CN101807006A - Exposure apparatus, exposure method and method of manufacturing a display panel substrate - Google Patents
Exposure apparatus, exposure method and method of manufacturing a display panel substrate Download PDFInfo
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- CN101807006A CN101807006A CN200910265751A CN200910265751A CN101807006A CN 101807006 A CN101807006 A CN 101807006A CN 200910265751 A CN200910265751 A CN 200910265751A CN 200910265751 A CN200910265751 A CN 200910265751A CN 101807006 A CN101807006 A CN 101807006A
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- catoptron
- light modulator
- spatial light
- substrate
- beam irradiation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Computer Hardware Design (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
The invention discloses an exposure apparatus, exposure method and method of manufacturing a display panel substrate, a spatial light modulator (25) of a beam irradiation apparatus (20) is formed by the arrangement of a plurality of micro reflectors for reflecting the beam in two directions, a drive circuit (27) changes the angle of each reflector according to the drawing data, therefore the beam irradiated to a substrate (1) is modulated. The modulated beam irradiates towards the substrate (1) from the head (20a) of the beam irradiation apparatus (20) containing an irradiation optical system. The drawing data is supplied for the drive circuit (27) of the beam irradiation apparatus (20), the motion of each reflector of the spatial light modulator (25) is monitored, and based on the drawing data supplied for the drive circuit of the beam irradiation apparatus (20) and the monitored motion of each reflector of the spatial light modulator (25), whether the motion of each reflector of the spatial light modulator (25) is normal is determined.
Description
Technical field
The present invention relates to a kind of in the manufacturing of display panel substrates such as LCD (display) device, to being coated with the substrate illumination beam of photoresist (photo-resist), and utilize light beam to come scanning substrate, thereby on substrate, describe the exposure device of pattern (pattern), exposure method and the manufacture method of using the display panel substrate of these exposure devices and exposure method relate in particular to a kind of exposure device that makes a plurality of catoptrons action on two directions that are arranged in spatial light modulator and light beam is modulated, exposure method and the manufacture method of using the display panel substrate of these exposure devices and exposure method.
Background technology
Thin film transistor (TFT) (the Thin FilmTransistor of the LCD device of using as display panel, TFT) substrate or chromatic filter (color filter) substrate, plasma (plasma) display pannel substrate, organic electroluminescent (Electroluminescence, EL) manufacturing of display panel substrate etc. is to use exposure device, forms pattern by photoetching (photolithography) technology on substrate and carries out.As exposure device, had in the past use lens (lens) or mirror with the graphic pattern projection of mask (mask) to the substrate projection (projection) mode and small gap (adjacent gap, proximity gap) is set and with the pattern transfer of mask contiguous mode to substrate between mask and substrate.
In recent years, develop and a kind ofly utilize light beam to come scanning substrate, thereby on substrate, describe the exposure device of pattern being coated with the substrate illumination beam of photoresist.Owing to be to utilize light beam to come scanning substrate and on substrate, directly describe pattern, therefore do not need the mask of high price.And, describe the program (program) of data (data) and scanning, display panel substrate that can corresponding multiple class by change.As this kind exposure device, the exposure device that discloses in patent documentation 1, patent documentation 2 and the patent documentation 3 is for example arranged.
[patent documentation]
[patent documentation 1] Jap.P. spy opens the 2003-332221 communique
[patent documentation 2] Jap.P. spy opens the 2005-353927 communique
[patent documentation 3] Jap.P. spy opens the 2007-219011 communique
As those disclosed herein in the patent documentation 1～3, to the substrate illumination beam, utilize light beam to come scanning substrate, thereby on substrate, describe in the exposure device of pattern, be by digital micromirror elements (DigitalMicro-mirror Device, DMD) etc. spatial light modulator comes the light beam that exposes to substrate is modulated, thereby carries out patterning (patterning).At this moment, if spatial light modulator breaks down or controls bad etc. undesirable condition, can't normally carry out describing of pattern, thereby can't obtain required pattern form.Be that the pattern form of the substrate that finishes exposure is checked in the past, described badly that thereby the bad problem of describing of pattern also can take place the substrate that has during this period to be exposed with what detect pattern.
Summary of the invention
Problem of the present invention is, when come scanning substrate when describing pattern on substrate by light beam, can detect the undesirable condition of the spatial light modulator that light beam is modulated in early days.And problem of the present invention is, when coming scanning substrate when describing pattern on substrate by light beam, even the part generation undesirable condition of the spatial light modulator that light beam is modulated also can normally carry out describing of pattern.And then problem of the present invention is to make high-quality display panel substrate.
Exposure device of the present invention comprises: chuck, and support is coated with the substrate of photoresist; Objective table moves described chuck; And beam irradiation device, comprise spatial light modulator, driving circuit and illuminating optical system, wherein said spatial light modulator makes a plurality of catoptrons that are arranged on two directions move and light beam is modulated, described driving circuit drives spatial light modulator according to describing data, the light beam of described illuminating optical system irradiation after the spatial light modulator modulation, and, come mobile chuck by objective table, be used to come scanning substrate from the light beam of beam irradiation device, thereby on substrate, describe pattern, this exposure device comprises: MA monitoring agency, the action of each catoptron of the spatial light modulator of monitoring beam irradiation unit; And describe control gear, driving circuit to beam irradiation device is supplied with the described data of describing, described data and action by each catoptron of the spatial light modulator that MA monitoring agency monitored according to what supply with, whether each catoptron that comes the decision space photomodulator regular event.
And, exposure method of the present invention is to utilize chuck support to be coated with the substrate of photoresist, come mobile chuck by objective table, be used to come scanning substrate from the light beam of beam irradiation device, thereby on substrate, describe pattern, described beam irradiation device comprises spatial light modulator, driving circuit and illuminating optical system, wherein said spatial light modulator makes a plurality of catoptrons that are arranged on two directions move and light beam is modulated, described driving circuit drives spatial light modulator according to describing data, the light beam of described illuminating optical system irradiation after the spatial light modulator modulation, in this exposure method, driving circuit to beam irradiation device is supplied with the described data of describing, the action of each catoptron of the spatial light modulator of monitoring beam irradiation unit, according to the action of describing data and each catoptron of the spatial light modulator that is monitored that the driving circuit of beam irradiation device is supplied with, whether each catoptron that comes the decision space photomodulator regular event.
