TWI462970B - 室溫下可固化之有機聚矽氧烷組合物 - Google Patents
室溫下可固化之有機聚矽氧烷組合物 Download PDFInfo
- Publication number
- TWI462970B TWI462970B TW097137994A TW97137994A TWI462970B TW I462970 B TWI462970 B TW I462970B TW 097137994 A TW097137994 A TW 097137994A TW 97137994 A TW97137994 A TW 97137994A TW I462970 B TWI462970 B TW I462970B
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- group
- mass
- parts
- component
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 108
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000010936 titanium Substances 0.000 claims abstract description 12
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 6
- 239000003054 catalyst Substances 0.000 claims abstract description 6
- 239000013522 chelant Substances 0.000 claims abstract description 6
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 3
- 150000002430 hydrocarbons Chemical group 0.000 claims description 14
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 9
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 6
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 125000000962 organic group Chemical group 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 14
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 abstract 1
- 125000005369 trialkoxysilyl group Chemical group 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 14
- -1 trimethoxysulfanyl group Chemical group 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 9
- 238000002955 isolation Methods 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- YTPFRRRNIYVFFE-UHFFFAOYSA-N 2,2,3,3,5,5-hexamethyl-1,4-dioxane Chemical compound CC1(C)COC(C)(C)C(C)(C)O1 YTPFRRRNIYVFFE-UHFFFAOYSA-N 0.000 description 6
- GCZWJRLXIPVNLU-UHFFFAOYSA-N 2,2-dimethoxy-3-methylundecane Chemical compound CC(C(OC)(OC)C)CCCCCCCC GCZWJRLXIPVNLU-UHFFFAOYSA-N 0.000 description 6
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 6
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 239000000565 sealant Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 240000004307 Citrus medica Species 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- FCHAHVALRSEXTN-UHFFFAOYSA-N CC(CCCC(CCCC)(OCC)OCC)C Chemical compound CC(CCCC(CCCC)(OCC)OCC)C FCHAHVALRSEXTN-UHFFFAOYSA-N 0.000 description 3
- MMJGHBIXGOTKRR-UHFFFAOYSA-N [Ti].C(C)CC#N.C(C)CC#N Chemical compound [Ti].C(C)CC#N.C(C)CC#N MMJGHBIXGOTKRR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- LNEJJQMNHUGXDW-UHFFFAOYSA-N CC(C(OCC)(OCC)C)CCCCCCCC Chemical compound CC(C(OCC)(OCC)C)CCCCCCCC LNEJJQMNHUGXDW-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- OTGGHZUEAWMAAK-UHFFFAOYSA-N (1,1-dimethoxy-1-phenyldecan-2-yl)benzene Chemical compound C1(=CC=CC=C1)C(C(OC)(OC)C1=CC=CC=C1)CCCCCCCC OTGGHZUEAWMAAK-UHFFFAOYSA-N 0.000 description 1
- JPEWDCTZJFUITH-UHFFFAOYSA-N 1-methoxydecane Chemical compound CCCCCCCCCCOC JPEWDCTZJFUITH-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VOQDCMULDZDDLP-UHFFFAOYSA-N 2-methoxy-2,3-dimethyloxane Chemical compound CC1C(OCCC1)(C)OC VOQDCMULDZDDLP-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- AUJBNJFBJPKHPY-UHFFFAOYSA-N 4,4-diethoxy-5-methyltridecane Chemical compound CC(C(OCC)(OCC)CCC)CCCCCCCC AUJBNJFBJPKHPY-UHFFFAOYSA-N 0.000 description 1
