TW201032004A - Exposure device, exposure method, and production method of displaying panel substrates - Google Patents
Exposure device, exposure method, and production method of displaying panel substrates Download PDFInfo
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- TW201032004A TW201032004A TW099102089A TW99102089A TW201032004A TW 201032004 A TW201032004 A TW 201032004A TW 099102089 A TW099102089 A TW 099102089A TW 99102089 A TW99102089 A TW 99102089A TW 201032004 A TW201032004 A TW 201032004A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
Abstract
Description
201032004 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種在液晶顯示器（display)裝置等 顯示用面板基板的製造中，對塗布有光阻（ph0t0_resist) 的基板照射光束，並利用光束來掃描基板，從而在基板上 描繪圖案（pattern)的曝光裝置、曝光方法以及使用這些 曝光裝置和曝光方法的顯示用面板基板的製造方法，尤其 涉及一種使排列在空間光調制器的二方向上的多個反射鏡 動作而對光束進行調制的曝光裝置、曝光方法以及使用這 些曝光裝置和曝光方法的顯示用面板基板的製造方法。 【先前技術】 作為顯不用面板而使用的液晶顯示器裝置的薄膜晶體 管（Thin Film Transistor，TFT)基板或彩色濾光器（⑶⑻ filter)基板、錢（piasma)顯示器面板用基板、有機電 致發光（EleCtr〇luminescence，EL)顯示面板用基板等的 製造是使用曝光裝置’通過微影（ph〇t〇lith〇graphy)技術 在基板上形成圖案而進行。作為曝光裝置，以往有使用透 鏡（lens)或鏡子來將光罩（mask)的圖案投影至基板上 的投影（projection)方式、以及在光罩與基板之間設置微 小的間隙（鄰近間隙，prQximity gap)而將光罩的圖案轉 印至基板的鄰近方式。 近年來’開發出-種對塗布有光阻的基板照射光束， 利用光束來掃描基板，從而在基板上财圖案的曝光裝 置由於是利用光束來掃描基板而在基板上直接描繪圖 201032004 案，因此不需要高價的光I。而且’通過變更描緣數據 (data)以及掃描的程式（prGgmm)，能夠對應多種類的 顯示用面板基板。作為此種曝絲置，例如有專利文獻i、 專利文獻2以及專利文獻3中揭示的曝光裝置。 [專利文獻] [專利文獻1]日本專利特開2003_332221號公報 [專利文獻2]曰本專利特開2〇〇5_353927號公報[Technical Field] The present invention relates to a substrate coated with a photoresist (ph0t0_resist), which is used in the manufacture of a display panel substrate such as a liquid crystal display device, and utilizes a light beam. An exposure apparatus for scanning a substrate, thereby drawing a pattern on a substrate, an exposure method, and a method of manufacturing a display panel substrate using the exposure apparatus and the exposure method, and more particularly to a two-direction arrangement of the spatial light modulator An exposure apparatus that modulates a light beam by a plurality of mirrors, an exposure method, and a method of manufacturing a panel substrate for display using the exposure apparatus and the exposure method. [Prior Art] A Thin Film Transistor (TFT) substrate or a color filter ((3) (8) filter) substrate, a piasma display panel substrate, and an organic electroluminescence (for a liquid crystal display device used for a panel) EleCtr 〇 luminescence, EL) The manufacture of a substrate for a display panel or the like is performed by forming a pattern on a substrate by a lithography technique using an exposure apparatus. As an exposure apparatus, there has been a projection method in which a lens or a mirror is used to project a pattern of a mask onto a substrate, and a small gap is provided between the mask and the substrate (proximity gap, prQximity) Gaps) The manner in which the pattern of the reticle is transferred to the substrate. In recent years, it has been developed to irradiate a light beam on a substrate coated with a photoresist, and to scan the substrate with a light beam, so that the exposure device on the substrate has a pattern of 201032004 directly on the substrate by scanning the substrate with a light beam. No expensive light I is needed. Further, by changing the data and the scanning program (prGgmm), it is possible to correspond to a variety of display panel substrates. As such an exposure wire, there are disclosed, for example, an exposure apparatus disclosed in Patent Document 1, Patent Document 2, and Patent Document 3. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-332221 (Patent Document 2) Japanese Patent Laid-Open Publication No. Hei 2 No. 5-353927
[專利文獻3]日本專利特開2007-219011號公報 如專利文獻1〜3中所揭示者，在對基板照射光束，利 用光束來掃描基板’從而在基板上描繪圖案的曝光裝置 中，是通過數位微鏡元件（Digital Mi_mirw ， DMD)等的空間光調制n來對照射至基板的光束進 制’從而進灯圖案化（patterning)。此時，如果空間光調 制器發生鱗或鋪U等料良狀況，將無法正常進行 圖案的描繪’從而無法獲得所需的圖案形狀。以往是對結 束曝光的基板賴案形狀進行檢查，以制出圖案的描緣 不良’因而有在此_所曝光的基板也會發生 皆 不良的問題。 策 【發明内容】 本發明的課題在於，當通過光束來掃描基板以在基板 =田緣®案時，能夠在早期制出對光束進行調制的空間 制器的不良狀況。而_a_，本發明的課題在於，當通過 光束來掃描基板以在基板上描繪圖案時，即使對光束 調制的空間光調制H的—部分發生不良狀況，也能正常地 201032004 a. 圖案。進而’本發明的課題在於製造高品質 顯示用面板基板。 •本發月的曝光裝置包括：夹盤，支持塗布有光阻的基 、，載物台，移動所述夾盤；以及光束照射裝置包含空 間光調、軸電路以及照射光㈣統，其巾所述空間 ，調制II使排列在二方向上的多個反射鏡動作而對光束進 仃調制，所述驅動電路根據描繪數據來驅動空間光調制 ^，所述照射光學系統照射經空間光調制器調制後的光 、，且藉由載物台來移動夾盤，利用來自光束照射裝置的 光束來掃描基板，從*在基板上減圖案，此曝光裝置包 括.監視機構，監視光束照射裝置的空間光調制器的各反 射鏡的動作；以及描繪控制機構，對光束照射裝置的驅動 電路供給所述描繪數據，根據所供給的描繪數 機構所監視的空間光調制器的各反射鏡的動作，來判^空 間光調制器的各反射鏡是否正常動作。 工 而且，本發明的曝光方法是利用夾盤來支持塗布有光 阻的基板，通過載物台來移動夾盤，利用來自光束照射裝 置的光束來掃描基板’從而在基板上描繪圖案，所述光束 照射裝置包含空間光調制器、驅動電路以及照射光學系 統，其中所述空間光調制器使排列在二方向上&多個1射 鏡動作而對光束進行調制’所述驅動電路根據描繪數據來 驅動空間光調制器’所述照射光學系統照射經Z間光調制 器調制後的光束，此曝光方法中，對找照射&的ς動 電路供給所述描繪數據’監視光束照射裝置的空間光調制 201032004 器的各反射鏡的動作’根據對光束照射裝置的驅動電路供 給的描繪數據與所監視的空間光調制器的各反射鏡的動 作’來判定空間光調制器的各反射鏡是否正常動作。 光束照射裝置的空間光調制器是將反射光束的多個微 小的反射鏡排列在二方向上而構成，驅動電路根據描繪數 據來變更各反射鏡的角度，由此對照射向基板的光束進行 調制。經空間光調制器調制後的光束從光束照射裝置的包 φ 含照射光學系統的頭部照射至由夹盤所支持的基板《對光 束照射裝置的驅動電路供給所述描繪數據，監視光束照射 裝置的空間光調制器的各反射鏡的動作，並根據對光束照 射裝置的驅動電路所供給的描繪數據與所監視的空間光調 y器的各反射鏡的動作，來判定空間光調制器的各反射鏡 是否正常動作’因此能夠在早期制出對光束進行調制的 空間光調制器的不良狀況。 鲁 進而，本發明的曝光裝置中，光束照射裝置的空間光 調制器將反射鏡由關姿勢改騎開姿勢輯絲進行調 制’監視機構包括：對由打開姿勢的反射鏡所反射的光束 進仃分支的分支麟；較絲的各像素對應於空間光調 制器的各反射鏡而配置的攝職置；以及使由分支機構所 分支的光束在攝影裝置的受光面上成像的機構。而且，本 ^明的曝光方法中，將光束照射裝置的空間光調制器的反 鏡由關閉妾勢改為打開姿勢而對光束進行調制由 ，姿勢的反射鏡所反㈣光束進行分支，使所分支的光束 在將受光面的各像素制於㈣的各反射鏡而配 201032004 置的攝影裝置的受光面上成像，以監視空間光調制器的各 反射鏡_作。崎開姿勢岐射鏡所反射的光束被照射 向光束照射I置的包含照射光學純_部，並從頭部照 射向由夾盤所支持的基板。對㈣打開姿勢的反射鏡所反 射的光束進行分支，並使所分支的光束在較絲的各像 ，對應於空間光卿器的各反射鏡而配置的攝影裝置的受 光面上成像，由此能夠容易地監視空間光調制器的各反射 鏡的動作。 ，者，本發明的曝光裝置中，光束照射裝置的空間光 調制器將反射鏡由關姿勢改為打開姿勢而㈣束進行調 制，且監視機構包括：將受光面的各像素對應於空間光調 制器的各反射鏡而配置的攝影裝置；以及使由關閉姿勢的 反射鏡所反射的光束在攝影裝置的受光面上成像的機構。 而且，本發明的曝光方法中，將光束照射裝置的空間光調 制器的反射鏡由關閉姿勢改為打開姿勢而對光束進行調 制，使由關閉姿勢的反射鏡所反射的光束在將受光面的各 像素對應於空間光調制器的各反射鏡而配置的攝影裝置的 受光面上成像，以監視空間光調制器的各反射鏡的動作。 由關閉姿勢的反射鏡所反射的光束偏離光束照射裝置的包 含照射光學系統的頭部的方向，而不照射至由夾盤所支持 的基板。使由該關閉姿勢的反射鏡所反射的光束在將受光 面的各像素對應於空間光調制器的各反射鏡而配置的攝影 裝置的受光面上成像，由此能夠容易地監視空間光調制= 的各反射鏡的動作。 ° 201032004 照射發明的曝絲置中，描緣控制機構根據光束 而贺你φ 1間光調制器的各反射鏡的動作的判定純果 製作出_因未正常動作的反射鏡所造成的光 j 遺漏來進行插彳當& _ & 束的知描的 動雷_ _據，並供給至光束照射裝置的驅 電路。而且，本發明的曝光方法中，根據光 的空間光調制器的各反射鏡的動作的判定結果， 對因未正常動作的反射鏡所造成的As disclosed in Patent Documents 1 to 3, in an exposure apparatus that irradiates a substrate with a light beam and scans the substrate with a light beam to draw a pattern on the substrate, it is passed. The spatial light modulation n of a digital micromirror element (Digital Mi_mirw, DMD) or the like is used to pattern the light beam that is irradiated onto the substrate. At this time, if the spatial light modulator is in a good condition such as a scale or a U, it is impossible to perform the drawing of the pattern normally, and the desired pattern shape cannot be obtained. In the past, the shape of the substrate to be exposed and exposed was examined to make the pattern of the pattern poor, and thus the substrate to be exposed was also defective. SUMMARY OF THE INVENTION An object of the present invention is to provide a problem in a spacecraft that modulates a light beam at an early stage when a substrate is scanned by a light beam to be used in a substrate=Tianyuan® case. Further, _a_, the problem of the present invention is that when a substrate is scanned by a light beam to draw a pattern on a substrate, even if a problem occurs in the portion of the spatial light modulation H modulated by the light beam, the pattern can be normally 201032004 a. Further, the subject of the present invention is to manufacture a panel substrate for high quality display. The exposing device of the present month includes: a chuck supporting a substrate coated with a photoresist, a stage, and moving the chuck; and the beam irradiation device includes a spatial light adjustment, a shaft circuit, and an illumination light (four) system, the towel In the space, the modulation II causes a plurality of mirrors arranged in two directions to modulate the light beam, and the driving circuit drives the spatial light modulation according to the drawing data, and the illumination optical system illuminates the spatial light modulator The modulated light, and the chuck is moved by the stage, the substrate is scanned by the light beam from the beam irradiation device, and the pattern is subtracted from the substrate. The exposure device includes a monitoring mechanism for monitoring the space of the beam irradiation device. The operation of each of the mirrors of the light modulator; and the drawing control means for supplying the drawing data to the driving circuit of the light beam irradiation device, and based on the operation of each of the mirrors of the spatial light modulator monitored by the supplied number of drawing means It is determined whether the mirrors of the spatial light modulator operate normally. Moreover, the exposure method of the present invention uses a chuck to support a substrate coated with a photoresist, moves the