The spatial light modulator of beam irradiation device is that a plurality of small rows of mirrors with folded light beam is listed on two directions and constitutes, and driving circuit is according to describing the angle that data change each catoptron, and the light beam that contrasts the directive substrate is thus modulated.Light beam after the spatial light modulator modulation exposes to the substrate of being supported by chuck from the head that comprises illuminating optical system of beam irradiation device.Driving circuit to beam irradiation device is supplied with the described data of describing, the action of each catoptron of the spatial light modulator of monitoring beam irradiation unit, and according to the action of describing data and each catoptron of the spatial light modulator that monitored that the driving circuit of beam irradiation device is supplied with, whether each catoptron that comes the decision space photomodulator regular event, therefore can detect the undesirable condition of the spatial light modulator that light beam is modulated in early days.
And then, in the exposure device of the present invention, the spatial light modulator of beam irradiation device is changed into catoptron and opens posture and light beam is modulated by closed posture, MA monitoring agency comprises: to carried out the branch offices of branch by the catoptron institute beam reflected of opening posture; The camera that each pixel of sensitive surface is disposed corresponding to each catoptron of spatial light modulator; And make mechanism by light beam imaging on the sensitive surface of camera of branch of institute of branch offices.And, in the exposure method of the present invention, the catoptron of the spatial light modulator of beam irradiation device changed into by closed posture open posture and light beam is modulated, to carrying out branch by the catoptron institute beam reflected of opening posture, make light beam imaging on the sensitive surface of the camera that each pixel with sensitive surface disposes corresponding to each catoptron of spatial light modulator of branch of institute, with the action of each catoptron of monitored space photomodulator.By the illuminated head that comprises illuminating optical system of catoptron institute beam reflected of opening posture, and shine the substrate of supporting to by chuck from the head to beam irradiation device.The catoptron institute beam reflected of being opened posture by this is carried out branch, and make light beam imaging, action of each catoptron of monitored space photomodulator easily thus on the sensitive surface of the camera that each pixel with sensitive surface disposes corresponding to each catoptron of spatial light modulator of branch of institute.
Perhaps, in the exposure device of the present invention, the spatial light modulator of beam irradiation device is changed into catoptron and opens posture and light beam is modulated by closed posture, and MA monitoring agency comprises: the camera that each pixel of sensitive surface is disposed corresponding to each catoptron of spatial light modulator; And make mechanism by catoptron institute beam reflected imaging on the sensitive surface of camera of closed posture.And, in the exposure method of the present invention, the catoptron of the spatial light modulator of beam irradiation device changed into by closed posture open posture and light beam is modulated, make catoptron institute beam reflected imaging on the sensitive surface of the camera that each pixel with sensitive surface disposes corresponding to each catoptron of spatial light modulator, with the action of each catoptron of monitored space photomodulator by closed posture.By the direction of the head that comprises illuminating optical system of the catoptron institute beam reflected off-beams irradiation unit of closed posture, and do not expose to the substrate of supporting by chuck.Make catoptron institute beam reflected imaging, action of each catoptron of monitored space photomodulator easily thus on the sensitive surface of the camera that each pixel with sensitive surface disposes corresponding to each catoptron of spatial light modulator by this closed posture.
And then, in the exposure device of the present invention, describe the result of determination of control gear according to the action of each catoptron of the spatial light modulator of beam irradiation device, describe data and produce to what the omission because of the not scanning of the light beam that catoptron caused of regular event compensated, and be supplied to the driving circuit of beam irradiation device.And, in the exposure method of the present invention, result of determination according to the action of each catoptron of the spatial light modulator of beam irradiation device, describe data and produce to what the omission because of the not scanning of the light beam that catoptron caused of regular event compensated, and be supplied to the driving circuit of beam irradiation device.Even a part of catoptron generation undesirable condition of the spatial light modulator that light beam is modulated also can compensate the omission of the scanning of light beam by other catoptrons, thereby can normally carry out describing of pattern.
The manufacture method of display panel substrate of the present invention is to use any above-mentioned exposure device or exposure method to carry out the exposure of substrate.By using above-mentioned exposure device or exposure method, what can prevent pattern that the undesirable condition because of spatial light modulator causes describes badly, therefore can make high-quality display panel substrate.
[effect of invention]
According to exposure device of the present invention and exposure method, data are described in driving circuit supply to beam irradiation device, the action of each catoptron of the spatial light modulator of monitoring beam irradiation unit, and according to the action of describing data and each catoptron of the spatial light modulator that monitored that the driving circuit of beam irradiation device is supplied with, whether each catoptron that comes the decision space photomodulator regular event, can detect the undesirable condition of the spatial light modulator that light beam is modulated thus in early days.
And then, according to exposure device of the present invention and exposure method, the catoptron of the spatial light modulator of beam irradiation device changed into by closed posture open posture and light beam is modulated, to carrying out branch by the catoptron institute beam reflected of opening posture, and make light beam imaging, action of each catoptron of monitored space photomodulator easily thus on the sensitive surface of the camera that each pixel with sensitive surface disposes corresponding to each catoptron of spatial light modulator of branch of institute.
Perhaps, according to exposure device of the present invention and exposure method, the catoptron of the spatial light modulator of beam irradiation device changed into by closed posture open posture and light beam is modulated, make catoptron institute beam reflected imaging, action of each catoptron of monitored space photomodulator easily thus on the sensitive surface of the camera that each pixel with sensitive surface disposes corresponding to each catoptron of spatial light modulator by closed posture.
And then, according to exposure device of the present invention and exposure method, result of determination according to the action of each catoptron of the spatial light modulator of beam irradiation device, describe data and produce to what the omission because of the not scanning of the light beam that catoptron caused of regular event compensated, and be supplied to the driving circuit of beam irradiation device, thus, even a part of catoptron generation undesirable condition of the spatial light modulator that light beam is modulated also can normally carry out describing of pattern.
According to the manufacture method of display panel substrate of the present invention, what can prevent pattern that the undesirable condition because of spatial light modulator causes describes badly, therefore can make high-quality display panel substrate.
Description of drawings
Fig. 1 is the figure that the summary of the exposure device of expression one embodiment of the present invention constitutes.
Fig. 2 is the outboard profile of the exposure device of one embodiment of the present invention.
Fig. 3 is the front view (FV) of the exposure device of one embodiment of the present invention.
Fig. 4 is the figure that the summary of an example of expression beam irradiation device constitutes.
Fig. 5 is describing with regional figure of expression DMD.
Fig. 6 is the figure that another routine summary of expression beam irradiation device constitutes.
Fig. 7 is the figure of the action of explanation laser length measurement system.
Fig. 8 is the figure of the alignment mark (alignment mark) of expression substrate.
Fig. 9 A is thermostatic vertical view, and Fig. 9 B is thermostatic outboard profile.
