CN101784577B - 反应性羧酸酯化合物、使用该反应性羧酸酯化合物的固化型树脂组合物及其用途 - Google Patents

反应性羧酸酯化合物、使用该反应性羧酸酯化合物的固化型树脂组合物及其用途 Download PDF

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Publication number
CN101784577B
CN101784577B CN200880104394.8A CN200880104394A CN101784577B CN 101784577 B CN101784577 B CN 101784577B CN 200880104394 A CN200880104394 A CN 200880104394A CN 101784577 B CN101784577 B CN 101784577B
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epoxy
epoxy resin
active energy
resin composition
energy ray
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CN101784577A (zh
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栗桥透
山本和义
中西政隆
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN200880104394.8A 2007-08-28 2008-08-26 反应性羧酸酯化合物、使用该反应性羧酸酯化合物的固化型树脂组合物及其用途 Active CN101784577B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-220850 2007-08-28
JP2007220850 2007-08-28
PCT/JP2008/065150 WO2009028479A1 (ja) 2007-08-28 2008-08-26 反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途

Publications (2)

Publication Number Publication Date
CN101784577A CN101784577A (zh) 2010-07-21
CN101784577B true CN101784577B (zh) 2015-11-25

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CN200880104394.8A Active CN101784577B (zh) 2007-08-28 2008-08-26 反应性羧酸酯化合物、使用该反应性羧酸酯化合物的固化型树脂组合物及其用途

Country Status (5)

Country Link
JP (1) JP5604106B2 (ko)
KR (1) KR101456516B1 (ko)
CN (1) CN101784577B (ko)
TW (1) TWI422608B (ko)
WO (1) WO2009028479A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013227360A (ja) * 2010-09-01 2013-11-07 Nippon Kayaku Co Ltd 不飽和基含有ポリカルボン酸樹脂を含む分散剤
CN102344547B (zh) * 2011-07-11 2013-03-06 山东圣泉化工股份有限公司 浅色苯酚芳烷基树脂及其制备方法
JP6025245B2 (ja) * 2012-07-04 2016-11-16 日本化薬株式会社 新規エポキシカルボキシレート化合物、その誘導体、それを含有する活性エネルギー線硬化型樹脂組成物及びその硬化物
KR102286273B1 (ko) * 2014-08-25 2021-08-04 닛뽄 가야쿠 가부시키가이샤 신규 반응성 에폭시카복실레이트 화합물, 그의 유도체, 그것을 함유하는 수지 조성물, 그의 경화물, 및 물품
JP6588346B2 (ja) * 2016-01-14 2019-10-09 日本化薬株式会社 エポキシ樹脂、反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途
JP6224188B1 (ja) * 2016-08-08 2017-11-01 太陽インキ製造株式会社 半導体封止材

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140144A (ja) * 1997-11-04 1999-05-25 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JP3995244B2 (ja) * 2003-05-16 2007-10-24 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂の製法、エポキシ樹脂組成物及びその硬化物
JP4561062B2 (ja) * 2003-08-07 2010-10-13 三菱化学株式会社 カラーフィルタ用感光性着色樹脂組成物、カラーフィルタ、及び液晶表示装置
WO2006009890A2 (en) * 2004-06-17 2006-01-26 The Regents Of The University Of California Methods and compositions for producing insulin sensitization
CN101142528B (zh) * 2005-04-13 2011-12-28 株式会社田村制作所 感光性树脂组合物、印刷电路板以及半导体封装基板
CN101291972B (zh) * 2005-10-21 2012-04-04 日本化药株式会社 环氧树脂、可固化树脂组合物及其固化物
JP5062714B2 (ja) * 2006-01-19 2012-10-31 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びその用途
WO2007132724A1 (ja) * 2006-05-11 2007-11-22 Nippon Kayaku Kabushiki Kaisha 反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途

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Publication number Publication date
JPWO2009028479A1 (ja) 2010-12-02
CN101784577A (zh) 2010-07-21
TW200927780A (en) 2009-07-01
KR101456516B1 (ko) 2014-11-03
WO2009028479A1 (ja) 2009-03-05
TWI422608B (zh) 2014-01-11
JP5604106B2 (ja) 2014-10-08
KR20100058450A (ko) 2010-06-03

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