chuck through the stage, and scans the substrate 'with a light beam from the beam irradiation device to draw a pattern on the substrate. The beam illuminating device includes a spatial light modulator, a driving circuit, and an illuminating optical system, wherein the spatial light modulator aligns the light beams by arranging two mirrors in two directions, and the driving circuit is based on the drawing data To drive the spatial light modulator, the illumination optical system illuminates the light beam modulated by the Z-to-light modulator, and in the exposure method, the drawing data is supplied to the tilting circuit of the seek illumination & The operation of each mirror of the light modulation 201032004 'determines whether the mirrors of the spatial light modulator are normal based on the drawing data supplied to the driving circuit of the beam irradiation device and the operation of each mirror of the monitored spatial light modulator' action. The spatial light modulator of the beam irradiation device is configured by arranging a plurality of minute mirrors of the reflected light beam in two directions, and the drive circuit modulates the angle of each of the mirrors based on the drawing data, thereby modulating the light beam that is irradiated onto the substrate. . The light beam modulated by the spatial light modulator is irradiated from the head of the beam irradiation device including the illumination optical system to the substrate supported by the chuck. "The drawing data is supplied to the driving circuit of the beam irradiation device, and the monitoring beam irradiation device is provided. The operation of each mirror of the spatial light modulator determines the respective spatial light modulators based on the drawing data supplied to the driving circuit of the beam irradiation device and the operation of each mirror of the monitored spatial light modulator Whether the mirror is operating normally' is therefore a disadvantage of the spatial light modulator that modulates the beam at an early stage. Further, in the exposure apparatus of the present invention, the spatial light modulator of the beam irradiation device modulates the mirror from the closed posture to the riding posture, and the monitoring mechanism includes: moving the light beam reflected by the mirror in the open posture. a branched branch of a branch; a photo-position disposed corresponding to each mirror of the spatial light modulator; and a mechanism for imaging a light beam branched by the branching mechanism on a light-receiving surface of the photographing device. Further, in the exposure method of the present invention, the mirror of the spatial light modulator of the beam irradiation device is changed from the closed pupil to the open posture to modulate the light beam, and the mirror of the posture is branched (four), and the light beam is branched. The branched beam is imaged on the light-receiving surface of the photographing device of 201032004, in which each pixel of the light-receiving surface is formed in each of the mirrors of (4), to monitor each mirror of the spatial light modulator. The light beam reflected by the mirror in the open position is irradiated to the light beam containing the illumination optical pure portion, and is irradiated from the head to the substrate supported by the chuck. Splitting the light beam reflected by the mirror in the (4) open posture, and imaging the branched light beam on the light-receiving surface of the photographing device disposed corresponding to each mirror of the spatial lighter The operation of each mirror of the spatial light modulator can be easily monitored. In the exposure apparatus of the present invention, the spatial light modulator of the light beam irradiation device modulates the mirror from the off position to the open position and (4) the beam, and the monitoring mechanism includes: each pixel of the light receiving surface corresponds to spatial light modulation A photographing device disposed with each of the mirrors of the device; and a mechanism for imaging a light beam reflected by the mirror in the closed posture on the light receiving surface of the photographing device. Further, in the exposure method of the present invention, the mirror of the spatial light modulator of the light beam irradiation device is changed from the closed posture to the open posture to modulate the light beam, and the light beam reflected by the mirror in the closed posture is on the light receiving surface. Each pixel is imaged on the light receiving surface of the imaging device disposed corresponding to each of the mirrors of the spatial light modulator to monitor the operation of each of the mirrors of the spatial light modulator. The light beam reflected by the mirror in the closed posture deviates from the direction of the head of the light beam illuminating device including the illuminating optical system without being irradiated to the substrate supported by the chuck. The light beam reflected by the mirror in the closed posture is formed on the light-receiving surface of the imaging device in which each pixel of the light-receiving surface is disposed corresponding to each of the mirrors of the spatial light modulator, whereby the spatial light modulation can be easily monitored. The action of each mirror. ° 201032004 In the exposure wire of the invention, the stroke control mechanism determines the operation of each mirror of the φ1 optical modulator according to the light beam, and produces the light caused by the mirror that is not normally operated. Missing is used to insert the & _ & beam of the known ray and is supplied to the drive circuit of the beam illuminating device. Further, in the exposure method of the present invention, the result of the determination of the operation of each of the mirrors of the spatial light modulator of the light is caused by the mirror which is not normally operated.
==·數據，並供給至光束照射二==進 進行補的”光_11的—料反射鏡發生 (’况’也可以通過其他反射鏡來補償光束的掃描的遺 漏，從而能夠正常進行圖案的描繪。 本發明的顯示用面板基板的製造方法是使用上述的任 二種曝光裝置或曝光方法來進行基板的曝光。藉由使用上 述的曝光裝置或曝光方法，能夠防止因空間光調制器的不 良狀況造成的圖案的描繪不良，因此能夠製造高品質的顯 示用面板基板。 【發明的效果】 根據本發明的曝光裝置以及曝光方法，對光束照射裝 置的驅動電路供給描繪數據，監視光束照射裝置的空間光 調制器的各反射鏡的動作，並根據對光束照射裝置的驅動 電路所供給的描繪數據與所監視的空間光調制器的各反射 鏡的動作’來判定空間光調制器的各反射鏡是否正常動 作’由此能夠在早期檢測出對光束進行調制的空間光調制 器的不良狀況。 201032004 -· · »' 進而，根據本發明的曝光裝置以及曝光方法，將光束 照射裝置的空間光調制器的反射鏡由關閉姿勢改為打開姿 勢而對光束進行調制，對由打開姿勢的反射鏡所反射的光 束進行刀支並使所分支的光束在將受光面的各像素對鹿 於空間光調制器的各反射鏡而配置的攝影裝置的受光面: 成像，由此能夠容易地監視空間光調制器的各反射鏡的 作。 或者，根據本發明的曝光裝置以及曝光方法，將光束 照射裝置的空間細制器的反射鏡由關姿勢改為打料 _ 勢而對光束進行調制，使由關閉姿勢的反射鏡所反射的光 束在將受光面的各像素對應於空間光調制器的各反射鏡而 配置的攝影裝置的受光面上成像，由此能夠容易地杜 間光調制器的各反射鏡的動作。 |工 進而，根據本發明的曝光裝置以及曝光方法，根據光 束照射裝置的空間光調制器的各反射鏡的動作的判定結 果，而製作出對因未正常動作的反射鏡所造成的光束的掃 描的遺漏來進行補償的描繪數據，並供給至光束照射裝置 的驅動電路，由此，即使對光束進行調制的空間光調制器 ® 的一部分反射鏡發生不良狀況，也能夠正常進行圖案的^ 繪。 根據本發明的顯示用面板基板的製造方法，能夠防止 因空間光調制器的不良狀況造成的圖案的描綠不良因此 能夠製造高品質的顯示用面板基板。 為讓本發明之上述和其他目的、特徵和優點能更明顯 10 201032004 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 圖1是表示本發明的一實施方式的曝光裝置的概略構 成的圖。而且，圖2是本發明的一實施方式的曝光裝置的 侧面圖，圖3是本發明的一實施方式的曝光裝置的正面 圖。本實施方式表示了以鄰近方式的曝光而在基板上形成 的基底圖案之上對新的圖案進行曝光的曝光裝置的示例。 曝光裝置包括底座(base)3、X導向器(guide)4、x載物台5、==·Data, and supply to the beam irradiation two == to make up the "light_11" material mirror occurs ('conditions' can also compensate for the omission of the scanning of the beam by other mirrors, so that the pattern can be normal The method for producing a panel substrate for display according to the present invention is to expose the substrate by using any of the above-described exposure apparatuses or exposure methods. By using the above-described exposure apparatus or exposure method, it is possible to prevent the spatial light modulator from being used. In the exposure apparatus and the exposure method of the present invention, the drawing data is supplied to the drive circuit of the light beam irradiation device, and the light beam irradiation device is monitored. The operation of each mirror of the spatial light modulator determines the reflection of the spatial light modulator based on the drawing data supplied to the driving circuit of the beam irradiation device and the operation of each mirror of the monitored spatial light modulator. Whether the mirror is in normal operation', thereby enabling early detection of spatial light modulation that modulates the beam In addition, according to the exposure apparatus and the exposure method of the present invention, the mirror of the spatial light modulator of the light beam irradiation device is changed from the closed position to the open position to modulate the light beam. The light beam reflected by the mirror in the open posture is subjected to a knife branch, and the branched light beam is imaged by the light receiving surface of the imaging device in which the pixels