Figure 10 is the vertical view that is in the chuck of delivery position.
Figure 11 is the outboard profile that is in the chuck of delivery position.
Figure 12 is the figure that the summary formation of control part is described in expression.
Figure 13 is the figure of explanation light beam to the scanning of substrate.
Figure 14 is the figure of explanation light beam to the scanning of substrate.
Figure 15 is the figure of explanation light beam to the scanning of substrate.
Figure 16 is the figure of explanation light beam to the scanning of substrate.
Figure 17 is the process flow diagram of an example of manufacturing process of the TFT substrate of expression LCD device.
Figure 18 is the process flow diagram of an example of manufacturing process of the base plate of color light filter of expression LCD device.
1: substrate 2a, 2b, 2c, 2d: base pattern
3: base 4:X guides
5:X objective table 6:Y guides
7:Y objective table 8: θ objective table
10: chuck 11: gate
20: beam irradiation device 20a: head
21: LASER Light Source unit 22: optical fiber
23: lens 24: catoptron
25:DMD (Digital Micro-mirror Device: digital micromirror elements)
25a: catoptron 26: projecting lens
27:DMD driving circuit 31,33: linear scale
32,34: scrambler 40: the laser length measurement system control device
41: LASER Light Source 42,44: laser interferometer
43,45: bar-shaped catoptron 46: the error-detector circuit of travelling
47,51,52a, 52b, 52c, 52d:CCD camera
48,53: image processing apparatus 50: temperature control equipment
54: position detecting circuit 60: the objective table driving circuit
70: main control unit 71: describe control part
72,76: storer 73: bandwidth settings portion
74: center point coordinate determination section 75: the coordinate determination section
77: describe data creating portion 78: catoptron action detection unit
80: display device 81: the semi-transparent reflection mirror
82a, 82b: imaging len 83: decay sees through light filter
84a, 84b: camera 85: image processing apparatus
GAM: global alignment mark
SAMa, SAMb, SAMc, SAMd: emission alignment mark
W: bandwidth X, Y: direction
Embodiment
Fig. 1 is the figure that the summary of the exposure device of expression one embodiment of the present invention constitutes.And Fig. 2 is the outboard profile of the exposure device of one embodiment of the present invention, and Fig. 3 is the front view (FV) of the exposure device of one embodiment of the present invention.Present embodiment has been represented the example of the exposure device that on the base pattern that forms on the substrate new pattern exposed with the exposure of the mode of being close to.Exposure device comprises base (base) 3, X guides (guide) 4, X objective table 5, Y guides 6, Y objective table 7, θ objective table 8, chuck (chuck) 10, gate (gate) 11, beam irradiation device 20, linear scale (Linear Scale) 31,33, scrambler (encoder) 32,34, the laser length measurement system, laser length measurement system control device 40, the error-detector circuit 46 of travelling, image processing apparatus 48,53, temperature control equipment 50, position detecting circuit 54, objective table driving circuit 60, main control unit 70 and display device 80 and constitute.In addition, among Fig. 2 and Fig. 3, omitted LASER Light Source 41, laser length measurement system control device 40, the error-detector circuit of travelling 46, image processing apparatus 48,53, temperature control equipment 50, position detecting circuit 54, objective table driving circuit 60, main control unit 70 and the display device 80 of laser length measurement system.Exposure device except above-mentioned part, the temperature control unit (unit) etc. that also possesses substrate transferring robot (robot) and carry out the temperature treatment in the device.
In addition, below XY direction in the illustrated embodiment only be illustration, also can be with directions X and the transposing of Y direction.
In Fig. 1 and Fig. 2, chuck 10 is positioned at the delivery position of the handing-over of carrying out substrate 1.On delivery position, by not shown substrate transferring robot substrate 1 is moved into chuck 10, and substrate 1 is taken out of from chuck 10 by not shown substrate transferring robot.The back side of this substrate 1 is supported on chuck 10 vacuum suction ground.On the surface of substrate 1, on the formed base pattern of the exposure of the mode of being close to, be coated with photoresist.
In the sky of the exposure position of the exposure of carrying out substrate 1, cross over base 3 and be provided with gate 11.On gate 11, carrying a plurality of beam irradiation devices 20.In addition, present embodiment has represented to use the example of the exposure device of 8 beam irradiation devices 20, but the quantity of beam irradiation device is not limited to this, also can use smaller or equal to 7 or more than or equal to 9 beam irradiation devices.
Fig. 4 is the figure that the summary of an example of expression beam irradiation device constitutes.Beam irradiation device 20 comprises optical fiber 22, lens 23, catoptron 24, DMD (Digital Micro-mirror Device, digital micromirror elements) 25, projecting lens 26, DMD driving circuit 27, semi-transparent reflection mirror (halfmirror) 81, imaging len 82a, camera 84a and image processing apparatus 85 and constitutes.In the light beam lead-in light beam irradiation apparatus 20 of the ultraviolet light that optical fiber 22 will take place from LASER Light Source unit 21.The light beam that penetrates from optical fiber 22 exposes to DMD25 via lens 23 and catoptron 24.DMD25 is that a plurality of small rows of mirrors with folded light beam is listed on two directions and the spatial light modulator that constitutes, and catoptron is changed into by closed posture open posture and light beam is modulated.DMD driving circuit 27 is according to the angle of being supplied with from main control unit 70 that data change each catoptron of DMD25 of describing.
Fig. 5 is describing with regional figure of expression DMD.The surface that is arranged with the DMD25 of a plurality of catoptron 25a on two directions is split into to be described to describe with the zone with zone and revisal usually.Be arranged in each the catoptron 25a that describes usually with the zone and be used for common pattern plotter.Being arranged in that revisal describes with each catoptron 25a in zone is to be used for describing usually with the catoptron in zone not during regular event when being positioned at as described later, and the omission of the scanning of the light beam that causes because of the catoptron of regular event is not compensated.In addition, describe usually to describe alternately to change the direction of scanning of substrate 1 according to light beam with the configuration in zone with zone and revisal.
In Fig. 4, illuminated to semi-transparent reflection mirror 81 by the catoptron institute beam reflected of opening posture of DMD25.Semi-transparent reflection mirror 81 will be branched off into through light and reflected light by the catoptron institute beam reflected of opening posture.The light beam that sees through semi-transparent reflection mirror 81 is illuminated to the head 20a that comprises projecting lens 26, and 20a irradiation from the head is to substrate 1.Catoptron institute beam reflected by the closed posture of DMD25 departs from the direction of semi-transparent reflection mirror 81 and head 20a, and does not shine to substrate 1.
