CN101882586A - 一种集成电路芯片的贴装方法 - Google Patents

一种集成电路芯片的贴装方法 Download PDF

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CN101882586A
CN101882586A CN2010102327147A CN201010232714A CN101882586A CN 101882586 A CN101882586 A CN 101882586A CN 2010102327147 A CN2010102327147 A CN 2010102327147A CN 201010232714 A CN201010232714 A CN 201010232714A CN 101882586 A CN101882586 A CN 101882586A
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CN101882586B (zh
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陈泽平
罗德财
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HanRun Electronics Co., Ltd.
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ZHONGSHAN HANREN SMART CARD CO Ltd
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Abstract

本发明公开了一种集成电路芯片的贴装方法，包括：(1)准备若干集成电路芯片，集成电路芯片的背面贴合于一安装胶带的表面；(2)在集成电路芯片的芯片连接点上印上导电凸块；(3)于集成电路芯片的正面贴一胶薄膜；(4)将安装胶带撕下；(5)将需要贴装的集成电路芯片与胶薄膜分离，将该集成电路芯片从背面吸住并输送到基板上，使集成电路芯片正面的带有导电凸块的芯片连接点与基板上的焊点压合连接。本发明的贴装方法具有极高的效率，利用此方法所得到的产品省略了长连接导线，确保产品可以具有极小的物理尺寸，并可以大大降低生产成本和增强连接的可靠性，本发明的贴装方法特别适合于在制作智能卡模块时所用。

