JP5587296B2 - 表面実装型の回路基板インジケータ - Google Patents
表面実装型の回路基板インジケータ Download PDFInfo
- Publication number
- JP5587296B2 JP5587296B2 JP2011508580A JP2011508580A JP5587296B2 JP 5587296 B2 JP5587296 B2 JP 5587296B2 JP 2011508580 A JP2011508580 A JP 2011508580A JP 2011508580 A JP2011508580 A JP 2011508580A JP 5587296 B2 JP5587296 B2 JP 5587296B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pcb
- housing
- led
- indicator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- BWWVXHRLMPBDCK-UHFFFAOYSA-N 1,2,4-trichloro-5-(2,6-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl BWWVXHRLMPBDCK-UHFFFAOYSA-N 0.000 description 35
- 229910000679 solder Inorganic materials 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
本出願は、米国特許法第119条(e)に基づき、2008年5月5日出願の米国仮特許出願第61/050,452号の優先権を主張する。同出願全体を、本願に引用して援用する。
Claims (9)
- 少なくとも1つの発光ダイオード(LED)ダイ、1つ以上の配線、および少なくとも1つのレンズを有するとともに主回路基板に対して垂直な状態で当該主回路基板に接続されるプリント回路基板(PCB)と、
筐体であって、前記筐体の周囲に沿って側面上に少なくとも1つの開口を備え、前記PCBは、前記筐体内のスロットを介して前記PCBを前記筐体内に垂直に挿入することによって前記筐体に結合されるとともに、前記少なくとも1つのLEDダイの光出力表面が前記少なくとも1つの開口と同じ方向を向くように、前記筐体に結合される、筐体と、
前記筐体に結合された少なくとも1つの位置合わせピンと
を備えることを特徴とする表面実装型の回路基板インジケータ。 - 請求項1に記載の表面実装型の回路基板インジケータであって、前記PCBが、少なくとも1つの固定用スロットと、垂直延伸部材を備えることを特徴とする表面実装型の回路基板インジケータ。
- 請求項2に記載の表面実装型の回路基板インジケータであって、前記少なくとも1つの固定用スロットは、筐体に設けられた垂直スロット内のノッチと噛み合うことを特徴とする表面実装型の回路基板インジケータ。
- 請求項2に記載の表面実装型の回路基板インジケータであって、前記少なくとも1つのLEDダイおよび前記少なくとも1つのレンズが前記PCB上で中心を外して位置決めされ、これにより、垂直延伸部材が形成されることを特徴とする表面実装型の回路基板インジケータ。
- 請求項1に記載の表面実装型の回路基板インジケータであって、前記PCBが、前記筐体の前記開口に隣接して前記筐体に結合されることを特徴とする表面実装型の回路基板インジケータ。
- 請求項1に記載の表面実装型の回路基板インジケータであって、前記PCBが、複数のLEDダイおよび複数のレンズを備えることを特徴とする表面実装型の回路基板インジケータ。
- 請求項6に記載の表面実装型の回路基板インジケータであって、前記複数のLEDダイのそれぞれが、それぞれの配線を介して独立して制御可能であることを特徴とする表面実装型の回路基板インジケータ。
- 請求項6に記載の表面実装型の回路基板インジケータであって、前記複数のLEDダイのそれぞれが異なる色であることを特徴とする表面実装型の回路基板インジケータ。
- 請求項1に記載の表面実装型の回路基板インジケータであって、前記1つまたは複数の配線が、前記PCBの前面、前記PCBの裏面、または前記PCBの前記前面と前記裏面の間の1つ以上の層のうちの少なくとも1つに結合されることを特徴とする表面実装型の回路基板インジケータ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5045208P | 2008-05-05 | 2008-05-05 | |
US61/050,452 | 2008-05-05 | ||
PCT/US2009/042732 WO2009137416A1 (en) | 2008-05-05 | 2009-05-04 | Surface mount circuit board indicator |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011520289A JP2011520289A (ja) | 2011-07-14 |
JP2011520289A5 JP2011520289A5 (ja) | 2012-05-31 |
JP5587296B2 true JP5587296B2 (ja) | 2014-09-10 |
Family
ID=41256963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011508580A Expired - Fee Related JP5587296B2 (ja) | 2008-05-05 | 2009-05-04 | 表面実装型の回路基板インジケータ |
Country Status (7)
Country | Link |
---|---|
US (2) | US8593298B2 (ja) |
EP (1) | EP2286468B1 (ja) |
JP (1) | JP5587296B2 (ja) |
CN (1) | CN102017205B (ja) |
CA (1) | CA2722585C (ja) |
IL (1) | IL208949A (ja) |
WO (1) | WO2009137416A1 (ja) |
Families Citing this family (7)
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KR101032928B1 (ko) | 2011-01-07 | 2011-05-06 | 메코시스 주식회사 | 미디어 파사드 루버장치 |
US20140307427A1 (en) * | 2013-04-11 | 2014-10-16 | Lg Innotek Co., Ltd. | Lighting device |
US9951910B2 (en) * | 2014-05-19 | 2018-04-24 | Cree, Inc. | LED lamp with base having a biased electrical interconnect |
JP6718601B2 (ja) * | 2016-08-30 | 2020-07-08 | 東芝ライテック株式会社 | 車両用照明装置、および車両用灯具 |
US9967993B1 (en) * | 2016-11-07 | 2018-05-08 | Phoenix Contact Development and Manufacturing, Inc. | Printed circuit board enclosure assembly |
DE102017116949B4 (de) | 2017-07-26 | 2023-03-16 | Ledvance Gmbh | Lampensockel mit Leuchtmitteltreiber |
CN111031667B (zh) * | 2019-12-26 | 2021-08-13 | 航天科工微系统技术有限公司 | 一种微波信号垂直互连装置及互连方法 |
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-
2009
- 2009-05-04 CN CN200980116224.6A patent/CN102017205B/zh not_active Expired - Fee Related
- 2009-05-04 JP JP2011508580A patent/JP5587296B2/ja not_active Expired - Fee Related
- 2009-05-04 EP EP09743402.1A patent/EP2286468B1/en active Active
- 2009-05-04 CA CA2722585A patent/CA2722585C/en active Active
- 2009-05-04 WO PCT/US2009/042732 patent/WO2009137416A1/en active Application Filing
- 2009-05-04 US US12/435,090 patent/US8593298B2/en active Active
-
2010
- 2010-10-26 IL IL208949A patent/IL208949A/en not_active IP Right Cessation
-
2013
- 2013-10-10 US US14/051,293 patent/US9671073B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20090273939A1 (en) | 2009-11-05 |
EP2286468A4 (en) | 2013-11-06 |
IL208949A (en) | 2015-08-31 |
JP2011520289A (ja) | 2011-07-14 |
IL208949A0 (en) | 2011-01-31 |
US20140036515A1 (en) | 2014-02-06 |
EP2286468A1 (en) | 2011-02-23 |
EP2286468B1 (en) | 2019-08-21 |
WO2009137416A1 (en) | 2009-11-12 |
CA2722585A1 (en) | 2009-11-12 |
CN102017205B (zh) | 2014-09-10 |
US9671073B2 (en) | 2017-06-06 |
CA2722585C (en) | 2014-10-14 |
US8593298B2 (en) | 2013-11-26 |
CN102017205A (zh) | 2011-04-13 |
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