CN102110698B - 闪烁体板、放射线成像装置和系统及其制造方法 - Google Patents

闪烁体板、放射线成像装置和系统及其制造方法 Download PDF

Info

Publication number
CN102110698B
CN102110698B CN2010105883811A CN201010588381A CN102110698B CN 102110698 B CN102110698 B CN 102110698B CN 2010105883811 A CN2010105883811 A CN 2010105883811A CN 201010588381 A CN201010588381 A CN 201010588381A CN 102110698 B CN102110698 B CN 102110698B
Authority
CN
China
Prior art keywords
plate
scintillator
substrate
radiation imaging
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010105883811A
Other languages
English (en)
Chinese (zh)
Other versions
CN102110698A (zh
Inventor
野村庆一
冈田聪
长野和美
石田阳平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102110698A publication Critical patent/CN102110698A/zh
Application granted granted Critical
Publication of CN102110698B publication Critical patent/CN102110698B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)
  • Conversion Of X-Rays Into Visible Images (AREA)
CN2010105883811A 2009-12-26 2010-12-15 闪烁体板、放射线成像装置和系统及其制造方法 Expired - Fee Related CN102110698B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009296524A JP2011137665A (ja) 2009-12-26 2009-12-26 シンチレータパネル及び放射線撮像装置とその製造方法、ならびに放射線撮像システム
JP2009-296524 2009-12-26

Publications (2)

Publication Number Publication Date
CN102110698A CN102110698A (zh) 2011-06-29
CN102110698B true CN102110698B (zh) 2013-12-11

Family

ID=44174802

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010105883811A Expired - Fee Related CN102110698B (zh) 2009-12-26 2010-12-15 闪烁体板、放射线成像装置和系统及其制造方法

Country Status (3)

Country Link
US (1) US20110155917A1 (https=)
JP (1) JP2011137665A (https=)
CN (1) CN102110698B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012145537A (ja) * 2011-01-14 2012-08-02 Canon Inc 放射線検出装置、放射線検出システム、及び放射線検出装置の製造方法
DE102011017789B3 (de) * 2011-04-29 2012-04-05 Siemens Aktiengesellschaft Leuchtstoffplatte
JP2013029384A (ja) * 2011-07-27 2013-02-07 Canon Inc 放射線検出装置、その製造方法および放射線検出システム
GB201119257D0 (en) 2011-11-08 2011-12-21 Eshtech Ltd X-ray detection apparatus
JP6000680B2 (ja) 2012-06-20 2016-10-05 キヤノン株式会社 放射線検出装置、その製造方法及び撮像システム
JP2014074595A (ja) * 2012-10-02 2014-04-24 Canon Inc 放射線撮像装置、放射線撮像システム、及び、放射線撮像装置の製造方法
JP2015049123A (ja) * 2013-08-30 2015-03-16 株式会社東芝 検出器モジュール製造方法、検出器モジュール及び医用画像診断装置
JP6179925B2 (ja) * 2014-08-27 2017-08-16 国立研究開発法人理化学研究所 放射線検出素子、放射線検出装置および放射線検出素子の製造方法
CN105988131B (zh) * 2015-02-09 2019-03-19 通用电气公司 激光雕刻系统、各向异性的闪烁体及其制造方法
US10871581B2 (en) 2017-02-17 2020-12-22 Yasu Medical Imaging Technology Co., Ltd. Scintillator module, scintillator sensor unit, and scintillator module production method
JP2018189933A (ja) * 2017-05-12 2018-11-29 コニカミノルタ株式会社 格子及びｘ線タルボ撮影装置、格子の製造方法
JP7011283B2 (ja) * 2017-07-20 2022-01-26 国立研究開発法人理化学研究所 放射線イメージング装置用光学素子、光学素子の製造方法、放射線イメージング装置及びｘ線イメージング装置
CN114639689B (zh) * 2020-12-15 2025-03-18 京东方科技集团股份有限公司 平板探测器、其制作方法及x射线成像系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101002110A (zh) * 2004-08-10 2007-07-18 佳能株式会社 放射线探测装置、闪烁体板及其制造方法和放射线探测系统

