CN101842165A - 机械整合并且紧密连接的印刷头和烟雾源 - Google Patents

机械整合并且紧密连接的印刷头和烟雾源 Download PDF

Info

Publication number
CN101842165A
CN101842165A CN200880113517A CN200880113517A CN101842165A CN 101842165 A CN101842165 A CN 101842165A CN 200880113517 A CN200880113517 A CN 200880113517A CN 200880113517 A CN200880113517 A CN 200880113517A CN 101842165 A CN101842165 A CN 101842165A
Authority
CN
China
Prior art keywords
deposition head
aerosol
deposition
atomizer
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200880113517A
Other languages
English (en)
Other versions
CN101842165B (zh
Inventor
布鲁斯·H·金
格雷戈里·詹姆斯·马克斯
迈克尔·J·雷恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Optomec Inc
Original Assignee
Optomec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optomec Inc filed Critical Optomec Inc
Publication of CN101842165A publication Critical patent/CN101842165A/zh
Application granted granted Critical
Publication of CN101842165B publication Critical patent/CN101842165B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02Spray pistols; Apparatus for discharge
    • B05B7/04Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/02Burettes; Pipettes
    • B01L3/0241Drop counters; Drop formers
    • B01L3/0268Drop counters; Drop formers using pulse dispensing or spraying, eg. inkjet type, piezo actuated ejection of droplets from capillaries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/28Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of spray; with integral means for catching drips or collecting surplus liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/18Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area using fluids, e.g. gas streams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/0012Apparatus for achieving spraying before discharge from the apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02Spray pistols; Apparatus for discharge
    • B05B7/04Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0408Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing two or more liquids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02Spray pistols; Apparatus for discharge
    • B05B7/04Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B05B7/0441Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber
    • B05B7/0458Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber the gas and liquid flows being perpendicular just upstream the mixing chamber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06Fluid handling related problems
    • B01L2200/0636Focussing flows, e.g. to laminate flows
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06Fluid handling related problems
    • B01L2200/0647Handling flowable solids, e.g. microscopic beads, cells, particles
    • B01L2200/0652Sorting or classification of particles or molecules
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/08Geometry, shape and general structure
    • B01L2300/0809Geometry, shape and general structure rectangular shaped
    • B01L2300/0819Microarrays; Biochips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00Moving or stopping fluids
    • B01L2400/04Moving fluids with specific forces or mechanical means
    • B01L2400/0403Moving fluids with specific forces or mechanical means specific forces
    • B01L2400/0433Moving fluids with specific forces or mechanical means specific forces vibrational forces
    • B01L2400/0439Moving fluids with specific forces or mechanical means specific forces vibrational forces ultrasonic vibrations, vibrating piezo elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00Moving or stopping fluids
    • B01L2400/04Moving fluids with specific forces or mechanical means
    • B01L2400/0475Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure
    • B01L2400/0487Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure fluid pressure, pneumatics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0615Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced at the free surface of the liquid or other fluent material in a container and subjected to the vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02Spray pistols; Apparatus for discharge
    • B05B7/04Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B05B7/0441Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber
    • B05B7/0475Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber with means for deflecting the peripheral gas flow towards the central liquid flow
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02Spray pistols; Apparatus for discharge
    • B05B7/12Spray pistols; Apparatus for discharge designed to control volume of flow, e.g. with adjustable passages
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/16Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Nozzles (AREA)
  • Powder Metallurgy (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

一种沉积装置,所述装置包括在结构上与沉积头整合的一个或多个雾化器。整个沉积头可以是可更换的,并且可以用材料预先填充。沉积头可以包括多个喷嘴。此外,还提供一种用于三维材料沉积的装置,所述装置包括与不可倾斜的雾化器连接的可倾斜沉积头。还提供用于同时或依次沉积不同材料的方法和装置。

