CN101863127A - 基板的制造方法及基板的制造装置 - Google Patents
基板的制造方法及基板的制造装置 Download PDFInfo
- Publication number
- CN101863127A CN101863127A CN201010136605A CN201010136605A CN101863127A CN 101863127 A CN101863127 A CN 101863127A CN 201010136605 A CN201010136605 A CN 201010136605A CN 201010136605 A CN201010136605 A CN 201010136605A CN 101863127 A CN101863127 A CN 101863127A
- Authority
- CN
- China
- Prior art keywords
- release sheet
- substrate
- heating
- prepreg
- pressurization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
- B29C70/46—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/268—Release layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/08—Reinforcements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
- B32B2398/10—Thermosetting resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/16—Surface bonding means and/or assembly means with bond interfering means [slip sheet, etc. ]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003009445A JP4170781B2 (ja) | 2003-01-17 | 2003-01-17 | 基板の製造方法 |
JP009448/2003 | 2003-01-17 | ||
JP009445/2003 | 2003-01-17 | ||
JP2003009446A JP2004265891A (ja) | 2003-01-17 | 2003-01-17 | 多層基板の製造方法 |
JP009447/2003 | 2003-01-17 | ||
JP009446/2003 | 2003-01-17 | ||
JP2003009447A JP4465962B2 (ja) | 2003-01-17 | 2003-01-17 | 基板の製造方法 |
JP2003009448A JP4151416B2 (ja) | 2003-01-17 | 2003-01-17 | 基板の製造装置およびそれを用いた基板の製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200480000092.8A Division CN1698403B (zh) | 2003-01-17 | 2004-01-19 | 基板的制造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101863127A true CN101863127A (zh) | 2010-10-20 |
Family
ID=32777142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010136605A Pending CN101863127A (zh) | 2003-01-17 | 2004-01-19 | 基板的制造方法及基板的制造装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20050144780A1 (fr) |
EP (1) | EP1499169A4 (fr) |
CN (1) | CN101863127A (fr) |
TW (1) | TWI303959B (fr) |
WO (1) | WO2004066698A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103157717A (zh) * | 2011-12-10 | 2013-06-19 | 江阴市霖肯科技有限公司 | 远红外电热空调发热芯片基片的裁切工艺 |
CN107148171A (zh) * | 2017-06-27 | 2017-09-08 | 北大方正集团有限公司 | 多层电路板的压合方法 |
CN107416581A (zh) * | 2016-05-24 | 2017-12-01 | Jx金属株式会社 | 卷筒状积层体及其制造方法,以及制造积层体、增层基板、印刷配线板、电子机器的方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7249943B2 (en) | 2003-08-01 | 2007-07-31 | Alliant Techsystems Inc. | Apparatus for forming composite stiffeners and reinforcing structures |
US9662841B2 (en) | 2009-11-10 | 2017-05-30 | Orbital Atk, Inc. | Radially extending composite structures |
US8282757B2 (en) | 2009-11-10 | 2012-10-09 | Alliant Techsystems Inc. | Automated composite annular structure forming |
WO2015026441A1 (fr) * | 2013-08-22 | 2015-02-26 | Cytec Industries Inc. | Liaison de matériaux composites |
CN110972401A (zh) * | 2019-12-30 | 2020-04-07 | 苏州精濑光电有限公司 | 一种柔性电路板捋平机构 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3574040A (en) * | 1967-06-29 | 1971-04-06 | Gen Dynamics Corp | Apparatus for making laminated structural shapes by the controlled detrusive placement and polymerization of tectonic filamentous tapes |
IT1002973B (it) * | 1973-02-21 | 1976-05-20 | Sumitomo Bakelite Co | Laminati placcati di metallo fles sibili e metodo per produrli |