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58177637A (ja) * 1982-04-14 1983-10-18 株式会社東芝 放射線用グリツドの製造方法
FR2567276B1 (fr) * 1984-07-06 1988-02-19 Labo Electronique Physique Perfectionnement apporte a une camera pour la detection de rayonnements x et g, camera dont le bloc scintillateur possede une fenetre d'entree formee d'une structure-support mecaniquement rigide et tres faiblement absorbante auxdits rayonnements
JPS6290599A (ja) * 1985-10-16 1987-04-25 富士写真フイルム株式会社 放射線像変換パネル
JP2514952B2 (ja) * 1987-03-13 1996-07-10 株式会社東芝 Ｘ線イメ−ジ管
JPH08184937A (ja) * 1994-12-28 1996-07-16 Fujitsu Ltd 輝尽蛍光体板の製造方法
JP3580879B2 (ja) * 1995-01-19 2004-10-27 浜松ホトニクス株式会社 電子管デバイス
WO1998012731A1 (fr) * 1996-09-18 1998-03-26 Kabushiki Kaisha Toshiba Tube a image radiologique et son procede de fabrication
JP3815766B2 (ja) * 1998-01-28 2006-08-30 キヤノン株式会社 二次元撮像装置
US6369867B1 (en) * 1998-03-12 2002-04-09 Gl Displays, Inc. Riveted liquid crystal display comprising at least one plastic rivet formed by laser drilling through a pair of plastic plates
US7034306B2 (en) * 1998-06-18 2006-04-25 Hamamatsu Photonics K.K. Scintillator panel and radiation image sensor
JP3566926B2 (ja) * 1998-06-18 2004-09-15 浜松ホトニクス株式会社 シンチレータパネル及び放射線イメージセンサ
JP4442833B2 (ja) * 1998-08-04 2010-03-31 キヤノン株式会社 光電変換装置
AU3168199A (en) * 1999-04-09 2000-11-14 Hamamatsu Photonics K.K. Scintillator panel and radiation ray image sensor
DE60135206D1 (de) * 2000-02-25 2008-09-18 Hamamatsu Photonics Kk Röntgenabbildungseinrichtung und verfahren zu ihrer herstellung
JP4447752B2 (ja) * 2000-08-03 2010-04-07 浜松ホトニクス株式会社 放射線検出器
JP4283427B2 (ja) * 2000-08-03 2009-06-24 浜松ホトニクス株式会社 放射線検出器およびシンチレータパネル
US6835936B2 (en) * 2001-02-07 2004-12-28 Canon Kabushiki Kaisha Scintillator panel, method of manufacturing scintillator panel, radiation detection device, and radiation detection system
US6847041B2 (en) * 2001-02-09 2005-01-25 Canon Kabushiki Kaisha Scintillator panel, radiation detector and manufacture methods thereof
JP2002333848A (ja) * 2001-05-10 2002-11-22 Sharp Corp 複合アクティブマトリクス基板、その製造方法、及び電磁波撮像装置
JP2003263119A (ja) * 2002-03-07 2003-09-19 Fuji Xerox Co Ltd リブ付き電極およびその製造方法
US7199379B2 (en) * 2002-06-28 2007-04-03 Agfa-Gevaert Binderless storage phosphor screen
JP2004093848A (ja) * 2002-08-30 2004-03-25 Toppan Printing Co Ltd 光拡散性スクリーンおよびこのスクリーンを用いた表示装置
US20040056366A1 (en) * 2002-09-25 2004-03-25 Maiz Jose A. A method of forming surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement
JP2004226269A (ja) * 2003-01-23 2004-08-12 Fuji Photo Film Co Ltd 放射線像変換器およびその製造方法
GB2403023A (en) * 2003-06-20 2004-12-22 Sharp Kk Organic light emitting device
US7067817B2 (en) * 2004-01-29 2006-06-27 Hamamatsu Photonics K.K. Radiation image sensor and making method of same
US7573035B2 (en) * 2004-10-29 2009-08-11 Koninklijke Philips Electronics N.V. GOS ceramic scintillating fiber optics x-ray imaging plate for use in medical DF and RF imaging and in CT
US7453065B2 (en) * 2004-11-10 2008-11-18 Canon Kabushiki Kaisha Sensor and image pickup device
EP1681584B1 (en) * 2005-01-13 2009-09-09 Aloka Co., Ltd. Scintillator member and manufacturing method thereof, and radiation measuring device
JP4176138B2 (ja) * 2005-01-27 2008-11-05 旭化成エレクトロニクス株式会社 大型ペリクル収納容器
JP2007240306A (ja) * 2006-03-08 2007-09-20 Toshiba Corp シンチレータパネルおよび平面検出器
JP2008026013A (ja) * 2006-07-18 2008-02-07 Toshiba Corp シンチレータパネルおよび放射線検出器
DE102006038969B4 (de) * 2006-08-21 2013-02-28 Siemens Aktiengesellschaft Röntgenkonverterelement und Verfahren zu dessen Herstellung
JP2008122275A (ja) * 2006-11-14 2008-05-29 Konica Minolta Medical & Graphic Inc シンチレータパネル、その製造方法及び放射線イメージセンサ
JP2008190929A (ja) * 2007-02-02 2008-08-21 Konica Minolta Medical & Graphic Inc 放射線用シンチレータプレートの製造方法及び放射線画像撮影装置
JP5597354B2 (ja) * 2007-03-27 2014-10-01 株式会社東芝 シンチレータパネル及び放射線検出器
US7732788B2 (en) * 2007-10-23 2010-06-08 Hamamatsu Photonics K.K. Radiation image converting panel, scintillator panel and radiation image sensor
US20080311484A1 (en) * 2007-06-15 2008-12-18 Hamamatsu Photonicfs K.K. Radiation image conversion panel, scintillator panel, and radiation image sensor
US7468514B1 (en) * 2007-06-15 2008-12-23 Hamamatsu Photonics K.K. Radiation image conversion panel, scintillator panel, and radiation image sensor
JP2009025075A (ja) * 2007-07-18 2009-02-05 Konica Minolta Medical & Graphic Inc 放射線用シンチレータパネルおよびフラットパネルディテクター

