CN101831051A - 含萘环、双环戊二烯环和酰亚胺结构的耐高温环氧树脂及其制备方法 - Google Patents
含萘环、双环戊二烯环和酰亚胺结构的耐高温环氧树脂及其制备方法 Download PDFInfo
- Publication number
- CN101831051A CN101831051A CN 201010167654 CN201010167654A CN101831051A CN 101831051 A CN101831051 A CN 101831051A CN 201010167654 CN201010167654 CN 201010167654 CN 201010167654 A CN201010167654 A CN 201010167654A CN 101831051 A CN101831051 A CN 101831051A
- Authority
- CN
- China
- Prior art keywords
- naphthalene nucleus
- imide structure
- weight parts
- dicyclopentadiene ring
- oxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 title claims abstract description 57
- 125000005462 imide group Chemical group 0.000 title claims abstract description 50
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 125000001624 naphthyl group Chemical group 0.000 title abstract 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 51
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 50
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 27
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims abstract description 24
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000006555 catalytic reaction Methods 0.000 claims abstract description 9
- -1 hydroxyl compound Chemical class 0.000 claims abstract description 6
- 150000002790 naphthalenes Chemical class 0.000 claims description 59
- 238000006243 chemical reaction Methods 0.000 claims description 34
- 239000002904 solvent Substances 0.000 claims description 24
- 239000000047 product Substances 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000004593 Epoxy Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 150000004782 1-naphthols Chemical class 0.000 claims description 15
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellityc acid Natural products OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 claims description 14
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 14
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 12
- ZBIBQNVRTVLOHQ-UHFFFAOYSA-N 5-aminonaphthalen-1-ol Chemical class C1=CC=C2C(N)=CC=CC2=C1O ZBIBQNVRTVLOHQ-UHFFFAOYSA-N 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 11
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 10
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 10
- 229940043265 methyl isobutyl ketone Drugs 0.000 claims description 10
- 238000001291 vacuum drying Methods 0.000 claims description 10
- 239000012265 solid product Substances 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 9
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 7
- 150000008065 acid anhydrides Chemical class 0.000 claims description 7
- 229920002866 paraformaldehyde Polymers 0.000 claims description 7
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 6
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 6
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000012046 mixed solvent Substances 0.000 claims description 5
- 230000007935 neutral effect Effects 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 abstract description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 230000002194 synthesizing effect Effects 0.000 abstract 3
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 32
- 229910052757 nitrogen Inorganic materials 0.000 description 16
- 238000010992 reflux Methods 0.000 description 16
- 238000010792 warming Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 230000006837 decompression Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000376 reactant Substances 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003444 phase transfer catalyst Substances 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101676545A CN101831051B (zh) | 2010-05-07 | 2010-05-07 | 含萘环、双环戊二烯环和酰亚胺结构的耐高温环氧树脂及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101676545A CN101831051B (zh) | 2010-05-07 | 2010-05-07 | 含萘环、双环戊二烯环和酰亚胺结构的耐高温环氧树脂及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101831051A true CN101831051A (zh) | 2010-09-15 |