on the light receiving surface are disposed on the respective mirrors of the spatial light modulator. Easily monitor the operation of each mirror of the spatial light modulator. Or, according to the exposure apparatus and the exposure method of the present invention, the mirror of the space finer of the beam irradiation apparatus is changed from the closed position to the shot _ potential and the light beam Modulation, the light beam reflected by the mirror in the closed posture is imaged on the light-receiving surface of the imaging device in which each pixel of the light-receiving surface is arranged corresponding to each of the mirrors of the spatial light modulator, whereby the light can be easily dull The operation of each of the mirrors of the modulator. Further, according to the exposure apparatus and the exposure method of the present invention, the spatial light according to the beam irradiation apparatus As a result of the determination of the operation of each of the mirrors, the drawing data for compensating for the omission of the scanning of the light beam by the mirror that is not normally operated is created and supplied to the driving circuit of the beam irradiation device. Even if a part of the mirror of the spatial light modulator® that modulates the light beam is defective, the pattern can be normally drawn. According to the method for manufacturing the panel substrate for display of the present invention, it is possible to prevent the malfunction of the spatial light modulator. The above-described and other objects, features and advantages of the present invention can be made more apparent by the poor greening of the pattern caused by the situation. The above and other objects, features and advantages of the present invention will become more apparent. 10 201032004 is easy to understand, and the preferred embodiment is exemplified below. The drawings are described in detail below. [Embodiment] FIG. 1 is a view showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of an exposure apparatus according to an embodiment of the present invention, and FIG. 3 is a front view of an exposure apparatus according to an embodiment of the present invention. The present embodiment shows an example of an exposure apparatus that exposes a new pattern over a substrate pattern formed on a substrate by exposure in an adjacent manner. The exposure device includes a base 3, an X guide 4, an x stage 5,
Y導向器6、Y載物台7、θ載物台8、夾盤(chuck)l〇、閘 門（gate) 11、光束照射裝置2〇、線性標度（LinearScale) 31、33、編碼器（eneGder) 32、34、雷射測長系統、雷射 測長系統控制裝置40、行駛誤差檢測電路牝、圖像處理裝 置48、53、溫度調節裝置5G、位置檢測電路54、載物台 驅動電路60、主控制裝置7〇以及顯示裝置8〇而構成。另 圖2以及圖3中’省略了雷射測長系統的雷射光源小 '射測長线控職置4G、行駛誤差檢測電路#、圖像處 ^置48 ' 53 '溫度襄置5()、位置檢測電路％、載 =台驅動電路60、主控制裝置7G以及齡裝置⑽。曝光 襄置除了上述部分⑽’還具備基板搬送顧人（r〇b〇t) 以及進行裝置㈣溫度管理的溫度控制單元（她）等。 -另外，以下所說明的實施方式中的XY方向僅為例 不’也可將X方向與Y方向調換。 在圖1以及圖2中，夾盤1G位於進行基板1的交接的 11 201032004 ——~ ~ — r· — 。在交接位置上，藉由未圖示的基板搬送機器人 將土板1搬人㈣1G，並藉由未圖示的基板搬送機器人 而將基板1自夾盤10搬出。夾盤⑴真空吸附地支持該基 板1的背^在基板丨的表面上^以鄰近方式的曝光所 开〉成的基底圖案之上塗布有光阻。Y guide 6, Y stage 7, θ stage 8, chuck, gate 11, beam irradiation device 2, linear scale 31, 33, encoder ( eneGder) 32, 34, laser length measuring system, laser length measuring system control device 40, driving error detecting circuit 牝, image processing device 48, 53, temperature adjusting device 5G, position detecting circuit 54, and stage driving circuit 60. The main control unit 7〇 and the display unit 8〇 are configured. In Fig. 2 and Fig. 3, the laser light source with the laser length measuring system is omitted, the long line control position 4G, the driving error detection circuit #, and the image position 48' 53 'temperature setting 5 ( ), position detection circuit %, carrier = stage drive circuit 60, main control unit 7G, and age device (10). In addition to the above-described portion (10)', the exposure device further includes a substrate transfer person (r〇b〇t) and a temperature control unit (her) for performing device (4) temperature management. Further, in the embodiment described below, the XY direction is merely an example, and the X direction and the Y direction may be reversed. In Fig. 1 and Fig. 2, the chuck 1G is located at 11 201032004 - ~ ~ - r · - which performs the transfer of the substrate 1. At the delivery position, the soil plate 1 is moved (4) 1G by a substrate transfer robot (not shown), and the substrate 1 is carried out from the chuck 10 by a substrate transfer robot (not shown). The chuck (1) vacuum-adsorbs the back of the substrate 1 on the surface of the substrate, and is coated with a photoresist on the substrate pattern formed by the adjacent exposure.
在進行基板1的曝光之曝光位置的上空，跨越底座3 而設有閘Η 11。在關U上搭載著多個光束照射裝置2〇。 另外，本實施方式表示了使用8個光束照射裝置20的曝光 裝置的示例，但光束照射裝置的數量並不限於此，也可以 使用小於等於7個或大於等於9個光束照射裝置。A gate 11 is provided across the base 3 in the upper position of the exposure position at which the exposure of the substrate 1 is performed. A plurality of light beam irradiation devices 2 are mounted on the U. Further, the present embodiment shows an example of an exposure apparatus using eight light beam irradiation devices 20. However, the number of light beam irradiation devices is not limited thereto, and seven or more light beam irradiation devices may be used.
圖4疋表示光束照射裝置的一例的概略構成的圖。光 束照射裝置20包括光纖22、透鏡23、反射鏡24、DMD (Digital Micro-mirror Device，數位微鏡元件）25、投影透 鏡26、DMD驅動電路27、半透反射鏡（half mirr〇r) ^、 成像透鏡82a、攝影裝置84a以及圖像處理裝置85而構 成。光纖22將從雷射光源單元21發生的紫外光的光束導 入光束照射裝置20内。從光纖22射出的光束經由透鏡23 以及反射鏡24而照射至DMD25。DMD25是將反射光束 的多個微小的反射鏡排列在二方向上而構成的空間光調制 器，將反射鏡由關閉姿勢改為打開姿勢而對光束進行調 制。DMD驅動電路27根據從主控制裝置70所供給的描 繪數據來變更DMD25的各反射鏡的角度。 圖5是表示DMD的描繪用區域的圖。在二方向上排 列有多個反射鏡25a的DMD25的表面被分割為通常描綠 12 201032004 用區域與補正描繪用區域。位於通常描繪用區域中的各反 射鏡25a是用於通常的圖案描繪。位於補正描緣用區域中 的各反射鏡25a如後所述般是用於當位於通常描繪用區域 中的反射鏡未正常動作時，對因未正常動作的反射鏡造成 的光束的掃描的遺漏來進行補償。另外，通常描螬·用區域 與補正描繪用區域的配置可根據光束對基板1的掃描方向 而交替地變化。 ❹ 在圖4中，由DMD25的打開姿勢的反射鏡所反射的 光束被照射向半透反射鏡81。半透反射鏡81將由打開姿 勢的反射鏡所反射的光束分支成透過光與反射光。透過半 透反射鏡81的光束被照射向包含投影透鏡26的頭部 20a，並從頭部20a照射向基板1。由DMD25的關閉姿勢 的反射鏡所反射的光束偏離半透反射鏡81以及頭部20a 的方向，而不照射向基板1。 由半透反射鏡81所反射的光束被照射向成像透鏡 82a，通過成像透鏡82a而收聚’從而在攝影裝置84a的受 ❿ 光面上成像。在攝影裝置84a的受光面上，對應於DMD25 的各反射鏡而配置有各像素，攝影裝置84a接收由半透反 射鏡81所反射的光束，而輸出圖像信號。圖像處理裝置 85對攝影裝置84a所輸出的圖像信號進行處理，以檢測 DMD25的各反射鏡25a的姿勢。 將DMD25的反射鏡25a由關閉姿勢改為打開姿勢而 對光束進行調制，對由打開姿勢的反射鏡所反射的光束進 行分支，並使所分支的光束在將受光面的各像素對應於 13 201032004 DMD25的各反射鏡25a而配置的攝影裝置84a的受光面上 成像，由此容易監視DMD25的各反射鏡25a的動作。 圖6是表示光束照射裝置的另一例的概略構成的圖。 光束照射裝置20包括光纖22、透鏡23、反射鏡24、 DMD25、投影透鏡26、DMD驅動電路27、成像透鏡82b、 衰減透過濾光器83、攝影裝置84b以及圖像處理裝置85 而構成。光纖22、透鏡23、反射鏡24、DMD25、投影透 鏡26以及DMD驅動電路27與圖4所示的示例相同。 由DMD25的打開姿勢的反射鏡所反射的光束被照射 向包含投影透鏡26的頭部20a，並從頭部20a照射向基板 1°由DMD25的關閉姿勢的反射鏡所反射的光束被照射向 成像透鏡82b ’且通過成像透鏡82b而收聚，從而在攝影 裝置84b的受光面上成像。在成像透鏡82b與攝影裝置84b 之間’設有衰減透過濾光器83，衰減透過濾光器83對由 攝影裝置84b所受光的光束的強度進行調節。在攝影裝置 84b的受光面上，對應於DMD25的各反射鏡而配置有各 像素’攝影裝置84b接收由關閉姿勢的反射鏡所反射的光 束’從而輸出圖像信號。圖像處理裝置85對攝影裝置84b 所輸出的圖像信號進行處理，以檢測DMD25的各反射鏡 的姿勢。 將DMD25的反射鏡25a由關閉姿勢改為打開姿勢而 對光束進行調制，並使由關閉姿勢的反射鏡所反射的光束 在將受光面的各像素對應於DMD25的各反射鏡25a而配 置的攝影裝置84b的受光面上成像’由此容易監視DMD25 201032004 的各反射鏡25a的動作。 參 ❹ 在Θ載物台3二：是搭載於β載物台8上， 物台5搭載於底座;载物台5。又載 器4而朝向X方向純ν:Χ 一向器4上’沿著X導向 所設的Υ導向器6上，;載7巧於X載物台5上 動。㊀裁物台8搭载於γ:::¥向盗6而朝向Υ方向移 通過e载物二8的朝6 D 7上且朝向θ方向旋轉。 上的基板!以正;的方向的旋轉，搭載於夾盤Η) 轉。通過X载物么5 σ Χ方向以及Υ方向的方式旋 Ϊ = ί 曝紐二。mm t ^ ^ :==光束所造成 電路60進行控制，以進1 行中^^制裝置7G對載物台驅動 X鸯⑽載物台8的朝向θ方向的旋轉、 的朝向χ方向的移動以及γ— 伸的2乂’在底座3上設置有朝向χ方向延 2 在線性標度31上，刻有用於檢測X載 ，口J的朝向X方向的移動量的刻度。而且，在χ載物台 上設置有朝向Υ方向延伸的線性標度33。在線性標度33 上，刻有用於檢測γ載物台7的朝向γ方向的移動量的刻 15 201032004 ——t— 度。4A is a view showing a schematic configuration of an example of a light beam irradiation device. The beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micro-mirror Device) 25, a projection lens 26, a DMD driving circuit 27, and a half mirror (half mirr〇r). The imaging lens 82a, the imaging device 84a, and the image processing device 85 are configured. The optical fiber 22 guides the light beam of the ultraviolet light generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 via the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator in which a plurality of minute mirrors of a reflected beam are arranged in two directions, and the beam is modulated by changing the mirror from the closed position to the open position. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main control unit 70. FIG. 5 is a view showing a drawing area of the DMD. The surface of the DMD 25 in which the plurality of mirrors 25a are arranged in the two directions is divided into a region for normal greening 12 201032004 and a region for correcting drawing. Each of the reflecting mirrors 25a located in the normal drawing area is used for normal pattern drawing. Each of the mirrors 25a located in the region for correcting the stroke is used for the omission of the scanning of the light beam due to the mirror that is not normally operated when the mirror located in the normal drawing region is not normally operated, as will be described later. To compensate. Further, the arrangement of the normal drawing area and the correction drawing area can be alternately changed in accordance with the scanning direction of the light beam on the substrate 1.