Description

机械整合并且紧密连接的印刷头和烟雾源
相关申请的交叉引用
本申请要求在2007年8月30日提交的名称为″机械整合并且紧密连接的印刷头和烟雾源(Mechanically Integrated and Closely Coupled Print Headand Mist Source)″的美国临时专利申请序列60/969,068的申请日权益,该美国临时专利申请的说明书通过引用结合在此。
发明背景
发明领域(技术领域)
本发明是一种包括雾化器的装置,所述雾化器位于直接将材料沉积到平坦或不平坦的目标物上的沉积头内部或相邻处。
发明简述
本发明是用于沉积材料的沉积头,所述沉积头包括:一个或多个载气进口;一个或多个雾化器;气溶胶歧管,其在结构上与所述一个或多个雾化器整合;一个或多个气溶胶输送导管,其与所述气溶胶歧管流体连通;包覆气体进口和一个或多个材料沉积出口。沉积头优选还包括虚拟冲击器(virtual impactor)和废气出口,所述虚拟冲击器被设置在一个或多个雾化器中的至少一个和气溶胶歧管之间。沉积头优选包括材料的储存器,以及任选的用于将未使用的材料从气溶胶歧管传输回到储存器中的排出管(drain)。沉积头任选还包括材料的外部储存器,该储存器可用于选自如下各项中的目的:能够更长时间地运行而不用重新填充,将材料保持在所需的温度,将所述材料保持在所需的粘度,将材料保持在所需的组成,以及防止粒子的聚集。沉积头优选还包括包覆气体歧管,该包覆气体歧管至少同心地包围一个或多个气溶胶输送导管的中部。沉积头任选还包括包覆气体室,该包覆气体室包围每一个包括导管出口在内的气溶胶输送导管的一部分,所述气溶胶输送导管优选足够长,因而在包覆气体流与气溶胶流于所述包覆气体室的出口处或附近合并之前,所述包覆气体流基本上平行于所述气溶胶流,所述合并是在所述气溶胶流离开所述导管出口之后进行的。沉积头任选可更换,并且包括在安装之前预先填充有材料的材料储存器。这种沉积头任选是一次性的(disposable),或是可再填充的。一个或多个雾化器中的每一个雾化不同的材料,这些材料优选不混合和/或不反应,直到即将沉积之前或沉积期间。要被沉积的不同材料的比率优选是可控的。雾化器任选同时运行,或至少两个雾化器任选在不同时间运行。
本发明还是用于三维材料沉积的装置,所述装置包括沉积头和雾化器,其中沉积头和雾化器在三个线性维度上一起移动,并且其中沉积头是可倾斜的,而雾化器不是可倾斜的。所述装置优选用于将材料沉积在结构体的外部、内部和/或下面,并且优选被构造成使得沉积头可延伸到窄的通道内。
本发明还是一种用于沉积材料的方法,所述方法包括如下步骤:雾化第一材料以形成第一气溶胶,雾化第二材料以形成第二气溶胶,将所述第一气溶胶和第二气溶胶合并,用环状的包覆气体流包围合并的气溶胶,将合并的气溶胶集中,以及沉积所述气溶胶。雾化步骤任选同时或依次进行。所述方法任选还包括改变在至少一种气溶胶中的材料的量的步骤。雾化步骤任选包括使用不同设计的雾化器。所述方法任选还包括沉积复合结构体的步骤。
本发明的一个优点是改善了沉积,原因在于降低了液滴的蒸发和降低了过度喷射。
本发明的另一个优点是降低了在气流的开始和材料到目标物上的沉积之间的延迟。
本发明的目的、其它优点和新的特征以及另外的可应用性范围将在下面的详述中结合附图部分地进行描述,并对于本领域技术人员,通过以下内容的审查将部分地变得明显,或可以通过本发明的实施而知晓。本发明的目的和优点可以通过特别在后附权利要求书中指出的手段和组合而实现和获得。
附图说明
结合到说明书中并且形成说明书的一部分的附图示出本发明的一个或多个实施方案,并且与说明书一起起到解释本发明的原理的作用。附图仅为了示出本发明的一个或多个优选实施方案的目的并且不应理解为限制本发明。在附图中:
图1是本发明的用于梯度材料(gradient material)制备的装置的示意图;
图2是具有雾化器的整体式的多喷嘴沉积头的示意图;
图3是具有单气溶胶喷射器的整合雾化器的示意图;
图4是整合了雾化器、沉积头和虚拟冲击器的单一装置的横截面示意图;
图5是具有沉积头和虚拟冲击器的整合的雾化系统的备选实施方案的示意图;
图6是具有沉积头和流量降低器的多喷嘴整合的雾化系统的另一个备选实施方案的示意图;以及
图7是与沉积头整合的多个雾化器(一个为容纳于一个室内的气动雾化器以及另一个为容纳于另一个室内的超声雾化器)的示意图。
发明详述
本发明总体上涉及利用气动力学集中(focusing)对液体、溶液和液体-粒子悬浮液的高分辨率、无掩模沉积。在一个实施方案中,将气溶胶流集中并且沉积到平坦或不平坦的目标物上,从而形成图案,这种图案被热或光化学处理以实现接近对应的本体材料的物理、光学和/或电学性质。这种方法被称为
Figure GPA00001115622400031
(无掩模中等尺度材料沉积(Maskless Mesoscale MaterialDeposition))技术,并且被用于沉积,优选直接并且在不使用掩模的情况下沉积气溶胶化的材料,其线宽的数量级小于用常规厚膜方法沉积的线的线宽的数量级,甚至小于1微米。
Figure GPA00001115622400032
装置优选包括气溶胶喷射印刷头,以形成由外部包覆流(sheathflow)和内部的气溶胶携带的载体流构成的环状传送射流。在所述环状气溶胶喷射法中,气溶胶流典型地进入印刷头,优选正好在气溶胶化方法之后或在经过加热器组件之后进入印刷头,并且沿着该装置的轴引导至印刷头锐孔。物料通过量优选通过气溶胶载气质量流量控制器控制。在沉积头内部,气溶胶流优选首先通过穿过毫米大小的锐孔而准直。然后,出来的粒子流优选与环状包覆气体合并,这起着消除喷嘴堵塞以及使气溶胶流集中的作用。载气和包覆气体最通常地包括压缩空气或惰性气体,其中一种或两种可以包含改性的溶剂蒸气内含物。例如,当气溶胶由水溶液形成时,水蒸气可以被添加到载气或包覆气体中以防止液滴蒸发。
包覆气体优选经由在气溶胶进口下面的包覆空气进口进入,并且与气溶胶流一起形成环形流。如同气溶胶载气一样,包覆气体流量优选通过质量流量控制器控制。合并的流以高速(~50m/s)经由对着目标物的锐孔离开喷嘴,并且随后撞击到目标物上。这种环形流将气溶胶流集中到目标物上,并且可以印刷尺寸小于约1微米的特征。通过使沉积头相对于目标物移动来形成图案。
与沉积头相邻布置的雾化器
雾化器典型地经由烟雾输送装置与沉积头连接,而不与沉积头机械连接。在本发明的一个实施方案中,雾化器和沉积头是完全整合的,共用共同的结构元件。
如整个说明书和权利要求书所使用的,术语“雾化器”是指典型地用于悬浮成气溶胶的雾化器、喷雾器、换能器、活塞或任何其它器件,它们以任何方式启动,包括但不限于气动、超声、机械,或经由喷雾工艺,其被用于由液体或其它材料形成更小的液滴或粒子,或来自蒸气的冷凝粒子。
如果雾化器与沉积头相邻或整合在一起,则烟雾在雾化器和所述头之间的传输所需要的管道的长度减小或消除。相应地,烟雾在管中的通过时间显著降低,因而在传输过程中来自液滴的溶剂损失最小化。这进而降低了过度喷射并且可以使用比通常能够被使用的液体更易挥发的液体。此外,在输送管内的粒子损失被最小化或消除,从而提高了沉积系统的总效率以及降低了堵塞的发生。系统的响应时间也得到了明显改善。
进一步的优点涉及紧密连接的头部在构造制造用系统中的使用。对于小的基板,通过固定雾化器和沉积头并且移动基板来简化自动化。在这种情况下,对于雾化器,相对于沉积头的布置选择有很多种。然而,对于大的基板,比如在制造平板显示器中碰到的那些基板,情形是相反的,并且移动沉积头是更简单的。在这种情况下,雾化器的布置选择受更多的限制。典型地,需要长的管道长度,以将烟雾从固定的雾化器输送到安装在移动台上的头部。由于聚结所导致的烟雾损失可能是严重的,并且由于长的停留时间导致的溶剂损失可能使烟雾干燥至不再可使用的水平。
另一个优点起因于筒式(cartridge-style)雾化器和沉积头的构造。在这种构造中,雾化器和沉积头以它们可以作为单一装置被安装到印刷系统上并且从该印刷系统上拆卸的这种方式连接。在这种构造中,雾化器和头部可以容易并且快速地进行更换。更换可以在通常的维修过程中进行,或由于灾难性故障事件比如喷嘴堵塞而进行。在这种实施方案中,雾化器储存器优选预先装载有原料,使得在安装时立即将更换装置准备使用。在相关的实施方案中,筒式装置允许印刷系统的快速替换。例如,容纳有材料A的印刷头可以快速地与容纳有材料B的印刷头交换。在这些实施方案中,雾化器/头部装置或筒优选被设计成是低成本的,使得它们能够作为消耗品售卖,这种消耗品可以是一次性的或是可再填充的。
在一个实施方案中,雾化器和沉积头完全整合成共用结构元件的单一装置,如图4所示。这种构造优选为最紧凑的并且最接近地表现为筒式装置。
虚拟冲击器通常用于移除运行气动雾化器所必要的过量气体,因此在整合雾化器的实施方案中还与沉积头整合。加热器,其用途在于加热烟雾并且驱散溶剂,也可以被整合到装置中。用于维持在雾化器中的原料所必需的,但是对于雾化未必是必需的,比如原料量控制或低墨水量报警、搅拌和温度控制的元件也可以任选被整合到雾化器中。
可以与装置整合的元件的其它实例通常涉及传感和诊断。将传感元件直接整合到装置中的背后动机是提高响应和精度。例如,可以将压力传感整合到沉积头。压力传感提供了关于整个沉积头状态的反馈;高于正常情况的压力表示喷嘴被堵塞,而低于正常的压力表示在系统中存在泄漏。通过将一个或多个压力传感器直接放置在沉积头中,反馈更迅速和更精确。确定材料的沉积速率的烟雾传感也可以被整合到装置中。
典型的气溶胶喷射系统使用了电子质量流量控制器以计量处于特定速率的气体。包覆气体和雾化器气体流量通常是不同的,并且可以取决于材料原料和应用而变化。对于为不需要可调节性的特定目的而制造的沉积头,电子质量流量控制器可以被静态节流器(static restriction)所代替。对于给定上游压力,一定尺寸的静态节流器将仅允许一定量的气体通过其中。通过精确地将上游压力控制为预定的水平,静态节流器可以是适当大小的,以替换用于包覆气体和雾化器气体的电子质量流量控制器。用于虚拟冲击器废气的质量流量控制器通常可以容易被拆卸,条件是使用真空泵,该真空泵优选能够产生约16 inHg的真空。在这种情况下,节流器起着临界锐孔的作用。静态节流器和其它控制元件在沉积头中的整合减少了必需延伸到该沉积头的气体管线的数量。这种情况对于其中沉积头移动而不是基板移动的情形是特别有用的。
在本文中提供的任何实施方案中,无论雾化器是否与沉积头整合,该沉积头都可以包括单喷嘴或多喷嘴设计,即,具有任何数量的喷嘴。多喷射器阵列包括以任何几何结构构造的一个或多个喷嘴。
图1显示了在沉积头中与气溶胶喷射器整合的超声雾化器的实施方案。墨水12位于在与加长喷嘴25相邻的储存器中。超声换能器10将墨水12雾化。然后,经雾化的墨水18被经由烟雾空气进口14进入的烟雾空气或载气携带出储存器,并且绕着挡板24被引导至相邻的烟雾歧管,在此它进入烟雾输送管30。包覆气体经由包覆气体进口22进入包覆气体歧管28。当经雾化的墨水移动经过烟雾输送管30时,随着它进入加长喷嘴25它被包覆空气集中。
图2是整合的气动雾化系统的实施方案,其具有单一喷嘴沉积头和虚拟冲击器。雾化气体36进入墨水储存器34,在此它使墨水雾化并且携带雾化的墨水118进入虚拟冲击器38。雾化气体36是至少部分汽提过的,并且经由虚拟冲击器气体废气32离开。雾化的墨水118继续向下通过任选的加热器42并且进入到沉积头44。包覆气体122进入沉积头并且使雾化的墨水118集中。
图3是整合的气动雾化器、虚拟冲击器和单喷嘴沉积头的备选实施方案的横截面示意图。允许可调节流量的活塞19被用于使从墨水悬浮液进口17进入的墨水雾化。然后,经雾化的墨水218移动至相邻的虚拟冲击器138。废气经由废气出口132离开虚拟冲击器。然后雾化的墨水218移动至相邻的沉积头144,在此包覆气体122使墨水集中。
图4显示了具有整合的超声雾化器的整体式多喷嘴气溶胶喷射沉积头的实施方案。墨水312位于优选与喷嘴阵列326相邻的储存器中。超声换能器310使墨水雾化。然后,雾化的墨水318被经由烟雾空气进口314进入的烟雾空气携带出储存器,并且绕着挡板324被引导至相邻的气溶胶歧管320,在此它进入各个气溶胶输送管330。没有进入到任何烟雾输送管330内的雾化墨水318优选经由放空的排出管316再循环回到相邻的墨水储存器。包覆气体经由包覆气体进口322进入包覆气体歧管328。当雾化墨水318移动通过烟雾输送管330时,随着它进入喷嘴阵列326而被包覆气体集中。
图5是多喷嘴整合气动雾化系统的一个实施方案,该系统具有使用了歧管和流量降低器的沉积头。烟雾空气经由通往气动雾化器452的烟雾空气进口414进入整合系统中。被夹带在烟雾空气中形成气溶胶的雾化的材料然后移动到相邻的虚拟冲击器438。废气经由废气出口432离开虚拟冲击器。然后,气溶胶移动到歧管进口447,并且经由一个或多个烟雾输送管430进入一个或多个包覆气体室448。包覆气体经由气体进口422进入沉积头,气体进口422任选与烟雾输送管430垂直定向,并且在烟雾输送管430的底部与气溶胶流合并。烟雾输送管430部分延长或完全延长至包覆气体室448的底部,优选形成直的几何结构。包覆气体室448的长度优选足够长,以确保包覆气体流与气溶胶流在两者合并之前基本上平行,由此产生优选圆柱形对称的包覆气体压力分布。然后包覆气体与气溶胶在包覆气体室448的底部或附近合并。保持这种用于合并气溶胶载气与包覆气体的直区域的优点在于:包覆流在与烟雾合并之前充分地形成,并且在烟雾管430周围分布更均匀,由此使得在合并过程中的湍流最小,使包覆/烟雾混合最小,降低了过度喷射以及产生了更紧密的集中。此外,在阵列中的喷嘴之间的“串流(cross talk)”最小化,这归因于单独的包覆气体室448。
歧管可以任选与沉积头远距离布置,或布置在沉积头上或在沉积头内部。在任一构造中,歧管可以由一个或多个雾化器进料。在图示的构造中,单一流量降低器(虚拟冲击器)被用于多喷射器阵列沉积头。在单个流量降低阶段不足以移除足够的过量载气的情况下,可以采用多个降低阶段。
多个雾化器
所述装置可以包括一个或多个雾化器。可以采用基本上相同设计的多个雾化器以产生更大量的从沉积头输送的烟雾,由此增加高速制造用的通过量。在这种情况下,基本上相同组成的材料优选起着用于多个雾化器的原料的作用。多个雾化器可以共用共同的原料室或任选地可以使用单独的室。可以使用独立的室来容纳不同组成的材料,以防止材料混合。在多种材料的情况下,雾化器可以同时运行,以所需的比率输送材料。可以使用任何的材料,比如电子材料、粘合剂、材料前体,或生物物质或生物材料。材料可以具有不同的材料组成、粘度、溶剂组成、悬浮流体,以及很多不同的其它物理、化学和材料性质。样品还可以是混溶或不混容的,并且可以是反应性的。在1个实例中,比如单体和催化剂之类的材料可以在使用之前保持分开直至使用,以避免在雾化器室中的反应。然后,优选将材料在沉积过程中以特定比率混合。在另外的实例中,具有不同的雾化特性的材料可以单独雾化以使各个材料的雾化率最佳化。例如,玻璃粒子的悬浮液可以采用1个雾化器雾化,而银粒子的悬浮液可以通过第二个雾化器雾化。在最终的沉积迹线中,可以控制玻璃与银的比率。
雾化器可以备选地依次运行以在相同位置上或在不同的位置上单独输送材料。在相同位置上的沉积能够形成复合结构,而在不同区域的沉积能够在基板的相同层上形成多个结构体。
任选地,雾化器可以包括不同的设计。例如,如图7所示,气动雾化器可以容纳在1个室内,而超声雾化器可以容纳在另一个室内。这允许最佳地选择雾化器,以匹配材料的雾化特性。
图6示出了用于同时经由单一沉积头沉积多种材料的
Figure GPA00001115622400081
法。每一个雾化器单元4a-c产生其相应样品的液滴,并且该液滴优选通过载气引导至合并室6。液滴流在合并室6中汇合,然后被引导至沉积头2。然后,同时沉积多种类型的样品液滴。沉积的相对速率优选通过进入每一个雾化器4a-c的载气速率进行控制。载气速率可以连续或间歇地变化。
这样的梯度材料制备允许由载气流量控制连续的混合比率。这种方法也允许多个雾化器和样品在同时使用。此外,在目标物上发生混合,而不是在样品瓶或气溶胶管线内发生。这种方法可以沉积各种类型的材料,包括但不限于:UV、热固性或热塑性聚合物;粘合剂;溶剂;蚀刻化合物;金属墨水;电阻材料(resistor)、电介质和金属厚膜膏;蛋白质、酶和其它生物材料;以及低(聚)核苷酸。梯度材料制备的应用包括但不限于:梯度光学,比如折射率的3D梯度化;梯度纤维光学;合金沉积;陶瓷/金属结;在传输(on the fly)中共混电阻材料墨水;组合药物释放;连续灰度级照片的制备;连续彩色照片的制备;用于在RF(无线电频率)电路中阻抗匹配的梯度结;在目标物上的化学反应,比如电子特征的选择性蚀刻;在芯片上的DNA制备;以及粘合剂材料的保存期的延长。
图7显示了多个雾化器与沉积头的整合。在沉积头544的一侧是具有烟雾空气进口514的超声雾化器部550。在沉积头544的另一侧是气动雾化器552,其具有烟雾空气进口516和带有废气出口532的虚拟冲击器538。在该图中,包覆气体进口522并没有显示包覆气体路径。尽管这个实施方案对于匹配材料的雾化特性是最佳的,但是多个雾化器的其它组合是可能的,比如两个或更多个超声雾化器;两个或更多个气动雾化器;或它们的任何组合。
非整合的雾化器或组件
存在不优选将雾化器或某些组件整合的情况,如具有沉积头的单一装置。例如,沉积头典型地具有当相对于垂直以任意角度定向时进行印刷的能力。然而,雾化器可以包括流体储存器,该流体储存器必需保持在某一水平的位置以适当地发挥作用。因此,在沉积头是铰接的情况下,这种雾化器和沉积头必需不是刚性连接的,由此能够使雾化器在这种铰接过程中保持水平。这种构造的一个实例是这样的雾化器和沉积头被安装到机械臂的末端上的情况。在这种实例中,雾化器和沉积头组件在x、y和z上一起移动。然而,所述装置被构造成使得仅沉积头没有倾斜任意角度。这种构造有利于三维空间中的印刷,比如印刷到结构体,包括但不限于大的结构体比如机身的外部、内部或下面。
在紧密连接的、但是没有完全整合的雾化器和印刷头的另一个实例中,布置合并单元使得沉积头可以延伸到窄的通道中。
尽管在某些构造中,雾化器的烟雾产生部与沉积头相邻布置,但是雾化器的不产生烟雾的部分可以任选地远距离布置。例如,用于超声雾化器的驱动电路可以远距离布置并且不整合到装置中。用于材料原料的储存器也可以远距离布置。可以采用远距离布置的储存器来再填充与沉积头有关的本地储存器,从而能够在不用用户维护的情况下长时期运行。在特定的条件下,还可以采用远距离布置的储存器来维护原料,例如,在使用前冷却温度敏感的流体。其它形式的维护可以远距离进行,比如粘度调节、组成调节或防止粒子聚集的超声。原料可以仅在1个方向上流动,例如,从远距离布置的储存器再供给至本地的墨水储存器,或可以备选地从本地墨水储存器返回至远距离的储存器,用于维护或储存的目的。
材料
本发明能够沉积液体、溶液和液体-粒子悬浮液。还可以沉积这些的组合,比如还包含一种或多种溶质的液体-粒子悬浮液。液体材料是优选的,还可以在采用液体载体促进雾化,但随后经由干燥步骤移除的情况下沉积干燥的材料。
在本文中提及了超声和气动雾化方法。尽管这两种方法中的任一种可以被用于雾化仅具有特定性质范围的流体,但是可以被本发明使用的材料并不受这两种雾化方法的限制。在上述的雾化方法之一不适合于特定材料的情况下,可以选择不同的雾化方法,并且将其结合到本发明中。此外,本发明的实施并不依赖于特定的液体载体或配方,可以使用许多材料源。
尽管特别参照这些优选实施方案详细描述了本发明,但是其它实施方案也可以实现相同的结果。本发明的变化和改变对于本领域技术人员是显而易见的,并且意欲在后附权利要求中涵盖所有这样的改变和等价物。以上引用的全部参考文献、申请、专利和出版物的整个公开内容都通过引用结合在此。