Illuminated by 81 beam reflected of semi-transparent reflection mirror to imaging len 82a, the pinching by imaging len 82a, thereby imaging on the sensitive surface of camera 84a.On the sensitive surface of camera 84a, dispose each pixel corresponding to each catoptron of DMD25, camera 84a receives by 81 beam reflected of semi-transparent reflection mirror, and output image signal.The picture signal that 85 couples of camera 84a of image processing apparatus are exported is handled, with the posture of each catoptron 25a of detecting DMD25.
The catoptron 25a of DMD25 changed into by closed posture open posture and light beam is modulated, to carrying out branch by the catoptron institute beam reflected of opening posture, and make light beam imaging on the sensitive surface of the camera 84a that each pixel with sensitive surface disposes corresponding to each catoptron 25a of DMD25 of branch of institute, monitor the action of each catoptron 25a of DMD25 thus easily.
Fig. 6 is the figure that another routine summary of expression beam irradiation device constitutes.Beam irradiation device 20 comprises that optical fiber 22, lens 23, catoptron 24, DMD25, projecting lens 26, DMD driving circuit 27, imaging len 82b, decay see through light filter 83, camera 84b and image processing apparatus 85 and constitute.Optical fiber 22, lens 23, catoptron 24, DMD25, projecting lens 26 and DMD driving circuit 27 are identical with example shown in Figure 4.
The catoptron institute beam reflected of opening posture by DMD25 is illuminated to the head 20a that comprises projecting lens 26, and 20a irradiation from the head is to substrate 1.Catoptron institute beam reflected by the closed posture of DMD25 is illuminated to imaging len 82b, and the pinching by imaging len 82b, thus imaging on the sensitive surface of camera 84b.Between imaging len 82b and camera 84b, be provided with decay and see through light filter 83, decay sees through 83 pairs of intensity by the light beam of the suffered light of camera 84b of light filter and regulates.On the sensitive surface of camera 84b, dispose each pixel corresponding to each catoptron of DMD25, camera 84b receives the catoptron institute beam reflected by closed posture, thus output image signal.The picture signal that 85 couples of camera 84b of image processing apparatus are exported is handled, with the posture of each catoptron of detecting DMD25.
The catoptron 25a of DMD25 changed into by closed posture open posture and light beam is modulated, and make catoptron institute beam reflected imaging on the sensitive surface of the camera 84b that each pixel with sensitive surface disposes corresponding to each catoptron 25a of DMD25 by closed posture, monitor the action of each catoptron 25a of DMD25 thus easily.
In Fig. 2 and Fig. 3, chuck 10 is to be equipped on the θ objective table 8, is provided with Y objective table 7 and X objective table 5 under θ objective table 8.X objective table 5 is equipped on the X guides 4 set on the base 3, moves towards directions X along X guides 4.Y objective table 7 is equipped on the Y guides 6 set on the X objective table 5, moves towards the Y direction along Y guides 6.θ objective table 8 is equipped on the Y objective table 7, and rotates towards the θ direction.
By the rotation towards the θ direction of θ objective table 8, the substrate 1 that is equipped on the chuck 10 rotates towards the mode of directions X and Y direction with the both sides of quadrature.By X objective table 5 towards the moving of directions X, chuck 10 moves between delivery position and exposure position.On exposure position, by X objective table 5 towards the moving of directions X, scan this substrate 1 from the light beam of the head 20a irradiation of each beam irradiation device 20 towards directions X.And, by Y objective table 7 towards the moving of Y direction, make the scanning area that light beam caused of being shone move towards the Y direction from the head 20a of each beam irradiation device 20 to substrate 1.In Fig. 1,70 pairs of objective table driving circuits 60 of main control unit are controlled, with the moving and the moving towards the Y direction of Y objective table 7 towards directions X of the rotation towards the θ direction of carrying out θ objective table 8, X objective table 5.
In Fig. 1 and Fig. 2, base 3 is provided with the linear scale 31 of extending towards directions X.On linear scale 31, be carved with the scale that is used to detect X objective table 5 towards the amount of movement of directions X.And X objective table 5 is provided with the linear scale 33 of extending towards the Y direction.On linear scale 33, be carved with the scale that is used to detect Y objective table 7 towards the amount of movement of Y direction.
In Fig. 1 and Fig. 3, on a side of X objective table 5, scrambler 32 is installed opposite to each other with linear scale 31.Scrambler 32 detects the scale of linear scale 31, and exports pulse (pulse) signal to main control unit 70.And, in Fig. 1 and Fig. 2, on a side of Y objective table 7, scrambler 34 is installed opposite to each other with linear scale 33.Scrambler 34 detects the scale of linear scale 33, and exports pulse signal to main control unit 70.The pulse signal of 70 pairs of scramblers 32 of main control unit is counted (count), detecting the amount of movement towards directions X of X objective table 5, and the pulse signal of scrambler 34 is counted, to detect the amount of movement towards the Y direction of Y objective table 7.
Fig. 7 is the figure of the action of explanation laser length measurement system.In addition, in Fig. 7, gate shown in Figure 1 11, beam irradiation device 20, image processing apparatus 48,53, temperature control equipment 50, position detecting circuit 54 and display device 80 have been omitted.The laser length measurement system is the length measurement system of known laser interference formula, comprises LASER Light Source 41, laser interferometer 42,44 and bar-shaped catoptron (barmirror) 43,45 and constitutes.Bar-shaped catoptron 43 is installed on the side of Y direction of chuck 10.And bar-shaped catoptron 45 is installed on the side of directions X of chuck 10.
On the other hand, laser interferometer 44 will be from the laser radiation of LASER Light Source 41 to bar-shaped catoptron 45, and receives by 45 laser light reflected of bar-shaped catoptron, to measure from the laser of LASER Light Source 41 and interference by 45 laser light reflected of bar-shaped catoptron.Laser length measurement system control device 40 detects the position of the Y direction of the chuck 10 that moves by X objective table 5 by the control of main control unit 70 according to the measurement result of laser interferometer 44.
The error-detector circuit of travelling 46 is according to the testing result of laser length measurement system control device 40, detects X objective table 5 vacillating now to the left, now to the right or the error of travelling of go off course (yawing) etc. when directions X moves.By using the laser length measurement system to detect the position of chuck 10, can precision detect the position of chuck 10 well, therefore can precision detect the error of travelling of X objective table 5 well.The error-detector circuit of travelling 46 exports testing result to main control unit 70.