图 In Fig. 4, the light beam reflected by the mirror of the open posture of the DMD 25 is irradiated to the half mirror 81. The half mirror 81 branches the light beam reflected by the mirror of the open posture into transmitted light and reflected light. The light beam transmitted through the half mirror 81 is irradiated toward the head portion 20a including the projection lens 26, and is irradiated from the head portion 20a toward the substrate 1. The light beam reflected by the mirror of the closed posture of the DMD 25 is deviated from the direction of the half mirror 81 and the head 20a without being irradiated to the substrate 1. The light beam reflected by the half mirror 81 is irradiated toward the imaging lens 82a, and is collected by the imaging lens 82a' to be imaged on the light-receiving surface of the photographing device 84a. On the light-receiving surface of the photographing device 84a, each pixel is disposed corresponding to each of the mirrors of the DMD 25, and the photographing device 84a receives the light beam reflected by the semi-transmissive mirror 81 to output an image signal. The image processing device 85 processes the image signal output from the imaging device 84a to detect the posture of each of the mirrors 25a of the DMD 25. The mirror 25a of the DMD 25 is changed from the closed position to the open position to modulate the light beam, and the light beam reflected by the mirror in the open posture is branched, and the branched light beam is corresponding to each pixel of the light receiving surface 13 201032004 The light-receiving surface of the imaging device 84a disposed on each of the mirrors 25a of the DMD 25 is imaged, whereby the operation of each of the mirrors 25a of the DMD 25 is easily monitored. Fig. 6 is a view showing a schematic configuration of another example of the light beam irradiation device. The beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD 25, a projection lens 26, a DMD drive circuit 27, an imaging lens 82b, an attenuation filter 83, a photographing device 84b, and an image processing device 85. The optical fiber 22, the lens 23, the mirror 24, the DMD 25, the projection lens 26, and the DMD drive circuit 27 are the same as the example shown in Fig. 4. The light beam reflected by the mirror of the open posture of the DMD 25 is irradiated toward the head portion 20a including the projection lens 26, and is irradiated from the head portion 20a toward the substrate 1°. The light beam reflected by the mirror in the closed posture of the DMD 25 is irradiated to the imaging lens. 82b' is collected by the imaging lens 82b to be imaged on the light receiving surface of the photographing device 84b. An attenuation filter 83 is provided between the imaging lens 82b and the imaging device 84b, and the attenuation filter 83 adjusts the intensity of the light beam received by the imaging device 84b. On the light-receiving surface of the photographing device 84b, each pixel 'photographing device 84b receives the light beam reflected by the mirror in the closed posture, corresponding to each of the mirrors of the DMD 25, and outputs an image signal. The image processing device 85 processes the image signal output from the imaging device 84b to detect the posture of each mirror of the DMD 25. The mirror 25a of the DMD 25 is changed from the closed position to the open position to modulate the light beam, and the light beam reflected by the mirror in the closed posture is placed corresponding to each of the mirrors 25a of the DMD 25 in the respective pixels of the light receiving surface. The imaging on the light-receiving surface of the device 84b is thus easy to monitor the operation of each of the mirrors 25a of the DMD 25 201032004.参 ❹ On the Θ stage 3 2: mounted on the β stage 8, the stage 5 is mounted on the base, and the stage 5 is mounted. Further, the carrier 4 is oriented toward the X direction, pure ν: Χ on the directional guide 4, which is guided along the X guide, and is loaded on the X stage 5. The one cutting table 8 is mounted on the γ:::¥ to the thief 6 and is moved in the direction of the 通过. The e-loaded object 8 is rotated toward the θ direction toward the 6D 7 . The upper substrate is rotated in the direction of the positive direction; Rotate = ί by the X-loaded 5 σ Χ direction and the Υ direction. Mm t ^ ^ :== The circuit 60 is controlled by the light beam to move in the direction of the χ direction of the rotation of the stage drive X 鸯 (10) stage 8 in the direction of the θ direction by the device 7G. And the γ-extended 2乂' is provided on the base 3 with a directional delay 2 on the linear scale 31, and is marked with a scale for detecting the amount of movement of the port J in the X direction. Further, a linear scale 33 extending in the Υ direction is provided on the cymbal stage. On the linear scale 33, a moment 15 201032004 - t - degrees for detecting the amount of movement of the gamma stage 7 in the γ direction is engraved.
在圖1以及圖3中，在X載物台5的-侧面上，與線 性標度相向地絲有編碼器32。編碼器32檢測線性標 度31的刻度’並將脈衝（pulse)信號輸出至主控制裝置 70。而且，在圖i以及圖2中，在γ载物台7的一侧面上， 與線性標度33相向地安裝有編碼器％。編碼器料檢測線 性標度33的刻度，並將脈衝信號輸出至主控制裝置％。 主控制裝置70對編碼器32的_信號進行計數（議〇, 以檢測X，物台5的朝向χ方向的移動量，並對編碼器 34的脈衝诚進行計數，以檢測γ載物台7的朝向γ方 向的移動量。 圖7是說明雷射測長系統的動作的圖。另外，在圖 中’痛略了圖1所示的閘門u、光束照射裝置2〇、圖像) 理裝置48、53、溫度調節裝置5()、位置檢測電路54以 顯示裝置8G。雷_長聽是公知㈣軒涉式的測長 統’包括雷射光源41、雷射干涉儀42、44以及棒狀反 鏡（⑻milT〇r) 43、45而構成。棒狀反射鏡43安裝在 盤10的Y方向的-侧面上。而且，棒狀反射鏡衫安裝: 炎盤10的X方向的一側面上。 雷射干涉儀42將來自雷射光源^的雷射照射向 反射鏡43 ’並接收由棒狀反射鏡43所反射的雷射， 定來自雷射光源41的雷射與轉狀反射鏡43所反射雷 射的干涉。該測定是在γ方向的2處來進行。f射測長^ 統控制裝置4G通過主控織置％的控制，根據雷射干ς 16 201032004 儀42的測定結果來檢測通過X載物台5而移動的失盤1〇 的X方向的位置以及旋轉。 另一方面，雷射干涉儀44將來自雷射光源41的雷射 照射至棒狀反射鏡45 ’並接收由棒狀反射鏡45所反射的 雷射’以測定來自雷射光源41的雷射與由棒狀反射鏡衫 所反射的雷射的干涉。雷射測長系統控制裝置4〇通過主控 制裝置70的控制’根據雷射干涉儀44的測定結果來檢測 通過X載物台5而移動的夾盤1〇的γ方向的位置。 行駛誤差檢測電路46根據雷射測長系統控制裝置4〇In Figs. 1 and 3, on the side surface of the X stage 5, an encoder 32 is threaded toward the linear scale. The encoder 32 detects the scale ' of the linear scale 31' and outputs a pulse signal to the main control unit 70. Further, in FIGS. 1 and 2, the encoder % is attached to the one side of the gamma stage 7 so as to face the linear scale 33. The encoder material detects the scale of the linear scale 33 and outputs the pulse signal to the main control unit %. The main control unit 70 counts the _ signal of the encoder 32 (to detect X, the amount of movement of the object table 5 in the χ direction, and counts the pulse of the encoder 34 to detect the gamma stage 7 Fig. 7 is a view for explaining the operation of the laser length measuring system. In addition, in the figure, the shutter u, the beam irradiating device 2, and the image shown in Fig. 1 are painfully omitted. 48, 53, temperature adjusting device 5 (), position detecting circuit 54 to display device 8G. Ray _ long-sounding is well-known (four) Xuan-style measuring system </ RTI> includes a laser light source 41, a laser interferometer 42, 44 and a rod mirror ((8) milT〇r) 43, 45. The rod mirror 43 is mounted on the side of the disk 10 in the Y direction. Further, the rod mirror shirt is mounted on one side of the X-direction of the disk 10. The laser interferometer 42 illuminates the laser light from the laser source to the mirror 43' and receives the laser reflected by the rod mirror 43, and the laser and the mirror 43 from the laser source 41 The interference of the reflected laser. This measurement was performed at two places in the γ direction. The f-shooting control device 4G controls the position of the X-direction of the lost disk 1 moved by the X stage 5 based on the measurement result of the laser dryness 16 201032004 by the control of the master control weave 4G and Rotate. On the other hand, the laser interferometer 44 irradiates the laser light from the laser light source 41 to the rod mirror 45' and receives the laser reflected by the rod mirror 45 to measure the laser light from the laser light source 41. Interference with a laser reflected by a rod mirror. The laser length measuring system control device 4 detects the position of the chuck 1 in the gamma direction moved by the X stage 5 based on the measurement result of the laser interferometer 44 by the control of the main control unit 70. The travel error detecting circuit 46 is based on the laser length measuring system control device 4〇
