电路制造(上海)有限公司 超低k介质层的形成方法
US20160214165A1 (en) * 2015-01-26 2016-07-28 General Electric Company Porous ceramic materials for investment casting
KR102624608B1 (ko) 2016-01-19 2024-01-16 삼성전자주식회사 저유전막의 형성 방법 및 이를 이용한 반도체 소자의 제조 방법
US10249489B2 (en) * 2016-11-02 2019-04-02 Versum Materials Us, Llc Use of silyl bridged alkyl compounds for dense OSG films
WO2019055393A1 (en) * 2017-09-14 2019-03-21 Versum Material Us, Llc COMPOSITIONS AND METHODS FOR DEPOSITION OF FILMS CONTAINING SILICON
JP7230067B2 (ja) * 2018-06-15 2023-02-28 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー シロキサン組成物、及び前記組成物を使用してケイ素含有膜を堆積させるための方法
US11594409B2 (en) 2020-02-28 2023-02-28 Applied Materials, Inc. Systems and methods for depositing low-k dielectric films
US20240087881A1 (en) * 2022-08-26 2024-03-14 Applied Materials, Inc. Systems and methods for depositing low-k dielectric films

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CN1662676A (zh) * 2002-05-08 2005-08-31 应用材料公司 用电子束硬化低介电常数膜的方法

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CN1662676A (zh) * 2002-05-08 2005-08-31 应用材料公司 用电子束硬化低介电常数膜的方法

Also Published As

Publication number Publication date
TWI388685B (zh) 2013-03-11
KR101139593B1 (ko) 2012-07-02
US7989033B2 (en) 2011-08-02
CN102113099A (zh) 2011-06-29
JP5312588B2 (ja) 2013-10-09
WO2010014626A2 (en) 2010-02-04
US20090017231A1 (en) 2009-01-15
WO2010014626A3 (en) 2010-04-15
TW201012962A (en) 2010-04-01
KR20110052674A (ko) 2011-05-18
JP2011530174A (ja) 2011-12-15

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