CN1017790B - 自动贴合转印件 - Google Patents

自动贴合转印件

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Publication number
CN1017790B
CN1017790B CN88100545A CN88100545A CN1017790B CN 1017790 B CN1017790 B CN 1017790B CN 88100545 A CN88100545 A CN 88100545A CN 88100545 A CN88100545 A CN 88100545A CN 1017790 B CN1017790 B CN 1017790B
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layer
surface layer
transfer printing
patterned layer
cylinder
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CN88100545A (zh
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唐纳德·科尔
罗伯特·W·史密斯
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Johnson Matthey PLC
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Johnson Matthey PLC
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Publication of CN88100545A publication Critical patent/CN88100545A/zh
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17Dry transfer
    • B44C1/1712Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
    • B44C1/172Decalcomanias provided with a layer being specially adapted to facilitate their release from a temporary carrier
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0284Paper, e.g. as reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0534Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851Intermediate layer is discontinuous or differential
    • Y10T428/2486Intermediate layer is discontinuous or differential with outer strippable or release layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851Intermediate layer is discontinuous or differential
    • Y10T428/24868Translucent outer layer
    • Y10T428/24876Intermediate layer contains particulate material [e.g., pigment, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Printing Methods (AREA)
  • Paper (AREA)

Abstract

一种用于自动透印贴合装置的转印件,包括衬纸、释放层、图案层和面层,其特征在于所述的面层由可热一激活的粘着剂形成以及其铺展范围超过图案层。较佳地,图案层也具有可热—激活的粘着剂性能。具体地,这种转印件是用釉油墨作为陶瓷器皿的施彩。使用时,加热的压板用于熔融释放层以及加热压迫滚筒促使与转印件接触以激活粘着剂,并完成转印操作。

