CN101901748B - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

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Publication number
CN101901748B
CN101901748B CN2010101931017A CN201010193101A CN101901748B CN 101901748 B CN101901748 B CN 101901748B CN 2010101931017 A CN2010101931017 A CN 2010101931017A CN 201010193101 A CN201010193101 A CN 201010193101A CN 101901748 B CN101901748 B CN 101901748B
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China
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substrate
module
conveyance
carrier
handing
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CN2010101931017A
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English (en)
Chinese (zh)
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CN101901748A (zh
Inventor
松山健一郎
金子知广
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN101901748A publication Critical patent/CN101901748A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN2010101931017A 2009-05-28 2010-05-28 基板处理装置和基板处理方法 Active CN101901748B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009129499A JP5223778B2 (ja) 2009-05-28 2009-05-28 基板処理装置、基板処理方法及び記憶媒体
JP2009-129499 2009-05-28

Publications (2)

Publication Number Publication Date
CN101901748A CN101901748A (zh) 2010-12-01
CN101901748B true CN101901748B (zh) 2012-04-25

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Family Applications (1)

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CN2010101931017A Active CN101901748B (zh) 2009-05-28 2010-05-28 基板处理装置和基板处理方法

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JP (1) JP5223778B2 (ja)
KR (1) KR101513748B1 (ja)
CN (1) CN101901748B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8999636B2 (en) 2007-01-08 2015-04-07 Toxic Report Llc Reaction chamber
JP5187274B2 (ja) * 2009-05-28 2013-04-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US8685708B2 (en) 2012-04-18 2014-04-01 Pathogenetix, Inc. Device for preparing a sample
JP6046007B2 (ja) * 2013-08-29 2016-12-14 東京エレクトロン株式会社 接合システム
JP6068663B2 (ja) 2013-09-30 2017-01-25 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および記録媒体
JP6607744B2 (ja) * 2015-09-04 2019-11-20 リンテック株式会社 供給装置および供給方法
JP6880913B2 (ja) * 2017-03-28 2021-06-02 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7126750B2 (ja) * 2018-03-20 2022-08-29 株式会社ディスコ 切削装置
JP7360849B2 (ja) * 2019-08-30 2023-10-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板搬送方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275511A (ja) * 1991-03-01 1993-10-22 Tokyo Electron Ltd 被処理体の移載システム及び処理装置
JP4069236B2 (ja) * 2000-06-05 2008-04-02 東京エレクトロン株式会社 液処理装置
JP3916468B2 (ja) 2002-01-11 2007-05-16 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4307132B2 (ja) * 2003-04-16 2009-08-05 大日本スクリーン製造株式会社 基板処理装置
JP4381121B2 (ja) * 2003-12-11 2009-12-09 大日本スクリーン製造株式会社 基板処理装置
JP4685584B2 (ja) * 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP2007287909A (ja) * 2006-04-17 2007-11-01 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP4893425B2 (ja) * 2007-03-30 2012-03-07 東京エレクトロン株式会社 枚葉式の基板処理装置、枚葉式の基板処理装置の運転方法及び記憶媒体
JP4957426B2 (ja) * 2007-07-19 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体

Also Published As

Publication number Publication date
CN101901748A (zh) 2010-12-01
KR20100129211A (ko) 2010-12-08
KR101513748B1 (ko) 2015-04-20
JP5223778B2 (ja) 2013-06-26
JP2010278249A (ja) 2010-12-09

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