Claims (23)

1.一种用于沉积材料的沉积头,所述沉积头包括:
一个或多个载气进口;
一个或多个雾化器;
气溶胶歧管,其在结构上与所述一个或多个雾化器整合;
一个或多个气溶胶输送导管,其与所述气溶胶歧管流体连接;
包覆气体进口;以及
一个或多个材料沉积出口。
2.权利要求1所述的沉积头,所述沉积头还包括虚拟冲击器和废气出口,所述虚拟冲击器被设置在所述一个或多个雾化器中的至少一个和所述气溶胶歧管之间。
3.权利要求1所述的沉积头,所述沉积头还包括材料的储存器。
4.权利要求3所述的沉积头,所述沉积头还包括用于将未使用的材料从所述气溶胶歧管传输回到所述储存器中的排出管。
5.权利要求3所述的沉积头,所述沉积头还包括材料的外部储存器,该外部储存器可用于选自如下各项中的目的:能够更长时间地运行而不用重新填充,将所述材料保持在所需的温度,将所述材料保持在所需的粘度,将所述材料保持在所需的组成,以及防止粒子的聚集。
6.权利要求1所述的沉积头,所述沉积头还包括包覆气体歧管,所述包覆气体歧管至少同心地包围所述一个或多个气溶胶输送导管的中部。
7.权利要求1所述的沉积头,所述沉积头还包括包覆气体室,该包覆气体室包围每一个包括导管出口在内的气溶胶输送导管的一部分。
8.权利要求7所述的沉积头,其中所述气溶胶输送导管足够长,因而在包覆气体流与气溶胶流于所述包覆气体室的出口处或附近合并之前,所述包覆气体流基本上平行于所述气溶胶流,所述合并是在所述气溶胶流离开所述导管出口之后进行的。
9.权利要求1所述的沉积头,其中所述沉积头是可更换的。
10.权利要求9所述的沉积头,所述沉积头还包括在安装之前预先填充有材料的材料储存器。
11.权利要求9所述的沉积头,其中所述沉积头是一次性的或可再填充的。
12.权利要求1所述的沉积头,其中所述一个或多个雾化器中的每一个雾化不同的材料。
13.权利要求12所述的沉积头,其中所述不同的材料不混合和/或反应,直到在即将沉积之前或沉积期间。
14.权利要求12所述的沉积头,其中要被沉积的材料的比率是可控的。
15.权利要求12所述的沉积头,其中所述雾化器是同时运行的,或所述雾化器中的至少2个是在不同时间运行的。
16.一种用于三维材料沉积的装置,所述装置包括沉积头和雾化器,其中所述沉积头和雾化器在三个线性维度上一起移动,并且其中所述沉积头是可倾斜的,而所述雾化器不是可倾斜的。
17.权利要求16所述的材料沉积装置,所述材料沉积装置可用于将所述材料沉积在结构体的外部、内部和/或下面。
18.权利要求16所述的材料沉积装置,所述材料沉积装置被构造成使得所述沉积头可延伸到窄的通道内。
19.一种用于沉积材料的方法,所述方法包括如下步骤:
雾化第一材料以形成第一气溶胶;
雾化第二材料以形成第二气溶胶;
将所述第一气溶胶和第二气溶胶合并;
用环状的包覆气体流包围合并的气溶胶;
将所述合并的气溶胶集中;以及
沉积所述气溶胶。
20.权利要求19所述的方法,其中所述的雾化步骤同时或依次进行。
21.权利要求19所述的方法,所述方法还包括改变这些气溶胶的至少一种中的材料的量的步骤。
22.权利要求19所述的方法,其中所述雾化步骤包括使用不同设计的雾化器。
23.权利要求19所述的方法,所述方法还包括沉积复合结构体的步骤。
CN2008801135174A 2007-08-30 2008-09-02 机械整合并且紧密连接的印刷头和烟雾源 Active CN101842165B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US96906807P 2007-08-30 2007-08-30
US60/969,068 2007-08-30
PCT/US2008/075042 WO2009029942A2 (en) 2007-08-30 2008-09-02 Mechanically integrated and closely coupled print head and mist source

Publications (2)

Publication Number Publication Date
CN101842165A true CN101842165A (zh) 2010-09-22
CN101842165B CN101842165B (zh) 2013-06-19

Family

ID=40388170

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801135174A Active CN101842165B (zh) 2007-08-30 2008-09-02 机械整合并且紧密连接的印刷头和烟雾源

Country Status (6)

Country Link
US (2) US8272579B2 (zh)
JP (1) JP2010537812A (zh)
KR (2) KR101594584B1 (zh)
CN (1) CN101842165B (zh)
TW (1) TWI482662B (zh)
WO (1) WO2009029942A2 (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103846171A (zh) * 2014-02-18 2014-06-11 厦门大学 一种静电喷雾装置
CN103946345A (zh) * 2011-10-28 2014-07-23 蓝宝石能源公司 升级藻油及其产品的工艺
CN104588226A (zh) * 2015-02-13 2015-05-06 北京京诚之星科技开发有限公司 一种线源电极静电粉末喷涂器
CN104802401A (zh) * 2014-01-28 2015-07-29 帕洛阿尔托研究中心公司 聚合物喷洒沉积方法及系统
CN106256447A (zh) * 2015-12-10 2016-12-28 耘创九州智能装备有限公司 字符选择气控装置以及字符选择的气控方法
CN112519417A (zh) * 2020-11-28 2021-03-19 厦门理工学院 一种双鞘气气溶胶喷印方法及喷印头
CN113245102A (zh) * 2021-06-07 2021-08-13 苏州微知电子科技有限公司 一种纤维器件喷涂机
CN113498363A (zh) * 2019-01-17 2021-10-12 Vs粒子控股有限公司 转换装置、包括转换装置的沉积装置、用于转换流体流的方法以及用于将颗粒沉积到基板上的方法

