CN101790797A - 用于led的无钎焊集成封装连接器和散热器 - Google Patents
用于led的无钎焊集成封装连接器和散热器 Download PDFInfo
- Publication number
- CN101790797A CN101790797A CN200880020763.5A CN200880020763A CN101790797A CN 101790797 A CN101790797 A CN 101790797A CN 200880020763 A CN200880020763 A CN 200880020763A CN 101790797 A CN101790797 A CN 101790797A
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- CN
- China
- Prior art keywords
- caulked
- structure according
- led
- encapsulation
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Abstract
Description
Claims (21)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/765,291 | 2007-06-19 | ||
US11/765,291 US7638814B2 (en) | 2007-06-19 | 2007-06-19 | Solderless integrated package connector and heat sink for LED |
PCT/IB2008/052348 WO2008155700A1 (en) | 2007-06-19 | 2008-06-13 | Solderless integrated package connector and heat sink for led |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101790797A true CN101790797A (zh) | 2010-07-28 |
CN101790797B CN101790797B (zh) | 2012-09-19 |
Family
ID=39739412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880020763.5A Active CN101790797B (zh) | 2007-06-19 | 2008-06-13 | 用于led的无钎焊集成封装连接器和散热器 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7638814B2 (zh) |
EP (1) | EP2160771B1 (zh) |
JP (1) | JP5714899B2 (zh) |
KR (1) | KR101460008B1 (zh) |
CN (1) | CN101790797B (zh) |
BR (1) | BRPI0813238B1 (zh) |
RU (1) | RU2464671C2 (zh) |
TW (1) | TWI455348B (zh) |
WO (1) | WO2008155700A1 (zh) |
Families Citing this family (33)
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US9660153B2 (en) | 2007-11-14 | 2017-05-23 | Cree, Inc. | Gap engineering for flip-chip mounted horizontal LEDs |
US9640737B2 (en) | 2011-01-31 | 2017-05-02 | Cree, Inc. | Horizontal light emitting diodes including phosphor particles |
US9754926B2 (en) | 2011-01-31 | 2017-09-05 | Cree, Inc. | Light emitting diode (LED) arrays including direct die attach and related assemblies |
TWI372918B (en) * | 2007-12-27 | 2012-09-21 | Everlight Electronics Co Ltd | Edge lighting light-emitting diode backlight module |
JP5839992B2 (ja) * | 2009-07-06 | 2016-01-06 | 株式会社東芝 | Ledランプ及びヘッドライト |
TW201112449A (en) * | 2009-09-30 | 2011-04-01 | Star Reach Corp | AC driven light emitting diode light apparatus, and its AC driven light emitting diode package element therein |
US8845130B2 (en) | 2009-12-09 | 2014-09-30 | Tyco Electronics Corporation | LED socket assembly |
US8235549B2 (en) * | 2009-12-09 | 2012-08-07 | Tyco Electronics Corporation | Solid state lighting assembly |
US8241044B2 (en) | 2009-12-09 | 2012-08-14 | Tyco Electronics Corporation | LED socket assembly |
US8878454B2 (en) | 2009-12-09 | 2014-11-04 | Tyco Electronics Corporation | Solid state lighting system |
US8210715B2 (en) * | 2009-12-09 | 2012-07-03 | Tyco Electronics Corporation | Socket assembly with a thermal management structure |
DE102010033092A1 (de) * | 2010-08-02 | 2012-02-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer |
TWI420714B (zh) * | 2010-08-16 | 2013-12-21 | Moreco Engineering Inc | The thermally conductive structure of light - emitting diodes |
US9673363B2 (en) * | 2011-01-31 | 2017-06-06 | Cree, Inc. | Reflective mounting substrates for flip-chip mounted horizontal LEDs |
US9401103B2 (en) | 2011-02-04 | 2016-07-26 | Cree, Inc. | LED-array light source with aspect ratio greater than 1 |
US9249955B2 (en) | 2011-09-26 | 2016-02-02 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US9429309B2 (en) | 2011-09-26 | 2016-08-30 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US9423119B2 (en) | 2011-09-26 | 2016-08-23 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US10043960B2 (en) | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
US8568001B2 (en) | 2012-02-03 | 2013-10-29 | Tyco Electronics Corporation | LED socket assembly |
WO2013119927A1 (en) * | 2012-02-10 | 2013-08-15 | Cree, Inc. | Light emitting devices and packages and related methods with electrode marks on leads |
CN109920774A (zh) * | 2012-03-26 | 2019-06-21 | 先进封装技术私人有限公司 | 用于半导体封装的多层基底 |
US9239135B2 (en) | 2012-07-25 | 2016-01-19 | Tyco Electronics Corporation | LED connector |
US9480141B1 (en) | 2012-09-20 | 2016-10-25 | Junis Hamadeh | Heat sink device or heat sink assembly |
TWI512229B (zh) | 2012-12-07 | 2015-12-11 | Ind Tech Res Inst | 照明裝置 |
AT513747B1 (de) | 2013-02-28 | 2014-07-15 | Mikroelektronik Ges Mit Beschränkter Haftung Ab | Bestückungsverfahren für Schaltungsträger und Schaltungsträger |
JP6519123B2 (ja) * | 2013-08-30 | 2019-05-29 | 日亜化学工業株式会社 | 発光素子搭載用基板及び該基板の固定方法 |
