CN101828434A - 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体 - Google Patents

粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体 Download PDF

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Publication number
CN101828434A
CN101828434A CN200880111995A CN200880111995A CN101828434A CN 101828434 A CN101828434 A CN 101828434A CN 200880111995 A CN200880111995 A CN 200880111995A CN 200880111995 A CN200880111995 A CN 200880111995A CN 101828434 A CN101828434 A CN 101828434A
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CN
China
Prior art keywords
circuit
adhesive composite
circuit block
connecting body
organosilicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880111995A
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English (en)
Chinese (zh)
Inventor
田中胜
茶山卓也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201510202528.1A priority Critical patent/CN104893655B/zh
Publication of CN101828434A publication Critical patent/CN101828434A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CN200880111995A 2007-10-18 2008-10-10 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体 Pending CN101828434A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510202528.1A CN104893655B (zh) 2007-10-18 2008-10-10 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007-271263 2007-10-18
JP2007271263 2007-10-18
JP2008-050383 2008-02-29
JP2008050383 2008-02-29
PCT/JP2008/068422 WO2009051067A1 (ja) 2007-10-18 2008-10-10 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201510202528.1A Division CN104893655B (zh) 2007-10-18 2008-10-10 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体

Publications (1)

Publication Number Publication Date
CN101828434A true CN101828434A (zh) 2010-09-08

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN200880111995A Pending CN101828434A (zh) 2007-10-18 2008-10-10 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体
CN201510202528.1A Active CN104893655B (zh) 2007-10-18 2008-10-10 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体

Family Applications After (1)

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CN201510202528.1A Active CN104893655B (zh) 2007-10-18 2008-10-10 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体

Country Status (5)

Country Link
JP (1) JP4930598B2 (ko)
KR (2) KR101183317B1 (ko)
CN (2) CN101828434A (ko)
TW (1) TWI402321B (ko)
WO (1) WO2009051067A1 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102709257A (zh) * 2012-05-10 2012-10-03 三星半导体(中国)研究开发有限公司 半导体塑封料及其制造方法和半导体封装件
CN103262172A (zh) * 2010-11-03 2013-08-21 弗赖斯金属有限公司 烧结材料及使用该材料的附着方法
CN107148809A (zh) * 2014-10-17 2017-09-08 太阳油墨制造株式会社 干膜及柔性印刷电路板
CN110050036A (zh) * 2016-12-09 2019-07-23 日立化成株式会社 组合物、粘接剂、烧结体、接合体和接合体的制造方法
CN112863732A (zh) * 2014-10-29 2021-05-28 迪睿合株式会社 连接结构体的制造方法、连接结构体以及导电材料

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JP4930623B2 (ja) * 2009-04-28 2012-05-16 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
JP5569121B2 (ja) * 2009-05-29 2014-08-13 日立化成株式会社 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP5569126B2 (ja) * 2009-05-29 2014-08-13 日立化成株式会社 接着剤組成物、接着剤シート及び半導体装置の製造方法
CN102295894B (zh) * 2010-06-14 2014-12-31 日立化成株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
KR101313939B1 (ko) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR20110136731A (ko) * 2010-06-14 2011-12-21 히다치 가세고교 가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR101314007B1 (ko) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
JP5206840B2 (ja) * 2010-06-14 2013-06-12 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP5223946B2 (ja) * 2010-06-14 2013-06-26 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP5441954B2 (ja) * 2010-06-14 2014-03-12 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP2012021140A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP2012023096A (ja) * 2010-07-12 2012-02-02 Yokohama Rubber Co Ltd:The 導電性組成物および太陽電池セル
WO2012137335A1 (ja) * 2011-04-07 2012-10-11 日立化成工業株式会社 回路接続材料及びその使用並びに接続構造体及びその製造方法
WO2013042203A1 (ja) 2011-09-20 2013-03-28 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法
KR101640631B1 (ko) * 2012-12-12 2016-07-18 제일모직주식회사 편광판용 접착 필름, 이를 위한 접착제 조성물, 이를 포함하는 편광판 및 이를 포함하는 광학 표시 장치
JP6695757B2 (ja) * 2016-08-09 2020-05-20 京セラ株式会社 接着シート
WO2018105125A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
CN106833511B (zh) * 2017-02-27 2020-09-01 苏州巨峰电气绝缘系统股份有限公司 一种高导热有机硅灌封胶及其制备方法和应用
KR102106996B1 (ko) * 2017-12-28 2020-05-07 주식회사 노피온 솔더입자를 포함한 시트를 사용한 부품 실장 방법
JP7184874B2 (ja) * 2018-03-28 2022-12-06 株式会社カネカ 接着剤組成物
KR102674579B1 (ko) * 2018-04-04 2024-06-13 세키스이가가쿠 고교가부시키가이샤 절연성 입자를 갖는 도전성 입자, 절연성 입자를 갖는 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체
CN111325071A (zh) * 2018-12-17 2020-06-23 上海箩箕技术有限公司 光学粘合料及光学传感器模组
JP7234032B2 (ja) * 2019-05-15 2023-03-07 デクセリアルズ株式会社 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法
JP7435001B2 (ja) * 2020-02-17 2024-02-21 株式会社レゾナック 異方導電性接着フィルム、接続構造体及びその製造方法

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JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103262172A (zh) * 2010-11-03 2013-08-21 弗赖斯金属有限公司 烧结材料及使用该材料的附着方法
CN102709257A (zh) * 2012-05-10 2012-10-03 三星半导体(中国)研究开发有限公司 半导体塑封料及其制造方法和半导体封装件
CN107148809A (zh) * 2014-10-17 2017-09-08 太阳油墨制造株式会社 干膜及柔性印刷电路板
CN107148809B (zh) * 2014-10-17 2020-08-11 太阳油墨制造株式会社 干膜及柔性印刷电路板
CN112863732A (zh) * 2014-10-29 2021-05-28 迪睿合株式会社 连接结构体的制造方法、连接结构体以及导电材料
CN112863732B (zh) * 2014-10-29 2023-01-17 迪睿合株式会社 连接结构体的制造方法、连接结构体以及导电材料
CN110050036A (zh) * 2016-12-09 2019-07-23 日立化成株式会社 组合物、粘接剂、烧结体、接合体和接合体的制造方法

Also Published As

Publication number Publication date
KR20110099793A (ko) 2011-09-08
JPWO2009051067A1 (ja) 2011-03-03
KR101183317B1 (ko) 2012-09-14
CN104893655A (zh) 2015-09-09
TWI402321B (zh) 2013-07-21
WO2009051067A1 (ja) 2009-04-23
JP4930598B2 (ja) 2012-05-16
KR101130377B1 (ko) 2012-03-27
KR20100009545A (ko) 2010-01-27
TW200932861A (en) 2009-08-01
CN104893655B (zh) 2020-06-16

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Application publication date: 20100908