CN103002661B - 一种薄板后期制作工艺 - Google Patents
一种薄板后期制作工艺 Download PDFInfo
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- CN103002661B CN103002661B CN201210347017.5A CN201210347017A CN103002661B CN 103002661 B CN103002661 B CN 103002661B CN 201210347017 A CN201210347017 A CN 201210347017A CN 103002661 B CN103002661 B CN 103002661B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 77
- 238000004381 surface treatment Methods 0.000 claims abstract description 27
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052737 gold Inorganic materials 0.000 claims abstract description 20
- 239000010931 gold Substances 0.000 claims abstract description 20
- 238000012360 testing method Methods 0.000 claims abstract description 19
- 238000007689 inspection Methods 0.000 claims description 30
- 238000007493 shaping process Methods 0.000 claims description 27
- 239000000126 substance Substances 0.000 claims description 22
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 238000005555 metalworking Methods 0.000 claims description 7
- 238000007654 immersion Methods 0.000 abstract 3
- 238000012795 verification Methods 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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CN201210347017.5A CN103002661B (zh) | 2012-09-19 | 2012-09-19 | 一种薄板后期制作工艺 |
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CN201210347017.5A CN103002661B (zh) | 2012-09-19 | 2012-09-19 | 一种薄板后期制作工艺 |
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CN103002661A CN103002661A (zh) | 2013-03-27 |
CN103002661B true CN103002661B (zh) | 2015-07-08 |
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CN201210347017.5A Active CN103002661B (zh) | 2012-09-19 | 2012-09-19 | 一种薄板后期制作工艺 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103369847B (zh) * | 2013-06-28 | 2016-04-27 | 昆山元茂电子科技有限公司 | 印制电路板防刮伤方法 |
CN105376954B (zh) * | 2015-11-12 | 2018-06-22 | 深圳市深联电路有限公司 | 一种电池pcb硬金面防止擦花的方法 |
CN108966520B (zh) * | 2018-07-02 | 2020-07-10 | 昆山万源通电子科技有限公司 | 防抄袭遮蔽型pcb印刷工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101969745A (zh) * | 2010-10-20 | 2011-02-09 | 厦门弘信电子科技有限公司 | 柔性线路板后工序的制作方法 |
CN102365001A (zh) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | 一种在同一块板上多种表面处理的制造方法 |
CN102510667A (zh) * | 2011-10-31 | 2012-06-20 | 景旺电子(深圳)有限公司 | 一种无npth孔定位的cnc锣板生产方法 |
CN102523692A (zh) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | 一种阶梯电路板制作工艺 |
CN102638934A (zh) * | 2011-12-28 | 2012-08-15 | 胜宏科技(惠州)股份有限公司 | 一种灯条线路板成型方法 |
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- 2012-09-19 CN CN201210347017.5A patent/CN103002661B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101969745A (zh) * | 2010-10-20 | 2011-02-09 | 厦门弘信电子科技有限公司 | 柔性线路板后工序的制作方法 |
CN102365001A (zh) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | 一种在同一块板上多种表面处理的制造方法 |
CN102510667A (zh) * | 2011-10-31 | 2012-06-20 | 景旺电子(深圳)有限公司 | 一种无npth孔定位的cnc锣板生产方法 |
CN102638934A (zh) * | 2011-12-28 | 2012-08-15 | 胜宏科技(惠州)股份有限公司 | 一种灯条线路板成型方法 |
CN102523692A (zh) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | 一种阶梯电路板制作工艺 |
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Effective date of registration: 20210223 Address after: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee after: Nantong Shenghong Technology Co.,Ltd. Address before: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. |
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Effective date of registration: 20231120 Address after: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee after: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. Address before: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee before: Nantong Shenghong Technology Co.,Ltd. |
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