BRPI0813238A2 - Estrutura de caixa de diodo emissor de luz - Google Patents
Estrutura de caixa de diodo emissor de luzInfo
- Publication number
- BRPI0813238A2 BRPI0813238A2 BRPI0813238-0A2A BRPI0813238A BRPI0813238A2 BR PI0813238 A2 BRPI0813238 A2 BR PI0813238A2 BR PI0813238 A BRPI0813238 A BR PI0813238A BR PI0813238 A2 BRPI0813238 A2 BR PI0813238A2
- Authority
- BR
- Brazil
- Prior art keywords
- box structure
- led box
- led
- box
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/765,291 US7638814B2 (en) | 2007-06-19 | 2007-06-19 | Solderless integrated package connector and heat sink for LED |
PCT/IB2008/052348 WO2008155700A1 (en) | 2007-06-19 | 2008-06-13 | Solderless integrated package connector and heat sink for led |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0813238A2 true BRPI0813238A2 (pt) | 2014-12-23 |
BRPI0813238B1 BRPI0813238B1 (pt) | 2018-12-11 |
Family
ID=39739412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0813238A BRPI0813238B1 (pt) | 2007-06-19 | 2008-06-13 | estrutura de caixa de diodo emissor de luz |
Country Status (9)
Country | Link |
---|---|
US (1) | US7638814B2 (pt) |
EP (1) | EP2160771B1 (pt) |
JP (1) | JP5714899B2 (pt) |
KR (1) | KR101460008B1 (pt) |
CN (1) | CN101790797B (pt) |
BR (1) | BRPI0813238B1 (pt) |
RU (1) | RU2464671C2 (pt) |
TW (1) | TWI455348B (pt) |
WO (1) | WO2008155700A1 (pt) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9754926B2 (en) | 2011-01-31 | 2017-09-05 | Cree, Inc. | Light emitting diode (LED) arrays including direct die attach and related assemblies |
US9660153B2 (en) | 2007-11-14 | 2017-05-23 | Cree, Inc. | Gap engineering for flip-chip mounted horizontal LEDs |
US9640737B2 (en) | 2011-01-31 | 2017-05-02 | Cree, Inc. | Horizontal light emitting diodes including phosphor particles |
TWI372918B (en) * | 2007-12-27 | 2012-09-21 | Everlight Electronics Co Ltd | Edge lighting light-emitting diode backlight module |
JP5839992B2 (ja) * | 2009-07-06 | 2016-01-06 | 株式会社東芝 | Ledランプ及びヘッドライト |
TW201112449A (en) * | 2009-09-30 | 2011-04-01 | Star Reach Corp | AC driven light emitting diode light apparatus, and its AC driven light emitting diode package element therein |
US8241044B2 (en) | 2009-12-09 | 2012-08-14 | Tyco Electronics Corporation | LED socket assembly |
US8210715B2 (en) * | 2009-12-09 | 2012-07-03 | Tyco Electronics Corporation | Socket assembly with a thermal management structure |
US8878454B2 (en) | 2009-12-09 | 2014-11-04 | Tyco Electronics Corporation | Solid state lighting system |
US8235549B2 (en) * | 2009-12-09 | 2012-08-07 | Tyco Electronics Corporation | Solid state lighting assembly |
US8845130B2 (en) | 2009-12-09 | 2014-09-30 | Tyco Electronics Corporation | LED socket assembly |
DE102010033092A1 (de) | 2010-08-02 | 2012-02-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer |
TWI420714B (zh) * | 2010-08-16 | 2013-12-21 | Moreco Engineering Inc | The thermally conductive structure of light - emitting diodes |
US9673363B2 (en) * | 2011-01-31 | 2017-06-06 | Cree, Inc. | Reflective mounting substrates for flip-chip mounted horizontal LEDs |