的檢測結果，來檢測X載物台5朝向X方向移動時的左右 搖擺或偏航（yawing)等的行駛誤差。通過使用雷射測長 系統來檢測夾盤10的位置，能夠精度良好地檢測夾盤1〇 的位置，因此能夠精度良好地檢測X載物台5的行駛誤 差。行駛誤差檢測電路46將檢測結果輸出至主控制裝置 70 ° 在圖1中，在底座3的前方設置著溫度調節裝置％。 通常，基板1通過前步驟中的處理而溫度會有所上升或下 降’因此必須在進行曝光之前騎基板丨的冷卻或加溫。 ^示的基板搬送機ϋ人在將基板〗搬人失盤1()之前將 基板1搬入溫度調節裝置50，再將通過溫度調節 而調節了溫度的基板i搬人錢1G。溫度調節裝置％ 進打夾盤1G上所搭載的基板丨的曝光的_，搭載下一次 ^3ί板1，以調節基板1的溫度。本實施方式中， 將基板i的表面分隔為鄰近方式來進行曝光的各發射 17 201032004 s— (Shot)分區，在通過溫度調節裝置5〇來調節基板丨的溫 度的期間，檢測各發射的基底圖案的對準標記的位置以 檢測每個各發射分區的基底圖案的位置，並根據每個各發 射分區的基底圖案的位置，而製作向光束照射裝置20的 DMD驅動電路27供給的描繪數據。 圖8是表示基板的對準標記的圖。圖8表示了由丄片 基板製造4片顯示用面板基板的示例。在基板1的表面的 四角上，設有用於檢測基板1的位置以及旋轉的全局 (global)對準標記GAM。而且，在基板1的表面上，通 © 過4次發射而形成著4個基底圖案2a、2b、2c、2d。在基 底圖案2a、2b、2c、2d中，分別各設有4個用於檢測基底 圖案2a、2b、2c、2d的位置、旋轉以及大小的發射(sh〇t) 對準標記 SAMa、SAMb、SAMc、SAMd。 圖9 (a)是溫度調節裝置的俯視圖，圖9 (b)是溫度 調節裝置的側面圖。如圖9 (a)、（b)所示般，在溫度 調節裝置50的上空’在基板1的全局對準標記GAM的正 上方的位置處’設置著電荷耦合器件（Charge Coupled θ Device，CCD)相機51。CCD相機51獲取全局對準標記 GAM的圖像，並將圖像信號輸出至圖1的圖像處理裝置 53。而且，在溫度調節裝置50的上空，在基板1的發射對 準標記SAMa、SAMb、SAMc、SAMd的正上方的位置處， 設置著 CCD 相機 52a、52b、52c、52d。CCD 相機 52a、 52b、52c、52d分別獲取發射對準標記SAMa、SAMb、 SAMc、SAMd的圖像，並將圖像信號輸出至圖1的圖像處 18 201032004 理裝置53。 在圖1中，圖像處理裝置53對CCD相機51所輸出 的圖像信號進域理，以⑹肢局對準標記（遍的位 置。位置檢測電路54根據圖像處理裝置53所檢測出的全 局對準標記GAM的位置，而檢測溫度調節裝置5〇上所搭 載的基板1的位置以及旋轉。而且，圖像處理裝置53對 CCD相機52a、52b、52c、52d所輸出的圖像信號進行處 理’以檢測各發射對準標記SAMa、SAMb、SAMc、SAMd 的位置。位置檢測電路54根據所檢測出的基板丨的位置以 及旋轉與圖像處理裝置53所檢測出的發射對準標記 SAMa、SAMb、SAMc、SAMd的位置，來檢測基底圖案 2a、2b、2c、2d在基板！内的位置、旋轉以及大小。使用 各發射的基底圖案2a、2b、2e、2d上所設的發射對準標記 SAMa、SAMb、SAMe、SAMd，通·像處理，從而精度 良好地檢測出各發射的基底圖案2a、2b、2c、2d在基板i a圖10是處於交接位置的夾盤的俯視圖。而且，圖u 是處於交接位置的夾盤的侧面圖。如圖1〇以及圖u所示， 在處於錢位置的錢K)的上空，在基板丨的全局對準標 記GAM的正上方的位置處，設置著CCD相機47。cc二 相機47獲取全局對準標記GAM的圖像，並將圖像信號輸 出至圖1的圖像處理裝置48。在圖i中，圖像處理裝置似 對CCD相機47所輪出_像錢進行處理，以檢測 對準標記GAM的位置。 ° 19 201032004 在圖1中，主控制裝置70根據圖像處理裝置48所檢 測出的全局對準標記gam的位置，來檢測夾盤10上所搭 載的基板1的位置以及旋轉。主控制裝置70根據所檢測出 的基板1的位置來控制載物台驅動電路⑼，通過X載物台 5來使夾盤1G朝向曝紐置移動，以使得基板丨的中心點 來到開始曝光刖的規定位置。而且，主控制裝置7〇根據所 檢測出的基板1的旋轉來控制載物台驅動電路6〇，使0載 物台8朝向Θ方向旋轉，以使得夾盤1()上所搭載的基板ι 的正交的兩邊朝向X方向以及γ方向。 ❹ 主控制裝置70具有對光束照射裝置20的DMD驅動 電路27供給描緣數據的描緣控制部。圖12是表示描緣控 制部的概略構成的圖。描繪控制部71包括記憶體 (Τ101!)72、76、帶寬（bandwidth)設定部 73、中心點 坐“決疋4 74、坐標決定部75、描緣數據製作部77以及 反射鏡動作判定部78而構成。 在°己隐體76中存儲著設計值映射（map)。在設計值 映射中描緣數據是以基底圖案2a、2b、2c、2d在基板1 _ 内的位置、旋轉以及大小符合設計值時的XY纟標來表 不描=數據製作部77在通過溫度調節裝置5〇來調節基 板丄的孤度的期間’根據位置檢測電路54所檢測出的基底 圖'2a 2b 2e、2d在基板1内的位置、旋轉以及大小， 而對:己隨76巾所存儲的設計值映射的满數據的 XY坐 不進行換’以製作向各光束照射裝置20的DMD驅動電 路27供給的推緣數據。記憶體72對於描繪數據製作部77 20 201032004 所製作的描緣數據’將其χγ坐標作為位址㈤卿）而 儲存。在記憶體72 +，設有對針對已搭載於央盤上的 屬的區域、與對針對搭載於溫 度調卽裝置5G上的基板1的财數據B進行儲存的區域。 帶寬設料73通過決定從記72讀出的描緣數據 的γ坐標的範圍’而設定從光束照射裝£ 2〇的頭部2〇a 照射的光束的Y方向的帶寬。 雷射測長系統控制裝置40對開始曝光位置上的基板j 的曝光之前的夹盤10的XY方向的位置進行檢測。中心點 坐標決定部74根據雷射測長系統控制裝置4 〇所檢測出的 夾盤10的XY方向的位置，來決定開始基板1的曝光之前 的夾盤10的中心點的XY坐標。在圖1中，當利用來自光 束照射裝置20的光束來進行基板1的掃描時，主控制裝置 70控制載物台躁動電路60，以通過X載物台$來使夾盤 10朝向X方向移動。當移動基板1的掃描區域時，主控制 裝置70控制载物台驅動電路60，以通過γ載物台7來使 ❿ 炎盤10朝向γ方向移動。在圖12中，中心點坐標決定部 74對來自編碼器32、34的脈衝信號進行計數，以檢測X 載物台5的朝向X方尚的移動量以及Y載物台7的朝向γ 方向的移動量，從而決定夾盤10的中心點的XY坐標。接 著，中心點坐標決定部74根據行駛誤差檢測電路46的檢 測結果，來補正所決定的夾盤10的中心點的XY坐標。 坐標決定部75根據中心點坐標決定部74所補正的夾 盤10的中心點的XY坐標’來決定向各光束照射裝置20 201032004 的DMD驅動電路27供給的描繪數據的XY坐標。記憶體 72輸入坐標決定部75所決定的ΧΥ坐標來作為位址，姐 將所輸入的ΧΥ坐標的位址上儲存的描繪數據向各光束照 射裝置20的DMD驅動電路27輸出° DMD驅動電路27 根據從記憶體72輸出的描繪數據，來變更位於DMD25的 通常描緣用區域中的反射鏡25a的角度。As a result of the detection, it is possible to detect a running error such as left and right swing or yawing when the X stage 5 is moved in the X direction. By detecting the position of the chuck 10 by using the laser length measuring system, the position of the chuck 1〇 can be accurately detected. Therefore, the running error of the X stage 5 can be accurately detected. The travel error detecting circuit 46 outputs the detection result to the main control unit 70 °. In Fig. 1, the temperature adjusting means % is disposed in front of the base 3. Generally, the substrate 1 is heated or lowered by the treatment in the previous step. Therefore, it is necessary to ride the substrate crucible for cooling or warming before the exposure is performed. The substrate transporter shown in Fig. 2 carries the substrate 1 into the temperature adjustment device 50 before moving the substrate to the disk 1 (1), and then transfers the substrate i adjusted by the temperature adjustment to 1 G. Temperature adjustment device % The exposure of the substrate 搭载 mounted on the chuck 1G is carried out, and the next ^3 板 plate 1 is mounted to adjust the temperature of the substrate 1. In the present embodiment, each surface 17 of the substrate i is separated into an adjacent manner for exposure, and the substrate is irradiated. The position of the alignment mark of the pattern is to detect the position of the base pattern of each of the respective emission sections, and the drawing data supplied to the DMD driving circuit 27 of the light beam irradiation device 20 is made in accordance with the position of the base pattern of each of the respective emission sections. Fig. 8 is a view showing an alignment mark of a substrate. Fig. 8 shows an example in which four display panel substrates for display are produced from a ruthenium substrate. At the four corners of the surface of the substrate 1, a global alignment mark GAM for detecting the position and rotation of the substrate 1 is provided. Further, on the surface of the substrate 1, four base patterns 2a, 2b, 2c, and 2d are formed by four times of emission. In the base patterns 2a, 2b, 2c, 2d, four emission (SAM) alignment marks SAMa, SAMb for detecting the position, rotation and size of the base patterns 2a, 2b, 2c, 2d, respectively, are provided. SAMc, SAMd. Fig. 9 (a) is a plan view of the temperature adjusting device, and Fig. 9 (b) is a side view of the temperature adjusting device. As shown in FIGS. 9(a) and (b), a charge coupled device (Charge Coupled θ Device, CCD) is disposed above the temperature adjustment device 50 at a position immediately above the global alignment mark GAM of the substrate 1. ) Camera 51. The CCD camera 51 acquires an image of the global alignment mark GAM and outputs the image signal to the image processing device 53 of Fig. 1. Further, above the temperature adjusting device 50, CCD cameras 52a, 52b, 52c, and 52d are provided at positions directly above the emission alignment marks SAMa, SAMb, SAMc, and SAMd of the substrate 1. The CCD cameras 52a, 52b, 52c, 52d respectively acquire images of the emission alignment marks SAMa, SAMb, SAMc, SAMd, and output the image signals to the image device of Fig. 1 at 201032004. In Fig. 1, the image processing device 53 aligns the image signal output from the CCD camera 51 with (6) the alignment mark (the position of the pass. The position detecting circuit 54 detects the image according to the image processing device 53. The position of the substrate 1 mounted on the temperature adjustment device 5 is detected and rotated globally by the position of the mark GAM. Further, the image processing device 53 performs image signals output from the CCD cameras 52a, 52b, 52c, and 52d. Processing 'to detect the position of each of the emission alignment marks SAMa, SAMb, SAMc, SAMd. The position detecting circuit 54 is based on the detected position and rotation of the substrate 丨 and the emission alignment mark SAMa detected by the image processing device 53, The positions of SAMb, SAMc, and SAMd are used to detect the position, rotation, and size of the base patterns 2a, 2b, 2c, and 2d in the substrate!. The emission alignments set on the respective base patterns 2a, 2b, 2e, and 2d are used. Marker SAMa, SAMb, SAMe, SAMd, and image processing are performed to accurately detect the top view of each of the emitted base patterns 2a, 2b, 2c, and 2d in the substrate ia in Fig. 10 at the delivery position. u is A side view of the chuck at the transfer position. As shown in FIG. 1A and FIG. u, at a position above the money K) at the money position, a CCD is disposed at a position directly above the global alignment mark GAM of the substrate 丨Camera 47. The cc 2 camera 47 acquires an image of the global alignment mark GAM and outputs the image signal to the image processing device 48 of Fig. 1. In Fig. i, the image processing apparatus processes the CCD camera 47 to process the image to detect the position of the alignment mark GAM. ° 19 201032004 In Fig. 1, the main control unit 70 detects the position and rotation of the substrate 1 loaded on the chuck 10 based on the position of the global alignment mark gam detected by the image processing unit 48. The main control device 70 controls the stage driving circuit (9) according to the detected position of the substrate 1, and moves the chuck 1G toward the exposure center by the X stage 5, so that the center point of the substrate 来到 comes to start exposure. The specified location of the cockroach. Further, the main controller 7 controls the stage drive circuit 6A based on the detected rotation of the substrate 1, and rotates the 0 stage 8 in the x direction so that the substrate 1 on the chuck 1 () is mounted. The orthogonal sides are oriented in the X direction and the γ direction. ❹ The main control device 70 has a stroke control unit that supplies the stroke data to the DMD drive circuit 27 of the light beam irradiation device 20. Fig. 12 is a view showing a schematic configuration of a stroke control unit; The drawing control unit 71 includes a memory (Τ101!) 