CN101835831B - 高介电常数的热塑性组合物、制备其的方法以及包含其的制品 - Google Patents
高介电常数的热塑性组合物、制备其的方法以及包含其的制品 Download PDFInfo
- Publication number
- CN101835831B CN101835831B CN200880112374.5A CN200880112374A CN101835831B CN 101835831 B CN101835831 B CN 101835831B CN 200880112374 A CN200880112374 A CN 200880112374A CN 101835831 B CN101835831 B CN 101835831B
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- CN
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- Prior art keywords
- composition
- dielectric filler
- fibre
- thermoplastic polymer
- fiber
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
配混机类型(TEM-37BS) | 单位 | 值 |
机筒尺寸 | mm | 1500 |
模头 | mm | 4 |
区段1温度 | ℃ | 50 |
区段2温度 | ℃ | 150 |
区段3温度 | ℃ | 280 |
区段4温度 | ℃ | 280 |
区段5温度 | ℃ | 270 |
区段6温度 | ℃ | 280 |
区段7温度 | ℃ | 280 |
区段8温度 | ℃ | 290 |
区段9温度 | ℃ | 290 |
区段10温度 | ℃ | 290 |
区段11温度 | ℃ | 290 |
模头温度 | ℃ | 290 |
螺杆速度 | rpm | 300 |
生产量 | kg/hr | 60 |
扭矩 | NONE | 50 |
操作 | 单位 | 值 |
预干燥时间 | 小时 | 3 |
预干燥温度 | ℃ | 105 |
料斗温度 | ℃ | 50 |
区段1温度 | ℃ | 280 |
区段2温度 | ℃ | 250 |
区段3温度 | ℃ | 300 |
喷嘴温度 | ℃ | 290 |
模具温度 | ℃ | 90 |
螺杆速度 | rpm | 100 |
背压 | kgf/cm2 | 90 |
保持时间 | s | 10 |
冷却时间 | s | 20 |
注射速度(mm/s) | mm/s | 25 |
保持压力 | kgf/cm2 | 600 |
最大注射压力 | kgf/cm2 | 1000 |
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/841,466 US20090054553A1 (en) | 2007-08-20 | 2007-08-20 | High dielectric constant thermoplastic composition, methods of manufacture thereof and articles comprising the same |
US11/841,466 | 2007-08-20 | ||
PCT/IB2008/053309 WO2009024920A2 (en) | 2007-08-20 | 2008-08-18 | High dielectric constant thermoplastic composition, methods of manufacture thereof and articles comprising the same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101835831A CN101835831A (zh) | 2010-09-15 |
CN101835831B true CN101835831B (zh) | 2015-03-04 |
Family
ID=40378765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880112374.5A Active CN101835831B (zh) | 2007-08-20 | 2008-08-18 | 高介电常数的热塑性组合物、制备其的方法以及包含其的制品 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090054553A1 (zh) |
EP (1) | EP2181148B1 (zh) |
KR (1) | KR101520947B1 (zh) |
CN (1) | CN101835831B (zh) |
WO (1) | WO2009024920A2 (zh) |
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US8309640B2 (en) * | 2008-05-23 | 2012-11-13 | Sabic Innovative Plastics Ip B.V. | High dielectric constant laser direct structuring materials |
DE102010005020B4 (de) * | 2010-01-19 | 2019-12-12 | Continental Automotive Gmbh | Verwendung eines Formkörpers aus einem wärmeleitenden Kompositmaterial zur Wärmeableitung |