In Fig. 1, temperature control equipment 50 is being set in the place ahead of base 3.Therefore usually, temperature can rise or descend substrate 1 to some extent by the processing in the preceding operation, must carry out the cooling of substrate 1 before exposing or heats.Not shown substrate transferring robot moved into temperature control equipment 50 with substrate 1 before substrate 1 is moved into chuck 10, will move into chuck 10 by the substrate 1 that temperature control equipment 50 has been regulated temperature again.Temperature control equipment 50 carries the substrate 1 that next time exposes during the exposure of the substrate 1 that carries out being carried on the chuck 10, to regulate the temperature of substrate 1.In the present embodiment, the surface of substrate 1 is divided into each emission (shot) subregion that utilizes contiguous mode to expose, during the temperature of regulating substrate 1 by temperature control equipment 50, detect the position of the alignment mark of each base pattern of launching, to detect the position that each respectively launches the base pattern of subregion, and respectively launch the position of the base pattern of subregion according to each, describe data and make to what the DMD of beam irradiation device 20 driving circuit 27 was supplied with.
Fig. 8 is the figure of the alignment mark of expression substrate.Fig. 8 has represented to be made by 1 plate base the example of 4 display panel substrates.On four jiaos of the surface of substrate 1, be provided with and be used to detect the position of substrate 1 and the overall situation of rotation (global) alignment mark GAM.And, on the surface of substrate 1, forming 4 base pattern 2a, 2b, 2c, 2d by 4 emissions.In base pattern 2a, 2b, 2c, 2d, respectively be provided with 4 emission (shot) alignment mark SAMa, SAMb, SAMc, SAMd that are used to detect position, rotation and the size of base pattern 2a, 2b, 2c, 2d respectively.
Fig. 9 A is thermostatic vertical view, and Fig. 9 B is thermostatic outboard profile.As shown in Fig. 9 A, Fig. 9 B, in the sky of temperature control equipment 50, the position directly over the global alignment mark GAM of substrate 1, charge-coupled image sensor is being set, and (Charge Coupled Device, CCD) camera 51.CCD camera 51 obtains the image of global alignment mark GAM, and picture signal is exported to the image processing apparatus 53 of Fig. 1.And in the sky of temperature control equipment 50, the position directly over the emission alignment mark SAMa of substrate 1, SAMb, SAMc, SAMd is being provided with CCD camera 52a, 52b, 52c, 52d.CCD camera 52a, 52b, 52c, 52d obtain the image of emission alignment mark SAMa, SAMb, SAMc, SAMd respectively, and picture signal are exported to the image processing apparatus 53 of Fig. 1.
In Fig. 1, the picture signal that 53 pairs of CCD cameras 51 of image processing apparatus are exported is handled, to detect the position of global alignment mark GAM.Position detecting circuit 54 is according to the position of the detected global alignment mark GAM of image processing apparatus 53, and the position and the rotation of the substrate 1 that is carried on the detected temperatures regulating device 50.And the picture signal that 53 pairs of CCD cameras of image processing apparatus 52a, 52b, 52c, 52d are exported is handled, to detect the position of respectively launching alignment mark SAMa, SAMb, SAMc, SAMd.Position detecting circuit 54 detects base pattern 2a, 2b, 2c, 2d position, rotation and the size in substrate 1 according to the position of the detected emission alignment mark SAMa of the position of detected substrate 1 and rotation and image processing apparatus 53, SAMb, SAMc, SAMd. Use base pattern 2a, 2b, 2c, 2d last set emission alignment mark SAMa, SAMb, SAMc, the SAMd of each emission, by Flame Image Process, thereby precision detects base pattern 2a, 2b, 2c, the 2d position in substrate 1 of each emission well.
Figure 10 is the vertical view that is in the chuck of delivery position.And Figure 11 is the outboard profile that is in the chuck of delivery position.As Figure 10 and shown in Figure 11, in the sky of the chuck 10 that is in delivery position, the position directly over the global alignment mark GAM of substrate 1 is being provided with CCD camera 47.CCD camera 47 obtains the image of global alignment mark GAM, and picture signal is exported to the image processing apparatus 48 of Fig. 1.In Fig. 1, the picture signal that 48 pairs of CCD cameras 47 of image processing apparatus are exported is handled, to detect the position of global alignment mark GAM.
In Fig. 1, main control unit 70 detects the position and the rotation of the substrate 1 that is carried on the chuck 10 according to the position of the detected global alignment mark GAM of image processing apparatus 48.Main control unit 70 is controlled objective table driving circuit 60 according to the position of detected substrate 1, by X objective table 5 chuck 10 is moved towards exposure position, so that the central point of substrate 1 is come the assigned position before beginning to expose.And main control unit 70 is controlled objective table driving circuit 60 according to the rotation of detected substrate 1, makes θ objective table 8 towards the rotation of θ direction, so that the both sides of the quadrature of the substrate 1 that is carried on the chuck 10 are towards directions X and Y direction.
In storer 76, storing design load mapping (map).In design load mapping, describe data and be to represent with position substrate 1 in of base pattern 2a, 2b, 2c, 2d, rotation and big or small XY coordinate when meeting design load.Describe data creating portion 77 during the temperature of regulating substrate 1 by temperature control equipment 50, according to position detecting circuit 54 detected base pattern 2a, 2b, 2c, 2d position, rotation and the size in substrate 1, and the XY coordinate of describing data that the design load of being stored in the storer 76 is shone upon is changed, to make the data of describing to 27 supplies of the DMD of each beam irradiation device 20 driving circuit.Storer 72 stores its XY coordinate for the data of describing of describing data creating portion 77 mades as address (address).In storer 72, be provided with at be equipped on substrate 1 on the chuck 10 describe zone that data A stores, with at the zone that data B stores of describing that is equipped on substrate 1 on the temperature control equipment 50.
The scope of the Y coordinate of describing data that bandwidth settings portion 73 reads from storer 72 by decision, and set from the bandwidth of the Y direction of the light beam of the head 20a irradiation of beam irradiation device 20.
The position of the XY direction of the chuck 10 before the exposure of the substrate 1 on 40 pairs of beginnings of laser length measurement system control device exposure position is detected.Center point coordinate determination section 74 is according to the position of the XY direction of the detected chuck 10 of laser length measurement system control device 40, decides the XY coordinate of the central point of the chuck 10 before the exposure of beginning substrate 1.In Fig. 1, when being used to when the light beam of beam irradiation device 20 carries out the scanning of substrate 1, main control unit 70 control objective table driving circuits 60 move towards directions X to make chuck 10 by X objective table 5.When the scanning area of moving substrate 1, main control unit 70 control objective table driving circuits 60 are to make chuck 10 move towards the Y direction by Y objective table 7.In Figure 12,74 pairs of pulse signals from scrambler 32,34 of center point coordinate determination section are counted, with detect X objective table 5 towards the amount of movement of directions X and the amount of movement towards the Y direction of Y objective table 7, thereby the XY coordinate of the central point of decision chuck 10.Then, center point coordinate determination section 74 is according to the testing result of the error-detector circuit 46 of travelling, and comes the XY coordinate of the central point of the chuck 10 that revisal determines.