72 and 76, a bandwidth setting unit 73, a center point “decision 4 74, a coordinate determination unit 75, a stroke data creation unit 77, and a mirror operation determination unit 78. The design value map is stored in the hidden body 76. In the design value mapping, the edge data is in accordance with the position, rotation, and size of the base patterns 2a, 2b, 2c, and 2d in the substrate 1_. XY 时 设计 = = = = = 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据 数据In the position, rotation, and size of the substrate 1, the XY sitting of the full data mapped with the design value stored in the 76 towel is not changed to create the push supplied to the DMD driving circuit 27 of each beam irradiation device 20. The data 72 is stored in the description data created by the drawing data creation unit 77 20 201032004, and the χ γ coordinate is stored as the address (five). In the memory 72 +, the pair is placed on the central disk. The area of the genus The area where the wealth data B of the substrate 1 on the temperature monitoring device 5G is stored. The bandwidth setting material 73 sets the head from the beam irradiation by determining the range γ of the γ coordinates of the stroke data read from the record 72. The bandwidth in the Y direction of the light beam irradiated by the portion 2〇a. The laser length measuring system control device 40 detects the position of the chuck 10 in the XY direction before the exposure of the substrate j at the exposure position is started. The center point coordinate determining unit 74 The XY coordinate of the center point of the chuck 10 before the exposure of the substrate 1 is started is determined based on the position of the chuck 10 in the XY direction detected by the laser length measuring system control device 4 。. In Fig. 1, when When the light beam of the light beam irradiation device 20 scans the substrate 1, the main control device 70 controls the stage tilting circuit 60 to move the chuck 10 in the X direction by the X stage. When the scanning area of the substrate 1 is moved At this time, the main control unit 70 controls the stage drive circuit 60 to move the sputum disk 10 in the γ direction by the γ stage 7. In Fig. 12, the center point coordinate determining unit 74 pairs the encoders 32 and 34. Pulse signal is counted, The XY coordinate of the center point of the chuck 10 is determined by detecting the amount of movement of the X stage 5 in the direction of the X direction and the amount of movement of the Y stage 7 in the γ direction. Then, the center point coordinate determining unit 74 is based on The XY coordinates of the center point of the determined chuck 10 are corrected by the detection result of the travel error detecting circuit 46. The coordinate determining unit 75 determines the XY coordinate ' of the center point of the chuck 10 corrected by the center point coordinate determining unit 74. The XY coordinates of the drawing data supplied to the DMD driving circuit 27 of each beam irradiation device 20 201032004. The memory 72 inputs the ΧΥ coordinate determined by the coordinate determining unit 75 as an address, and the sister stores the address of the input ΧΥ coordinate. The drawing data is output to the DMD driving circuit 27 of each of the light beam irradiation devices 20. The DMD driving circuit 27 changes the angle of the mirror 25a located in the normal drawing region of the DMD 25 based on the drawing data output from the memory 72.
檢測每個各發射分區的基底圖案2a、2b、2c、2d在基· 板1内的位置、旋轉以及大小，根據檢測結果，並對應於 每個各發射分區的基底圖案2a、2b、2c、2d在基板丨内的 位置、旋轉以及大小，來製作向光束照射裴置2〇的dMP 驅動電路27供給的描繪數據，因此即使基底圖案2a、2b、 2c、2d的位置偏移量在基板1内根據場所而有所不同也 可以遍及整個基板1而對準基底圖案2a、2b、2c、2d來曝 光新的圖案。Detecting the position, rotation, and size of the base patterns 2a, 2b, 2c, 2d of each of the respective emission sections in the base plate 1, according to the detection result, and corresponding to the base patterns 2a, 2b, 2c of each of the respective emission sections, 2d, in the position, rotation, and size of the substrate, the drawing data supplied to the dMP driving circuit 27 of the light beam irradiation means 2 is formed, so that the positional shift amount of the base patterns 2a, 2b, 2c, 2d is on the substrate 1 The base pattern 2a, 2b, 2c, 2d may be aligned throughout the substrate 1 to expose a new pattern, depending on the location.
而且’在通過溫度調節裝置50來調節基板丨的溫度的 期間’根據每個各發射分區的基底圖案2a、2b、“、加 的位置、旋轉以及大小的檢測結果來製作向光束照射裝置 20的DMD驅動電路27供給的描繪數據，因此在將基^ 1 由溫度調料置％搬送至缝1G之後，衫要等待所述 描繪數據的製作便可以開始曝光處理，間歇時間⑽ time)變短。 檢測X載物台5的行駛誤差，並根據χ載 5 、〇誤差的檢測結果’來補正向各光束照射裝置2 DMD驅動電路27供給的描_據的坐標，並將所補 22 201032004 i才示的爲繪數據供給至各光束照射裝置2〇的DMD驅動電 路27’因此即使X載物台5發生左右搖擺或偏航等的行駛 誤差，也可精度良好地進行圖案的描繪。 反射鏡動作判定部78根據向各光束照射裝置2〇的 DMD驅動電路27所供給的描繪數據、與各光束照射裝 20的圖像處理裝置85所檢測出的DMD25的各反射鏡 的姿勢，來判定DMD25的各反射鏡25a是否正常動作广 如果根據向DMD驅動電路27輸出的描繪數據而應成為 開姿勢的反射鏡被圖像處理裝置85檢測出處於 勢’則反射鏡動作判定部78判定為該反射鏡未正常動 接著’日反射鏡動作判定部78將欺為未正常動作的反 的數量以及位置顯示在顯示上，#狀為未正 作的反射鏡的數量超過預定的容許值時，將該含遮主 顯示於顯示裝置80上。 舌σ 9 向光束照射裝置20的DMD驅動電路27供給据 據’監視光束照射裝置20的DMD25的各反射的 作，並根據向光束照射裝置2〇的DMD驅動電路^所^ 給的描賴據朗監_ DMD25的各簡鏡Μ ^ 作热來判定咖25的各反射鏡25a是否 = J夠在早期檢測出對光束進行調制的DMD25: = 描緣數據製作部77根據反射鏡動作判 士 D=5的各反射鏡25a的動作的判定結果，對纪、 f子的描繪數據的X坐標進行轉換，從而製作出^因未 23 201032004 正=動作的反射鏡造成的光束的掃描的遺漏來進行補 :驅動祕27雜雜賴縣較錄的 對光:進:==2?::4用二Γ位於 夠通過位於補=== 〇 兄的遺漏，從而可正常進行圖案的描繪。 圖U〜圖16是說日絲束對基板的掃 ==^^來自8個光束照射裝置個光束， 采進行四认基板1的X方向的搞知 的示例。在圖13〜圖16中，各的掃描整個基板1 束在Y方向上具有帶的頭部20a照射的光Further, 'the period during which the temperature of the substrate cassette is adjusted by the temperature adjustment device 50' is made to the light beam irradiation device 20 based on the detection results of the base patterns 2a, 2b, "additional position, rotation, and size of each of the emission sections". Since the DMD drive circuit 27 supplies the drawing data, after the substrate 1 is transported from the temperature adjustment to the slit 1G, the shirt can wait for the creation of the drawing data to start the exposure processing, and the intermittent time (10) time becomes short. The traveling error of the X stage 5 is corrected by the detection result of the load 5 and the error of the ', and the coordinates of the data supplied by the DMD drive circuit 27 of each of the light beam irradiation devices 2 are complemented, and the supplement 22 201032004 i is shown. Since the drawing data is supplied to the DMD driving circuit 27' of each of the light beam irradiation devices 2', even if the X-stage 5 has a running error such as a left-right swing or a yaw, the pattern can be accurately drawn. The portion 78 is based on the drawing data supplied from the DMD driving circuit 27 of each beam irradiation device 2 and the reflection of the DMD 25 detected by the image processing device 85 of each beam irradiation device 20. In the posture, it is determined whether or not the mirrors 25a of the DMD 25 are normally operated. If the mirrors that should be in the open position are detected by the image processing device 85 based on the drawing data outputted to the DMD drive circuit 27, the mirror operation determination is performed. The portion 78 determines that the mirror is not normally moved, and then the 'day mirror operation determining unit 78 displays the number and position of the inverse of the normal operation on the display, and the number of the mirrors that are not in progress exceeds a predetermined number. When the allowable value is displayed, the mask is displayed on the display device 80. The tongue σ 9 supplies the DMD drive circuit 27 of the beam irradiation device 20 with the respective reflections of the DMD 25 of the monitor beam irradiation device 20, and according to the beam toward the beam The DMD driving circuit of the illuminating device 2 给 据 据 朗 朗 D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D DMD25: = The stroke data creation unit 77 converts the X coordinate of the drawing data of the s and f sub-segments based on the determination result of the operation of each of the mirrors 25a of the mirror operation judgement D=5, thereby creating a result 23 201 032004 Positive = action of the mirror caused by the omission of the scanning of the beam to make up: drive secret 27 miscellaneous counties of the recorded light: In: == 2?:: 4 with two Γ located enough to pass the patch == = The omission of the brother, so that the pattern can be drawn normally. Fig. U to Fig. 16 show that the sweep of the Japanese tow to the substrate ==^^ from the eight beam irradiation devices, and the X direction of the substrate 1 is taken. In the example of Fig. 13 to Fig. 16, each of the entire substrate 1 is scanned for the light irradiated by the head 20a having the belt in the Y direction.