US3988195A (en) * | 1976-01-27 | 1976-10-26 | National Distillers And Chemical Corporation | Machine for applying a semipermeable patch on a plastic bag |
US4117198A (en) * | 1976-11-03 | 1978-09-26 | Formica Corporation | Release sheet of a cellulosic paper coated with a resin mixture |
US4328061A (en) * | 1977-10-25 | 1982-05-04 | Haggar Company | Apparatus for depositing adhesive strips |
JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
DE3247146C1 (de) * | 1982-12-21 | 1984-03-22 | Held, Kurt, 7218 Trossingen | Verfahren und Vorrichtung zur kontinuierlichen Herstellung von Schichtpress-Stoffen |
JPH0698874B2 (ja) * | 1985-06-26 | 1994-12-07 | 日本写真印刷株式会社 | 転写材 |
JPS62212133A (ja) * | 1986-03-13 | 1987-09-18 | Matsushita Electric Works Ltd | 積層板の製法 |
GB8725746D0 (en) * | 1987-11-03 | 1987-12-09 | Du Pont Canada | Release sheet for printed circuit board |
US4909886A (en) * | 1987-12-02 | 1990-03-20 | Mitsubishi Gas Chemical Company, Inc. | Process for producing copper-clad laminate |
JPH01281247A (ja) * | 1988-05-07 | 1989-11-13 | Shin Nippon Koki Kk | テープの自動貼付装置におけるテープの張力制御装置 |
JP2556897B2 (ja) * | 1989-02-23 | 1996-11-27 | ファナック株式会社 | 多層プリント配線板の外層材及び製造方法 |
JP3231537B2 (ja) * | 1994-03-09 | 2001-11-26 | 松下電器産業株式会社 | 多層基板の製造方法 |
JP2991032B2 (ja) * | 1994-04-15 | 1999-12-20 | 松下電器産業株式会社 | 多層基板の製造方法 |
JPH07288384A (ja) | 1994-04-19 | 1995-10-31 | Hitachi Chem Co Ltd | 多層プリント配線板の製造方法 |
US5672226A (en) * | 1995-10-11 | 1997-09-30 | Delco Electronics Corporation | Process of forming multilayer circuit boards |
JP4036926B2 (ja) * | 1997-08-27 | 2008-01-23 | 松下電器産業株式会社 | 積層板の製造方法およびその製造装置 |
JP2000022333A (ja) * | 1998-07-01 | 2000-01-21 | Ibiden Co Ltd | 積層板の製造方法 |
US6245696B1 (en) * | 1999-06-25 | 2001-06-12 | Honeywell International Inc. | Lasable bond-ply materials for high density printed wiring boards |
WO2001032418A1 (fr) * | 1999-11-01 | 2001-05-10 | Kaneka Corporation | Procede et dispositif de fabrication de plaques laminees |
JP2003008201A (ja) * | 2001-06-18 | 2003-01-10 | Nitto Denko Corp | 金属箔積層体の製造方法及び配線基板の製造方法 |
JP4259024B2 (ja) * | 2002-02-07 | 2009-04-30 | 富士通株式会社 | 多層配線基板の製造方法およびこれにより製造される多層配線基板 |
-
2004
- 2004-01-14 TW TW093100888A patent/TWI303959B/zh not_active IP Right Cessation
- 2004-01-19 WO PCT/JP2004/000353 patent/WO2004066698A1/fr active Application Filing
- 2004-01-19 US US10/509,754 patent/US20050144780A1/en not_active Abandoned
- 2004-01-19 EP EP04703242A patent/EP1499169A4/fr not_active Withdrawn
- 2004-01-19 CN CN201010136605A patent/CN101863127A/zh active Pending
-
2009
- 2009-05-26 US US12/471,850 patent/US8230891B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103157717A (zh) * | 2011-12-10 | 2013-06-19 | 江阴市霖肯科技有限公司 | 远红外电热空调发热芯片基片的裁切工艺 |
CN103157717B (zh) * | 2011-12-10 | 2016-06-22 | 江阴市文昌智能机电研究所有限公司 | 远红外电热空调发热芯片基片的裁切工艺 |
CN107416581A (zh) * | 2016-05-24 | 2017-12-01 | Jx金属株式会社 | 卷筒状积层体及其制造方法,以及制造积层体、增层基板、印刷配线板、电子机器的方法 |
CN107148171A (zh) * | 2017-06-27 | 2017-09-08 | 北大方正集团有限公司 | 多层电路板的压合方法 |
Also Published As
Publication number | Publication date |
---|---|
US20050144780A1 (en) | 2005-07-07 |
TWI303959B (en) | 2008-12-01 |
EP1499169A1 (fr) | 2005-01-19 |
TW200420207A (en) | 2004-10-01 |
EP1499169A4 (fr) | 2009-11-11 |
US8230891B2 (en) | 2012-07-31 |
WO2004066698A1 (fr) | 2004-08-05 |
US20090229762A1 (en) | 2009-09-17 |
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