CN101901979B - 具有引线的基片 - Google Patents

具有引线的基片 Download PDF

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Publication number
CN101901979B
CN101901979B CN201010194136.2A CN201010194136A CN101901979B CN 101901979 B CN101901979 B CN 101901979B CN 201010194136 A CN201010194136 A CN 201010194136A CN 101901979 B CN101901979 B CN 101901979B
Authority
CN
China
Prior art keywords
pad
substrate
lead
wire
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010194136.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN101901979A (zh
Inventor
井原义博
寺泽岳人
北岛正邦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN101901979A publication Critical patent/CN101901979A/zh
Application granted granted Critical
Publication of CN101901979B publication Critical patent/CN101901979B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Measuring Leads Or Probes (AREA)
  • Combinations Of Printed Boards (AREA)
CN201010194136.2A 2009-05-28 2010-05-28 具有引线的基片 Expired - Fee Related CN101901979B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009128785A JP5500870B2 (ja) 2009-05-28 2009-05-28 接続端子付き基板及び電子部品のソケット等
JP2009-128785 2009-05-28

Publications (2)

Publication Number Publication Date
CN101901979A CN101901979A (zh) 2010-12-01
CN101901979B true CN101901979B (zh) 2015-08-19

Family

ID=43218937

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010194136.2A Expired - Fee Related CN101901979B (zh) 2009-05-28 2010-05-28 具有引线的基片

Country Status (4)

Country Link
US (1) US8735737B2 (enExample)
JP (1) JP5500870B2 (enExample)
CN (1) CN101901979B (enExample)
TW (1) TWI517326B (enExample)

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US10885471B2 (en) * 2008-07-18 2021-01-05 Disney Enterprises, Inc. System and method for providing location-based data on a wireless portable device
JP2012069764A (ja) 2010-09-24 2012-04-05 On Semiconductor Trading Ltd 回路装置およびその製造方法
US8363418B2 (en) * 2011-04-18 2013-01-29 Morgan/Weiss Technologies Inc. Above motherboard interposer with peripheral circuits
JP5794833B2 (ja) 2011-06-10 2015-10-14 新光電気工業株式会社 接続端子及びその製造方法、並びにソケット
US8727808B2 (en) * 2011-07-13 2014-05-20 Tyco Electronics Corporation Electrical connector assembly for interconnecting an electronic module and an electrical component
JP5809509B2 (ja) * 2011-09-29 2015-11-11 新光電気工業株式会社 スプリング端子付配線基板及びその実装構造とソケット
JP2013239338A (ja) * 2012-05-15 2013-11-28 Sharp Corp 電子機器の接点構造および当該接点構造を有する携帯可能な電子機器
JP6046392B2 (ja) * 2012-06-22 2016-12-14 新光電気工業株式会社 接続端子構造、インターポーザ、及びソケット
KR20160118806A (ko) * 2015-04-03 2016-10-12 에스케이하이닉스 주식회사 반도체 패키지 모듈
CN105523281B (zh) * 2016-01-04 2020-08-07 京东方科技集团股份有限公司 一种弹性支撑结构及包含此弹性支撑结构的显示装置
BR112018014360A2 (pt) * 2016-03-08 2019-01-15 Hoffmann La Roche sistema de análise de elemento de teste e método para fabricar um sistema de análise de elemento de teste
JP6989754B2 (ja) * 2017-05-02 2022-01-12 山一電機株式会社 コンタクト端子、コンタクトピンモジュール、および、それを備える半導体装置用ソケット
JP6898827B2 (ja) * 2017-10-23 2021-07-07 新光電気工業株式会社 ソケット
JP7060989B2 (ja) * 2018-03-22 2022-04-27 セイコーインスツル株式会社 電子部品の接続構造、電子機器、電子機器の製造方法
CN112910285B (zh) * 2021-01-05 2022-06-14 深圳市富鑫产业科技有限公司 一种逆变器电力系统及其制造方法
CN113314504A (zh) * 2021-06-18 2021-08-27 杭州电子科技大学 一种用于2.5维封装的柔性互连弹片及集成电路封装结构
CN113991376A (zh) * 2021-09-30 2022-01-28 歌尔光学科技有限公司 Dmd组件、dlp光机模组以及dlp投影机

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US4553192A (en) * 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US5974662A (en) * 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US6029344A (en) * 1993-11-16 2000-02-29 Formfactor, Inc. Composite interconnection element for microelectronic components, and method of making same
US6016254A (en) * 1996-07-15 2000-01-18 Pfaff; Wayne K. Mounting apparatus for grid array packages
JPH10255930A (ja) * 1997-03-14 1998-09-25 Dai Ichi Denshi Kogyo Kk 電気コネクタ
JPH11154571A (ja) * 1997-11-21 1999-06-08 Alpha Corp コネクタ
JP3903332B2 (ja) * 1998-06-12 2007-04-11 モレックス インコーポレーテッド 電気コネクタ
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JP2004259530A (ja) * 2003-02-25 2004-09-16 Shinko Electric Ind Co Ltd 外部接触端子を有する半導体装置及びその使用方法
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JP4452304B2 (ja) * 2007-12-20 2010-04-21 日本航空電子工業株式会社 電気接続部材
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JP5606695B2 (ja) * 2009-07-03 2014-10-15 新光電気工業株式会社 接続端子付き基板

Also Published As

Publication number Publication date
JP2010277829A (ja) 2010-12-09
US20100300742A1 (en) 2010-12-02
CN101901979A (zh) 2010-12-01
JP5500870B2 (ja) 2014-05-21
TWI517326B (zh) 2016-01-11
TW201101443A (en) 2011-01-01
US8735737B2 (en) 2014-05-27

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150819

Termination date: 20210528