^ 並通過X載物台5的朝向X 科料料描基板1。 圖13表不第1次掃描 描，而在® U 方向的第1次掃 ❿ 纷。當第1結束日域中進行圖案的描 的移動，使基板1朝向丫方载物台7的朝向γ方向 離。圖Μ表示第2次掃描，與帶寬W相同的距 描，而在圖U中以灰色所向X方向的第2次掃 纷。當第2次域+進行圖案的描 的移動’使基板1朝向γ 載物台7的朝向Y方向 圖15表示第3次掃描，通過相同的距離。 而在圖15中以灰色所示 方向的第3次掃描， ㈣區域中進行圖案的描繪。當 24 201032004 第3次掃描結束時，通過Y載物台7的朝向γ方向的移動， 使基板1朝向γ方向移動與帶寬貿相同的距離。圖16表 示第4次掃描，通過朝向X方向的第4次掃描，而在圖a 中以灰色卿麟描區域巾進行圖案的描繪，整個基 的掃描結束。 ❹ 在利用來自多個光束照射裝置20的多個光束來掃描 基板1時’也能夠防止通過來自各光束照射裝置2〇的 而描緣的圖案因X載物台5的行驶誤差而彼此錯離，因此 此夠精度良好地進行圖案的描綠。並且，通過利用來 裝置2G的多個光束來平行地進行基板i的掃 限於此，也可以進行 的X方向的掃描以掃指整個基…。I於5人基板1 根據以上所說明的實施方式 _驅動電路27供給 光置20的 20的DMD25的各反射二，據，監視先束照射裝置 裝置20的DMD驅動㈣動作，並根據向光束照射 的各反射鏡25a的動作ml供給的描緣數據與所監視 是否正常動作，由此能夠在早:射:25a DMD25的不良狀況。 π愤而出對先束進仃調制的 進而，將光束照射裝置20的咖25的反射鏡仏由 25 201032004 關閉姿勢改為打開姿勢而對光束進行調制，對由打開姿勢 的反射鏡所反射的光束進行分支，並使所分支的光束在將 受光面的各像素對應於DMD25的各反射鏡25a而配置的 攝影裝置84a的受光面上成像，由此能夠容 DMD25的各反射鏡25a的動作。 或者，將光束照射裝置20的DMD25的反射鏡25a由 打開姿勢改為關閉姿勢而對光束進行調制，並 勢的反射鏡所反射Μ束在將受光面的各 DMD25的各反射鏡25a而配置的攝影裝置8牝的受光面上 ❹ 成像，由此能夠容易地監視DMD25的各反射鏡25a的動 作。 進而，根據光束照射裝置20的DMD25的各反射鏡 25a的動作的判定結果，而製作出對因未正常動作的反射 鏡造成的光束的掃描的遺漏來進行補償的描繪數據，並供 給至光束照射裝置20的DMD驅動電路27，由此，即使 對光束進行調制的DMD25的一部分反射鏡發生不良狀 況，也能正常進行圖案的描繪。 ❹ 通過使用本發明的曝光裝置或曝光方法來進行基板的 曝光，月b夠防止因空間光調制器的不良狀況造成的圖案的 描緣不良，因此能夠製造高品質的顯示用面板基板。 例如，圖17是表示液晶顯示器裝置的TFT基板的製 造步驟的一例的流程圖。在薄膜形成步驟（步驟101)中， 通過濺鍍法或電漿化學氣相沉積（chemical vapor Deposition ’ CVD)法等，在基板上形成作為液晶驅動用透 26 201032004 明電極的導電體膜或絕緣體膜等的薄膜。在光阻塗布步驟 (步驟102)中，通過輥(„)11)式塗布法等來塗布光阻，以在 薄膜形成步驟（步驟1〇1)中所形成的薄膜上形成光阻膜。 在曝光步驟（步驟1〇3)中，使用曝光裝置來在光阻膜上 形成圖案。在顯影步驟（步驟1〇4)中，通過淋浴式（sh〇wer；) 顯影法等’將顯影液供給至光阻膜上，以去除光阻膜的不 要部分。在蝕刻（etching)步驟（步驟1〇5)中，通過濕 Φ 式（wet)蝕刻，將薄膜形成步驟（步驟1〇1)中形成的薄 膜内、未被光阻膜所遮掩的部分予以去除。在剝離步驟（步 驟1〇6)中’將在蝕刻步驟（步驟105)中完成光罩作用的 光阻膜通過剝離液而剝離。在這些步驟之前或之後，根據 需要而實施基板的清洗/乾燥步驟。反復進行數次這些步 驟，從而在基板上形成TFT陣列（array)。 而且，圖18是表示液晶顯示器裝置的彩色濾光器基板 的氣造步驟的一例的流程圖。在黑色矩陣（black matrix) 形成步驟（步驟201)中，通過光阻塗布、曝光、顯影、 蝕刻、剝離等的處理而在基板上形成黑色矩陣。在著色圖 案形成步驟（步驟202)中，通過印刷法等，在基板上形 成著色圖案。針對R、G、B的著色圖案，反復進行該步 驟。在保護膜形成步驟（步驟203)中，在著色圖案之上 形成保護膜，在透明電極膜形成步驟（步驟2〇4)中，在 保護膜之上形成透明電極膜。在這些步驟之前、中途或之 後’根據需要而實施基板的清洗/乾燥步驟。 在圖17所示的TFT基板的製造步驟中，在曝光步驟 201032004 (步驟103)中’在圖18所示的彩色濾光器基板的製造步 驟中，在黑色矩陣形成步驟（步驟2()1)以及著 的曝光處理中’能夠適用本發明的曝 以上所述’僅是本發明的較佳實施例❿已，並 ^明作任何形式上的限制，雖然本發明已以較佳實施例揭 •如上，然而並非用以限定本發明，任何熟悉本專業的技 術^員，在不脫離本發明技術方案範圍内，當可利用上述 揭示的結構及技術内容製作些許的更動或修飾為等 I 籲 的等效實施例’但是凡是未脫離本發明技術方案的内容， 依據本發明的技術實質對以上實施例所作的任何簡 改’等同變更與修飾，均仍屬於本發明技術方案的範9圍内二 雖然本發明已以較佳實施例揭露如上，然其 限^本發明，任何熟習此技藝者，在不脫離本^明之精 和範圍内，當可作些許之更動與潤飾，因此本發明之保 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】^ and the substrate 1 is drawn through the X-stage of the X stage 5. Figure 13 shows the first scan, but the first sweep in the ® U direction. The movement of the pattern is performed in the first end day domain, and the substrate 1 is oriented in the direction γ of the 载-stage stage 7. The map shows the second scan, the same distance as the bandwidth W, and the second sweep in the X direction in the gray direction in Fig. U. In the second subfield + the movement of the pattern is drawn, the substrate 1 is directed toward the y stage 7 in the Y direction. Fig. 15 shows the third scan, and the same distance is passed. In Fig. 15, the third scan in the direction indicated by gray is used, and the pattern is drawn in the (4) region. When the third scan of 24 201032004 is completed, the substrate 1 is moved in the γ direction by the same distance as the bandwidth trade by the movement of the Y stage 7 in the γ direction. Fig. 16 shows the fourth scan, and the fourth scanning is performed in the X direction, and the pattern is drawn by the gray scented area towel in Fig. a, and the scanning of the entire base is completed.时 When the substrate 1 is scanned by a plurality of light beams from the plurality of light beam irradiation devices 20, it is also possible to prevent the patterns drawn by the respective light beam irradiation devices 2 from being displaced from each other due to the traveling error of the X stage 5 Therefore, it is possible to perform greening of the pattern with high precision. Further, the scanning of the substrate i is performed in parallel by using a plurality of light beams of the device 2G, and the X-direction scanning may be performed to sweep the entire substrate. I-to-five substrate 1 According to the embodiment described above, the drive circuit 27 supplies each of the reflections of the DMD 25 of the light 20, and monitors the DMD drive (4) of the pre-beam irradiation device 20, and irradiates the light beam according to The tracking data supplied by the operation ml of each of the mirrors 25a and whether or not the monitoring is performed normally can be used to detect the defect of the DMD 25 at 25a. In addition, the mirror 仏 of the illuminating device of the light beam illuminating device 20 is changed from the closing posture of the 25 201032004 to the open position to modulate the light beam, and is reflected by the mirror of the open posture. The light beam is branched, and the branched light beam is imaged on the light receiving surface of the imaging device 84a in which the respective pixels of the light receiving surface are arranged corresponding to the respective mirrors 25a of the DMD 25, whereby the operation of each of the mirrors 25a of the DMD 25 can be accommodated. Alternatively, the mirror 25a of the DMD 25 of the beam irradiation device 20 is changed from the open position to the closed position to modulate the light beam, and the mirror of the potential beam is reflected and bundled on each of the mirrors 25a of the respective DMDs 25 on the light receiving surface. The imaging on the light-receiving surface of the imaging device 8 is performed, whereby the operation of each of the mirrors 25a of the DMD 25 can be easily monitored. Further, based on the determination result of the operation of each of the mirrors 25a of the DMD 25 of the light beam irradiation device 20, drawing data for compensating for the omission of the scanning of the light beam due to the mirror that is not normally operated is created and supplied to the beam irradiation. The DMD driving circuit 27 of the device 20 can normally draw a pattern even if a part of the mirror of the DMD 25 that modulates the light beam is defective. ❹ By performing exposure of the substrate by using the exposure apparatus or the exposure method of the present invention, it is possible to prevent the pattern from being defective due to the problem of the spatial light modulator, and thus it is possible to manufacture a high-quality display panel substrate. For example, Fig. 17 is a flowchart showing an example of a manufacturing procedure of a TFT substrate of a liquid crystal display device. In the thin film forming step (step 101), a conductive film or insulator as a liquid crystal driving transparent electrode 26 201032004 is formed on the substrate by a sputtering method, a chemical vapor deposition (CVD) method, or the like. A film such as a film. In the photoresist coating step (step 102), the photoresist is applied by a roll coating method or the like to form a photoresist film on the film formed in the film forming step (step 1〇1). In the exposure step (step 1〇3), an exposure device is used to form a pattern on the photoresist film. In the development step (step 1〇4), the developer is supplied by a shower method or the like. To the photoresist film to remove unnecessary portions of the photoresist film. In the etching step (step 1〇5), the film formation step (step 1〇1) is formed by wet Φ (wet) etching. The portion of the film that is not covered by the photoresist film is removed. In the peeling step (step 1〇6), the photoresist film that has completed the mask operation in the etching step (step 105) is peeled off by the peeling liquid. Before or after these steps, the cleaning/drying step of the substrate is performed as needed. The steps are repeated several times to form a TFT array on the substrate. Moreover, FIG. 18 is a color filter showing a liquid crystal display device. Flow of an example of a gas-making step of a substrate In a black matrix forming step (step 201), a black matrix is formed on a substrate by a process such as photoresist coating, exposure, development, etching, lift-off, etc. In the coloring pattern forming step (step 202) A colored pattern is formed on the substrate by a printing method or the like. This step is repeated for the coloring patterns of R, G, and B. In the protective film forming step (step 203), a protective film is formed over the colored pattern, and is transparent. In the electrode film forming step (step 2〇4), a transparent electrode film is formed on the protective film. Before, during or after these steps, the cleaning/drying step of the substrate is performed as needed. The TFT substrate shown in FIG. In the manufacturing step, in the