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101002110A (zh) * 2004-08-10 2007-07-18 佳能株式会社 放射线探测装置、闪烁体板及其制造方法和放射线探测系统

Also Published As

Publication number Publication date
US20110155917A1 (en) 2011-06-30
JP2011137665A (ja) 2011-07-14
CN102110698A (zh) 2011-06-29

Similar Documents

Publication Publication Date Title
CN102110698B (zh) 闪烁体板、放射线成像装置和系统及其制造方法
US8648312B2 (en) Radiation detection apparatus, manufacturing method thereof, and radiation detection system
US9081104B2 (en) Radiation detection apparatus and radiation detection system
CN101657737B (zh) 放射线检测装置和放射线检测系统
US20140091225A1 (en) Radiation imaging apparatus, radiation imaging system, and radiation imaging apparatus manufacturing method
US9568614B2 (en) Radiation detection apparatus, method of manufacturing the same, and imaging system
JP2011247822A (ja) 放射線検出装置及び放射線撮像システム
JP6310216B2 (ja) 放射線検出装置及びその製造方法並びに放射線検出システム
JP7342184B2 (ja) 放射線検出器、放射線画像撮影装置及び放射線検出器の製造方法
JP2014077735A (ja) 放射線検出装置及び放射線検出システム
CN101542635A (zh) 闪烁器板和射线检测器
US20120318990A1 (en) Radiation detection panel and radiation imaging apparatus
US20120187298A1 (en) Scintillator panel, method of manufacturing the same, and radiation detection apparatus
US10345455B2 (en) Radiation detection apparatus, radiation imaging system, and method of manufacturing radiation detection apparatus
JP2006189377A (ja) シンチレータパネル、放射線検出装置、及び放射線検出システム
JP2010101640A (ja) 放射線検出器
JP5908212B2 (ja) 放射線検出器及びその製造方法
JP7125502B2 (ja) 放射線検出器、放射線画像撮影装置、及び製造方法
CN111819471B (zh) 放射线成像装置和放射线成像系统
JP2003262678A (ja) 放射線検出装置用シンチレーターパネルおよびその製造方法
JP2004061116A (ja) 放射線検出装置及びシステム
JP4136416B2 (ja) シンチレーターパネルおよびその製造方法
JP2007057428A (ja) 放射線検出装置及び放射線撮像システム
JPWO2008108186A1 (ja) 放射線画像撮影装置
WO2019244610A1 (ja) 放射線検出器及び放射線画像撮影装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131211

Termination date: 20141215

EXPY Termination of patent right or utility model