Coordinate determination section 75 decides the XY coordinate of supplying with to the DMD of each beam irradiation device 20 driving circuit 27 of describing data according to the XY coordinate of the central point of the chuck 10 of 74 revisals of center point coordinate determination section.The XY coordinate that storer 72 input coordinate determination sections 75 are determined is used as address, and store on the address with the XY coordinate imported describe data to 27 outputs of the DMD of each beam irradiation device 20 driving circuit.DMD driving circuit 27 changes the angle of the catoptron 25a that describes the usefulness zone usually that is arranged in DMD25 according to the data of describing from storer 72 outputs.
Detect the base pattern 2a that each respectively launches subregion, 2b, 2c, the position of 2d in substrate 1, rotation and size, according to testing result, and respectively launch the base pattern 2a of subregion corresponding to each, 2b, 2c, the position of 2d in substrate 1, rotation and size, make the data of describing to 27 supplies of the DMD of beam irradiation device 20 driving circuit, even so base pattern 2a, 2b, 2c, the position offset of 2d according to the place and different, also can spread all over whole base plate 1 and aims at base pattern 2a in substrate 1,2b, 2c, the 2d new pattern that exposes.
And, during the temperature of regulating substrate 1 by temperature control equipment 50, make to what the DMD of beam irradiation device 20 driving circuit 27 was supplied with according to each testing result of respectively launching position, rotation and the size of base pattern 2a, 2b, 2c, the 2d of subregion and to describe data, therefore with substrate 1 by temperature control equipment 50 conveyances to chuck 10, do not need to wait for that the described making of describing data just can begin exposure-processed, the quiescent interval, (tact time) shortened.
And then, detect the error of travelling of X objective table 5, and according to the testing result of the error of travelling of X objective table 5, the coordinate of describing data that comes revisal to supply with to the DMD of each beam irradiation device 20 driving circuit 27, and with the DMD driving circuit 27 that data are supplied to each beam irradiation device 20 of describing of the coordinate of institute's revisal, therefore even X objective table 5 is vacillated now to the left, now to the right or the error of travelling of driftage etc., but also precision is carried out describing of pattern well.
Catoptron action detection unit 78 according to supplied with to the DMD of each beam irradiation device 20 driving circuit 27 describe data, with the posture of each catoptron 25a of the detected DMD25 of the image processing apparatus 85 of each beam irradiation device 20, whether each the catoptron 25a that judges DMD25 regular event.If detected by image processing apparatus 85 and be in closed posture according to should become the catoptron of opening posture to the describing data of DMD driving circuit 27 output, then catoptron action detection unit 78 is judged to be not regular event of this catoptron.Then, catoptron action detection unit 78 will be judged to be the quantity of the catoptron of regular event not and position display on display device 80, when the quantity that is judged to be the catoptron of regular event surpasses predetermined allowable value, the warning of this implication is shown on the display device 80.
Describe data to 27 supplies of the DMD of beam irradiation device 20 driving circuit, the action of each catoptron 25a of the DMD25 of monitoring beam irradiation unit 20, and according to the action of being supplied with to the DMD of beam irradiation device 20 driving circuit 27 of describing data and each catoptron 25a of the DMD25 that monitored, whether each the catoptron 25a that judges DMD25 regular event, therefore can detect the undesirable condition of the DMD25 that light beam is modulated in early days.
Describe the result of determination of data creating portion 77 according to the action of each catoptron 25a of 78 couples of DMD25 of catoptron action detection unit, the X coordinate of describing data that stores in the storer 72 is changed, thereby produce the data of describing that omission to the scanning of the light beam that causes because of the catoptron of regular event not compensates, and export DMD driving circuit 27 to via storer 72.DMD driving circuit 27 is described data according to this and is changed the angle that the catoptron 25a in usefulness zone is described in the revisal that is arranged in DMD25.Thus, even be arranged in the catoptron generation undesirable condition of describing to use the zone usually of the DMD25 that light beam is modulated, also can describe to compensate the omission of the scanning of light beam, thereby can normally carry out describing of pattern by being arranged in revisal with the catoptron in zone.
Figure 13～Figure 16 is the figure of explanation light beam to the scanning of substrate.Figure 13～Figure 16 has represented to carry out the scanning of the directions X of No. four substrates 1 by 8 light beams from 8 beam irradiation devices 20, thus the example of scanning whole base plate 1.In Figure 13～Figure 16, the head 20a of each beam irradiation device 20 is by shown in the dotted line.Have bandwidth W from the light beam of the head 20a of each beam irradiation device 20 irradiation in the Y direction, and come scanning substrate 1 towards moving of directions X towards the direction shown in the arrow by X objective table 5.
Figure 13 represents the 1st scanning, by towards the 1st time of directions X scanning, and in Figure 13 to carry out describing of pattern in the scanning area shown in the grey.When the 1st end of scan, by Y objective table 7 towards the moving of Y direction, make substrate 1 move the distance identical towards the Y direction with bandwidth W.Figure 14 represents the 2nd scanning, by towards the 2nd time of directions X scanning, and in Figure 14 to carry out describing of pattern in the scanning area shown in the grey.When the 2nd end of scan, by Y objective table 7 towards the moving of Y direction, make substrate 1 move the distance identical with bandwidth W towards the Y direction.Figure 15 represents the 3rd scanning, by towards the 3rd time of directions X scanning, and in Figure 15 to carry out describing of pattern in the scanning area shown in the grey.When the 3rd end of scan, by Y objective table 7 towards the moving of Y direction, make substrate 1 move the distance identical with bandwidth W towards the Y direction.Figure 16 represents the 4th scanning, by the 4th scanning towards directions X, and in Figure 16 to carry out describing of pattern in the scanning area shown in the grey, the end of scan of whole base plate 1.