- UAPJIXSMWIFQEH-UHFFFAOYSA-N 4,4-dimethoxy-5-methyltridecane Chemical compound CC(C(OC)(OC)CCC)CCCCCCCC UAPJIXSMWIFQEH-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- DPDVAQUTUAZEKP-UHFFFAOYSA-N C(=C)C(C(OC)(OC)C=C)CCCCCCCC Chemical compound C(=C)C(C(OC)(OC)C=C)CCCCCCCC DPDVAQUTUAZEKP-UHFFFAOYSA-N 0.000 description 1
- CAPXJNGJKLJAKM-UHFFFAOYSA-N C(=C)C(C(OCC)(OCC)C=C)CCCCCCCC Chemical compound C(=C)C(C(OCC)(OCC)C=C)CCCCCCCC CAPXJNGJKLJAKM-UHFFFAOYSA-N 0.000 description 1
- QNGUFVBAHBNZGW-UHFFFAOYSA-N C(C)C(C(OC)(OC)CC)CCCCCCCC Chemical compound C(C)C(C(OC)(OC)CC)CCCCCCCC QNGUFVBAHBNZGW-UHFFFAOYSA-N 0.000 description 1
- XEPAKJGFUVCJOW-UHFFFAOYSA-N C(C)C(C(OCC)(OCC)CC)CCCCCCCC Chemical compound C(C)C(C(OCC)(OCC)CC)CCCCCCCC XEPAKJGFUVCJOW-UHFFFAOYSA-N 0.000 description 1
- GHDHVFYKUQKSRV-UHFFFAOYSA-N C(C1=CC=CC=C1)C(CCCCCCCCC)(OC)OC Chemical compound C(C1=CC=CC=C1)C(CCCCCCCCC)(OC)OC GHDHVFYKUQKSRV-UHFFFAOYSA-N 0.000 description 1
- RPLANZPCJBROPJ-UHFFFAOYSA-N C(C1=CC=CC=C1)C(CCCCCCCCC)(OCC)OCC Chemical compound C(C1=CC=CC=C1)C(CCCCCCCCC)(OCC)OCC RPLANZPCJBROPJ-UHFFFAOYSA-N 0.000 description 1
- STJBWPMXSJHEFV-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(OCC)(OCC)C1=CC=CC=C1)CCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(OCC)(OCC)C1=CC=CC=C1)CCCCCCCC STJBWPMXSJHEFV-UHFFFAOYSA-N 0.000 description 1
- GGGZEAQPQFUYCJ-UHFFFAOYSA-N CC(C(OC)(OC)CC)CCCCCCCC Chemical compound CC(C(OC)(OC)CC)CCCCCCCC GGGZEAQPQFUYCJ-UHFFFAOYSA-N 0.000 description 1
- QTBITDQOMQRBCU-UHFFFAOYSA-N CC(C(OCC)(OCC)CC)CCCCCCCC Chemical compound CC(C(OCC)(OCC)CC)CCCCCCCC QTBITDQOMQRBCU-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical group CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PYHNCTSVRKZVJY-UHFFFAOYSA-N [Ti].CC(C)=NO.CC(C)=NO Chemical compound [Ti].CC(C)=NO.CC(C)=NO PYHNCTSVRKZVJY-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- RXKUYBRRTKRGME-UHFFFAOYSA-N butanimidamide Chemical compound CCCC(N)=N RXKUYBRRTKRGME-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940008099 dimethicone Drugs 0.000 description 1
- 125000001891 dimethoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007278105A JP5285892B2 (ja) | 2007-10-25 | 2007-10-25 | 室温硬化性オルガノポリシロキサン組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200932833A TW200932833A (en) | 2009-08-01 |
| TWI462970B true TWI462970B (zh) | 2014-12-01 |
Family
ID=40279059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097137994A TWI462970B (zh) | 2007-10-25 | 2008-10-02 | 室溫下可固化之有機聚矽氧烷組合物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8247516B2 (enExample) |
| EP (1) | EP2207856B1 (enExample) |
| JP (1) | JP5285892B2 (enExample) |
| KR (1) | KR101528789B1 (enExample) |
| CN (1) | CN101827905B (enExample) |
| AT (1) | ATE548432T1 (enExample) |
| TW (1) | TWI462970B (enExample) |
| WO (1) | WO2009054279A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5645939B2 (ja) | 2009-09-15 | 2014-12-24 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 光潜在性チタン触媒 |
| EP2477738B1 (en) | 2009-09-15 | 2019-01-23 | Basf Se | Photo-latent titanium-chelate catalysts |
| DE102010041676A1 (de) * | 2010-09-29 | 2012-03-29 | Wacker Chemie Ag | Vernetzbare Organopolysiloxanzusammensetzung |
| JP2012158619A (ja) * | 2011-01-28 | 2012-08-23 | Dow Corning Toray Co Ltd | プライマー用組成物及び積層体 |
| WO2012136606A1 (en) | 2011-04-05 | 2012-10-11 | Basf Se | Photo-latent titanium-oxo-chelate catalysts |