Families Citing this family (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045015B2 (en) 1998-09-30 2006-05-16 Optomec Design Company Apparatuses and method for maskless mesoscale material deposition
AU2001274364B2 (en) * 2000-06-13 2005-09-15 Element Six (Pty) Ltd Composite diamond compacts
US7674671B2 (en) 2004-12-13 2010-03-09 Optomec Design Company Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US7938341B2 (en) * 2004-12-13 2011-05-10 Optomec Design Company Miniature aerosol jet and aerosol jet array
US20070154634A1 (en) * 2005-12-15 2007-07-05 Optomec Design Company Method and Apparatus for Low-Temperature Plasma Sintering
US20100310630A1 (en) * 2007-04-27 2010-12-09 Technische Universitat Braunschweig Coated surface for cell culture
TWI482662B (zh) 2007-08-30 2015-05-01 Optomec Inc 機械上一體式及緊密式耦合之列印頭以及噴霧源
TWI538737B (zh) * 2007-08-31 2016-06-21 阿普托麥克股份有限公司 材料沉積總成
TW200918325A (en) * 2007-08-31 2009-05-01 Optomec Inc AEROSOL JET® printing system for photovoltaic applications
US8887658B2 (en) * 2007-10-09 2014-11-18 Optomec, Inc. Multiple sheath multiple capillary aerosol jet
US20150273510A1 (en) * 2008-08-15 2015-10-01 Ndsu Research Foundation Method and apparatus for aerosol direct write printing
WO2010138493A1 (en) 2009-05-28 2010-12-02 Hsio Technologies, Llc High performance surface mount electrical interconnect
US9536815B2 (en) 2009-05-28 2017-01-03 Hsio Technologies, Llc Semiconductor socket with direct selective metalization
US9276336B2 (en) 2009-05-28 2016-03-01 Hsio Technologies, Llc Metalized pad to electrical contact interface
WO2010141318A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit peripheral lead semiconductor test socket
US9231328B2 (en) 2009-06-02 2016-01-05 Hsio Technologies, Llc Resilient conductive electrical interconnect
WO2010141311A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit area array semiconductor device package
US9184527B2 (en) 2009-06-02 2015-11-10 Hsio Technologies, Llc Electrical connector insulator housing
US9414500B2 (en) 2009-06-02 2016-08-09 Hsio Technologies, Llc Compliant printed flexible circuit
US9699906B2 (en) 2009-06-02 2017-07-04 Hsio Technologies, Llc Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
US8912812B2 (en) 2009-06-02 2014-12-16 Hsio Technologies, Llc Compliant printed circuit wafer probe diagnostic tool
WO2012061008A1 (en) 2010-10-25 2012-05-10 Hsio Technologies, Llc High performance electrical circuit structure
US8928344B2 (en) 2009-06-02 2015-01-06 Hsio Technologies, Llc Compliant printed circuit socket diagnostic tool
US9196980B2 (en) 2009-06-02 2015-11-24 Hsio Technologies, Llc High performance surface mount electrical interconnect with external biased normal force loading
US8987886B2 (en) 2009-06-02 2015-03-24 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
US9318862B2 (en) 2009-06-02 2016-04-19 Hsio Technologies, Llc Method of making an electronic interconnect
US9930775B2 (en) 2009-06-02 2018-03-27 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
WO2012074963A1 (en) 2010-12-01 2012-06-07 Hsio Technologies, Llc High performance surface mount electrical interconnect
US9136196B2 (en) 2009-06-02 2015-09-15 Hsio Technologies, Llc Compliant printed circuit wafer level semiconductor package
WO2012078493A1 (en) 2010-12-06 2012-06-14 Hsio Technologies, Llc Electrical interconnect ic device socket
US9603249B2 (en) 2009-06-02 2017-03-21 Hsio Technologies, Llc Direct metalization of electrical circuit structures
WO2010141266A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit peripheral lead semiconductor package
US8618649B2 (en) 2009-06-02 2013-12-31 Hsio Technologies, Llc Compliant printed circuit semiconductor package
US9613841B2 (en) 2009-06-02 2017-04-04 Hsio Technologies, Llc Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
US8970031B2 (en) 2009-06-16 2015-03-03 Hsio Technologies, Llc Semiconductor die terminal
WO2010141298A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Composite polymer-metal electrical contacts
US8988093B2 (en) 2009-06-02 2015-03-24 Hsio Technologies, Llc Bumped semiconductor wafer or die level electrical interconnect
US8525346B2 (en) 2009-06-02 2013-09-03 Hsio Technologies, Llc Compliant conductive nano-particle electrical interconnect
US9276339B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Electrical interconnect IC device socket
WO2011002712A1 (en) 2009-06-29 2011-01-06 Hsio Technologies, Llc Singulated semiconductor device separable electrical interconnect
US8610265B2 (en) 2009-06-02 2013-12-17 Hsio Technologies, Llc Compliant core peripheral lead semiconductor test socket
US9184145B2 (en) 2009-06-02 2015-11-10 Hsio Technologies, Llc Semiconductor device package adapter
WO2010141264A1 (en) 2009-06-03 2010-12-09 Hsio Technologies, Llc Compliant wafer level probe assembly
US8981568B2 (en) 2009-06-16 2015-03-17 Hsio Technologies, Llc Simulated wirebond semiconductor package
US9320144B2 (en) 2009-06-17 2016-04-19 Hsio Technologies, Llc Method of forming a semiconductor socket
US8981809B2 (en) 2009-06-29 2015-03-17 Hsio Technologies, Llc Compliant printed circuit semiconductor tester interface
US8758067B2 (en) 2010-06-03 2014-06-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
US10159154B2 (en) 2010-06-03 2018-12-18 Hsio Technologies, Llc Fusion bonded liquid crystal polymer circuit structure
US9689897B2 (en) 2010-06-03 2017-06-27 Hsio Technologies, Llc Performance enhanced semiconductor socket
US9350093B2 (en) 2010-06-03 2016-05-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
US8728241B2 (en) * 2010-12-08 2014-05-20 Intermolecular, Inc. Combinatorial site-isolated deposition of thin films from a liquid source
JP2012190954A (ja) * 2011-03-10 2012-10-04 Kyushu Univ 光電変換素子の製造方法
KR101271629B1 (ko) * 2011-03-23 2013-06-11 주식회사 신성에프에이 솔라셀의 전극패턴 형성장치 및 그 방법
KR101271528B1 (ko) * 2011-03-23 2013-06-05 주식회사 신성에프에이 솔라셀의 전극패턴 형성장치 및 그 방법
TWI504518B (zh) * 2011-05-09 2015-10-21 Yi Tsung Yan 填充墨水匣的對流填充裝置
US8824247B2 (en) 2012-04-23 2014-09-02 Seagate Technology Llc Bonding agent for heat-assisted magnetic recording and method of application
US9761520B2 (en) 2012-07-10 2017-09-12 Hsio Technologies, Llc Method of making an electrical connector having electrodeposited terminals
US9178184B2 (en) 2013-02-21 2015-11-03 Universal Display Corporation Deposition of patterned organic thin films
WO2014197027A2 (en) * 2013-03-14 2014-12-11 Ndsu Research Foundation Method and apparatus for aerosol direct write printing
DE102013205683A1 (de) * 2013-03-28 2014-10-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Druckkopf, Bausatz und Druckverfahren
US10667410B2 (en) 2013-07-11 2020-05-26 Hsio Technologies, Llc Method of making a fusion bonded circuit structure
US10506722B2 (en) 2013-07-11 2019-12-10 Hsio Technologies, Llc Fusion bonded liquid crystal polymer electrical circuit structure
US9962673B2 (en) 2013-10-29 2018-05-08 Palo Alto Research Center Incorporated Methods and systems for creating aerosols
US10016777B2 (en) 2013-10-29 2018-07-10 Palo Alto Research Center Incorporated Methods and systems for creating aerosols
US10933636B2 (en) * 2013-12-06 2021-03-02 Palo Alto Research Center Incorporated Print head design for ballistic aerosol marking with smooth particulate injection from an array of inlets into a matching array of microchannels
US9527056B2 (en) 2014-05-27 2016-12-27 Palo Alto Research Center Incorporated Methods and systems for creating aerosols
US9707588B2 (en) 2014-05-27 2017-07-18 Palo Alto Research Center Incorporated Methods and systems for creating aerosols
US9757747B2 (en) 2014-05-27 2017-09-12 Palo Alto Research Center Incorporated Methods and systems for creating aerosols
US9821411B2 (en) 2014-06-20 2017-11-21 Velo3D, Inc. Apparatuses, systems and methods for three-dimensional printing
US11220737B2 (en) 2014-06-25 2022-01-11 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
EP2960059B1 (en) 2014-06-25 2018-10-24 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US11267012B2 (en) * 2014-06-25 2022-03-08 Universal Display Corporation Spatial control of vapor condensation using convection
US9878493B2 (en) 2014-12-17 2018-01-30 Palo Alto Research Center Incorporated Spray charging and discharging system for polymer spray deposition device
US9782790B2 (en) 2014-12-18 2017-10-10 Palo Alto Research Center Incorporated Devices and methods for the controlled formation and dispension of small drops of highly viscous and/or non-newtonian liquids
US10393414B2 (en) 2014-12-19 2019-08-27 Palo Alto Research Center Incorporated Flexible thermal regulation device
US9543495B2 (en) 2014-12-23 2017-01-10 Palo Alto Research Center Incorporated Method for roll-to-roll production of flexible, stretchy objects with integrated thermoelectric modules, electronics and heat dissipation
KR102444204B1 (ko) 2015-02-10 2022-09-19 옵토멕 인코포레이티드 에어로졸의 비행 중 경화에 의해 3차원 구조를 제조하는 방법
US9559447B2 (en) 2015-03-18 2017-01-31 Hsio Technologies, Llc Mechanical contact retention within an electrical connector
US9789499B2 (en) 2015-07-29 2017-10-17 Palo Alto Research Center Incorporated Filament extension atomizers
US9707577B2 (en) 2015-07-29 2017-07-18 Palo Alto Research Center Incorporated Filament extension atomizers
EP3341111B1 (en) * 2015-08-24 2020-09-30 Zeteo Tech, Inc. Coating of aerosol particles using an acoustic coater
US10566534B2 (en) 2015-10-12 2020-02-18 Universal Display Corporation Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP)
JP2018535121A (ja) 2015-11-06 2018-11-29 ヴェロ・スリー・ディー・インコーポレイテッド 熟達した3次元印刷
US10286603B2 (en) 2015-12-10 2019-05-14 Velo3D, Inc. Skillful three-dimensional printing
US9993839B2 (en) 2016-01-18 2018-06-12 Palo Alto Research Center Incorporated System and method for coating a substrate
US10500784B2 (en) 2016-01-20 2019-12-10 Palo Alto Research Center Incorporated Additive deposition system and method
US10434703B2 (en) 2016-01-20 2019-10-08 Palo Alto Research Center Incorporated Additive deposition system and method
US10252335B2 (en) 2016-02-18 2019-04-09 Vel03D, Inc. Accurate three-dimensional printing
US20190030562A1 (en) * 2016-02-26 2019-01-31 Beneq Oy Improved coating process and apparatus
EP3419764A4 (en) * 2016-02-26 2019-10-16 Beneq OY IMPROVED APPARATUS AND METHOD FOR AEROSOL COATING
JP2017225947A (ja) * 2016-06-23 2017-12-28 株式会社デンソーテン スプレー装置及びスプレー装置を用いた霧状体の噴射方法
EP3492244A1 (en) 2016-06-29 2019-06-05 VELO3D, Inc. Three-dimensional printing system and method for three-dimensional printing
US11691343B2 (en) 2016-06-29 2023-07-04 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
MX2018016002A (es) * 2016-07-15 2019-09-13 Transitions Optical Ltd Aparato y metodo para el recubrimiento de precision de lentes oftalmicos con recubrientos fotocromicos.
US9988720B2 (en) 2016-10-13 2018-06-05 Palo Alto Research Center Incorporated Charge transfer roller for use in an additive deposition system and process
US20180126650A1 (en) 2016-11-07 2018-05-10 Velo3D, Inc. Gas flow in three-dimensional printing
IT201600127393A1 (it) * 2016-12-16 2018-06-16 Miroglio Textile S R L Macchina per la stampa di immagini su tessuti, con sistema di nebulizzazione d'acqua.
US20180186080A1 (en) 2017-01-05 2018-07-05 Velo3D, Inc. Optics in three-dimensional printing
US10357829B2 (en) 2017-03-02 2019-07-23 Velo3D, Inc. Three-dimensional printing of three-dimensional objects
US20180281237A1 (en) 2017-03-28 2018-10-04 Velo3D, Inc. Material manipulation in three-dimensional printing
US10493483B2 (en) 2017-07-17 2019-12-03 Palo Alto Research Center Incorporated Central fed roller for filament extension atomizer
US10464094B2 (en) 2017-07-31 2019-11-05 Palo Alto Research Center Incorporated Pressure induced surface wetting for enhanced spreading and controlled filament size
US10562099B2 (en) * 2017-08-10 2020-02-18 Formalloy, Llc Gradient material control and programming of additive manufacturing processes
US10919215B2 (en) 2017-08-22 2021-02-16 Palo Alto Research Center Incorporated Electrostatic polymer aerosol deposition and fusing of solid particles for three-dimensional printing
CN111655382B (zh) 2017-11-13 2022-05-31 奥普托美克公司 气溶胶流的阻挡
US10272525B1 (en) 2017-12-27 2019-04-30 Velo3D, Inc. Three-dimensional printing systems and methods of their use
US10144176B1 (en) 2018-01-15 2018-12-04 Velo3D, Inc. Three-dimensional printing systems and methods of their use
DE102018103049A1 (de) 2018-02-12 2019-08-14 Karlsruher Institut für Technologie Druckkopf und Druckverfahren
JP7065357B2 (ja) * 2018-07-10 2022-05-12 パナソニックIpマネジメント株式会社 ミスト発生装置
CN109738578B (zh) * 2019-01-11 2021-06-29 李冉 一种消化内科用胃液酸性检测装置
US11454490B2 (en) 2019-04-01 2022-09-27 General Electric Company Strain sensor placement
KR20230047214A (ko) 2019-07-26 2023-04-06 벨로3디, 인크. 3차원 물체 형상화에 대한 품질 보증
KR20220071226A (ko) * 2019-09-25 2022-05-31 인테그리티드 디포지션 솔루션스, 아이엔씨 에어로졸 기반 인쇄 카트리지, 장치에서의 그 카트리지의 사용 및 그 카트리지의 사용 방법
EP4214057A1 (en) * 2020-09-21 2023-07-26 Integrated Deposition Solutions, Inc. High-definition aerosol printing using an optimized aerosol distribution and aerodynamic lens system
US20220379333A1 (en) * 2021-05-28 2022-12-01 Nissan North America, Inc. Acoustic force assisted painting system