Be used to when a plurality of light beams of a plurality of beam irradiation devices 20 come scanning substrate 1, also can prevent by the pattern described from the light beam of each beam irradiation device 20 because of the error of travelling of X objective table 5 wrong each other from, therefore can precision carry out describing of pattern well.And, by being used to carry out abreast the scanning of substrate 1, can shortening the scanning of whole base plate 1 and want consumed time, thereby the quiescent interval is shortened from a plurality of light beams of a plurality of beam irradiation devices 20.
In addition, among Figure 13～Figure 16, the scanning of directions X of having represented to carry out No. 4 substrates 1 is with the example of scanning whole base plate 1, but the number of times of scanning is not limited to this, also can carry out smaller or equal to 3 times or more than or equal to the scanning of the directions X of No. 5 substrates 1 with scanning whole base plate 1.
According to embodiment discussed above, supply with the described data of describing to the DMD of beam irradiation device 20 driving circuit 27, the action of each catoptron 25a of the DMD25 of monitoring beam irradiation unit 20, and according to the action of being supplied with to the DMD of beam irradiation device 20 driving circuit 27 of describing data and each catoptron 25a of being monitored, whether each the catoptron 25a that judges DMD25 regular event, can detect the undesirable condition of the DMD25 that light beam is modulated thus in early days.
And then, the catoptron 25a of the DMD25 of beam irradiation device 20 changed into by closed posture open posture and light beam is modulated, to carrying out branch by the catoptron institute beam reflected of opening posture, and make light beam imaging on the sensitive surface of the camera 84a that each pixel with sensitive surface disposes corresponding to each catoptron 25a of DMD25 of branch of institute, can easily monitor the action of each catoptron 25a of DMD25 thus.
Perhaps, the catoptron 25a of the DMD25 of beam irradiation device 20 is changed into closed posture and light beam is modulated by opening posture, and make catoptron institute beam reflected imaging on the sensitive surface of the camera 84b that each pixel with sensitive surface disposes corresponding to each catoptron 25a of DMD25 by closed posture, can easily monitor the action of each catoptron 25a of DMD25 thus.
And then, result of determination according to the action of each catoptron 25a of the DMD25 of beam irradiation device 20, and produce the data of describing that omission to the scanning of the light beam that causes because of the catoptron of regular event not compensates, and be supplied to the DMD driving circuit 27 of beam irradiation device 20, thus, even a part of catoptron generation undesirable condition of the DMD25 that light beam is modulated also can normally carry out describing of pattern.
The exposure device or the exposure method of the application of the invention carry out the exposure of substrate, and what can prevent pattern that the undesirable condition because of spatial light modulator causes describes badly, therefore can make high-quality display panel substrate.
For example, Figure 17 is the process flow diagram of an example of manufacturing process of the TFT substrate of expression LCD device.Form in the operation (step 101) at film, by sputtering method or plasma activated chemical vapour deposition (Chemical Vapor Deposition, CVD) method etc. forms on substrate as the film of liquid crystal drive with the electric conductor film of transparency electrode or insulator film etc.In resist-coating operation (step 102), wait painting photoresist by roller (roll) formula rubbing method, form photoresist film to form in the operation (step 101) on the formed film at film.In exposure process (step 103), use exposure device on photoresist film, to form pattern.In developing procedure (step 104), by shower type (shower) development method etc., developer solution is supplied on the photoresist film, to remove the not part of photoresist film.In etching (etching) operation (step 105), by wet type (wet) etching, the part of form film in the film that forms in the operation (step 101), not covered by photoresist film is removed.In stripping process (step 106), will in etching work procedure (step 105), finish the photoresist film of mask effect and peel off by stripper.Before or after these operations, implement the washing/drying operation of substrate as required.Carry out these operations of several repeatedly, thereby on substrate, form tft array (array).
And Figure 18 is the process flow diagram of an example of manufacturing process of the base plate of color light filter of expression LCD device.Form in the operation (step 201) at black matrix" (black matrix), on substrate, form black matrix" by resist-coating, exposure, development, etching, the processing of peeling off etc.Form in the operation (step 202) at colored pattern,, on substrate, form colored pattern by print process etc.At the colored pattern of R, G, B, carry out this operation repeatedly.Form in the operation (step 203) at diaphragm, on colored pattern, form diaphragm, form in the operation (step 204), on diaphragm, form ELD in ELD.Before these operations, midway or afterwards, implement the washing/drying operation of substrate as required.
In the manufacturing process of TFT substrate shown in Figure 17, in exposure process (step 103), in the manufacturing process of base plate of color light filter shown in Figure 180, form in the exposure-processed of operation (step 201) and colored pattern formation operation (step 202) at black matrix", can be suitable for exposure device of the present invention or exposure method.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the structure that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment that is equal to change, but every content that does not break away from technical solution of the present invention,, be equal to change and modify any simple modification that above embodiment did according to technical spirit of the present invention, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. exposure device comprises:
Chuck, support is coated with the substrate of photoresist;
Objective table moves described chuck; And
Beam irradiation device, comprise spatial light modulator, driving circuit and illuminating optical system, wherein said spatial light modulator makes a plurality of catoptrons that are arranged on two directions move and light beam is modulated, described driving circuit drives spatial light modulator according to describing data, the light beam of described illuminating optical system irradiation after the spatial light modulator modulation, and
Move described chuck by described objective table, be used to come scanning substrate from the light beam of described beam irradiation device, thereby describe pattern on substrate, this exposure device is characterised in that and comprises:
MA monitoring agency monitors the action of each catoptron of the spatial light modulator of described beam irradiation device; And
Describe control gear, driving circuit to described beam irradiation device is supplied with the described data of describing, described data and action by each catoptron of the spatial light modulator that described MA monitoring agency monitored according to what supply with, whether each catoptron of judging described spatial light modulator regular event.
2. exposure device according to claim 1 is characterized in that,
The spatial light modulator of described beam irradiation device is changed into catoptron and opens posture and light beam is modulated by closed posture,
Described MA monitoring agency comprises: to carried out the branch offices of branch by the catoptron institute beam reflected of opening posture; The camera that each pixel of sensitive surface is disposed corresponding to each catoptron of described spatial light modulator; And make mechanism by light beam imaging on the sensitive surface of camera of branch of institute of described branch offices.
3. exposure device according to claim 1 is characterized in that,
The spatial light modulator of described beam irradiation device is changed into catoptron and opens posture and light beam is modulated by closed posture,
Described MA monitoring agency comprises: the camera that each pixel of sensitive surface is disposed corresponding to each catoptron of described spatial light modulator; And make mechanism by catoptron institute beam reflected imaging on the sensitive surface of camera of closed posture.