CN101921479B (zh) * | 2010-08-11 | 2012-04-04 | 苏州大学 | 一种氰酸酯树脂基复合材料及其制备方法 |
CN102101775B (zh) * | 2010-12-08 | 2013-03-13 | 汕头高新区松田实业有限公司 | 一种低损耗高压陶瓷电容器介质 |
CN103146182B (zh) * | 2012-04-16 | 2015-09-09 | 东莞市常平大京九高聚物导电静电研究中心 | 高散热氮化物复合材料及其制备方法 |
US20140093712A1 (en) * | 2012-09-28 | 2014-04-03 | Sabic Innovative Plastics Ip B.V. | Polycarbonate ABS Composites with Improved Electromagnetic Shielding Effectiveness |
CN102952388B (zh) * | 2012-11-30 | 2015-12-09 | 深圳市博恩实业有限公司 | 高介电常数导热塑料及其制备方法 |
EP2951838A4 (en) | 2013-02-04 | 2016-09-07 | 3M Innovative Properties Co | INSULATING COMPOSITION, INSULATION ARTICLE, PREPARATION METHOD AND ELECTRIC CABLE ACCESSORY |
CN104402449A (zh) * | 2014-11-28 | 2015-03-11 | 吴江佳亿电子科技有限公司 | 一种纳米陶瓷材料及其制备方法 |
CN104788897A (zh) * | 2015-04-27 | 2015-07-22 | 苏州中亚芯能新材料科技有限公司 | 一种纳米改性聚醚醚酮材料及其制备方法 |
KR20180038495A (ko) | 2015-08-20 | 2018-04-16 | 사빅 글로벌 테크놀러지스 비.브이. | 고주파수 전자장치 구성부품용 수지 조성물 |
CN105367959B (zh) * | 2015-10-27 | 2017-12-05 | 北京航空航天大学 | 一种核壳结构粉体及其聚合物基介电复合材料的制备方法 |
CN107987390B (zh) * | 2017-12-19 | 2020-01-03 | 西安交通大学 | 一种高储能密度聚丙烯-马来酸酐接枝聚丙烯-纳米氧化锆复合材料及其制备方法 |
CN108129792A (zh) * | 2017-12-25 | 2018-06-08 | 合肥卡洛塑业科技有限公司 | 一种高介电低损耗pc/abs合金及其制备方法 |
CN110041619A (zh) * | 2019-05-14 | 2019-07-23 | 上海皓月新能源科技有限公司 | 一种高介电常数的塑料薄膜及其制造方法 |
US11637365B2 (en) * | 2019-08-21 | 2023-04-25 | Ticona Llc | Polymer composition for use in an antenna system |
CN111607125B (zh) * | 2020-06-05 | 2021-11-09 | 国家电网有限公司 | 一种提高聚丙烯薄膜介电常数的方法 |
KR102451638B1 (ko) * | 2020-06-12 | 2022-10-06 | 충남대학교산학협력단 | 고유전막 및 이를 포함하는 반도체 또는 커패시터 소자 |
JP7244467B2 (ja) * | 2020-09-16 | 2023-03-22 | 矢崎総業株式会社 | 樹脂組成物、並びにそれを用いた通信ケーブル及びワイヤーハーネス |
EP4019590A1 (en) | 2020-12-22 | 2022-06-29 | SHPP Global Technologies B.V. | Thermoplastic compositions with high dielectric constant, high heat resistance and improved mechanical properties and the shaped article therefore |
CN112851335B (zh) * | 2021-02-19 | 2022-08-19 | 中国科学院新疆理化技术研究所 | 一种类钙钛矿基复合高温热敏电阻材料及其制备方法 |
CN114957976B (zh) * | 2021-02-26 | 2023-11-03 | 合肥杰事杰新材料股份有限公司 | 一种高性能低介电的pa6复合材料及其制备方法 |
CN112980188B (zh) * | 2021-05-07 | 2022-11-18 | 哈尔滨理工大学 | 一种锆钛酸钡钙纤维/聚醚砜基复合电介质制备及储能性能优化 |
CN113061341B (zh) * | 2021-05-08 | 2023-02-21 | 哈尔滨理工大学 | 一种表面修饰的无机填充相/聚醚砜基复合电介质制备 |
CN115028932B (zh) * | 2022-06-24 | 2024-03-22 | 郑荣妹 | 一种有机高分子复合陶瓷材料的制备方法 |
CN115109412A (zh) * | 2022-08-12 | 2022-09-27 | 山东产研明泉新材料研究院有限公司 | 一种韧性增强高绝缘聚苯硫醚复合材料及其制备方法 |
CN116102362B (zh) * | 2023-02-17 | 2024-04-19 | 潮州市长鸿卫浴科技有限公司 | 一种防污卫浴陶瓷及其制备方法 |
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JPH0629367B2 (ja) * | 1985-12-02 | 1994-04-20 | ポリプラスチックス株式会社 | 導電性樹脂組成物 |
