CN102523692B - 一种阶梯电路板制作工艺 - Google Patents

一种阶梯电路板制作工艺 Download PDF

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CN102523692B
CN102523692B CN201110454578.0A CN201110454578A CN102523692B CN 102523692 B CN102523692 B CN 102523692B CN 201110454578 A CN201110454578 A CN 201110454578A CN 102523692 B CN102523692 B CN 102523692B
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circuit board
wiring board
pad
milling
board substrate
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CN102523692A (zh
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宋建远
彭卫红
谢萍萍
刘�东
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Shenzhen Suntak Multilayer PCB Co Ltd
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Shenzhen Suntak Multilayer PCB Co Ltd
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Priority to PCT/CN2012/080829 priority patent/WO2013097480A1/zh
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    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
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    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
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Abstract

本发明公开了一种阶梯电路板制作工艺，包括步骤：A）对线路板基板进行开料、内层印制图形后内层蚀刻、锣阶梯槽、铣垫片，棕化、压板处理后，对其外层进行钻孔；B）将钻孔后的线路板基板进行外层沉铜，然后将整个线路板基板进行电镀；C）通过镀孔菲林进行图形转移；D）将线路板基板进行图形镀铜，并对图形镀铜后的线路板基板锣连接片（SET）外形，然后进行外层蚀刻；E）阻焊塞孔后丝印阻焊及文字；F）全板沉镍金后丝印字符，成型线路板；G）测试检查成品板的电气性能及外观，制得成品。本发明在制作阶梯槽的时候采用先铣阶梯槽，防止层压时流胶，后使用聚四氟乙烯PTFE高温阻胶垫片层压的方式制作，可以有效避免因后铣槽而产生的层间缝隙。