4. according to each described exposure device in the claim 1 to 3, it is characterized in that,
The described result of determination of describing control gear according to the action of each catoptron of the spatial light modulator of described beam irradiation device, describe data and produce to what the omission because of the not scanning of the light beam that catoptron caused of regular event compensated, and be supplied to the driving circuit of described beam irradiation device.
5. exposure method utilizes chuck support to be coated with the substrate of photoresist,
Come mobile chuck by objective table,
Be used to come scanning substrate from the light beam of beam irradiation device; Thereby describe pattern at substrate; Described beam irradiation device comprises spatial light modulator, drive circuit and illuminating optical system; Wherein said spatial light modulator makes a plurality of speculums that are arranged on two directions move and light beam is modulated; Described drive circuit drives described spatial light modulator according to describing data; The light beam of described illuminating optical system irradiation after described spatial light modulator modulation; This exposure method is characterised in that
Driving circuit to beam irradiation device is supplied with the described data of describing,
The action of each catoptron of the spatial light modulator of monitoring beam irradiation unit,
According to the action of describing data and each catoptron of the spatial light modulator that is monitored that the driving circuit of beam irradiation device is supplied with, whether each catoptron that comes the decision space photomodulator regular event.
6. exposure method according to claim 5 is characterized in that,
The catoptron of the spatial light modulator of beam irradiation device changed into by closed posture opens posture and light beam is modulated,
To carrying out branch by the catoptron institute beam reflected of opening posture,
Make light beam imaging on the sensitive surface of the camera that each pixel with sensitive surface disposes corresponding to each catoptron of described spatial light modulator of branch of institute, with the action of each catoptron of monitoring described spatial light modulator.
7. exposure method according to claim 5 is characterized in that,
The catoptron of the spatial light modulator of beam irradiation device changed into by closed posture opens posture and light beam is modulated,
Make catoptron institute beam reflected imaging on the sensitive surface of the camera that each pixel with sensitive surface disposes corresponding to each catoptron of described spatial light modulator, with the action of each catoptron of monitored space photomodulator by closed posture.
8. according to each described exposure method in the claim 5 to 7, it is characterized in that,
Result of determination according to the action of each catoptron of the spatial light modulator of beam irradiation device, describe data and produce to what the omission because of the not scanning of the light beam that catoptron caused of regular event compensated, and be supplied to the driving circuit of beam irradiation device.
9. the manufacture method of a display panel substrate is characterized in that using according to each described exposure device in the claim 1 to 4 and carries out the exposure of substrate.
10. the manufacture method of a display panel substrate is characterized in that using according to each described exposure method in the claim 5 to 8 and carries out the exposure of substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009034757A JP2010191127A (en) | 2009-02-18 | 2009-02-18 | Exposure apparatus, exposure method, and method for manufacturing panel substrate for display |
| JP2009-034757 | 2009-02-18 |
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| Publication Number | Publication Date |
|---|---|
| CN101807006A true CN101807006A (en) | 2010-08-18 |
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| CN200910265751A Pending CN101807006A (en) | 2009-02-18 | 2009-12-31 | Exposure apparatus, exposure method and method of manufacturing a display panel substrate |
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| Country | Link |
|---|---|
| JP (1) | JP2010191127A (en) |
| KR (1) | KR20100094353A (en) |
| CN (1) | CN101807006A (en) |
| TW (1) | TW201032004A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102540755A (en) * | 2010-12-07 | 2012-07-04 | 株式会社日立高科技 | Exposure apparatus, exposure method, and method of making panel substrate for display |
| CN102799073A (en) * | 2011-05-20 | 2012-11-28 | 株式会社日立高科技 | Exposure device, exposure and inspection method, and manufacturing method for substrate of display panel |
| CN109283796A (en) * | 2017-07-21 | 2019-01-29 | 中芯国际集成电路制造(上海)有限公司 | A kind of lithography simulation system |
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| JP5703069B2 (en) * | 2010-09-30 | 2015-04-15 | 株式会社Ｓｃｒｅｅｎホールディングス | Drawing apparatus and drawing method |
| DE102012218221A1 (en) * | 2012-10-05 | 2014-04-10 | Carl Zeiss Smt Gmbh | Monitor system for determining orientations of mirror elements and EUV lithography system |
| NO20190876A1 (en) | 2019-07-11 | 2021-01-12 | Visitech As | Real time Registration Lithography system |
| CN111474813B (en) * | 2020-04-29 | 2021-09-28 | Oppo广东移动通信有限公司 | Projection optical machine and electronic equipment |
| CN111795930B (en) * | 2020-08-09 | 2021-09-21 | 泰州市博泰电子有限公司 | Universal test fixture for mobile communication circuit board |
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| JP2003257844A (en) * | 2002-03-07 | 2003-09-12 | M S Tec:Kk | Direct exposure system |
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| JP2004304135A (en) * | 2003-04-01 | 2004-10-28 | Nikon Corp | Exposure device, exposing method and manufacturing method of micro-device |
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- 2009-02-18 JP JP2009034757A patent/JP2010191127A/en active Pending
- 2009-12-31 CN CN200910265751A patent/CN101807006A/en active Pending
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- 2010-01-25 KR KR1020100006335A patent/KR20100094353A/en not_active Application Discontinuation
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| US20020171816A1 (en) * | 2001-03-23 | 2002-11-21 | Markle David A. | Computer architecture for and method of high-resolution imaging using a low-resolution image transducer |
| JP2003257844A (en) * | 2002-03-07 | 2003-09-12 | M S Tec:Kk | Direct exposure system |
| US20040130561A1 (en) * | 2003-01-07 | 2004-07-08 | Kanti Jain | Maskless lithography with multiplexed spatial light modulators |
| US20060033902A1 (en) * | 2004-08-13 | 2006-02-16 | Asml Holding, N.V. | System and method to compensate for static and dynamic misalignments and deformations in a maskless lithography tool |
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| CN102540755A (en) * | 2010-12-07 | 2012-07-04 | 株式会社日立高科技 | Exposure apparatus, exposure method, and method of making panel substrate for display |
| CN102799073A (en) * | 2011-05-20 | 2012-11-28 | 株式会社日立高科技 | Exposure device, exposure and inspection method, and manufacturing method for substrate of display panel |
| CN109283796A (en) * | 2017-07-21 | 2019-01-29 | 中芯国际集成电路制造(上海)有限公司 | A kind of lithography simulation system |
Also Published As
| Publication number | Publication date |
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| KR20100094353A (en) | 2010-08-26 |
| TW201032004A (en) | 2010-09-01 |
| JP2010191127A (en) | 2010-09-02 |
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Application publication date: 20100818 |