JPH0770410B2 (ja) * | 1986-09-03 | 1995-07-31 | 株式会社東芝 | コンデンサ |
JPH03179805A (ja) * | 1989-12-07 | 1991-08-05 | Murata Mfg Co Ltd | 誘電体レンズアンテナ用複合材料 |
US5574104A (en) | 1990-01-05 | 1996-11-12 | The B. F. Goodrich Company | Chain extended low molecular weight polyoxiranes and electrostatic dissipating blend compositions based thereon |
EP0552377B1 (en) * | 1991-08-09 | 1997-01-22 | TDK Corporation | Dielectric material for high frequency and resonator made thereof, and manufacture thereof |
KR940001657A (ko) * | 1992-06-26 | 1994-01-11 | 이헌조 | 팩시밀리의 메모리 복사 제어방법 |
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JP3238064B2 (ja) * | 1996-02-05 | 2001-12-10 | ティーディーケイ株式会社 | 低誘電性高分子材料の使用方法ならびにそれを用いたフィルム、基板および電子部品の使用方法 |
US5739193A (en) * | 1996-05-07 | 1998-04-14 | Hoechst Celanese Corp. | Polymeric compositions having a temperature-stable dielectric constant |
JP3753742B2 (ja) | 1996-09-19 | 2006-03-08 | 旭化成ケミカルズ株式会社 | ポリカーボネート樹脂組成物 |
US5965273A (en) * | 1997-01-31 | 1999-10-12 | Hoechst Celanese Corporation | Polymeric compositions having a temperature-stable dielectric constant |
KR20010013831A (ko) * | 1998-04-16 | 2001-02-26 | 엔오에프 코퍼레이션 | 유전성 복합 재료 조성물, 및 이로부터 제조한 필름,기판, 전자 부품 및 성형 제품 |
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US20040126522A1 (en) * | 2002-10-09 | 2004-07-01 | Extrand Charles W. | High temperature, high strength, colorable materials for device processing systems |
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JP2005306662A (ja) * | 2004-04-21 | 2005-11-04 | Tdk Corp | 誘電体セラミックス粉末の製造方法及び複合誘電体材料の製造方法 |
DE602006021155D1 (de) * | 2005-02-03 | 2011-05-19 | Asahi Kasei Chemicals Corp | Harzzusammensetzung für elektronische und elektrische bauteile von hochfrequenzanwendungen und geformtes produkt daraus |
-
2007
- 2007-08-20 US US11/841,466 patent/US20090054553A1/en not_active Abandoned
-
2008
- 2008-08-18 CN CN200880112374.5A patent/CN101835831B/zh active Active
- 2008-08-18 EP EP08807352.3A patent/EP2181148B1/en active Active
- 2008-08-18 WO PCT/IB2008/053309 patent/WO2009024920A2/en active Application Filing
- 2008-08-18 KR KR1020107006011A patent/KR101520947B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US20090054553A1 (en) | 2009-02-26 |
WO2009024920A3 (en) | 2009-05-22 |
EP2181148A2 (en) | 2010-05-05 |
KR20100057860A (ko) | 2010-06-01 |
KR101520947B1 (ko) | 2015-05-18 |
WO2009024920A2 (en) | 2009-02-26 |
CN101835831A (zh) | 2010-09-15 |
EP2181148B1 (en) | 2017-02-15 |
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