Description

一种阶梯电路板制作工艺
技术领域
本发明属于线路板制作技术领域，尤其是涉及一种广泛应用于微型设备的阶梯线路板的制作工艺。
背景技术
电子产品的小型多样化的发展，使其在空间和安全性上受到较大制约，传统的平面线路板显然已经不能满足许多领域电子产品的要求，于是出现了多层或者阶梯式的电路板逐渐取代传统的平面线路板。但是采用三维结构设计的阶梯式线路板在制作工艺上一直是本领域技术人员的难题，尤其是对其阶梯槽的制备，往往会出现凹陷或凸起，或者流胶等缺陷；另外的，阶梯槽设计不合理的话，对线路板的外层图形、贴干膜、钻孔、阻焊等工艺都会带来诸多麻烦。
发明内容
本发明的目的在于提供一种全新的阶梯线路板的制作工艺，解决现有技术存在的缺陷。
为实现上述目的，本发明采用如下技术方案：
一种线路板镀铜填孔工艺，包括步骤：
A）对线路板基板进行开料、内层印制图形后内层蚀刻、锣阶梯槽、铣垫片，棕化、压板处理后，对其外层进行钻孔；
B）将钻孔后的线路板基板铣镀通孔(PTH)槽后进行外层沉铜，然后将整个线路板基板进行电镀；
C）对沉铜电镀后的线路板基板通过镀孔菲林进行图形转移；
D）将图形转移后的线路板基板进行图形镀铜，并对图形镀铜后的线路板基板锣连接片（SET）外形，然后进行外层蚀刻；
E）阻焊塞孔后丝印阻焊及文字；
F）全板沉镍金后丝印字符，成型线路板； 
G）测试检查成品板的电气性能及外观，制得成品。
优选的是：所述步骤A）所述的压板处理采用的层压垫片为聚四氟乙烯（PTFE）垫片。
更优选的是：所述步骤A）所述的钻孔为将线路板基板的所有孔一次性钻出，并对钻出的孔进行孔金属化。
在进行锣连接片（SET）外形时，其外形公差为+/-0.10mm；所述阻焊为绿油阻焊。
所述的垫片为PP垫片和/或PTFE垫片。
所述步骤A）垫片比阶梯槽槽位单边缩小0.3mm。
本发明在制作阶梯槽的时候采用先铣阶梯槽，垫片缩小0.3mm，防止层压时流胶，后使用聚四氟乙烯PTFE高温阻胶垫片层压的方式制作，可以有效避免因后铣槽而产生的层间缝隙。
制作阶梯槽若采用铣盲槽的方法，压合后再铣槽，极易导致阶梯连接位层间缝隙问题产生。因为从层压至成型，还存在大量的微蚀、磨板过程，层间缝隙内极易藏药水，导致爆板，或开路短路等问题。
阶梯板层压时，一般都会向阶梯位垫相应的垫片，保证阶梯板模仿正常板制作，怎样选取合适的垫片，保证层压等工序品质的可靠性，是一个研发重点，选用的垫片厚度或大小补偿不合适，就会造成在层压过程中的凹陷或凸起问题。
本发明采取的技术方案为：采用热膨胀系数小，具有较好阻胶性的的PTFE垫片作为槽位垫片，可以更好的控制垫片的补偿大小和厚度，有效避免了因为PP片补偿不当而造成的槽位凹陷或凸起不良。
在槽位的大小基础上，垫片单边减小0.3mm左右，厚度与层压后的阶梯槽厚度一致制作。层压过程中，阶梯槽位会产生相应的膨胀，若垫片大小与槽位大小一致，则在层压时板材膨胀的内应力不能有效释放，从而造成阶梯槽边缘凸起现象。经过反复验证，将垫片单边减小0.3mm，可有效避免此现象的发生。另外，垫片厚度必须与层压完成后阶梯槽的厚度一致，才能使阶梯槽层压厚度与垫片厚度一致，垫片过厚会造成阶梯槽位凸起，过薄会造成凹陷。
本发明与现有技术相比，具有如下优点和有益效果：
本发明在制作阶梯槽的时候采用先铣阶梯槽，并预大0.3mm，防止层压时流胶，后使用聚四氟乙烯PTFE高温阻胶垫片层压的方式制作，可以有效避免因后铣槽而产生的层间缝隙。本发明采用热膨胀系数小，具有较好阻胶性的的PTFE垫片作为槽位垫片，可以更好的控制垫片的补偿大小和厚度，有效避免了因为PP片补偿不当而造成的槽位凹陷或凸起不良。
具体实施方式
下面结合具体实施例对本发明做进一步详细说明。
阶梯电路板制作流程：
1)开料：
l  开料时需测量开料基板厚度在公差范围之内，确保开料板材可以满足压合板厚要求；
l  开料尺寸：605*300mm；材料：IT158和RF-35；
2)内层图形：
l  L2层和L3层正常制作图形，L1和L4面只做外围靶位图形；
3)铣槽：
l  从L3层铣槽，将IT158板料的L3-L4层芯板和0.30mm光板的指定槽位铣空，铣槽系数与L3层图形菲林系数相同；
4 )铣PP垫片及PTFE垫片：
l  使用1.0mm厚光板将PP或PTFE夹在中间，铣槽系数与L3层图形菲林系数相同；
l  铣PTFE垫片时需要每趟换一只新双刃铣刀，不允许有聚胶，铣边披锋缺陷，铆钉孔完整；
5) 压合
l  棕化：光板、芯板做棕化，棕化速度：3.0～3.2m/min；