US9401103B2 (en) | 2011-02-04 | 2016-07-26 | Cree, Inc. | LED-array light source with aspect ratio greater than 1 |
US9423119B2 (en) | 2011-09-26 | 2016-08-23 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US9429309B2 (en) | 2011-09-26 | 2016-08-30 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US9249955B2 (en) | 2011-09-26 | 2016-02-02 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US10043960B2 (en) * | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
US8568001B2 (en) | 2012-02-03 | 2013-10-29 | Tyco Electronics Corporation | LED socket assembly |
CN104106152A (zh) * | 2012-02-10 | 2014-10-15 | 克利公司 | 在引线上具有电极标记的发光装置和封装件和相关方法 |
TWI694557B (zh) * | 2012-03-26 | 2020-05-21 | 先進封裝技術私人有限公司 | 半導體基板、半導體封裝件及其製造方法 |
US9239135B2 (en) | 2012-07-25 | 2016-01-19 | Tyco Electronics Corporation | LED connector |
US9480141B1 (en) | 2012-09-20 | 2016-10-25 | Junis Hamadeh | Heat sink device or heat sink assembly |
TWI512229B (zh) | 2012-12-07 | 2015-12-11 | Ind Tech Res Inst | 照明裝置 |
AT513747B1 (de) | 2013-02-28 | 2014-07-15 | Mikroelektronik Ges Mit Beschränkter Haftung Ab | Bestückungsverfahren für Schaltungsträger und Schaltungsträger |
JP6519123B2 (ja) * | 2013-08-30 | 2019-05-29 | 日亜化学工業株式会社 | 発光素子搭載用基板及び該基板の固定方法 |
US9772097B2 (en) | 2014-03-27 | 2017-09-26 | Philips Lighting Holding B.V. | Efficient board to board connection |
US9748723B2 (en) | 2014-12-12 | 2017-08-29 | Peter Sussman | Solder-less board-to-wire connector |
US10041657B2 (en) | 2016-06-13 | 2018-08-07 | Rebo Lighting & Electronics, Llc | Clip unit and edge mounted light emitting diode (LED) assembly comprising a clip unit |
US10194495B2 (en) | 2016-12-21 | 2019-01-29 | Lumileds Llc | Method for addressing misalignment of LEDs on a printed circuit board |
US10765009B2 (en) | 2016-12-21 | 2020-09-01 | Lumileds Llc | Method for addressing misalignment of LEDs on a printed circuit board |
US11769862B2 (en) | 2020-03-26 | 2023-09-26 | Nichia Corporation | Light emitting device |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS584836B2 (ja) * | 1978-08-04 | 1983-01-27 | 富士通株式会社 | 光半導体素子パッケ−ジ |
US4731693A (en) * | 1986-09-29 | 1988-03-15 | Tektronix, Inc. | Connection apparatus for integrated circuit |
US6441943B1 (en) | 1997-04-02 | 2002-08-27 | Gentex Corporation | Indicators and illuminators using a semiconductor radiation emitter package |
US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
US7497596B2 (en) | 2001-12-29 | 2009-03-03 | Mane Lou | LED and LED lamp |
JP3960053B2 (ja) | 2002-01-18 | 2007-08-15 | 松下電器産業株式会社 | 半導体発光装置及びこれを用いた照明用発光装置 |
JP2004055229A (ja) * | 2002-07-17 | 2004-02-19 | Mitsubishi Electric Lighting Corp | Led光源装置及び照明器具 |
JP2004146870A (ja) * | 2002-10-21 | 2004-05-20 | Nippon Sheet Glass Co Ltd | ライン照明装置およびこのライン照明装置を組み込んだ画像読取装置 |
JP2004355869A (ja) * | 2003-05-28 | 2004-12-16 | Toshiba Lighting & Technology Corp | 発光ダイオード照明装置 |
US7211835B2 (en) | 2003-07-09 | 2007-05-01 | Nichia Corporation | Light emitting device, method of manufacturing the same and lighting equipment |
JP4274032B2 (ja) * | 2003-07-09 | 2009-06-03 | 日亜化学工業株式会社 | 照明装置 |