| CN118271847A (zh) * | 2016-08-19 | 2024-07-02 | 陶氏东丽株式会社 | 用于保护电气/电子部件的室温可固化的有机聚硅氧烷组合物 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200604291A (en) * | 2004-07-09 | 2006-02-01 | Dow Corning Toray Co Ltd | Room-temperature curable organopolysiloxane composition and electrical or electronic devices |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3725178B2 (ja) * | 1991-03-22 | 2005-12-07 | 東レ・ダウコーニング株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| US7307134B2 (en) * | 2002-02-22 | 2007-12-11 | Henkel Corporation | Mixed alkoxysilyl functional polymers |
| JP4860099B2 (ja) * | 2003-03-12 | 2012-01-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 室温硬化性ポリオルガノシロキサン組成物 |
| JP4283009B2 (ja) * | 2003-03-12 | 2009-06-24 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 室温硬化性ポリオルガノシロキサン組成物 |
| JP2004269817A (ja) * | 2003-03-12 | 2004-09-30 | Ge Toshiba Silicones Co Ltd | 室温硬化性ポリオルガノシロキサン組成物の製造方法 |
| JP4180477B2 (ja) * | 2003-09-10 | 2008-11-12 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 室温硬化性ポリオルガノシロキサン組成物 |
| JP4799835B2 (ja) * | 2004-07-09 | 2011-10-26 | 東レ・ダウコーニング株式会社 | 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 |
-
2007
- 2007-10-25 JP JP2007278105A patent/JP5285892B2/ja active Active
-
2008
- 2008-10-02 TW TW097137994A patent/TWI462970B/zh active
- 2008-10-06 KR KR1020107008988A patent/KR101528789B1/ko active Active
- 2008-10-06 AT AT08843158T patent/ATE548432T1/de active
- 2008-10-06 CN CN2008801117566A patent/CN101827905B/zh active Active
- 2008-10-06 WO PCT/JP2008/068517 patent/WO2009054279A1/en not_active Ceased
- 2008-10-06 US US12/739,343 patent/US8247516B2/en active Active
- 2008-10-06 EP EP08843158A patent/EP2207856B1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200604291A (en) * | 2004-07-09 | 2006-02-01 | Dow Corning Toray Co Ltd | Room-temperature curable organopolysiloxane composition and electrical or electronic devices |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2207856B1 (en) | 2012-03-07 |
| KR101528789B1 (ko) | 2015-06-15 |
| US8247516B2 (en) | 2012-08-21 |
| EP2207856A1 (en) | 2010-07-21 |
| CN101827905A (zh) | 2010-09-08 |
| TW200932833A (en) | 2009-08-01 |
| JP2009102591A (ja) | 2009-05-14 |
| JP5285892B2 (ja) | 2013-09-11 |
| ATE548432T1 (de) | 2012-03-15 |
| CN101827905B (zh) | 2013-04-17 |
| KR20100087129A (ko) | 2010-08-03 |
| US20100236450A1 (en) | 2010-09-23 |
| WO2009054279A1 (en) | 2009-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7781522B2 (en) | Curable silicone composition and cured product thereof | |
| EP3087143B1 (en) | Room-temperature-curable silicone rubber composition, the use thereof, and method for repairing electronic device | |
| TWI462970B (zh) | 室溫下可固化之有機聚矽氧烷組合物 | |
| CN103459509A (zh) | 室温下可固化的有机硅橡胶组合物 | |
| JP3725178B2 (ja) | 室温硬化性オルガノポリシロキサン組成物 | |
| JP2004292724A (ja) | 室温硬化性オルガノポリシロキサン組成物 | |
| KR101127301B1 (ko) | 실온 경화성 오르가노폴리실록산 조성물 | |
| CN100577734C (zh) | 可室温固化的有机基聚硅氧烷组合物和电气或电子器件 | |
| JP7327212B2 (ja) | 二成分型室温縮合硬化性オルガノポリシロキサン組成物 | |
| JP2020026493A (ja) | 室温硬化性ポリオルガノシロキサン組成物及びその硬化物 | |
| KR101127368B1 (ko) | 실온 경화성 오르가노폴리실록산 조성물 | |
| JP2005082734A (ja) | 室温硬化性ポリオルガノシロキサン組成物 | |
| JP2020026492A (ja) | 室温硬化性ポリオルガノシロキサン組成物及びその硬化物 | |
| JP4530177B2 (ja) | 室温硬化性オルガノポリシロキサン組成物 | |
| JP7647879B2 (ja) | 室温硬化性シリコーンコーティング剤組成物及び物品 | |
| KR101166034B1 (ko) | 실온 경화성 오가노폴리실록산 조성물, 및 전기 또는 전자기기 | |
| KR101159537B1 (ko) | 실온 경화성 폴리오르가노실록산 조성물 | |
| CN102056991A (zh) | 可室温固化的有机基聚硅氧烷组合物 |