Family Cites Families (297)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4200660A (en) * 1966-04-18 1980-04-29 Firmenich & Cie. Aromatic sulfur flavoring agents
US3474971A (en) 1967-06-14 1969-10-28 North American Rockwell Two-piece injector
US3590477A (en) * 1968-12-19 1971-07-06 Ibm Method for fabricating insulated-gate field effect transistors having controlled operating characeristics
US3808550A (en) * 1969-12-15 1974-04-30 Bell Telephone Labor Inc Apparatuses for trapping and accelerating neutral particles
US3642202A (en) * 1970-05-13 1972-02-15 Exxon Research Engineering Co Feed system for coking unit
US3808432A (en) * 1970-06-04 1974-04-30 Bell Telephone Labor Inc Neutral particle accelerator utilizing radiation pressure
US3715785A (en) * 1971-04-29 1973-02-13 Ibm Technique for fabricating integrated incandescent displays
US3846661A (en) 1971-04-29 1974-11-05 Ibm Technique for fabricating integrated incandescent displays
US3777983A (en) * 1971-12-16 1973-12-11 Gen Electric Gas cooled dual fuel air atomized fuel nozzle
US3816025A (en) * 1973-01-18 1974-06-11 Neill W O Paint spray system
US3854321A (en) 1973-04-27 1974-12-17 B Dahneke Aerosol beam device and method
US3901798A (en) 1973-11-21 1975-08-26 Environmental Research Corp Aerosol concentrator and classifier
US4036434A (en) * 1974-07-15 1977-07-19 Aerojet-General Corporation Fluid delivery nozzle with fluid purged face
US3982251A (en) 1974-08-23 1976-09-21 Ibm Corporation Method and apparatus for recording information on a recording medium
US3959798A (en) * 1974-12-31 1976-05-25 International Business Machines Corporation Selective wetting using a micromist of particles
DE2517715C2 (de) * 1975-04-22 1977-02-10 Hans Behr Verfahren und einrichtung zum mischen und/oder dispergieren und abstrahlen der komponenten eines fliessfaehigen materials zum beschichten von oberflaechen
US4019188A (en) * 1975-05-12 1977-04-19 International Business Machines Corporation Micromist jet printer
US3974769A (en) 1975-05-27 1976-08-17 International Business Machines Corporation Method and apparatus for recording information on a recording surface through the use of mists
US4004733A (en) * 1975-07-09 1977-01-25 Research Corporation Electrostatic spray nozzle system
US4016417A (en) * 1976-01-08 1977-04-05 Richard Glasscock Benton Laser beam transport, and method
US4046073A (en) 1976-01-28 1977-09-06 International Business Machines Corporation Ultrasonic transfer printing with multi-copy, color and low audible noise capability
US4046074A (en) 1976-02-02 1977-09-06 International Business Machines Corporation Non-impact printing system
US4034025A (en) * 1976-02-09 1977-07-05 Martner John G Ultrasonic gas stream liquid entrainment apparatus
US4092535A (en) * 1977-04-22 1978-05-30 Bell Telephone Laboratories, Incorporated Damping of optically levitated particles by feedback and beam shaping
US4171096A (en) 1977-05-26 1979-10-16 John Welsh Spray gun nozzle attachment
US4112437A (en) 1977-06-27 1978-09-05 Eastman Kodak Company Electrographic mist development apparatus and method
US4235563A (en) 1977-07-11 1980-11-25 The Upjohn Company Method and apparatus for feeding powder
JPS592617B2 (ja) 1977-12-22 1984-01-19 株式会社リコー インク噴射装置
US4132894A (en) * 1978-04-04 1979-01-02 The United States Of America As Represented By The United States Department Of Energy Monitor of the concentration of particles of dense radioactive materials in a stream of air
US4200669A (en) 1978-11-22 1980-04-29 The United States Of America As Represented By The Secretary Of The Navy Laser spraying
GB2052566B (en) * 1979-03-30 1982-12-15 Rolls Royce Laser aplication of hard surface alloy
US4323756A (en) * 1979-10-29 1982-04-06 United Technologies Corporation Method for fabricating articles by sequential layer deposition
JPS5948873B2 (ja) 1980-05-14 1984-11-29 ペルメレック電極株式会社 耐食性被覆を設けた電極基体又は電極の製造方法
US4453803A (en) * 1981-06-25 1984-06-12 Agency Of Industrial Science & Technology Optical waveguide for middle infrared band
US4605574A (en) 1981-09-14 1986-08-12 Takashi Yonehara Method and apparatus for forming an extremely thin film on the surface of an object
US4485387A (en) 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
US4685563A (en) 1983-05-16 1987-08-11 Michelman Inc. Packaging material and container having interlaminate electrostatic shield and method of making same
US4497692A (en) * 1983-06-13 1985-02-05 International Business Machines Corporation Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method
US4601921A (en) * 1984-12-24 1986-07-22 General Motors Corporation Method and apparatus for spraying coating material
US4694136A (en) 1986-01-23 1987-09-15 Westinghouse Electric Corp. Laser welding of a sleeve within a tube
US4689052A (en) 1986-02-19 1987-08-25 Washington Research Foundation Virtual impactor
US4823009A (en) 1986-04-14 1989-04-18 Massachusetts Institute Of Technology Ir compatible deposition surface for liquid chromatography
US4670135A (en) * 1986-06-27 1987-06-02 Regents Of The University Of Minnesota High volume virtual impactor
JPS6359195A (ja) * 1986-08-29 1988-03-15 Hitachi Ltd 磁気記録再生装置
DE3686161D1 (de) 1986-09-25 1992-08-27 Lucien Diego Laude Vorrichtung zur laserunterstuetzten, elektrolytischen metallabscheidung.
US4733018A (en) 1986-10-02 1988-03-22 Rca Corporation Thick film copper conductor inks
US4927992A (en) 1987-03-04 1990-05-22 Westinghouse Electric Corp. Energy beam casting of metal articles
US4724299A (en) 1987-04-15 1988-02-09 Quantum Laser Corporation Laser spray nozzle and method
US4904621A (en) * 1987-07-16 1990-02-27 Texas Instruments Incorporated Remote plasma generation process using a two-stage showerhead
US4893886A (en) * 1987-09-17 1990-01-16 American Telephone And Telegraph Company Non-destructive optical trap for biological particles and method of doing same
US4997809A (en) * 1987-11-18 1991-03-05 International Business Machines Corporation Fabrication of patterned lines of high Tc superconductors
US4920254A (en) 1988-02-22 1990-04-24 Sierracin Corporation Electrically conductive window and a method for its manufacture
JPH0621335B2 (ja) 1988-02-24 1994-03-23 工業技術院長 レ−ザ溶射法
US4895735A (en) 1988-03-01 1990-01-23 Texas Instruments Incorporated Radiation induced pattern deposition
US4917830A (en) 1988-09-19 1990-04-17 The United States Of America As Represented By The United States Department Of Energy Monodisperse aerosol generator
US4971251A (en) 1988-11-28 1990-11-20 Minnesota Mining And Manufacturing Company Spray gun with disposable liquid handling portion
US6056994A (en) 1988-12-27 2000-05-02 Symetrix Corporation Liquid deposition methods of fabricating layered superlattice materials
US5614252A (en) * 1988-12-27 1997-03-25 Symetrix Corporation Method of fabricating barium strontium titanate
US4911365A (en) * 1989-01-26 1990-03-27 James E. Hynds Spray gun having a fanning air turbine mechanism
US5043548A (en) 1989-02-08 1991-08-27 General Electric Company Axial flow laser plasma spraying
US5038014A (en) 1989-02-08 1991-08-06 General Electric Company Fabrication of components by layered deposition
US5064685A (en) 1989-08-23 1991-11-12 At&T Laboratories Electrical conductor deposition method
US5017317A (en) 1989-12-04 1991-05-21 Board Of Regents, The Uni. Of Texas System Gas phase selective beam deposition
US5032850A (en) * 1989-12-18 1991-07-16 Tokyo Electric Co., Ltd. Method and apparatus for vapor jet printing
US4978067A (en) 1989-12-22 1990-12-18 Sono-Tek Corporation Unitary axial flow tube ultrasonic atomizer with enhanced sealing
DE4000690A1 (de) 1990-01-12 1991-07-18 Philips Patentverwaltung Verfahren zum herstellen von ultrafeinen partikeln und deren verwendung
DE69130184T2 (de) 1990-02-23 1999-02-11 Fuji Photo Film Co Ltd Verfahren zur Herstellung mehrschichtiger Beschichtungen
DE4006511A1 (de) 1990-03-02 1991-09-05 Krupp Gmbh Einrichtung zum zufuehren pulverfoermiger zusatzwerkstoffe in den bereich einer schweissstelle
US5176328A (en) 1990-03-13 1993-01-05 The Board Of Regents Of The University Of Nebraska Apparatus for forming fin particles
US5126102A (en) 1990-03-15 1992-06-30 Kabushiki Kaisha Toshiba Fabricating method of composite material
CN2078199U (zh) 1990-06-15 1991-06-05 蒋隽 多用途便携式超声雾化器
US5152462A (en) 1990-08-10 1992-10-06 Roussel Uclaf Spray system
JPH04120259A (ja) * 1990-09-10 1992-04-21 Agency Of Ind Science & Technol レーザ溶射法による機器・部材の製造方法および装置
FR2667811B1 (fr) * 1990-10-10 1992-12-04 Snecma Dispositif d'apport de poudre pour revetement par traitement au faisceau laser.
US5245404A (en) 1990-10-18 1993-09-14 Physical Optics Corportion Raman sensor
US5170890A (en) 1990-12-05 1992-12-15 Wilson Steven D Particle trap
EP0498286B1 (de) 1991-02-02 1995-01-11 FRIEDRICH THEYSOHN GmbH Verfahren zur Erzeugung einer verschleissmindernden Schicht
CA2061069C (en) * 1991-02-27 1999-06-29 Toshio Kubota Method of electrostatically spray-coating a workpiece with paint
US5292418A (en) * 1991-03-08 1994-03-08 Mitsubishi Denki Kabushiki Kaisha Local laser plating apparatus
US5173220A (en) 1991-04-26 1992-12-22 Motorola, Inc. Method of manufacturing a three-dimensional plastic article
US5176744A (en) * 1991-08-09 1993-01-05 Microelectronics Computer & Technology Corp. Solution for direct copper writing
US5164535A (en) 1991-09-05 1992-11-17 Silent Options, Inc. Gun silencer
US5314003A (en) 1991-12-24 1994-05-24 Microelectronics And Computer Technology Corporation Three-dimensional metal fabrication using a laser
FR2685922B1 (fr) 1992-01-07 1995-03-24 Strasbourg Elec Buse coaxiale de traitement superficiel sous irradiation laser, avec apport de materiaux sous forme de poudre.
US5495105A (en) * 1992-02-20 1996-02-27 Canon Kabushiki Kaisha Method and apparatus for particle manipulation, and measuring apparatus utilizing the same
US5194297A (en) * 1992-03-04 1993-03-16 Vlsi Standards, Inc. System and method for accurately depositing particles on a surface
US5378508A (en) * 1992-04-01 1995-01-03 Akzo Nobel N.V. Laser direct writing
JPH05283708A (ja) 1992-04-02 1993-10-29 Mitsubishi Electric Corp 不揮発性半導体記憶装置,その製造方法および試験方法
JPH07508923A (ja) 1992-07-08 1995-10-05 ノードソン コーポレーション 分離した泡状被覆物を塗布する装置及び方法
US5335000A (en) 1992-08-04 1994-08-02 Calcomp Inc. Ink vapor aerosol pen for pen plotters
US5294459A (en) 1992-08-27 1994-03-15 Nordson Corporation Air assisted apparatus and method for selective coating
IL107120A (en) 1992-09-29 1997-09-30 Boehringer Ingelheim Int Atomising nozzle and filter and spray generating device
US5344676A (en) 1992-10-23 1994-09-06 The Board Of Trustees Of The University Of Illinois Method and apparatus for producing nanodrops and nanoparticles and thin film deposits therefrom
US5322221A (en) * 1992-11-09 1994-06-21 Graco Inc. Air nozzle
US5775402A (en) 1995-10-31 1998-07-07 Massachusetts Institute Of Technology Enhancement of thermal properties of tooling made by solid free form fabrication techniques
US5449536A (en) 1992-12-18 1995-09-12 United Technologies Corporation Method for the application of coatings of oxide dispersion strengthened metals by laser powder injection
US5529634A (en) 1992-12-28 1996-06-25 Kabushiki Kaisha Toshiba Apparatus and method of manufacturing semiconductor device
US5359172A (en) 1992-12-30 1994-10-25 Westinghouse Electric Corporation Direct tube repair by laser welding
US5270542A (en) 1992-12-31 1993-12-14 Regents Of The University Of Minnesota Apparatus and method for shaping and detecting a particle beam
US5425802A (en) * 1993-05-05 1995-06-20 The United States Of American As Represented By The Administrator Of Environmental Protection Agency Virtual impactor for removing particles from an airstream and method for using same
US5366559A (en) 1993-05-27 1994-11-22 Research Triangle Institute Method for protecting a substrate surface from contamination using the photophoretic effect
US5733609A (en) * 1993-06-01 1998-03-31 Wang; Liang Ceramic coatings synthesized by chemical reactions energized by laser plasmas
IL106803A (en) 1993-08-25 1998-02-08 Scitex Corp Ltd Printable inkjet head
US5398193B1 (en) 1993-08-20 1997-09-16 Alfredo O Deangelis Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
US5491317A (en) 1993-09-13 1996-02-13 Westinghouse Electric Corporation System and method for laser welding an inner surface of a tubular member
US5403617A (en) * 1993-09-15 1995-04-04 Mobium Enterprises Corporation Hybrid pulsed valve for thin film coating and method
US5736195A (en) * 1993-09-15 1998-04-07 Mobium Enterprises Corporation Method of coating a thin film on a substrate
US5518680A (en) 1993-10-18 1996-05-21 Massachusetts Institute Of Technology Tissue regeneration matrices by solid free form fabrication techniques
US5554415A (en) * 1994-01-18 1996-09-10 Qqc, Inc. Substrate coating techniques, including fabricating materials on a surface of a substrate
US5477026A (en) 1994-01-27 1995-12-19 Chromalloy Gas Turbine Corporation Laser/powdered metal cladding nozzle
US5512745A (en) * 1994-03-09 1996-04-30 Board Of Trustees Of The Leland Stanford Jr. University Optical trap system and method
DE69513482T2 (de) 1994-04-25 2000-05-18 Koninkl Philips Electronics Nv Verfahren zum aushärten eines filmes
US5609921A (en) * 1994-08-26 1997-03-11 Universite De Sherbrooke Suspension plasma spray
FR2724853B1 (fr) 1994-09-27 1996-12-20 Saint Gobain Vitrage Dispositif de distribution de solides pulverulents a la surface d'un substrat en vue d'y deposer un revetement
US5732885A (en) * 1994-10-07 1998-03-31 Spraying Systems Co. Internal mix air atomizing spray nozzle
US5486676A (en) * 1994-11-14 1996-01-23 General Electric Company Coaxial single point powder feed nozzle
US5541006A (en) 1994-12-23 1996-07-30 Kennametal Inc. Method of making composite cermet articles and the articles
US5861136A (en) * 1995-01-10 1999-01-19 E. I. Du Pont De Nemours And Company Method for making copper I oxide powders by aerosol decomposition
US5770272A (en) * 1995-04-28 1998-06-23 Massachusetts Institute Of Technology Matrix-bearing targets for maldi mass spectrometry and methods of production thereof
US5814152A (en) 1995-05-23 1998-09-29 Mcdonnell Douglas Corporation Apparatus for coating a substrate
US5612099A (en) * 1995-05-23 1997-03-18 Mcdonnell Douglas Corporation Method and apparatus for coating a substrate
TW284907B (en) 1995-06-07 1996-09-01 Cauldron Lp Removal of material by polarized irradiation and back side application for radiation
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
GB9515439D0 (en) 1995-07-27 1995-09-27 Isis Innovation Method of producing metal quantum dots
KR100479485B1 (ko) 1995-08-04 2005-09-07 마이크로코팅 테크놀로지, 인크. 근초임계및초임계유동용액의열적분무를이용한화학증착및분말형성
US5779833A (en) 1995-08-04 1998-07-14 Case Western Reserve University Method for constructing three dimensional bodies from laminations
US5837960A (en) 1995-08-14 1998-11-17 The Regents Of The University Of California Laser production of articles from powders
US5746844A (en) 1995-09-08 1998-05-05 Aeroquip Corporation Method and apparatus for creating a free-form three-dimensional article using a layer-by-layer deposition of molten metal and using a stress-reducing annealing process on the deposited metal
US5607730A (en) 1995-09-11 1997-03-04 Clover Industries, Inc. Method and apparatus for laser coating
US5653925A (en) 1995-09-26 1997-08-05 Stratasys, Inc. Method for controlled porosity three-dimensional modeling
CA2240625A1 (en) 1995-12-14 1997-06-19 Imperial College Of Science, Technology & Medicine Film or coating deposition and powder formation
US6015083A (en) * 1995-12-29 2000-01-18 Microfab Technologies, Inc. Direct solder bumping of hard to solder substrate
US5772106A (en) * 1995-12-29 1998-06-30 Microfab Technologies, Inc. Printhead for liquid metals and method of use
US5993549A (en) 1996-01-19 1999-11-30 Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.V. Powder coating apparatus
US5676719A (en) 1996-02-01 1997-10-14 Engineering Resources, Inc. Universal insert for use with radiator steam traps
US5772964A (en) 1996-02-08 1998-06-30 Lab Connections, Inc. Nozzle arrangement for collecting components from a fluid for analysis
CN1093783C (zh) 1996-02-21 2002-11-06 松下电器产业株式会社 液体喷涂喷嘴和液体喷涂喷嘴的制造方法
US5705117A (en) 1996-03-01 1998-01-06 Delco Electronics Corporaiton Method of combining metal and ceramic inserts into stereolithography components
CN1137285C (zh) * 1997-04-30 2004-02-04 高松研究所 金属糊和金属膜的制造方法
US5844192A (en) 1996-05-09 1998-12-01 United Technologies Corporation Thermal spray coating method and apparatus
US6116184A (en) 1996-05-21 2000-09-12 Symetrix Corporation Method and apparatus for misted liquid source deposition of thin film with reduced mist particle size
US5854311A (en) 1996-06-24 1998-12-29 Richart; Douglas S. Process and apparatus for the preparation of fine powders
US6046426A (en) 1996-07-08 2000-04-04 Sandia Corporation Method and system for producing complex-shape objects
EP0910775A4 (en) * 1996-07-08 2002-05-02 Corning Inc SPRAYING DEVICE SUPPORTED BY GAS
US5772963A (en) 1996-07-30 1998-06-30 Bayer Corporation Analytical instrument having a control area network and distributed logic nodes
US6544599B1 (en) * 1996-07-31 2003-04-08 Univ Arkansas Process and apparatus for applying charged particles to a substrate, process for forming a layer on a substrate, products made therefrom
US5707715A (en) 1996-08-29 1998-01-13 L. Pierre deRochemont Metal ceramic composites with improved interfacial properties and methods to make such composites
JP3867176B2 (ja) 1996-09-24 2007-01-10 アール・アイ・ディー株式会社 粉体質量流量測定装置、およびこれを適用した静電粉体塗装装置