CN101831051B CN101831051B (zh) | 2012-01-04 |
Family
ID=42715285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101676545A Active CN101831051B (zh) | 2010-05-07 | 2010-05-07 | 含萘环、双环戊二烯环和酰亚胺结构的耐高温环氧树脂及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101831051B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104163912A (zh) * | 2014-02-12 | 2014-11-26 | 安徽善孚新材料科技有限公司 | 一种双重网络交联型环氧树脂及其制备方法 |
WO2016101538A1 (zh) | 2014-12-26 | 2016-06-30 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及使用它的预浸料和层压板 |
US10544255B2 (en) | 2015-12-28 | 2020-01-28 | Shengyi Technology Co., Ltd. | Epoxy resin composition, prepreg and laminate prepared therefrom |
US10696844B2 (en) | 2014-02-25 | 2020-06-30 | Shengyi Technology Co., Ltd. | Halogen-free flame retardant type resin composition |
CN112662130A (zh) * | 2020-12-21 | 2021-04-16 | 上海中化科技有限公司 | 树脂组合物、树脂材料及其制备方法 |
CN109749440B (zh) * | 2018-12-29 | 2021-08-27 | 广东生益科技股份有限公司 | 氰酸酯树脂组合物及其用途 |
CN113844128A (zh) * | 2021-09-09 | 2021-12-28 | 江苏耀鸿电子有限公司 | 一种无铅高耐热覆铜板及其制备方法 |
CN113861383A (zh) * | 2021-10-19 | 2021-12-31 | 上海华谊树脂有限公司 | 含萘环结构的环氧树脂及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4731423A (en) * | 1986-08-13 | 1988-03-15 | The Dow Chemical Company | Meta-halo-phenolic alkylation products and epoxy systems |
CN101177478A (zh) * | 2006-11-09 | 2008-05-14 | 西北工业大学 | 线型双酚f酚醛环氧树脂及其制备方法 |
-
2010
- 2010-05-07 CN CN2010101676545A patent/CN101831051B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4731423A (en) * | 1986-08-13 | 1988-03-15 | The Dow Chemical Company | Meta-halo-phenolic alkylation products and epoxy systems |
CN101177478A (zh) * | 2006-11-09 | 2008-05-14 | 西北工业大学 | 线型双酚f酚醛环氧树脂及其制备方法 |
Non-Patent Citations (1)
Title |
---|
《Polymer》 20081231 Hua Ren et al Synthesis and characterization of a novel heat resistant epoxy resin based on N,N`-bis(5-hydroxy-1-naphthyl)pyromellitic diimide 5249-5253 1-8 第49卷, 2 * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104163912A (zh) * | 2014-02-12 | 2014-11-26 | 安徽善孚新材料科技有限公司 | 一种双重网络交联型环氧树脂及其制备方法 |
CN104163912B (zh) * | 2014-02-12 | 2016-09-14 | 安徽善孚新材料科技股份有限公司 | 一种双重网络交联型环氧树脂及其制备方法 |
US10696844B2 (en) | 2014-02-25 | 2020-06-30 | Shengyi Technology Co., Ltd. | Halogen-free flame retardant type resin composition |
EP3075782A4 (en) * | 2014-12-26 | 2017-08-30 | Shengyi Technology Co. Ltd. | Epoxy resin composition, prepreg and laminate using same |
US10208156B2 (en) | 2014-12-26 | 2019-02-19 | Shengyi Technology Co., Ltd. | Epoxy resin composition, prepreg and laminate using same |
WO2016101538A1 (zh) | 2014-12-26 | 2016-06-30 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及使用它的预浸料和层压板 |
US10544255B2 (en) | 2015-12-28 | 2020-01-28 | Shengyi Technology Co., Ltd. | Epoxy resin composition, prepreg and laminate prepared therefrom |
CN109749440B (zh) * | 2018-12-29 | 2021-08-27 | 广东生益科技股份有限公司 | 氰酸酯树脂组合物及其用途 |
CN112662130A (zh) * | 2020-12-21 | 2021-04-16 | 上海中化科技有限公司 | 树脂组合物、树脂材料及其制备方法 |
CN112662130B (zh) * | 2020-12-21 | 2023-05-26 | 上海中化科技有限公司 | 树脂组合物、树脂材料及其制备方法 |
CN113844128A (zh) * | 2021-09-09 | 2021-12-28 | 江苏耀鸿电子有限公司 | 一种无铅高耐热覆铜板及其制备方法 |
CN113844128B (zh) * | 2021-09-09 | 2022-10-21 | 江苏耀鸿电子有限公司 | 一种无铅高耐热覆铜板及其制备方法 |
CN113861383A (zh) * | 2021-10-19 | 2021-12-31 | 上海华谊树脂有限公司 | 含萘环结构的环氧树脂及其制备方法 |
CN113861383B (zh) * | 2021-10-19 | 2024-04-19 | 上海华谊树脂有限公司 | 含萘环结构的环氧树脂及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101831051B (zh) | 2012-01-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101831051B (zh) | 含萘环、双环戊二烯环和酰亚胺结构的耐高温环氧树脂及其制备方法 | |
CN107266336B (zh) | 一种含有氟和邻苯二甲腈的低聚物及其固化物和制备方法 | |
Na et al. | Preparation and properties of novel fluorinated epoxy resins cured with 4-trifluoromethyl phenylbenzimidazole for application in electronic materials | |
CN103865101B (zh) | 一种高效磷氮系阻燃剂及制备方法 | |
CN102504252B (zh) | 氨基苯氧基邻苯二甲腈预聚物、固化物及其制备方法和用途 | |
CN101307013A (zh) | 含邻苯二甲腈侧基的芳香族二胺及其制备方法和由其制备的聚酰亚胺或聚酰胺 | |
CN104016870B (zh) | 一种含间三联苯结构二胺化合物及其合成方法和应用 | |
