CN101807006A - 曝光装置、曝光方法以及显示用面板基板的制造方法 - Google Patents

曝光装置、曝光方法以及显示用面板基板的制造方法 Download PDF

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Publication number
CN101807006A
CN101807006A CN200910265751A CN200910265751A CN101807006A CN 101807006 A CN101807006 A CN 101807006A CN 200910265751 A CN200910265751 A CN 200910265751A CN 200910265751 A CN200910265751 A CN 200910265751A CN 101807006 A CN101807006 A CN 101807006A
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CN
China
Prior art keywords
catoptron
light modulator
spatial light
substrate
beam irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910265751A
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English (en)
Chinese (zh)
Inventor
根本亮二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Publication of CN101807006A publication Critical patent/CN101807006A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
CN200910265751A 2009-02-18 2009-12-31 曝光装置、曝光方法以及显示用面板基板的制造方法 Pending CN101807006A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-034757 2009-02-18
JP2009034757A JP2010191127A (ja) 2009-02-18 2009-02-18 露光装置、露光方法、及び表示用パネル基板の製造方法

Publications (1)

Publication Number Publication Date
CN101807006A true CN101807006A (zh) 2010-08-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910265751A Pending CN101807006A (zh) 2009-02-18 2009-12-31 曝光装置、曝光方法以及显示用面板基板的制造方法

Country Status (4)

Country Link
JP (1) JP2010191127A (ja)
KR (1) KR20100094353A (ja)
CN (1) CN101807006A (ja)
TW (1) TW201032004A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102540755A (zh) * 2010-12-07 2012-07-04 株式会社日立高科技 曝光装置、曝光方法以及显示用面板基板的制造方法
CN102799073A (zh) * 2011-05-20 2012-11-28 株式会社日立高科技 曝光装置及曝光、检查方法及显示用面板基板的制造方法
CN109283796A (zh) * 2017-07-21 2019-01-29 中芯国际集成电路制造(上海)有限公司 一种光刻仿真系统

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5703069B2 (ja) * 2010-09-30 2015-04-15 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
DE102012218221A1 (de) 2012-10-05 2014-04-10 Carl Zeiss Smt Gmbh Monitorsystem zum Bestimmen von Orientierungen von Spiegelelementen und EUV-Lithographiesystem
NO20190876A1 (en) 2019-07-11 2021-01-12 Visitech As Real time Registration Lithography system
CN111474813B (zh) * 2020-04-29 2021-09-28 Oppo广东移动通信有限公司 投影光机及电子设备
CN111795930B (zh) * 2020-08-09 2021-09-21 泰州市博泰电子有限公司 一种移动通信电路板通用测试夹具

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020171816A1 (en) * 2001-03-23 2002-11-21 Markle David A. Computer architecture for and method of high-resolution imaging using a low-resolution image transducer
JP2003257844A (ja) * 2002-03-07 2003-09-12 M S Tec:Kk ダイレクト露光装置
US20040130561A1 (en) * 2003-01-07 2004-07-08 Kanti Jain Maskless lithography with multiplexed spatial light modulators
US20060033902A1 (en) * 2004-08-13 2006-02-16 Asml Holding, N.V. System and method to compensate for static and dynamic misalignments and deformations in a maskless lithography tool

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6618185B2 (en) * 2001-11-28 2003-09-09 Micronic Laser Systems Ab Defective pixel compensation method
JP2004304135A (ja) * 2003-04-01 2004-10-28 Nikon Corp 露光装置、露光方法及びマイクロデバイスの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020171816A1 (en) * 2001-03-23 2002-11-21 Markle David A. Computer architecture for and method of high-resolution imaging using a low-resolution image transducer
JP2003257844A (ja) * 2002-03-07 2003-09-12 M S Tec:Kk ダイレクト露光装置
US20040130561A1 (en) * 2003-01-07 2004-07-08 Kanti Jain Maskless lithography with multiplexed spatial light modulators
US20060033902A1 (en) * 2004-08-13 2006-02-16 Asml Holding, N.V. System and method to compensate for static and dynamic misalignments and deformations in a maskless lithography tool

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102540755A (zh) * 2010-12-07 2012-07-04 株式会社日立高科技 曝光装置、曝光方法以及显示用面板基板的制造方法
CN102799073A (zh) * 2011-05-20 2012-11-28 株式会社日立高科技 曝光装置及曝光、检查方法及显示用面板基板的制造方法
CN109283796A (zh) * 2017-07-21 2019-01-29 中芯国际集成电路制造(上海)有限公司 一种光刻仿真系统

Also Published As

Publication number Publication date
KR20100094353A (ko) 2010-08-26
TW201032004A (en) 2010-09-01
JP2010191127A (ja) 2010-09-02

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Application publication date: 20100818