US6143116A (en) 1996-09-26 2000-11-07 Kyocera Corporation Process for producing a multi-layer wiring board
US5742050A (en) * 1996-09-30 1998-04-21 Aviv Amirav Method and apparatus for sample introduction into a mass spectrometer for improving a sample analysis
US6144008A (en) 1996-11-22 2000-11-07 Rabinovich; Joshua E. Rapid manufacturing system for metal, metal matrix composite materials and ceramics
US5578227A (en) 1996-11-22 1996-11-26 Rabinovich; Joshua E. Rapid prototyping system
EP1012871A1 (en) 1997-01-03 2000-06-28 MDS Inc. Spray chamber with dryer
US6379745B1 (en) * 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
US6699304B1 (en) 1997-02-24 2004-03-02 Superior Micropowders, Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
IT1290428B1 (it) * 1997-03-21 1998-12-03 Ausimont Spa Grassi fluorurati
US5894403A (en) * 1997-05-01 1999-04-13 Wilson Greatbatch Ltd. Ultrasonically coated substrate for use in a capacitor
US5849238A (en) 1997-06-26 1998-12-15 Ut Automotive Dearborn, Inc. Helical conformal channels for solid freeform fabrication and tooling applications
US6952504B2 (en) * 2001-12-21 2005-10-04 Neophotonics Corporation Three dimensional engineering of planar optical structures
US6391494B2 (en) * 1999-05-13 2002-05-21 Nanogram Corporation Metal vanadium oxide particles
US6890624B1 (en) * 2000-04-25 2005-05-10 Nanogram Corporation Self-assembled structures
US5847357A (en) 1997-08-25 1998-12-08 General Electric Company Laser-assisted material spray processing
US6021776A (en) * 1997-09-09 2000-02-08 Intertex Research, Inc. Disposable atomizer device with trigger valve system
US6548122B1 (en) * 1997-09-16 2003-04-15 Sri International Method of producing and depositing a metal film
US5980998A (en) 1997-09-16 1999-11-09 Sri International Deposition of substances on a surface
EP1027723B1 (en) * 1997-10-14 2009-06-17 Patterning Technologies Limited Method of forming an electric capacitor
US6007631A (en) 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
US5993416A (en) 1998-01-15 1999-11-30 Medtronic Ave, Inc. Method and apparatus for regulating the fluid flow rate to and preventing over-pressurization of a balloon catheter
US5993554A (en) 1998-01-22 1999-11-30 Optemec Design Company Multiple beams and nozzles to increase deposition rate
US20050097987A1 (en) 1998-02-24 2005-05-12 Cabot Corporation Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same
US6349668B1 (en) * 1998-04-27 2002-02-26 Msp Corporation Method and apparatus for thin film deposition on large area substrates
CA2320296A1 (en) * 1998-05-18 1999-11-25 University Of Washington Liquid analysis cartridge
DE19822674A1 (de) 1998-05-20 1999-12-09 Gsf Forschungszentrum Umwelt Gaseinlaß für eine Ionenquelle
DE19822672B4 (de) * 1998-05-20 2005-11-10 GSF - Forschungszentrum für Umwelt und Gesundheit GmbH Verfahren und Vorrichtung zur Erzeugung eines gerichteten Gasstrahls
FR2780170B1 (fr) * 1998-06-19 2000-08-11 Aerospatiale Dispositif autonome de limitation du debit d'un fluide dans une canalisation et circuit de carburant pour aeronef comportant un tel dispositif
US6410105B1 (en) 1998-06-30 2002-06-25 Jyoti Mazumder Production of overhang, undercut, and cavity structures using direct metal depostion
US6159749A (en) 1998-07-21 2000-12-12 Beckman Coulter, Inc. Highly sensitive bead-based multi-analyte assay system using optical tweezers
US6149076A (en) 1998-08-05 2000-11-21 Nordson Corporation Dispensing apparatus having nozzle for controlling heated liquid discharge with unheated pressurized air
KR100271208B1 (ko) * 1998-08-13 2000-12-01 윤덕용 선택적 용침공정을 이용한 쾌속조형방법및 쾌속조형장치
US7347850B2 (en) * 1998-08-14 2008-03-25 Incept Llc Adhesion barriers applicable by minimally invasive surgery and methods of use thereof
US7098163B2 (en) 1998-08-27 2006-08-29 Cabot Corporation Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
DE19841401C2 (de) 1998-09-10 2000-09-21 Lechler Gmbh & Co Kg Zweistoff-Flachstrahldüse
US6340216B1 (en) * 1998-09-30 2002-01-22 Xerox Corporation Ballistic aerosol marking apparatus for treating a substrate
US7294366B2 (en) * 1998-09-30 2007-11-13 Optomec Design Company Laser processing for heat-sensitive mesoscale deposition
US6265050B1 (en) 1998-09-30 2001-07-24 Xerox Corporation Organic overcoat for electrode grid
US6467862B1 (en) 1998-09-30 2002-10-22 Xerox Corporation Cartridge for use in a ballistic aerosol marking apparatus
US6116718A (en) 1998-09-30 2000-09-12 Xerox Corporation Print head for use in a ballistic aerosol marking apparatus
US6291088B1 (en) 1998-09-30 2001-09-18 Xerox Corporation Inorganic overcoat for particulate transport electrode grid
US6290342B1 (en) 1998-09-30 2001-09-18 Xerox Corporation Particulate marking material transport apparatus utilizing traveling electrostatic waves
US6511149B1 (en) 1998-09-30 2003-01-28 Xerox Corporation Ballistic aerosol marking apparatus for marking a substrate
US20050156991A1 (en) 1998-09-30 2005-07-21 Optomec Design Company Maskless direct write of copper using an annular aerosol jet
US6251488B1 (en) 1999-05-05 2001-06-26 Optomec Design Company Precision spray processes for direct write electronic components
US6454384B1 (en) 1998-09-30 2002-09-24 Xerox Corporation Method for marking with a liquid material using a ballistic aerosol marking apparatus
US7045015B2 (en) * 1998-09-30 2006-05-16 Optomec Design Company Apparatuses and method for maskless mesoscale material deposition
US6416156B1 (en) 1998-09-30 2002-07-09 Xerox Corporation Kinetic fusing of a marking material
US6416157B1 (en) 1998-09-30 2002-07-09 Xerox Corporation Method of marking a substrate employing a ballistic aerosol marking apparatus
US20040197493A1 (en) 1998-09-30 2004-10-07 Optomec Design Company Apparatus, methods and precision spray processes for direct write and maskless mesoscale material deposition
US7938079B2 (en) * 1998-09-30 2011-05-10 Optomec Design Company Annular aerosol jet deposition using an extended nozzle
JP2002528744A (ja) 1998-09-30 2002-09-03 ボード・オブ・コントロール・オブ・ミシガン・テクノロジカル・ユニバーシティ 非原子粒子のレーザガイドされる操作
US8110247B2 (en) * 1998-09-30 2012-02-07 Optomec Design Company Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials
US6136442A (en) 1998-09-30 2000-10-24 Xerox Corporation Multi-layer organic overcoat for particulate transport electrode grid
US7108894B2 (en) * 1998-09-30 2006-09-19 Optomec Design Company Direct Write™ System
US20030020768A1 (en) * 1998-09-30 2003-01-30 Renn Michael J. Direct write TM system
US6636676B1 (en) 1998-09-30 2003-10-21 Optomec Design Company Particle guidance system
US6151435A (en) 1998-11-01 2000-11-21 The United States Of America As Represented By The Secretary Of The Navy Evanescent atom guiding in metal-coated hollow-core optical fibers
US6001304A (en) 1998-12-31 1999-12-14 Materials Modification, Inc. Method of bonding a particle material to near theoretical density
JP2000238270A (ja) * 1998-12-22 2000-09-05 Canon Inc インクジェット記録ヘッド及びインクジェット記録ヘッドの製造方法
US6280302B1 (en) 1999-03-24 2001-08-28 Flow International Corporation Method and apparatus for fluid jet formation
DE19913451C2 (de) 1999-03-25 2001-11-22 Gsf Forschungszentrum Umwelt Gaseinlaß zur Erzeugung eines gerichteten und gekühlten Gasstrahls
US6573491B1 (en) * 1999-05-17 2003-06-03 Rock Mountain Biosystems, Inc. Electromagnetic energy driven separation methods
US6405095B1 (en) 1999-05-25 2002-06-11 Nanotek Instruments, Inc. Rapid prototyping and tooling system
US6520996B1 (en) 1999-06-04 2003-02-18 Depuy Acromed, Incorporated Orthopedic implant
US20020128714A1 (en) 1999-06-04 2002-09-12 Mark Manasas Orthopedic implant and method of making metal articles
US6267301B1 (en) * 1999-06-11 2001-07-31 Spraying Systems Co. Air atomizing nozzle assembly with improved air cap
US6811744B2 (en) 1999-07-07 2004-11-02 Optomec Design Company Forming structures from CAD solid models
AU6747100A (en) 1999-07-07 2001-01-22 Optomec Design Company Method for providing features enabling thermal management in complex three-dimensional structures
US6391251B1 (en) 1999-07-07 2002-05-21 Optomec Design Company Forming structures from CAD solid models
US20060003095A1 (en) 1999-07-07 2006-01-05 Optomec Design Company Greater angle and overhanging materials deposition
US6348687B1 (en) * 1999-09-10 2002-02-19 Sandia Corporation Aerodynamic beam generator for large particles
US6293659B1 (en) 1999-09-30 2001-09-25 Xerox Corporation Particulate source, circulation, and valving system for ballistic aerosol marking
US6328026B1 (en) 1999-10-13 2001-12-11 The University Of Tennessee Research Corporation Method for increasing wear resistance in an engine cylinder bore and improved automotive engine
US6486432B1 (en) 1999-11-23 2002-11-26 Spirex Method and laser cladding of plasticating barrels
US6318642B1 (en) 1999-12-22 2001-11-20 Visteon Global Tech., Inc Nozzle assembly
KR20010063781A (ko) 1999-12-24 2001-07-09 박종섭 반도체소자의 제조방법
US6423366B2 (en) 2000-02-16 2002-07-23 Roll Coater, Inc. Strip coating method
US6564038B1 (en) 2000-02-23 2003-05-13 Lucent Technologies Inc. Method and apparatus for suppressing interference using active shielding techniques
US6384365B1 (en) * 2000-04-14 2002-05-07 Siemens Westinghouse Power Corporation Repair and fabrication of combustion turbine components by spark plasma sintering
AU5273401A (en) 2000-04-18 2001-11-12 Kang-Ho Ahn Apparatus for manufacturing ultra-fine particles using electrospray device and method thereof
US20020063117A1 (en) * 2000-04-19 2002-05-30 Church Kenneth H. Laser sintering of materials and a thermal barrier for protecting a substrate
US6572033B1 (en) 2000-05-15 2003-06-03 Nordson Corporation Module for dispensing controlled patterns of liquid material and a nozzle having an asymmetric liquid discharge orifice
JP4380962B2 (ja) 2000-05-24 2009-12-09 シルバーブルック リサーチ ピーティワイ リミテッド インクジェットプリントヘッドの製造方法
US6521297B2 (en) * 2000-06-01 2003-02-18 Xerox Corporation Marking material and ballistic aerosol marking process for the use thereof
US6576861B2 (en) * 2000-07-25 2003-06-10 The Research Foundation Of State University Of New York Method and apparatus for fine feature spray deposition
US20020082741A1 (en) 2000-07-27 2002-06-27 Jyoti Mazumder Fabrication of biomedical implants using direct metal deposition
US6416389B1 (en) 2000-07-28 2002-07-09 Xerox Corporation Process for roughening a surface
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
JP3947374B2 (ja) 2000-08-25 2007-07-18 エーエスエムエル ネザーランズ ビー.ブイ. 平板投影装置および素子製造方法
ATE525730T1 (de) 2000-10-25 2011-10-15 Harima Chemicals Inc Elektroleitfähige metallpaste und verfahren zu ihrer herstellung
EP1215705A3 (en) 2000-12-12 2003-05-21 Nisshinbo Industries, Inc. Transparent electromagnetic radiation shielding material
US6607597B2 (en) 2001-01-30 2003-08-19 Msp Corporation Method and apparatus for deposition of particles on surfaces
US6471327B2 (en) 2001-02-27 2002-10-29 Eastman Kodak Company Apparatus and method of delivering a focused beam of a thermodynamically stable/metastable mixture of a functional material in a dense fluid onto a receiver
US6657213B2 (en) 2001-05-03 2003-12-02 Northrop Grumman Corporation High temperature EUV source nozzle
EP1258293A3 (de) 2001-05-16 2003-06-18 Roberit Ag Vorrichtung zum Spritzen einer Mehrkomponentenmischung
US6811805B2 (en) 2001-05-30 2004-11-02 Novatis Ag Method for applying a coating
JP2003011100A (ja) * 2001-06-27 2003-01-15 Matsushita Electric Ind Co Ltd ガス流中のナノ粒子の堆積方法、並びに表面修飾方法
US6998785B1 (en) * 2001-07-13 2006-02-14 University Of Central Florida Research Foundation, Inc. Liquid-jet/liquid droplet initiated plasma discharge for generating useful plasma radiation
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20030108664A1 (en) 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US6598954B1 (en) 2002-01-09 2003-07-29 Xerox Corporation Apparatus and process ballistic aerosol marking
EP1468266A4 (en) 2002-01-22 2009-03-11 Beckman Coulter Inc ENVIRONMENTALLY COMPLETED SYSTEM FOR A FLOW CYTOMETER
US6593540B1 (en) 2002-02-08 2003-07-15 Honeywell International, Inc. Hand held powder-fed laser fusion welding torch
US20040029706A1 (en) * 2002-02-14 2004-02-12 Barrera Enrique V. Fabrication of reinforced composite material comprising carbon nanotubes, fullerenes, and vapor-grown carbon fibers for thermal barrier materials, structural ceramics, and multifunctional nanocomposite ceramics
CA2374338A1 (en) 2002-03-01 2003-09-01 Ignis Innovations Inc. Fabrication method for large area mechanically flexible circuits and displays
US6705703B2 (en) 2002-04-24 2004-03-16 Hewlett-Packard Development Company, L.P. Determination of control points for construction of first color space-to-second color space look-up table
US7601406B2 (en) 2002-06-13 2009-10-13 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7736693B2 (en) 2002-06-13 2010-06-15 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7566360B2 (en) 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
JP4388263B2 (ja) * 2002-09-11 2009-12-24 日鉱金属株式会社 珪化鉄スパッタリングターゲット及びその製造方法
US7067867B2 (en) 2002-09-30 2006-06-27 Nanosys, Inc. Large-area nonenabled macroelectronic substrates and uses therefor
US20040080917A1 (en) 2002-10-23 2004-04-29 Steddom Clark Morrison Integrated microwave package and the process for making the same
US20040185388A1 (en) 2003-01-29 2004-09-23 Hiroyuki Hirai Printed circuit board, method for producing same, and ink therefor
US20040151978A1 (en) 2003-01-30 2004-08-05 Huang Wen C. Method and apparatus for direct-write of functional materials with a controlled orientation
US6921626B2 (en) 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7009137B2 (en) 2003-03-27 2006-03-07 Honeywell International, Inc. Laser powder fusion repair of Z-notches with nickel based superalloy powder
US7579251B2 (en) 2003-05-15 2009-08-25 Fujitsu Limited Aerosol deposition process
WO2004112151A2 (en) 2003-06-12 2004-12-23 Patterning Technologies Limited Transparent conducting structures and methods of production thereof
US6855631B2 (en) 2003-07-03 2005-02-15 Micron Technology, Inc. Methods of forming via plugs using an aerosol stream of particles to deposit conductive materials
US20050002818A1 (en) * 2003-07-04 2005-01-06 Hitachi Powdered Metals Co., Ltd. Production method for sintered metal-ceramic layered compact and production method for thermal stress relief pad
JP2007507114A (ja) 2003-09-26 2007-03-22 オプトメック・デザイン・カンパニー 感熱性中規模デポジションのレーザ処理
DE602004016440D1 (de) 2003-11-06 2008-10-23 Rohm & Haas Elect Mat Optischer Gegenstand mit leitender Struktur
US20050147749A1 (en) 2004-01-05 2005-07-07 Msp Corporation High-performance vaporizer for liquid-precursor and multi-liquid-precursor vaporization in semiconductor thin film deposition
US20050184328A1 (en) 2004-02-19 2005-08-25 Matsushita Electric Industrial Co., Ltd. Semiconductor device and its manufacturing method
JP4593947B2 (ja) 2004-03-19 2010-12-08 キヤノン株式会社 成膜装置および成膜方法
US20050205415A1 (en) 2004-03-19 2005-09-22 Belousov Igor V Multi-component deposition
US7220456B2 (en) 2004-03-31 2007-05-22 Eastman Kodak Company Process for the selective deposition of particulate material
WO2005095005A1 (en) 2004-03-31 2005-10-13 Eastman Kodak Company Deposition of uniform layer of particulate material
CA2463409A1 (en) 2004-04-02 2005-10-02 Servo-Robot Inc. Intelligent laser joining head
EP1625893A1 (en) 2004-08-10 2006-02-15 Konica Minolta Photo Imaging, Inc. Spray coating method, spray coating device and inkjet recording sheet
US7129567B2 (en) 2004-08-31 2006-10-31 Micron Technology, Inc. Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
US7575999B2 (en) 2004-09-01 2009-08-18 Micron Technology, Inc. Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
US7235431B2 (en) 2004-09-02 2007-06-26 Micron Technology, Inc. Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
US20060280866A1 (en) * 2004-10-13 2006-12-14 Optomec Design Company Method and apparatus for mesoscale deposition of biological materials and biomaterials
US7938341B2 (en) 2004-12-13 2011-05-10 Optomec Design Company Miniature aerosol jet and aerosol jet array
US20080013299A1 (en) * 2004-12-13 2008-01-17 Optomec, Inc. Direct Patterning for EMI Shielding and Interconnects Using Miniature Aerosol Jet and Aerosol Jet Array
US7674671B2 (en) 2004-12-13 2010-03-09 Optomec Design Company Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
WO2006076603A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electrical conductors
US7178380B2 (en) 2005-01-24 2007-02-20 Joseph Gerard Birmingham Virtual impactor device with reduced fouling
US7393559B2 (en) 2005-02-01 2008-07-01 The Regents Of The University Of California Methods for production of FGM net shaped body for various applications
US8715772B2 (en) * 2005-04-12 2014-05-06 Air Products And Chemicals, Inc. Thermal deposition coating method
ES2340001T3 (es) 2005-11-21 2010-05-27 Mannkind Corporation Aparato y procedimiento de dispensacion y deteccion de polvo.
US20070154634A1 (en) 2005-12-15 2007-07-05 Optomec Design Company Method and Apparatus for Low-Temperature Plasma Sintering
WO2007122684A1 (ja) 2006-04-14 2007-11-01 Hitachi Metals, Ltd. 低酸素金属粉末の製造方法
DE102007017032B4 (de) 2007-04-11 2011-09-22 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zur Herstellung von flächigen Größen- oder Abstandsvariationen in Mustern von Nanostrukturen auf Oberflächen
TWI482662B (zh) 2007-08-30 2015-05-01 Optomec Inc 機械上一體式及緊密式耦合之列印頭以及噴霧源
TWI538737B (zh) * 2007-08-31 2016-06-21 阿普托麥克股份有限公司 材料沉積總成
TW200918325A (en) * 2007-08-31 2009-05-01 Optomec Inc AEROSOL JET® printing system for photovoltaic applications

