CN102017205B - 表面安装电路板指示器 - Google Patents

表面安装电路板指示器 Download PDF

Info

Publication number
CN102017205B
CN102017205B CN200980116224.6A CN200980116224A CN102017205B CN 102017205 B CN102017205 B CN 102017205B CN 200980116224 A CN200980116224 A CN 200980116224A CN 102017205 B CN102017205 B CN 102017205B
Authority
CN
China
Prior art keywords
circuit board
pcb
printed circuit
surface mount
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980116224.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN102017205A (zh
Inventor
克劳斯·厄斯特黑尔德
肯尼思·詹金斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dialight Corp
Original Assignee
Dialight Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dialight Corp filed Critical Dialight Corp
Publication of CN102017205A publication Critical patent/CN102017205A/zh
Application granted granted Critical
Publication of CN102017205B publication Critical patent/CN102017205B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN200980116224.6A 2008-05-05 2009-05-04 表面安装电路板指示器 Expired - Fee Related CN102017205B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5045208P 2008-05-05 2008-05-05
US61/050,452 2008-05-05
PCT/US2009/042732 WO2009137416A1 (en) 2008-05-05 2009-05-04 Surface mount circuit board indicator

Publications (2)

Publication Number Publication Date
CN102017205A CN102017205A (zh) 2011-04-13
CN102017205B true CN102017205B (zh) 2014-09-10

Family

ID=41256963

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980116224.6A Expired - Fee Related CN102017205B (zh) 2008-05-05 2009-05-04 表面安装电路板指示器

Country Status (7)

Country Link
US (2) US8593298B2 (enExample)
EP (1) EP2286468B1 (enExample)
JP (1) JP5587296B2 (enExample)
CN (1) CN102017205B (enExample)
CA (1) CA2722585C (enExample)
IL (1) IL208949A (enExample)
WO (1) WO2009137416A1 (enExample)

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KR101032928B1 (ko) 2011-01-07 2011-05-06 메코시스 주식회사 미디어 파사드 루버장치
US20140307427A1 (en) * 2013-04-11 2014-10-16 Lg Innotek Co., Ltd. Lighting device
US9951910B2 (en) * 2014-05-19 2018-04-24 Cree, Inc. LED lamp with base having a biased electrical interconnect
JP6718601B2 (ja) * 2016-08-30 2020-07-08 東芝ライテック株式会社 車両用照明装置、および車両用灯具
US9967993B1 (en) * 2016-11-07 2018-05-08 Phoenix Contact Development and Manufacturing, Inc. Printed circuit board enclosure assembly
DE102017116949B4 (de) 2017-07-26 2023-03-16 Ledvance Gmbh Lampensockel mit Leuchtmitteltreiber
CN111031667B (zh) * 2019-12-26 2021-08-13 航天科工微系统技术有限公司 一种微波信号垂直互连装置及互连方法

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US4959761A (en) * 1989-12-21 1990-09-25 Dialight Corporation Surface mounted led package
US7062112B2 (en) * 2002-08-29 2006-06-13 Cml Innovative Technologies, Inc. SMT LED indicator package
US7066660B2 (en) * 2003-08-29 2006-06-27 Finisar Corporation Optoelectronic packaging assembly
US7329034B2 (en) * 2003-03-05 2008-02-12 Dialight Corporation Multi-level surface mounted lightpipe package design with LED light sources

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JP2006324529A (ja) * 2005-05-19 2006-11-30 Seiwa Electric Mfg Co Ltd 発光ダイオードラインモジュール
KR100757196B1 (ko) 2005-08-01 2007-09-07 서울반도체 주식회사 실리콘 렌즈를 구비하는 발광소자
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Patent Citations (4)

* Cited by examiner, † Cited by third party
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US4959761A (en) * 1989-12-21 1990-09-25 Dialight Corporation Surface mounted led package
US7062112B2 (en) * 2002-08-29 2006-06-13 Cml Innovative Technologies, Inc. SMT LED indicator package
US7329034B2 (en) * 2003-03-05 2008-02-12 Dialight Corporation Multi-level surface mounted lightpipe package design with LED light sources
US7066660B2 (en) * 2003-08-29 2006-06-27 Finisar Corporation Optoelectronic packaging assembly

Also Published As

Publication number Publication date
JP2011520289A (ja) 2011-07-14
EP2286468B1 (en) 2019-08-21
CA2722585C (en) 2014-10-14
IL208949A (en) 2015-08-31
WO2009137416A1 (en) 2009-11-12
IL208949A0 (en) 2011-01-31
CN102017205A (zh) 2011-04-13
EP2286468A1 (en) 2011-02-23
US20090273939A1 (en) 2009-11-05
JP5587296B2 (ja) 2014-09-10
US8593298B2 (en) 2013-11-26
EP2286468A4 (en) 2013-11-06
US9671073B2 (en) 2017-06-06
US20140036515A1 (en) 2014-02-06
CA2722585A1 (en) 2009-11-12

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140910

Termination date: 20170504

CF01 Termination of patent right due to non-payment of annual fee