Description

一种集成电路芯片的贴装方法
技术领域
本发明属于集成电路芯片的封装工艺，特别是一种集成电路芯片的贴装方法。
背景技术
集成电路芯片的贴装是一个非常复杂的过程，需要十分精确地进行控制。采用何种贴装方法不但决定了所生成产品的物理尺寸大小、工作性能优劣、可靠性，还会对其产品的生产成本产生巨大的影响，此外，由于贴装过程是一个利用各种设备共同配合而实现的工作，其包括各种各样复杂的动作，这些动作在贴装过程中的重复次数是以万为单位进行计数的，因此某一动作存在不合理或者过于繁琐都会给集成电路芯片的贴装过程带来严重的不便，严重影响生产效率。
传统的集成电路芯片贴装过程（如传统的智能卡模块制作时所用的）都是采用导线焊接的方式实现。众所周知的是，半导体晶片切割后所得到的集成电路芯片其具有芯片连接点的正面都是向外露出的，假若不经过处理，当这些集成电路芯片被吸合传送并安装到基板上时必然也是正面向外露出的。由于芯片连接点都位于正面上，因此要使得其与基板上的焊点电气连接，那么这是必要需要利用导线焊接的方式实现，即通过导线将正面上的芯片连接点和基板上的焊点连接起来，如图1所示。这种导线焊接的方式具有以下的缺点：（1）贴装所占用的物理尺寸较大，特别是由于导线焊接不能交叉或下射，因此无法实现物理尺寸非常小的模块产品，如在制作智能卡模块时，利用此方式实现所得到的智能卡模块产品的物理尺寸通常较大；（2）制作成本高，由于连接导线一般都是采用黄金材料，此导线连接的方式需要使用一从芯片连接点到基板上的较长接线，此导线需要花费较多量的黄金进行制作，因而会导致成本升高；（3）连接不可靠，当此导线折断或掉落时芯片便不能正常工作。
为了克服上述部分缺点，现出现了一种Flip-Chip的芯片贴装工艺，该工艺在将集成电路芯片吸合传送到基板上设有将该单个芯片翻转的动作，使得芯片安装到基板上时可以正面与基板贴合，芯片和焊点上直接通过凸点电气连接。这种贴装方法可以大大减小贴装所占用的物理尺寸，减轻制作成本，但由于此工艺在翻转芯片时是针对单个芯片进行的，在实现时一般通过双机械臂进行传递和操作，因此这种贴装方法存在效率低下、控制复杂的缺点。
发明内容
为解决上述问题，本发明提供一种效率高的集成电路芯片的贴装方法，利用此贴装方法所得到的产品具有极小的物理尺寸，制作成本较低。
本发明为解决其问题所采用的技术方案是：
一种集成电路芯片的贴装方法，包括以下步骤：
（1）准备若干集成电路芯片，集成电路芯片的背面贴合于一安装胶带的表面，集成电路芯片设有芯片连接点的正面向外露出；
（2）在集成电路芯片的芯片连接点上印上导电凸块；
（3）于集成电路芯片的正面贴一胶薄膜，集成电路芯片分别通过印有导电凸块的芯片连接点与胶薄膜贴合；
（4）将安装胶带撕下，使得集成电路芯片的背面向外露出；
（5）将需要贴装的集成电路芯片与胶薄膜分离，将该集成电路芯片从背面吸住并输送到基板上，使集成电路芯片正面的带有导电凸块的芯片连接点与基板上的焊点压合连接。
优选的是，步骤（1）中所准备的集成电路芯片为由半导体晶片切割分解后所得的整盘芯片。
优选的是，步骤（1）中所准备的集成电路芯片按行按列地排列贴合于安装胶带的表面。
优选的是，步骤（5）中利用针柱穿过胶薄膜顶起集成电路芯片使集成电路芯片与胶薄膜分离。
优选的是，步骤（5）中所述基板上与集成电路芯片正面中心位置相对应处设有非导电胶，在集成电路芯片的芯片连接点与焊点压合连接后设有加热固定处理过程。
步骤（1）、步骤（2）和步骤（3）进一步限定为：
（1）准备若干集成电路芯片，集成电路芯片的背面贴合于一水平放置的安装胶带的表面并朝向正下方，集成电路芯片设有芯片连接点的正面向外露出并朝向正上方；
（2）在集成电路芯片的芯片连接点上印上导电凸块；
（3）于集成电路芯片的正面贴一胶薄膜，集成电路芯片分别通过印有导电凸块的芯片连接点与胶薄膜贴合，翻转安装胶带，使得集成电路芯片的正面朝向正下方，背面朝向正上方。
本发明通过胶薄膜贴合集成电路芯片正面然后将芯片背面的安装胶带撕下的方式使得集成电路芯片的背面向外露出，当利用机械臂等吸合提取芯片时其吸合点便会处于芯片的背面，此芯片传送到基板上时便会直接以正面朝下的方式与基板连接，中间并不需要设置复杂的转换动作，因此本发明的贴装方法具有极高的效率，利用此方法所得到的产品省略了长连接导线，确保产品可以具有极小的物理尺寸，并可以大大降低生产成本和增强连接的可靠性，本发明的贴装方法特别适合于在制作智能卡模块时所用。
附图说明
下面结合附图和实施例对本发明作进一步说明：
图1为利用导线焊接方式实现的集成电路芯片贴装示意图；
图2为本发明的贴装方法工艺流程示意图。
具体实施方式
参照图2，本发明的一种集成电路芯片的贴装方法，包括以下步骤：
（1）准备若干集成电路芯片，集成电路芯片的背面贴合于一安装胶带1的表面，集成电路芯片设有芯片连接点3的正面向外露出，在实际的产品中，所准备的集成电路芯片一般为由半导体晶片切割分解后所得的整盘芯片，这些芯片经过切割后按行按列地排列贴合于安装胶带1的表面，该安装胶带1用于在半导体晶片进行切割时以黏着力抓住芯片，避免脱落和飞散，当然，所准备的集成电路芯片并不限于整盘芯片，其可以为贴合于安装胶带1上的部分或者甚至为单片芯片，这些芯片也优选采用按行按列的排列方式贴合于安装胶带1的表面；
（2）在集成电路芯片的芯片连接点3上印上导电凸块4，如图2中的第一部分所示；
（3）于集成电路芯片的正面贴一胶薄膜2，集成电路芯片分别通过印有导电凸块4的芯片连接点3与胶薄膜2贴合，如图2中的第二部分所示，该胶薄膜2可以采用和安装胶带1相同材料、相同形状的结构，完成此步骤后，集成电路芯片的正面和背面分别与胶薄膜2和安装胶带1贴合；
（4）将安装胶带1撕下，使得集成电路芯片的背面向外露出，如图2中的第三部分所示；
（5）将需要贴装的集成电路芯片与胶薄膜2分离，分离时可以采用利用针柱穿过胶薄膜顶起集成电路芯片的方式，为了使得芯片的性能得到更好的保护，该针柱优选采用胶针柱，而不采用传统的金属钢针，此外，为了更加便于上述分离过程，所述胶薄膜2上与每个集成电路芯片的中心位置相对应处设置有细孔7，针柱从此细孔7穿过将芯片与胶薄膜2分离，芯片与胶薄膜2分离后，接着将该集成电路芯片从背面吸住并输送到基板5上，使集成电路芯片正面的带有导电凸块4的芯片连接点3与基板5上的焊点6压合连接，如图2中的第四部分所示，上述输送和压合的过程一般利用机械臂完成，其中该基板5为芯片的安装板，在智能卡模块的制作中，该基板5为专用的载体带。
为了增强芯片与基板5之间的连接可靠度，优选的是在步骤（5）中所述基板5上与集成电路芯片正面中心位置相对应处设置非导电胶8，在集成电路芯片的芯片连接点与焊点压合连接后设有加热固定处理过程，此加热固定处理过程可以使得非导电胶8熔化，冷却后便可以将芯片牢牢固定于基板5上。
为了使得集成电路芯片的贴装过程更加方便，并且与芯片的贴装工艺特征相适应，本发明的步骤（1）、步骤（2）和步骤（3）可以优选进一步限定为：
（1）准备若干集成电路芯片，集成电路芯片的背面贴合于一水平放置的安装胶带的表面并朝向正下方，集成电路芯片设有芯片连接点的正面向外露出并朝向正上方；
（2）在集成电路芯片的芯片连接点上印上导电凸块；
（3）于集成电路芯片的正面贴一胶薄膜，集成电路芯片分别通过印有导电凸块的芯片连接点与胶薄膜贴合，翻转安装胶带，使得集成电路芯片的正面朝向正下方，背面朝向正上方。
上述限定使得芯片除了在进行翻转外都分布于水平面上，芯片的正下方持续具有相应的支撑面（安装胶带或胶薄膜），确保芯片不会散乱，机械臂对其进行吸合、输送等操作时可以极方便地进行，不易出错。