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103946345B (zh) * 2011-10-28 2017-05-17 蓝宝石能源公司 升级藻油及其产品的工艺
CN103946345A (zh) * 2011-10-28 2014-07-23 蓝宝石能源公司 升级藻油及其产品的工艺
CN104802401B (zh) * 2014-01-28 2019-12-10 帕洛阿尔托研究中心公司 聚合物喷洒沉积方法及系统
CN104802401A (zh) * 2014-01-28 2015-07-29 帕洛阿尔托研究中心公司 聚合物喷洒沉积方法及系统
TWI649128B (zh) * 2014-01-28 2019-02-01 美商帕洛阿爾托研究中心公司 聚合物噴灑沉積系統
CN103846171B (zh) * 2014-02-18 2016-05-11 厦门大学 一种静电喷雾装置
CN103846171A (zh) * 2014-02-18 2014-06-11 厦门大学 一种静电喷雾装置
CN104588226A (zh) * 2015-02-13 2015-05-06 北京京诚之星科技开发有限公司 一种线源电极静电粉末喷涂器
CN106256447A (zh) * 2015-12-10 2016-12-28 耘创九州智能装备有限公司 字符选择气控装置以及字符选择的气控方法
CN106256447B (zh) * 2015-12-10 2018-09-21 耘创九州智能装备有限公司 字符选择气控装置以及字符选择的气控方法
CN113498363A (zh) * 2019-01-17 2021-10-12 Vs粒子控股有限公司 转换装置、包括转换装置的沉积装置、用于转换流体流的方法以及用于将颗粒沉积到基板上的方法
CN113498363B (zh) * 2019-01-17 2024-01-23 Vs粒子控股有限公司 转换装置、包括转换装置的沉积装置、用于转换流体流的方法以及用于将颗粒沉积到基板上的方法
CN112519417A (zh) * 2020-11-28 2021-03-19 厦门理工学院 一种双鞘气气溶胶喷印方法及喷印头
CN112519417B (zh) * 2020-11-28 2022-03-29 厦门理工学院 一种双鞘气气溶胶喷印方法及喷印头
CN113245102A (zh) * 2021-06-07 2021-08-13 苏州微知电子科技有限公司 一种纤维器件喷涂机
CN113245102B (zh) * 2021-06-07 2022-02-25 苏州微知电子科技有限公司 一种纤维器件喷涂机

