KR101513748B1 - 기판 처리 장치, 기판 처리 방법 및 기억 매체 - Google Patents

기판 처리 장치, 기판 처리 방법 및 기억 매체 Download PDF

Info

Publication number
KR101513748B1
KR101513748B1 KR1020100049815A KR20100049815A KR101513748B1 KR 101513748 B1 KR101513748 B1 KR 101513748B1 KR 1020100049815 A KR1020100049815 A KR 1020100049815A KR 20100049815 A KR20100049815 A KR 20100049815A KR 101513748 B1 KR101513748 B1 KR 101513748B1
Authority
KR
South Korea
Prior art keywords
substrate
carrier
module
transfer
transfer module
Prior art date
Application number
KR1020100049815A
Other languages
English (en)
Korean (ko)
Other versions
KR20100129211A (ko
Inventor
겐이치로 마츠야마
도모히로 가네코
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20100129211A publication Critical patent/KR20100129211A/ko
Application granted granted Critical
Publication of KR101513748B1 publication Critical patent/KR101513748B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
KR1020100049815A 2009-05-28 2010-05-27 기판 처리 장치, 기판 처리 방법 및 기억 매체 KR101513748B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009129499A JP5223778B2 (ja) 2009-05-28 2009-05-28 基板処理装置、基板処理方法及び記憶媒体
JPJP-P-2009-129499 2009-05-28

Publications (2)

Publication Number Publication Date
KR20100129211A KR20100129211A (ko) 2010-12-08
KR101513748B1 true KR101513748B1 (ko) 2015-04-20

Family

ID=43227183

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100049815A KR101513748B1 (ko) 2009-05-28 2010-05-27 기판 처리 장치, 기판 처리 방법 및 기억 매체

Country Status (3)

Country Link
JP (1) JP5223778B2 (ja)
KR (1) KR101513748B1 (ja)
CN (1) CN101901748B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8999636B2 (en) 2007-01-08 2015-04-07 Toxic Report Llc Reaction chamber
JP5187274B2 (ja) * 2009-05-28 2013-04-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US8685708B2 (en) 2012-04-18 2014-04-01 Pathogenetix, Inc. Device for preparing a sample
JP6046007B2 (ja) * 2013-08-29 2016-12-14 東京エレクトロン株式会社 接合システム
JP6068663B2 (ja) 2013-09-30 2017-01-25 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および記録媒体
JP6607744B2 (ja) * 2015-09-04 2019-11-20 リンテック株式会社 供給装置および供給方法
JP6880913B2 (ja) * 2017-03-28 2021-06-02 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7126750B2 (ja) * 2018-03-20 2022-08-29 株式会社ディスコ 切削装置
JP7360849B2 (ja) * 2019-08-30 2023-10-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板搬送方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209154A (ja) 2002-01-11 2003-07-25 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2006287178A (ja) 2005-03-11 2006-10-19 Tokyo Electron Ltd 塗布、現像装置
JP2009026916A (ja) 2007-07-19 2009-02-05 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275511A (ja) * 1991-03-01 1993-10-22 Tokyo Electron Ltd 被処理体の移載システム及び処理装置
JP4069236B2 (ja) * 2000-06-05 2008-04-02 東京エレクトロン株式会社 液処理装置
JP4307132B2 (ja) * 2003-04-16 2009-08-05 大日本スクリーン製造株式会社 基板処理装置
JP4381121B2 (ja) * 2003-12-11 2009-12-09 大日本スクリーン製造株式会社 基板処理装置
JP2007287909A (ja) * 2006-04-17 2007-11-01 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP4893425B2 (ja) * 2007-03-30 2012-03-07 東京エレクトロン株式会社 枚葉式の基板処理装置、枚葉式の基板処理装置の運転方法及び記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209154A (ja) 2002-01-11 2003-07-25 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2006287178A (ja) 2005-03-11 2006-10-19 Tokyo Electron Ltd 塗布、現像装置
JP2009026916A (ja) 2007-07-19 2009-02-05 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体

Also Published As

Publication number Publication date
CN101901748A (zh) 2010-12-01
KR20100129211A (ko) 2010-12-08
JP5223778B2 (ja) 2013-06-26
CN101901748B (zh) 2012-04-25
JP2010278249A (ja) 2010-12-09

Similar Documents

Publication Publication Date Title
KR101666227B1 (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
KR101513748B1 (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
KR101117872B1 (ko) 도포·현상 장치 및 도포·현상 방법
KR101553417B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP5267720B2 (ja) 塗布、現像装置、塗布、現像方法及び記憶媒体
KR101184789B1 (ko) 도포, 현상 장치
JP4464993B2 (ja) 基板の処理システム
KR101522742B1 (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
KR20130118236A (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP4687682B2 (ja) 塗布、現像装置及びその方法並びに記憶媒体
JP2010199427A (ja) 基板処理装置
KR101215712B1 (ko) 기판 처리 장치
US9004788B2 (en) Substrate processing apparatus, substrate processing method, and storage medium
JP4957426B2 (ja) 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
JP5348290B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP2013069916A (ja) 基板処理装置、基板処理方法及び記憶媒体
KR102243966B1 (ko) 도포, 현상 장치, 도포, 현상 장치의 운전 방법 및 기억 매체
KR100592132B1 (ko) 제조 장치 및 제조 방법
JP7347658B2 (ja) 基板処理装置及び基板処理方法
JP5541251B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP4657528B2 (ja) 処理システムおよび処理方法
KR20230104679A (ko) 기판 처리 장치 및 기판 처리 방법

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
FPAY Annual fee payment

Payment date: 20180329

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190328

Year of fee payment: 5