l  压合：A、热压参数：使用YB参数； 牛皮纸：上下各 20张(全新)； 
B、          排板时铣空位使用PTFE垫片填充，铣空面朝上，配合使用铝片、硅胶垫及离型膜；
C、          耐PTFE垫片不能放偏，否则会出现失压和凹陷；
D、          排版时，注意清洁阶梯板铜面上PP粉；
E、          排板层数：每盘板最多排5层；
6) 除板面流胶
l  退净棕化膜：先使用喷砂退棕化膜（不开磨刷）再使用98%浓硫酸浸泡5-8min除板面流胶，使用沉铜前磨板机烘干（不开磨刷）；
7) 外层钻孔
l  用全新UC系列钻刀；
l  在铣空位放PP垫片填充再盖铝片，防止阶梯位孔披锋；
l  首板确认孔粗小于25um，无扯铜异常，检查无孔口披锋和孔内毛刺；
l  钻孔后叠板烘板150℃×3H，每叠板数不能超过15PNL；
8) 等离子活化
l  活化参数
使用H2进行活化35min；
表1：等离子活化参数
Figure 353065DEST_PATH_IMAGE001
 9）P T H&全板电镀
l  沉铜两次：第一次从除油缸进缸，第2次沉铜从预浸缸开始（不能过化学除胶渣）；
l  孔切片：板电后切片检查：孔铜、表铜符合MI要求；孔粗≤25um；
10) 外层图形
l  压膜前加放PTFE垫片填充阶梯位，使用殷田DF-40干膜,手动贴膜机压膜；
l  显影后将耐高温阻胶垫片取出；
11) 阻焊
l  使用芯板塞孔，塞孔芯板必须张贴在网版上，不允许塞孔不饱满和发红；
l  阻焊使用挡点网印刷生产，不允许绿油塞孔，为防止盲槽位堆积油墨，不允许使用静电喷涂生产；
12) 沉镍金
l  来料检查阻焊塞孔需饱满，化金前处理只过喷砂处理，不过机械磨刷；
l  延长活化30秒，首板检查漏镀、不上金缺陷，测量完成金、镍厚；
13) 成型
l  采用混压板铣板参数，使用全新铣刀生产；
l  为防止金面擦花，铣板时每PNL间放白纸隔开，检查首板无板边毛刺、披锋。
此流程实例为一个四层阶梯板制作流程，总体制作思路，即先制作内层图形，再将需要制作槽的层锣空，然后再与不需要制作槽的层进行压合时候，在槽位垫一个PTFE垫片，垫片比槽位单边缩小0.3mm；钻孔时给槽位垫一个PP垫片，防止槽位钻孔毛刺披锋；钻孔完成后为了除去孔内残留胶渣，并且防止化学除胶对基材的伤害，所以采用等离子除胶方法代替化学除胶方法。 
制作关键点是第3、4、5、7、8步。
第3步是将需要制作槽位的层锣空，尺寸和设计尺寸一致；
第4步是锣垫片，包括PP垫片和PTFE垫片，都比槽位尺寸缩小0.3mm，因为槽位在压合时候会板材膨胀（即会溢胶），垫片如果不缩小，则会阻止槽位的膨胀，压合后就会板曲；
第5步是进行压合，使用指定参数，给槽位处垫PTFE垫片，进行压合，压合完成后去掉PTFE垫片；
第7步钻孔时候给槽位垫一个PP垫片，防止槽位钻孔毛刺或披锋，钻孔完成后去掉PP垫片；
第8步是使用等离子活化除去钻孔后的胶渣，防止化学除胶对基材造成伤害，保证后续电镀孔金属化良好。
取得的效果：使用缩小0.3mm的PTFE垫片垫入槽位处进行压合，可以保证槽位平整和控制溢胶量；使用钻孔垫片可以防止钻孔毛刺；使用等离子除胶可以保证除胶量合适，不伤害基材，保证后续电镀孔金属化良好。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。

Claims (1)

1.一种阶梯电路板制作工艺，包括步骤：
A）对线路板基板进行开料、内层印制图形后内层蚀刻、锣阶梯槽、铣垫片，棕化、压板处理后，对其外层进行钻孔；
B）将钻孔后的线路板基板铣镀通孔(PTH)槽后进行外层沉铜，然后将整个线路板基板进行电镀；
C）对沉铜电镀后的线路板基板通过镀孔菲林进行图形转移；
D）将图形转移后的线路板基板进行图形镀铜，并对图形镀铜后的线路板基板锣连接片（SET）外形，然后进行外层蚀刻；
E）阻焊塞孔后丝印阻焊及文字；
F）全板沉镍金后丝印字符，成型线路板；
G）测试检查成品板的电气性能及外观，制得成品；
其中，在步骤A）中锣阶梯槽的工艺中，采用先铣阶梯槽，垫片缩小0.3mm，防止层压时流胶，后使用聚四氟乙烯PTFE高温阻胶垫片层压的方式制作；
步骤A）所述的钻孔为将线路板基板的所有孔一次性钻出，并对钻出的孔进行孔金属化；
步骤A）所述的压板处理采用的层压垫片为聚四氟乙烯（PTFE）垫片。
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