CN102006734B - 一种板内金手指倒角工艺 - Google Patents
一种板内金手指倒角工艺 Download PDFInfo
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- CN102006734B CN102006734B CN 201010286574 CN201010286574A CN102006734B CN 102006734 B CN102006734 B CN 102006734B CN 201010286574 CN201010286574 CN 201010286574 CN 201010286574 A CN201010286574 A CN 201010286574A CN 102006734 B CN102006734 B CN 102006734B
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- chamfering
- connector
- cutter
- golden finger
- board
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Priority Applications (1)
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CN 201010286574 CN102006734B (zh) | 2010-09-17 | 2010-09-17 | 一种板内金手指倒角工艺 |
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CN 201010286574 CN102006734B (zh) | 2010-09-17 | 2010-09-17 | 一种板内金手指倒角工艺 |
Publications (2)
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CN102006734A CN102006734A (zh) | 2011-04-06 |
CN102006734B true CN102006734B (zh) | 2013-04-03 |
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CN 201010286574 Expired - Fee Related CN102006734B (zh) | 2010-09-17 | 2010-09-17 | 一种板内金手指倒角工艺 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104540316A (zh) * | 2014-12-10 | 2015-04-22 | 江门崇达电路技术有限公司 | 一种全刚性材料假性软硬结合线路板及其制作方法 |
CN108296567A (zh) * | 2018-02-01 | 2018-07-20 | 成都德坤航空设备制造有限公司 | 一种使用锣机对蜂窝材料棱边倒圆方法 |
CN111417260B (zh) * | 2020-04-07 | 2021-07-30 | 信丰祥达丰电子有限公司 | 一种pcb斜边金属化包铜的生产工艺 |
CN111642084B (zh) * | 2020-06-29 | 2021-08-31 | 苏州浪潮智能科技有限公司 | 金手指倒角的确定方法、确定装置、确定设备及存储介质 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2084112A (en) * | 1980-09-30 | 1982-04-07 | Brine Terence John | Wiring tool |
CN101521984A (zh) * | 2008-02-29 | 2009-09-02 | 中兴通讯股份有限公司 | 降低金手指配合推力的方法和印刷电路板 |
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2010
- 2010-09-17 CN CN 201010286574 patent/CN102006734B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2084112A (en) * | 1980-09-30 | 1982-04-07 | Brine Terence John | Wiring tool |
CN101521984A (zh) * | 2008-02-29 | 2009-09-02 | 中兴通讯股份有限公司 | 降低金手指配合推力的方法和印刷电路板 |
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CN102006734A (zh) | 2011-04-06 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20110406 Assignee: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO., LTD. Assignor: Shenzhen Suntak Circuit Technology Co., Ltd. Contract record no.: 2013440000530 Denomination of invention: Chamfering process for connector in board Granted publication date: 20130403 License type: Exclusive License Record date: 20131205 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151014 Address after: No. 363, No. 529000, Lian Hai Road, hi tech Zone, Guangdong, Jiangmen Patentee after: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO., LTD. Address before: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Tong Mei Road on the eastern side of CSG community Patentee before: Shenzhen Suntak Circuit Technology Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20190917 |
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CF01 | Termination of patent right due to non-payment of annual fee |