Claims (9)

1.一种集成电路芯片的贴装方法，其特征在于包括以下步骤：
（1）准备若干集成电路芯片，集成电路芯片的背面贴合于一安装胶带的表面，集成电路芯片设有芯片连接点的正面向外露出；
（2）在集成电路芯片的芯片连接点上印上导电凸块；
（3）于集成电路芯片的正面贴一胶薄膜，集成电路芯片分别通过印有导电凸块的芯片连接点与胶薄膜贴合；
（4）将安装胶带撕下，使得集成电路芯片的背面向外露出；
（5）将需要贴装的集成电路芯片与胶薄膜分离，将该集成电路芯片从背面吸住并输送到基板上，使集成电路芯片正面的带有导电凸块的芯片连接点与基板上的焊点压合连接。
2.根据权利要求1所述的一种集成电路芯片的贴装方法，其特征在于步骤（1）中所准备的集成电路芯片为由半导体晶片切割分解后所得的整盘芯片。
3.根据权利要求1或2所述的一种集成电路芯片的贴装方法，其特征在于步骤（1）中所准备的集成电路芯片按行按列地排列贴合于安装胶带的表面。
4.根据权利要求1所述的一种集成电路芯片的贴装方法，其特征在于步骤（5）中利用针柱穿过胶薄膜顶起集成电路芯片使集成电路芯片与胶薄膜分离。
5.根据权利要求4所述的一种集成电路芯片的贴装方法，其特征在于所述针柱为胶针柱。
6.根据权利要求4所述的一种集成电路芯片的贴装方法，其特征在于所述胶薄膜上与每个集成电路芯片的中心位置相对应处设置有可供针柱穿过的细孔。
7.根据权利要求1所述的一种集成电路芯片的贴装方法，其特征在于步骤（5）中所述基板上与集成电路芯片正面中心位置相对应处设有非导电胶，在集成电路芯片的芯片连接点与焊点压合连接后设有加热固定处理过程。
8.根据权利要求1所述的一种集成电路芯片的贴装方法，其特征在于步骤（1）、步骤（2）和步骤（3）进一步限定为：
（1）准备若干集成电路芯片，集成电路芯片的背面贴合于一水平放置的安装胶带的表面并朝向正下方，集成电路芯片设有芯片连接点的正面向外露出并朝向正上方；
（2）在集成电路芯片的芯片连接点上印上导电凸块；
（3）于集成电路芯片的正面贴一胶薄膜，集成电路芯片分别通过印有导电凸块的芯片连接点与胶薄膜贴合，翻转安装胶带，使得集成电路芯片的正面朝向正下方，背面朝向正上方。
9.根据权利要求1所述的一种集成电路芯片的贴装方法，其特征在于所述基板为载体带。
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