US7321161B2 (en) | 2003-12-19 | 2008-01-22 | Philips Lumileds Lighting Company, Llc | LED package assembly with datum reference feature |
RU2258979C1 (ru) * | 2004-06-02 | 2005-08-20 | Уральский государственный университет путей сообщения (УрГУПС) | Светодиодное устройство |
TWM258416U (en) | 2004-06-04 | 2005-03-01 | Lite On Technology Corp | Power LED package module |
KR100623024B1 (ko) * | 2004-06-10 | 2006-09-19 | 엘지전자 주식회사 | 고출력 led 패키지 |
JP2006093470A (ja) * | 2004-09-24 | 2006-04-06 | Toshiba Corp | リードフレーム、発光装置、発光装置の製造方法 |
US20060082315A1 (en) | 2004-10-20 | 2006-04-20 | Timothy Chan | Method and system for attachment of light emmiting diodes to circuitry for use in lighting |
CN1812143A (zh) * | 2005-01-24 | 2006-08-02 | 史杰 | Led发光二极管 |
JP4711715B2 (ja) * | 2005-03-30 | 2011-06-29 | 株式会社東芝 | 半導体発光装置及び半導体発光ユニット |
US20070063213A1 (en) * | 2005-09-21 | 2007-03-22 | Lighthouse Technology Co., Ltd. | LED package |
-
2007
- 2007-06-19 US US11/765,291 patent/US7638814B2/en active Active
-
2008
- 2008-06-13 CN CN200880020763.5A patent/CN101790797B/zh active Active
- 2008-06-13 KR KR1020107001271A patent/KR101460008B1/ko active IP Right Grant
- 2008-06-13 JP JP2010512820A patent/JP5714899B2/ja active Active
- 2008-06-13 BR BRPI0813238A patent/BRPI0813238B1/pt active IP Right Grant
- 2008-06-13 EP EP08763335.0A patent/EP2160771B1/en active Active
- 2008-06-13 RU RU2010101426/28A patent/RU2464671C2/ru active
- 2008-06-13 WO PCT/IB2008/052348 patent/WO2008155700A1/en active Application Filing
- 2008-06-16 TW TW097122454A patent/TWI455348B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW200919785A (en) | 2009-05-01 |
KR101460008B1 (ko) | 2014-11-10 |
KR20100034018A (ko) | 2010-03-31 |
EP2160771B1 (en) | 2017-11-15 |
US7638814B2 (en) | 2009-12-29 |
WO2008155700A1 (en) | 2008-12-24 |
CN101790797B (zh) | 2012-09-19 |
RU2010101426A (ru) | 2011-07-27 |
CN101790797A (zh) | 2010-07-28 |
EP2160771A1 (en) | 2010-03-10 |
JP2010530631A (ja) | 2010-09-09 |
US20080315214A1 (en) | 2008-12-25 |
RU2464671C2 (ru) | 2012-10-20 |
BRPI0813238B1 (pt) | 2018-12-11 |
TWI455348B (zh) | 2014-10-01 |
JP5714899B2 (ja) | 2015-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B25G | Requested change of headquarter approved |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V. (NL) , PHILIP |
|
B25D | Requested change of name of applicant approved |
Owner name: PHILIPS LUMILEDS LIGHTING COMPANY (US) , KONINKLIJ |
|
B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 11/12/2018, OBSERVADAS AS CONDICOES LEGAIS. |
|
B25D | Requested change of name of applicant approved |
Owner name: KONINKLIJKE PHILIPS N.V. (NL) ; LUMILEDS LLC (US) |
|
B25A | Requested transfer of rights approved |
Owner name: LUMILEDS HOLDING B.V. (NL) |
|
B25B | Requested transfer of rights rejected |
Owner name: LUMILEDS HOLDING B.V. (NL) Free format text: INDEFERIDO O PEDIDO DE TRANSFERENCIA CONTIDO NA PETICAO 870190040072 DE 29/04/2019, EM VIRTUDE DA SOLICITACAO JA TER SIDO ATENDIDA PELA PETICAO 870190039196 DE 25/04/2019 E PUBLICADA NA RPI2531 DE 09/07/2019. |