CN106008926B (zh) | 一种具有改进环氧树脂抗紫外线性能的环氧树脂固化剂及其制备方法 | |
CN103012780B (zh) | 苯并噁嗪树脂/离子液体组合物 | |
CN103922989B (zh) | 含邻苯二甲腈结构的吡咯基芳香二胺及其制备方法和应用 | |
CN102976972A (zh) | 一种腈基树脂单体和聚合物及其制备方法 | |
CN103664699B (zh) | 一种自催化腈基树脂单体和聚合物及其制备方法 | |
Hu et al. | A novel development route for cyano-based high performance thermosetting resins via the strategy of functional group design-dicyanoimidazole resins | |
Kaliavaradhan et al. | Synthesis and characterization of various phenylene diamine-based bismaleimide-containing phthalonitrile resins | |
CN105153144A (zh) | 主链双胺型喹喔啉基苯并噁嗪及其制备方法 | |
CN105130975A (zh) | 三胺型喹喔啉基苯并噁嗪及其制备方法 | |
CN101870693B (zh) | 含1,3,4-噁二唑结构双马来酰亚胺及其制备方法 | |
CN101024681A (zh) | 一种含氟多官能环氧树脂的制备方法 | |
CN102887999A (zh) | 含芳醚腈链段的双酚a型双邻苯二甲腈树脂、固化物及其制备方法 | |
CN103788123B (zh) | 含双塔型倍半硅氧烷的双官能苯并噁嗪树脂 | |
CN104558533A (zh) | 一种间乙炔基苯偶氮联苯型酚醛树脂及其制备方法 | |
CN108129640A (zh) | 一种耐高温阻燃环氧树脂固化剂及其制备方法 | |
CN105061417A (zh) | 单胺-双酚型不对称三官能度喹喔啉基苯并噁嗪及其制备方法 | |
CN104163912B (zh) | 一种双重网络交联型环氧树脂及其制备方法 | |
CN109678880A (zh) | 一种基于白藜芦醇的三官能苯并噁嗪单体及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: ANHUI SHANFU NEW MATERIAL TECHNOLOGY CO., LTD. Free format text: FORMER NAME: HUANGSHAN SHANFU CHEMICAL CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 245251 No. 398 Binjiang Road, Wang Cun town, Anhui, Shexian Patentee after: Anhui Shanfu New Material Technology Co., Ltd. Address before: 245251 No. 398 Binjiang Road, Wang Cun town, Anhui, Shexian Patentee before: Huangshan Shanfu Chemical Co., Ltd. |
|
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: 245251 circular economy garden, emblem Town, Huangshan City, Anhui, Shexian Patentee after: Anhui Shanfu new materials Polytron Technologies Inc Address before: 245251 No. 398 Binjiang Road, Wang Cun town, Anhui, Shexian Patentee before: Anhui Shanfu New Material Technology Co., Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High-temperature-resistant epoxy resin containing naphthalene ring, dicyclopentadiene ring and imide structure and preparation method thereof Effective date of registration: 20171211 Granted publication date: 20120104 Pledgee: Shexian Anhui rural commercial bank Limited by Share Ltd Pledgor: Anhui Shanfu new materials Polytron Technologies Inc Registration number: 2017340000400 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20181214 Granted publication date: 20120104 Pledgee: Shexian Anhui rural commercial bank Limited by Share Ltd Pledgor: Anhui Shanfu new materials Polytron Technologies Inc Registration number: 2017340000400 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High-temperature-resistant epoxy resin containing naphthalene ring, dicyclopentadiene ring and imide structure and preparation method thereof Effective date of registration: 20181221 Granted publication date: 20120104 Pledgee: Shexian Anhui rural commercial bank Limited by Share Ltd Pledgor: Anhui Shanfu new materials Polytron Technologies Inc Registration number: 2018340000757 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191122 Granted publication date: 20120104 Pledgee: Shexian Anhui rural commercial bank Limited by Share Ltd Pledgor: Anhui Shanfu new materials Polytron Technologies Inc Registration number: 2018340000757 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High-temperature-resistant epoxy resin containing naphthalene ring, dicyclopentadiene ring and imide structure and preparation method thereof Effective date of registration: 20191127 Granted publication date: 20120104 Pledgee: Shexian Anhui rural commercial bank Limited by Share Ltd Pledgor: Anhui Shanfu new materials Polytron Technologies Inc Registration number: Y2019340000227 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201112 Granted publication date: 20120104 Pledgee: Shexian Anhui rural commercial bank Limited by Share Ltd. Pledgor: ANHUI SHANFU NEW MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2019340000227 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |