CN101827905B - 室温可固化的有机基聚硅氧烷组合物 - Google Patents

室温可固化的有机基聚硅氧烷组合物 Download PDF

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Publication number
CN101827905B
CN101827905B CN2008801117566A CN200880111756A CN101827905B CN 101827905 B CN101827905 B CN 101827905B CN 2008801117566 A CN2008801117566 A CN 2008801117566A CN 200880111756 A CN200880111756 A CN 200880111756A CN 101827905 B CN101827905 B CN 101827905B
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mass
parts
component
composition
temperature curable
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CN101827905A (zh
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锅田祥子
大西正之
潮嘉人
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0091Complexes with metal-heteroatom-bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Sealing Material Composition (AREA)
CN2008801117566A 2007-10-25 2008-10-06 室温可固化的有机基聚硅氧烷组合物 Active CN101827905B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007278105A JP5285892B2 (ja) 2007-10-25 2007-10-25 室温硬化性オルガノポリシロキサン組成物
JP2007-278105 2007-10-25
PCT/JP2008/068517 WO2009054279A1 (en) 2007-10-25 2008-10-06 Room-temperature curable organopolysiloxane composition

Publications (2)

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CN101827905A CN101827905A (zh) 2010-09-08
CN101827905B true CN101827905B (zh) 2013-04-17

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CN2008801117566A Active CN101827905B (zh) 2007-10-25 2008-10-06 室温可固化的有机基聚硅氧烷组合物

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Country Link
US (1) US8247516B2 (enExample)
EP (1) EP2207856B1 (enExample)
JP (1) JP5285892B2 (enExample)
KR (1) KR101528789B1 (enExample)
CN (1) CN101827905B (enExample)
AT (1) ATE548432T1 (enExample)
TW (1) TWI462970B (enExample)
WO (1) WO2009054279A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2477738B1 (en) 2009-09-15 2019-01-23 Basf Se Photo-latent titanium-chelate catalysts
KR101752516B1 (ko) 2009-09-15 2017-06-29 바스프 에스이 광-잠재성 티타늄 촉매
DE102010041676A1 (de) 2010-09-29 2012-03-29 Wacker Chemie Ag Vernetzbare Organopolysiloxanzusammensetzung
JP2012158619A (ja) * 2011-01-28 2012-08-23 Dow Corning Toray Co Ltd プライマー用組成物及び積層体
JP6184401B2 (ja) 2011-04-05 2017-08-23 ビーエーエスエフ ソシエタス・ヨーロピアBasf Se 光潜在性チタン−オキソ−キレート触媒
CN109563347A (zh) * 2016-08-19 2019-04-02 道康宁东丽株式会社 用于保护电气/电子部件的室温可固化的有机聚硅氧烷组合物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1984964A (zh) * 2004-07-09 2007-06-20 陶氏康宁东丽株式会社 可室温固化的有机基聚硅氧烷组合物和电气或电子器件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3725178B2 (ja) * 1991-03-22 2005-12-07 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
US7307134B2 (en) * 2002-02-22 2007-12-11 Henkel Corporation Mixed alkoxysilyl functional polymers
JP2004269817A (ja) * 2003-03-12 2004-09-30 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物の製造方法
JP4283009B2 (ja) * 2003-03-12 2009-06-24 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4860099B2 (ja) * 2003-03-12 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4180477B2 (ja) * 2003-09-10 2008-11-12 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4799835B2 (ja) * 2004-07-09 2011-10-26 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1984964A (zh) * 2004-07-09 2007-06-20 陶氏康宁东丽株式会社 可室温固化的有机基聚硅氧烷组合物和电气或电子器件

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平4-293962A 1992.10.19

Also Published As

Publication number Publication date
KR20100087129A (ko) 2010-08-03
TWI462970B (zh) 2014-12-01
ATE548432T1 (de) 2012-03-15
US8247516B2 (en) 2012-08-21
TW200932833A (en) 2009-08-01
US20100236450A1 (en) 2010-09-23
JP5285892B2 (ja) 2013-09-11
EP2207856A1 (en) 2010-07-21
KR101528789B1 (ko) 2015-06-15
CN101827905A (zh) 2010-09-08
EP2207856B1 (en) 2012-03-07
JP2009102591A (ja) 2009-05-14
WO2009054279A1 (en) 2009-04-30

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