CN101878252B - 用于金属电镀制品的部分芳香族聚酰胺组合物 - Google Patents

用于金属电镀制品的部分芳香族聚酰胺组合物 Download PDF

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Publication number
CN101878252B
CN101878252B CN2008801182936A CN200880118293A CN101878252B CN 101878252 B CN101878252 B CN 101878252B CN 2008801182936 A CN2008801182936 A CN 2008801182936A CN 200880118293 A CN200880118293 A CN 200880118293A CN 101878252 B CN101878252 B CN 101878252B
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CN
China
Prior art keywords
polyamide
weight
acid
compsn
partially aromatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801182936A
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English (en)
Chinese (zh)
Other versions
CN101878252A (zh
Inventor
A·E·艾丽娅
C·皮尔多梅尼科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
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Publication of CN101878252A publication Critical patent/CN101878252A/zh
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Publication of CN101878252B publication Critical patent/CN101878252B/zh
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
CN2008801182936A 2007-11-30 2008-11-24 用于金属电镀制品的部分芳香族聚酰胺组合物 Expired - Fee Related CN101878252B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US485707P 2007-11-30 2007-11-30
US61/004857 2007-11-30
PCT/US2008/084507 WO2009073435A1 (en) 2007-11-30 2008-11-24 Partially aromatic polyamide compositions for metal plated articles

Publications (2)

Publication Number Publication Date
CN101878252A CN101878252A (zh) 2010-11-03
CN101878252B true CN101878252B (zh) 2012-10-10

Family

ID=40445237

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801182936A Expired - Fee Related CN101878252B (zh) 2007-11-30 2008-11-24 用于金属电镀制品的部分芳香族聚酰胺组合物

Country Status (6)

Country Link
US (2) US20090143520A1 (cg-RX-API-DMAC10.html)
EP (1) EP2215151A1 (cg-RX-API-DMAC10.html)
JP (1) JP2011505463A (cg-RX-API-DMAC10.html)
KR (1) KR20100094542A (cg-RX-API-DMAC10.html)
CN (1) CN101878252B (cg-RX-API-DMAC10.html)
WO (1) WO2009073435A1 (cg-RX-API-DMAC10.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8394507B2 (en) 2009-06-02 2013-03-12 Integran Technologies, Inc. Metal-clad polymer article
US8906515B2 (en) 2009-06-02 2014-12-09 Integran Technologies, Inc. Metal-clad polymer article
US20120234682A1 (en) 2011-03-18 2012-09-20 E.I. Du Pont De Nemours And Company Process For Copper Plating Of Polyamide Articles
RU2013158459A (ru) 2011-06-01 2015-07-20 Басф Се Композиция для электроосаждения металла, содержащая добавку для заполнения снизу вверх переходных отверстий в кремнии и межсоединительных элементов
US10927232B2 (en) 2015-02-20 2021-02-23 Asahi Kasei Kabushiki Kaisha Polyamide resin composition, method for producing polyamide resin composition, and molded article
CN106046781B (zh) * 2016-07-12 2019-01-04 江门市德众泰工程塑胶科技有限公司 用于电镀处理的芳香族聚酰胺复合物及其制备方法
KR101940418B1 (ko) 2017-10-30 2019-01-18 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
KR102171421B1 (ko) * 2017-12-31 2020-10-29 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
KR101893709B1 (ko) * 2017-12-31 2018-08-30 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
US11577496B2 (en) * 2017-12-31 2023-02-14 Lotte Chemical Corporation Polyamide resin composition and molded article comprising the same
CN108251874B (zh) * 2018-01-24 2019-08-16 永星化工(上海)有限公司 适于电镀的功能性树脂组合物上涂布金属层的预处理溶液
KR102198388B1 (ko) 2018-05-31 2021-01-05 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5324766A (en) * 1989-07-07 1994-06-28 Mitsui Petrochemical Industries, Ltd. Resin composition for forming plated layer and use thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432458B2 (cg-RX-API-DMAC10.html) * 1974-11-26 1979-10-15
US4444836A (en) * 1979-09-17 1984-04-24 Allied Corporation Metal plated polyamide articles
US4552626A (en) * 1984-11-19 1985-11-12 Michael Landney, Jr. Metal plating of polyamide thermoplastics
US5266655A (en) * 1989-07-11 1993-11-30 Rhone-Poulenc Chimie Single phase/amorphous blends of amorphous semiaromatic polyamides and semicrystalline nylon polyamides
JP3123119B2 (ja) * 1991-06-17 2001-01-09 三菱化学株式会社 ポリアミド樹脂メッキ製品
US6376093B1 (en) * 1998-05-26 2002-04-23 Toyo Boseki Kabushiki Kaisha Polyamide film and polyamide laminate film
EP1312647B1 (en) * 2001-11-16 2008-01-09 Mitsubishi Engineering-Plastics Corporation Polyamide moulding compositions and thick-wall molded products therefrom
CH695687A5 (de) * 2002-09-06 2006-07-31 Ems Chemie Ag Polyamid-Formmassen mit ultrafeinen Füllstoffen und daraus herstellbare Lichtreflektier-Bauteile.

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5324766A (en) * 1989-07-07 1994-06-28 Mitsui Petrochemical Industries, Ltd. Resin composition for forming plated layer and use thereof

Also Published As

Publication number Publication date
WO2009073435A1 (en) 2009-06-11
US20100247774A1 (en) 2010-09-30
EP2215151A1 (en) 2010-08-11
US20090143520A1 (en) 2009-06-04
CN101878252A (zh) 2010-11-03
JP2011505463A (ja) 2011-02-24
KR20100094542A (ko) 2010-08-26

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