CN101928967B - 钴-钨-镍-磷合金电镀液 - Google Patents
钴-钨-镍-磷合金电镀液 Download PDFInfo
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- CN101928967B CN101928967B CN2010102661142A CN201010266114A CN101928967B CN 101928967 B CN101928967 B CN 101928967B CN 2010102661142 A CN2010102661142 A CN 2010102661142A CN 201010266114 A CN201010266114 A CN 201010266114A CN 101928967 B CN101928967 B CN 101928967B
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CN2010102661142A CN101928967B (zh) | 2010-08-30 | 2010-08-30 | 钴-钨-镍-磷合金电镀液 |
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CN2010102661142A CN101928967B (zh) | 2010-08-30 | 2010-08-30 | 钴-钨-镍-磷合金电镀液 |
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CN101928967A CN101928967A (zh) | 2010-12-29 |
CN101928967B true CN101928967B (zh) | 2011-08-24 |
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CN2010102661142A Expired - Fee Related CN101928967B (zh) | 2010-08-30 | 2010-08-30 | 钴-钨-镍-磷合金电镀液 |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102605393B (zh) * | 2012-03-13 | 2015-06-17 | 广州三孚新材料科技股份有限公司 | 一种Ni-W-Fe-Co合金电镀液及其电镀工艺 |
JP5700846B2 (ja) * | 2012-03-28 | 2015-04-15 | 本田技研工業株式会社 | 内燃機関 |
CN103911638B (zh) * | 2014-04-18 | 2016-03-02 | 合鸿新材科技有限公司 | 一种钴镍磷-碳化硅电镀液及电镀方法 |
CN104264197A (zh) * | 2014-10-22 | 2015-01-07 | 华文蔚 | 一种钕-镍-钨合金电镀液及其制备方法 |
CN104372387A (zh) * | 2014-10-30 | 2015-02-25 | 青岛昌安达药业有限公司 | 一种电镀液 |
CN105040052A (zh) * | 2015-09-15 | 2015-11-11 | 河海大学常州校区 | 一种电镀液及利用其制备纳米晶铁-钴-镍-磷四元合金镀层的工艺 |
CN105350036B (zh) * | 2015-10-31 | 2018-03-13 | 北京工业大学 | 一种电沉积钨合金的方法 |
CN108220825A (zh) * | 2016-12-14 | 2018-06-29 | 刘志红 | 一种Ni基非晶合金粉末及其制备工艺 |
CN110029376A (zh) * | 2018-01-11 | 2019-07-19 | 泰科电子(上海)有限公司 | 合金镀层、工件和电镀液 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1114720C (zh) * | 1999-07-14 | 2003-07-16 | 昆明理工大学 | 电沉积多功能金属基复合材料的方法 |
CN1313647C (zh) * | 2003-09-04 | 2007-05-02 | 长沙高新技术产业开发区英才科技有限公司 | 电沉积钨基系列非晶合金镀层或纳米晶合金镀层及所使用的电镀液和工艺 |
JP4993858B2 (ja) * | 2005-01-28 | 2012-08-08 | 隆久 山本 | タングステン−リン系合金電気めっき皮膜 |
CN101445946B (zh) * | 2008-11-27 | 2011-02-09 | 湖南纳菲尔新材料科技股份有限公司 | 一种Ni-W-P三元合金防腐耐磨电沉积镀层及其生产工艺和电镀液 |
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Address after: 264400 Building No. 7, Tianshan international development base, No. 66, Wenchang Road, Wendeng Economic Development Zone, Shandong, China Patentee after: HEHONG NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 264400 Building No. 7, Tianshan international development base, No. 66, Wenchang Road, Wendeng Economic Development Zone, Shandong, China Patentee before: Weihai Hongxin New Material Technology Co., Ltd. |
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Address after: 264400 No. 12, Zhangzhou Road, Wendeng Economic Development Zone, Shandong, Weihai Patentee after: HEHONG NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 264400 Building No. 7, Tianshan international development base, No. 66, Wenchang Road, Wendeng Economic Development Zone, Shandong, China Patentee before: HEHONG NEW MATERIAL TECHNOLOGY CO., LTD. |
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