Also Published As

Publication number Publication date
WO2009029942A3 (en) 2009-05-07
US8272579B2 (en) 2012-09-25
KR101616067B1 (ko) 2016-04-28
US9114409B2 (en) 2015-08-25
TW200918170A (en) 2009-05-01
KR20100067093A (ko) 2010-06-18
CN101842165B (zh) 2013-06-19
KR101594584B1 (ko) 2016-02-26
US20130029032A1 (en) 2013-01-31
JP2010537812A (ja) 2010-12-09
TWI482662B (zh) 2015-05-01
WO2009029942A2 (en) 2009-03-05
US20090061089A1 (en) 2009-03-05
KR20150027847A (ko) 2015-03-12

Similar Documents

Publication Publication Date Title
CN101842165B (zh) 机械整合并且紧密连接的印刷头和烟雾源
US6409839B1 (en) Method and apparatus for vapor generation and film deposition
CN101896642B (zh) 一种用于淀积材料的方法和设备
US5390864A (en) Apparatus for forming fine particles
CA2314918A1 (en) Device and method for creating dry particles
JP2002508250A (ja) 均一なサイズの球状微粒子を生成するデバイスおよび方法
EP2195055B1 (en) Ultrasonic atomizing nozzle with variable fan-spray feature
CN110461373A (zh) 用于将流体组合物向上分配到空气中的微流体递送装置和方法
US20130071551A1 (en) Coating method and apparatus
EP1358004B1 (en) Method and apparatus for production of droplets
CN105555414A (zh) 固相粉末涂敷装置及涂敷方法
AU2002217410A1 (en) Method and apparatus for production of droplets
WO1998055668A1 (en) Method and apparatus for vapor generation and film deposition
CN217963114U (zh) 一种模块化质谱基质喷涂装置
US9844791B2 (en) Micronozzle atomizers and methods of manufacture and use
KR20160095339A (ko) 스프레이 코팅유닛 및 이를 이용한 코팅시스템
KR100929866B1 (ko) 정전분무 기화기
CN214431758U (zh) 一种滤棒增塑剂喷涂装置
CN210458362U (zh) 用于化学气相沉积反应的供气系统
CN115301466A (zh) 一种模块化质谱基质喷涂装置及方法
WO2023194572A1 (en) Improved atomizer for plasma coating apparatus
KR20090032427A (ko) 정전분무 기화기

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant