CN102024677B - 半导体器件的制造方法 - Google Patents

半导体器件的制造方法 Download PDF

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Publication number
CN102024677B
CN102024677B CN201010233605.7A CN201010233605A CN102024677B CN 102024677 B CN102024677 B CN 102024677B CN 201010233605 A CN201010233605 A CN 201010233605A CN 102024677 B CN102024677 B CN 102024677B
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lead frame
dimensional barcode
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CN102024677A (zh
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横泽薰
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Renesas Electronics Corp
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Renesas Electronics Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/106—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols digital information, e.g. bar codes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Lead Frames For Integrated Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
CN201010233605.7A 2009-09-18 2010-07-19 半导体器件的制造方法 Active CN102024677B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-217825 2009-09-18
JP2009217825A JP5315186B2 (ja) 2009-09-18 2009-09-18 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
CN102024677A CN102024677A (zh) 2011-04-20
CN102024677B true CN102024677B (zh) 2016-01-06

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US (2) US8649896B2 (https=)
JP (1) JP5315186B2 (https=)
CN (1) CN102024677B (https=)

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US10290606B2 (en) * 2012-06-21 2019-05-14 Advanced Micro Devices, Inc. Interposer with identification system
JP5968705B2 (ja) * 2012-07-13 2016-08-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2014142729A (ja) * 2013-01-23 2014-08-07 Renesas Electronics Corp 半導体装置の製造方法
US8901715B1 (en) 2013-07-05 2014-12-02 Infineon Technologies Ag Method for manufacturing a marked single-crystalline substrate and semiconductor device with marking
JP6387256B2 (ja) * 2014-07-07 2018-09-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
WO2016103125A1 (en) * 2014-12-22 2016-06-30 Bombardier Inc. Reference system for online vision inspection
KR101661839B1 (ko) * 2015-01-05 2016-09-30 금오공과대학교 산학협력단 솔라셀 제조 공정 관리 방법
JP6103547B2 (ja) * 2015-01-09 2017-03-29 三菱電機株式会社 電子基板ユニット
JP6537277B2 (ja) * 2015-01-23 2019-07-03 キヤノン株式会社 インプリント装置、物品製造方法
JP6388547B2 (ja) * 2015-01-26 2018-09-12 株式会社ディスコ 切削装置
CN106332453A (zh) * 2015-06-16 2017-01-11 中兴通讯股份有限公司 印制电路板pcb制作信息的确定方法及装置
KR102503892B1 (ko) 2015-12-31 2023-02-28 삼성전자주식회사 패키지-온-패키지 타입의 반도체 패키지 및 그 제조방법
GB201614147D0 (en) * 2016-08-18 2016-10-05 Trw Ltd Methods of controlling access to keys and of obscuring information and electronic devices
KR102473662B1 (ko) 2017-10-18 2022-12-02 삼성전자주식회사 반도체 소자의 제조 방법
CN110895732A (zh) * 2018-09-12 2020-03-20 欧菲影像技术（广州）有限公司 晶圆映射生产管理方法、装置、系统、介质和计算机设备
KR102110498B1 (ko) * 2018-10-19 2020-05-13 무진전자 주식회사 반도체 공정에서의 지능형 영상 추적 시스템
CN109849105A (zh) * 2018-11-16 2019-06-07 惠科股份有限公司 覆晶薄膜冲切装置、显示装置组装设备及其组装系统
CN109558923A (zh) * 2018-12-04 2019-04-02 北极光电(深圳)有限公司 一种基于二维码的光模块标记系统及方法
US11576263B2 (en) * 2019-01-02 2023-02-07 Novatek Microelectronics Corp. Chip on film package structure and method for reading a code-included pattern on a package structure
JP7401284B2 (ja) * 2019-12-12 2023-12-19 東京エレクトロン株式会社 基板処理装置
US12504747B2 (en) * 2021-03-23 2025-12-23 International Business Machines Corporation Multicomponent module design and fabrication
CN116383146A (zh) * 2023-05-11 2023-07-04 上海哥瑞利软件股份有限公司 半导体封测打标机设备印章自动调取方法及系统
CN116541426B (zh) * 2023-06-25 2024-05-14 荣耀终端有限公司 半导体器件的数据存储方法和数据追查方法、电子设备
JP7664503B1 (ja) * 2023-10-30 2025-04-17 リンテック株式会社 半導体装置の製造方法、半導体装置の同一性判定方法、および半導体装置の製造システム
WO2025094558A1 (ja) * 2023-10-30 2025-05-08 リンテック株式会社 半導体装置の製造方法、半導体装置の同一性判定方法、および半導体装置の製造システム

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US7031791B1 (en) * 2001-02-27 2006-04-18 Cypress Semiconductor Corp. Method and system for a reject management protocol within a back-end integrated circuit manufacturing process

Also Published As

Publication number Publication date
US20140147971A1 (en) 2014-05-29
US20110071662A1 (en) 2011-03-24
US9287142B2 (en) 2016-03-15
JP2011066340A (ja) 2011-03-31
JP5315186B2 (ja) 2013-10-16
US8649896B2 (en) 2014-02-11
CN102024677A (zh) 2011-04-20

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