WO2015144469A1 (en) | 2014-03-27 | 2015-10-01 | Koninklijke Philips N.V. | Efficient board to board connection |
US9748723B2 (en) | 2014-12-12 | 2017-08-29 | Peter Sussman | Solder-less board-to-wire connector |
US10041657B2 (en) * | 2016-06-13 | 2018-08-07 | Rebo Lighting & Electronics, Llc | Clip unit and edge mounted light emitting diode (LED) assembly comprising a clip unit |
US10765009B2 (en) | 2016-12-21 | 2020-09-01 | Lumileds Llc | Method for addressing misalignment of LEDs on a printed circuit board |
US10194495B2 (en) | 2016-12-21 | 2019-01-29 | Lumileds Llc | Method for addressing misalignment of LEDs on a printed circuit board |
US11769862B2 (en) | 2020-03-26 | 2023-09-26 | Nichia Corporation | Light emitting device |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS584836B2 (ja) * | 1978-08-04 | 1983-01-27 | 富士通株式会社 | 光半導体素子パッケ−ジ |
US4731693A (en) * | 1986-09-29 | 1988-03-15 | Tektronix, Inc. | Connection apparatus for integrated circuit |
US6441943B1 (en) * | 1997-04-02 | 2002-08-27 | Gentex Corporation | Indicators and illuminators using a semiconductor radiation emitter package |
US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
KR100991830B1 (ko) * | 2001-12-29 | 2010-11-04 | 항조우 후양 신잉 띠앤즈 리미티드 | Led 및 led램프 |
JP3960053B2 (ja) | 2002-01-18 | 2007-08-15 | 松下電器産業株式会社 | 半導体発光装置及びこれを用いた照明用発光装置 |
JP2004055229A (ja) * | 2002-07-17 | 2004-02-19 | Mitsubishi Electric Lighting Corp | Led光源装置及び照明器具 |
JP2004146870A (ja) * | 2002-10-21 | 2004-05-20 | Nippon Sheet Glass Co Ltd | ライン照明装置およびこのライン照明装置を組み込んだ画像読取装置 |
JP2004355869A (ja) * | 2003-05-28 | 2004-12-16 | Toshiba Lighting & Technology Corp | 発光ダイオード照明装置 |
JP4274032B2 (ja) * | 2003-07-09 | 2009-06-03 | 日亜化学工業株式会社 | 照明装置 |
EP1496551B1 (en) | 2003-07-09 | 2013-08-21 | Nichia Corporation | Light emitting diode, method of manufacturing the same and lighting equipment incorporating the same |
US7321161B2 (en) | 2003-12-19 | 2008-01-22 | Philips Lumileds Lighting Company, Llc | LED package assembly with datum reference feature |
RU2258979C1 (ru) * | 2004-06-02 | 2005-08-20 | Уральский государственный университет путей сообщения (УрГУПС) | Светодиодное устройство |
TWM258416U (en) * | 2004-06-04 | 2005-03-01 | Lite On Technology Corp | Power LED package module |
KR100623024B1 (ko) * | 2004-06-10 | 2006-09-19 | 엘지전자 주식회사 | 고출력 led 패키지 |
JP2006093470A (ja) * | 2004-09-24 | 2006-04-06 | Toshiba Corp | リードフレーム、発光装置、発光装置の製造方法 |
US20060082315A1 (en) * | 2004-10-20 | 2006-04-20 | Timothy Chan | Method and system for attachment of light emmiting diodes to circuitry for use in lighting |
CN1812143A (zh) * | 2005-01-24 | 2006-08-02 | 史杰 | Led发光二极管 |
JP4711715B2 (ja) * | 2005-03-30 | 2011-06-29 | 株式会社東芝 | 半導体発光装置及び半導体発光ユニット |
US20070063213A1 (en) * | 2005-09-21 | 2007-03-22 | Lighthouse Technology Co., Ltd. | LED package |
-
2007
- 2007-06-19 US US11/765,291 patent/US7638814B2/en active Active
-
2008
- 2008-06-13 WO PCT/IB2008/052348 patent/WO2008155700A1/en active Application Filing
- 2008-06-13 KR KR1020107001271A patent/KR101460008B1/ko active IP Right Grant
- 2008-06-13 BR BRPI0813238A patent/BRPI0813238B1/pt active IP Right Grant
- 2008-06-13 CN CN200880020763.5A patent/CN101790797B/zh active Active
- 2008-06-13 JP JP2010512820A patent/JP5714899B2/ja active Active
- 2008-06-13 EP EP08763335.0A patent/EP2160771B1/en active Active
- 2008-06-13 RU RU2010101426/28A patent/RU2464671C2/ru active
- 2008-06-16 TW TW097122454A patent/TWI455348B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI455348B (zh) | 2014-10-01 |
BRPI0813238A2 (pt) | 2014-12-23 |
EP2160771B1 (en) | 2017-11-15 |
CN101790797B (zh) | 2012-09-19 |
RU2464671C2 (ru) | 2012-10-20 |
RU2010101426A (ru) | 2011-07-27 |
BRPI0813238B1 (pt) | 2018-12-11 |
EP2160771A1 (en) | 2010-03-10 |
JP2010530631A (ja) | 2010-09-09 |
KR20100034018A (ko) | 2010-03-31 |
KR101460008B1 (ko) | 2014-11-10 |
WO2008155700A1 (en) | 2008-12-24 |
JP5714899B2 (ja) | 2015-05-07 |
US20080315214A1 (en) | 2008-12-25 |
TW200919785A (en) | 2009-05-01 |
US7638814B2 (en) | 2009-12-29 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Eindhoven, Netherlands Co-patentee after: LUMILEDS LLC Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Eindhoven, Netherlands Co-patentee before: Philips Ramildes Lighting Equipment Co.,Ltd. Patentee before: KONINKLIJKE PHILIPS ELECTRONICS N.V. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200831 Address after: Holland Schiphol Patentee after: KONINKLIJKE PHILIPS NV Address before: Eindhoven, Netherlands Co-patentee before: LUMILEDS LLC Patentee before: KONINKLIJKE PHILIPS N.V. |
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TR01 | Transfer of patent right |