exposure step 201032004 (step 103), in the manufacturing step of the color filter substrate shown in FIG. 18, in the black matrix forming step (step 2 () 1) and the exposure processing" The above description of the present invention is merely a preferred embodiment of the present invention, and is to be construed as being limited in any form, although the present invention has been disclosed in the preferred embodiments. However, it is not intended to limit the invention, and any skilled person skilled in the art can make a slight modification or modification to the equivalent of the I appeal when using the structure and technical contents disclosed above without departing from the technical scope of the present invention. The embodiment 'but without departing from the technical solution of the present invention, any simplifications and equivalent modifications to the above embodiments in accordance with the technical spirit of the present invention are still within the scope of the technical solution of the present invention. The invention has been disclosed in the above preferred embodiments, and it is to be understood that the invention may be modified and modified without departing from the spirit and scope of the invention. This is subject to the definition of the scope of the patent application. [Simple description of the map]
圖1是表示本發明的一 成的圖。 實施方式的曝光裝置的概略構 圖2是本發明的-實施方式的曝光裝置的侧面圖。 圖3是本發明的一實施方式的曝光裝置的正面圖。 圖4是表示光束照射裝置的一例的概略構成的圖。 圖5是表示DMD的描繪用區域的圖。 圖6是表示光束照射裝置的另一例的概略構成的圖。 28 201032004 圖7义說明雷射測長系統的動作的圖。 圖8是表示基板的對準標記（alignmentmark)的圖。 圖9 (a)是溫度調節裝置的俯視圖，圖9 (b)是溫度 調節裝置的侧面圖。 圖1〇是處於交接位置的夾盤的俯視圖。 圖11是處於交接位置的夾盤的側面圖。 圖12是表示描繪控制部的概略構成的圖。 0 圖13是說明光束對基板的掃描的圖。 圖14是說明光束對基板的掃描的圖。 圖15是說明光束對基板的掃描的圖。 圖16是說明光束對基板的掃描的圖。 圖17是表示液晶顯示器裝置的TFT基板的製造步驟 的一例的流程圖。 圖18是表示液晶顯示器裝置的彩色濾光器基板的製 造步驟的一例的流程圖。 【主要元件符號說明】 ❿ 1 :基板 2a、2b、2c、2d :基底圖案 3 :底座 4: X導向器 5:X載物台 6:Y導向器 7 : Y載物台 8 : Θ載物台 29 201032004 ίο :夾盤 11 :閘門 20 :光束照射裝置 20a :頭部 21 :雷射光源單元 22 :光纖 23 :透鏡 24 :反射鏡 25 : DMD (Digital Micro-mirror Device :數位微鏡元件） 25a :反射鏡 26 :投影透鏡 27 : DMD驅動電路 31、 33 :線性標度 32、 34 :編碼器 40 :雷射測長系統控制裝置 41 :雷射光源 42、 44 :雷射干涉儀 43、 45 :棒狀反射鏡 46 :行駛誤差檢測電路 47、 51、52a、52b、52c、52d : CCD 相機 48、 53 :圖像處理裝置 50 :溫度調節裝置 54 :位置檢測電路 60 :載物台驅動電路 201032004 70 :主控制裝置 71 :描繪控制部 72、76 :記憶體 73 :帶寬設定部 74 :中心點坐標決定部 75 :坐標決定部 77 :描繪數據製作部 78 :反射鏡動作判定部 ® 80 :顯示裝置 81 :半透反射鏡 82a、82b :成像透鏡 83 :衰減透過濾光器 84a、84b :攝影裝置 85 :圖像處理裝置 GAM :全局對準標記 SAMa、SAMb、SAMc、SAMd :發射對準標記 ❹ W :帶寬 X、Y:方向 31Fig. 1 is a view showing a part of the present invention. The schematic configuration of the exposure apparatus of the embodiment is a side view of the exposure apparatus according to the embodiment of the present invention. Fig. 3 is a front elevational view of an exposure apparatus according to an embodiment of the present invention. 4 is a view showing a schematic configuration of an example of a light beam irradiation device. FIG. 5 is a view showing a drawing area of the DMD. Fig. 6 is a view showing a schematic configuration of another example of the light beam irradiation device. 28 201032004 Figure 7 is a diagram illustrating the operation of the laser length measuring system. Fig. 8 is a view showing an alignment mark of a substrate. Fig. 9 (a) is a plan view of the temperature adjusting device, and Fig. 9 (b) is a side view of the temperature adjusting device. Figure 1 is a top plan view of the chuck in the transfer position. Figure 11 is a side elevational view of the chuck in the transfer position. FIG. 12 is a view showing a schematic configuration of a drawing control unit. 0 Figure 13 is a diagram for explaining scanning of a light beam to a substrate. Fig. 14 is a view for explaining scanning of a light beam to a substrate. Fig. 15 is a view for explaining scanning of a light beam to a substrate. Fig. 16 is a view for explaining scanning of a light beam to a substrate. Fig. 17 is a flowchart showing an example of a manufacturing procedure of a TFT substrate of a liquid crystal display device. Fig. 18 is a flowchart showing an example of a manufacturing procedure of a color filter substrate of a liquid crystal display device. [Description of main component symbols] ❿ 1 : Substrate 2a, 2b, 2c, 2d: Base pattern 3: Base 4: X guide 5: X stage 6: Y guide 7: Y stage 8: Θ load Table 29 201032004 ίο : chuck 11 : gate 20 : beam irradiation device 20a : head 21 : laser light source unit 22 : optical fiber 23 : lens 24 : mirror 25 : DMD (Digital Micro-mirror Device) 25a: mirror 26: projection lens 27: DMD drive circuit 31, 33: linear scale 32, 34: encoder 40: laser length measurement system control device 41: laser light source 42, 44: laser interferometer 43, 45: rod mirror 46: travel error detecting circuits 47, 51, 52a, 52b, 52c, 52d: CCD camera 48, 53: image processing device 50: temperature adjusting device 54: position detecting circuit 60: stage driving Circuit 201032004 70: main control device 71: drawing control unit 72, 76: memory 73: bandwidth setting unit 74: center point coordinate determining unit 75: coordinate determining unit 77: drawing data creating unit 78: mirror operation determining unit 80 : display device 81: half mirrors 82a, 82b: imaging lens 83: attenuation transmission Optical receiver 84a, 84b: imaging device 85: the image processing apparatus the GAM: global alignment mark SAMa, SAMb, SAMc, SAMd: emitting alignment mark ❹ W: bandwidth of X, Y: 31 direction
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| Application Number | Priority Date | Filing Date | Title |
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| JP2009034757A JP2010191127A (en) | 2009-02-18 | 2009-02-18 | Exposure apparatus, exposure method, and method for manufacturing panel substrate for display |
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| TW201032004A true TW201032004A (en) | 2010-09-01 |
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| JP (1) | JP2010191127A (en) |
| KR (1) | KR20100094353A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11906903B2 (en) | 2019-07-11 | 2024-02-20 | Visitech As | Real time registration in lithography system |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5703069B2 (en) * | 2010-09-30 | 2015-04-15 | 株式会社Ｓｃｒｅｅｎホールディングス | Drawing apparatus and drawing method |
| JP5611016B2 (en) * | 2010-12-07 | 2014-10-22 | 株式会社日立ハイテクノロジーズ | Exposure apparatus, exposure method, and manufacturing method of display panel substrate |
| JP2012242630A (en) * | 2011-05-20 | 2012-12-10 | Hitachi High-Technologies Corp | Exposure apparatus, exposure method, manufacturing method for display panel substrate and inspection method for exposure apparatus |
| DE102012218221A1 (en) | 2012-10-05 | 2014-04-10 | Carl Zeiss Smt Gmbh | Monitor system for determining orientations of mirror elements and EUV lithography system |
| CN109283796B (en) * | 2017-07-21 | 2021-08-17 | 中芯国际集成电路制造(上海)有限公司 | Photoetching simulation system |
| CN111474813B (en) * | 2020-04-29 | 2021-09-28 | Oppo广东移动通信有限公司 | Projection optical machine and electronic equipment |
| CN111795930B (en) * | 2020-08-09 | 2021-09-21 | 泰州市博泰电子有限公司 | Universal test fixture for mobile communication circuit board |
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| US6833908B2 (en) * | 2001-03-23 | 2004-12-21 | Ultratech, Inc. | Computer architecture for and method of high-resolution imaging using a low-resolution image transducer |
| US6618185B2 (en) * | 2001-11-28 | 2003-09-09 | Micronic Laser Systems Ab | Defective pixel compensation method |
| JP4208045B2 (en) * | 2002-03-07 | 2009-01-14 | 株式会社ユメックス | Direct exposure system |
| US6870554B2 (en) * | 2003-01-07 | 2005-03-22 | Anvik Corporation | Maskless lithography with multiplexed spatial light modulators |
| JP2004304135A (en) * | 2003-04-01 | 2004-10-28 | Nikon Corp | Exposure device, exposing method and manufacturing method of micro-device |
| US7102733B2 (en) * | 2004-08-13 | 2006-09-05 | Asml Holding N.V. | System and method to compensate for static and dynamic misalignments and deformations in a maskless lithography tool |
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2009
- 2009-02-18 JP JP2009034757A patent/JP2010191127A/en active Pending
- 2009-12-31 CN CN200910265751A patent/CN101807006A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11906903B2 (en) | 2019-07-11 | 2024-02-20 | Visitech As | Real time registration in lithography system |
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| Publication number | Publication date |
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| KR20100094353A (en) | 2010-08-26 |
| JP2010191127A (en) | 2010-09-02 |
| CN101807006A (en) | 2010-08-18 |
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