Description

本发明涉及用于自动贴合装置的转印件,特别是自动透印贴合装置的转印件,所述的转印件的粘着剂活性是通过加热激活的。本发明具体地是可用于陶瓷的转印件,将图案贴合在耐热基材接着通过灼烧熔合在陶瓷构件以及把图案粘结在基材上。
已知的美国专利3,967,021提供一种热一释放转印件或移画印花法,其中图案层是夹心的,它铺在上下粘合剂层之间,所述的粘合剂在不同的预定温度范围内是发粘的,而在所述的温度之外是不粘的。该下粘着剂层是在一纸基材上带有一种含蜡的释放层形成。在应用时,该转移件加热到蜡熔融的温度时上粘着剂层变粘,因此图案层和上下粘着剂层可以转移,压进与上粘着剂层接触的透印印花滚筒的表面。当温度下降时,上层成不粘而下层变粘,那么滚筒迎着器皿的表面压制,该图案层和上下粘着剂层一起向那处转印并在其上通过下层留下,在灼烧前该图案层永久地粘结着在器皿上。
已知的欧洲专利申请号57940和55395提供了一种带有下层图案层的转印件,并由可热激活的粘着剂形成,以及基本上覆盖图案层的上层,该上层乃是一种没有粘着能力的保护层。在使用时,加热转印件,活化粘着剂,并能熔化施于衬纸上的蜡释放层,以及顺次地迎着图案层上表面压迫透印滚筒,然后迎着器皿物件的表面,随着滚筒/图案层以及器皿/下层粘着剂之间的不同粘性,导致转印件图案从衬纸转移到滚筒再到器皿。
已知的日本专利59-41869提供一种具有蜡释放层的转印件,以及图案层由一种可热激活的粘性油墨形成。在使用时,该印花滚筒和预热的转印件的图案层接触,这样图案层转印到滚筒上,而带有图案层的滚筒和预热的器皿的表面接触,使图案层转印至器皿上。该方法取决于转印件的加热来满足操作,首先熔融蜡释放层,但也要活化油墨的粘着性能,以保证使图案层转印到滚筒上。
我们发现,实际上用这些已知系统如不用上粘着剂层,是不利于从补纸上分离,是难以达到完全清晰的转印。进一步地,如美国专利3,967,021所说的那样,粘着性能仅在说明的温度范围内显现,为易受周围温度和/或时间滞后而导致冷却速率改变,并由此引起粘着性能不同的方法提供一成功的操作。
本发明的目的是提供一种克服现有技术缺点的转印件,当用于自动贴合装置时,应用时具有简便和可再现性。
根据本发明,一种用于自动贴合装置的转印件包括:衬纸,释放层,图案层和面层,其中面层由可热激活的粘合剂和铺展比图案层要大的面积所构成。
相对于图案层的面层的铺展提供露出较低的面层的临界部分,并与释放层直接接融。
较佳地,图案层也有可热激活粘着性能,特别地,当本发明用作陶瓷转印件的场合,即转印件包括釉图案层并接着用灼烧贴合到耐热基材。因为作为高质量的烧制产品在图案层和基材之间密切接触是必须的。
在本发明的转印件中,油墨和面层材料的选定,由当活化时,油墨和面层露出的较低的表面区域,对释放层具有较低的上表面对透印滚筒,(例如:一种硅酮“弹体”)的粘着率,而对器皿的表面具有较高的粘着率,于是使图案层完全从衬纸上分离到滚筒上,再由滚筒到达器皿上。为了这个目的,油墨与面层材料的最大粘着率(在温度范围内)相比,在各个不同温度范围均具有最大的粘着率。“粘着率”的意义是指材料的粘着或粘性,它涉及一材料与它接触的材料之间的问题。于是,油墨的粘着性可以涉及衬纸也涉及器皿的表面,而面层的粘着性一般考虑涉及印花滚筒表面,虽然它将由面层的临界的较低表面区域和将与它接触的衬纸以及在贴合工艺期间不同时间下的器皿来评定。由于面层铺展区域超过图案层的界限,粘着率不仅受粘合剂材料的性质和固有粘性的影响,也受与它相接触的材料性质的影响。适宜的材料,在不同的温度下达到最大的粘着率,赋于图案层从衬纸经由印花滚筒到达器皿的清晰的转移。
本发明同时包括用转印件在器皿表面上自动贴合印花的方法,所述的转印件包括衬纸、释放层、图案层和面层,该面层由可热激活的粘着剂形成以及其铺展比图案层要大的面积所构成,以提供面层的临界露出部分,该方法包括采用转印件用加热压板贴合以熔融蜡释放层,带动热的印花滚筒与面层接触以活化所述的层的粘性,除去贴合所述面层和图案层的印花滚筒,促使滚筒将所述的层和器皿物件表面接触,然后撤去滚筒,该面层对印花滚筒的粘着率小于面层边沿对器皿的粘着率,这样所述的图案层即由滚筒转印至器皿上。
当本发明用于陶瓷转印件时,该器皿最终要经受灼烧工序,以烧去有机组成,并使图案熔合到器皿上。在本方法中使用加热板和滚筒及未加热的器件,使本方法在操作期间控制物料的粘着率,比已知技术能有效高的重现性。特别地,该图案层受到可预定升高到整个工艺的温度,以此温度与器皿接触。在各个阶段对粘着率应避免不予控制的环境温度的逆效应,或者,换言之,也就是要避免用恒温控制室来保证合适的温度控制。
在本发明的说明书和权利要求中的“图案层”是指一构图例如以施彩、印字、数字、线图或图画说明,或确定用于可视的或具有导电或绝缘性能的电子线路,由至少一种可选择的粘性油墨通过筛网印刷或其它印刷技术印在蜡释放层贴合在衬纸上形成的。该油墨包括颜料或具有颜色物料、光学性能或导电或绝缘性能以及其他所需性能的金属颗粒所组成,作为陶瓷施用,一种以颗粒形式的玻璃相分散在油墨介质中,它给油墨引进适合的印刷粘度,其在空气中的环境温度下干燥形成一种基本上无粘性的薄膜以及当在加热升高温度时,它可选择性地变成发粘的。
面层是由可热一激活的粘着剂形成以及可选择地基本上铺展到转印件全部表面,说是说,铺展到衬纸的露出部分以及图案层。于是面层的一个目的是起图案层的一个载体作用,接着从衬纸分离直至 贴合在器皿的物体上,以保持图案层在转印过程期间的完整性。图案的外部的面层也粘附于器皿上,在压力下优先粘附于滚筒,滚筒的凸工作面最好是硅酮树脂或其它具有释放特性的物料组成。
该衬纸可以是标准的已知技术中的转印衬纸并带有涂层或蜡的薄膜或其它在热贴合时熔融的释放介质。
于是,根据本发明在转印件使用时,该转印件在压板上加热,最好通过负压来载持,以熔化蜡释放层。加热的转印滚筒,它是有弹性的并具有凸出形状,以致它的中间区域完全与转印件接触,然后压贴整个面层区域使转印件处于压力之下,然后使面层的上表面发粘并由此因为熔融的蜡释放层不具有粘合力,而在移开转印滚筒时,与图案层一起,很容易地与衬纸分离。而滚筒,载持着面层和图案层,然后贴合在器件的表面以及由于滚筒材料的释放特性,面层的边界露出的较低的表面区域优先地粘附于器件上。于是在开始移开滚筒时,面层的边界区域从滚筒和粘附于器件的残留释放以及当滚筒移开时包括图案层的中心区域牢固地固定于器件上。对转印到耐热基材陶瓷的应用,该图案层由釉形成,即包括玻璃相及颜料或金属颗粒以及为了达到高质量的烧制产品,在未烧釉和基材之间必须有紧密接触。较佳地,特别是作为陶瓷转印件,该图案层也将显示粘着性能,以便从滚筒得到清晰的转印并满足其后的灼烧。
我们已发现,适合用于图案层的油墨的合适的粘度是较低的,而对于热激活的粘性油墨介质来说,其“浆状”的粘度可通过加入颜料或金属粉末,最好是玻璃相的粒子来达到。
换言之,固有粘性的油墨介质的粘度是可以通过添加颜料或金属粉末,和最好是加入玻璃相的粒子来减小到“浆状”粘性。于是,合适的比粘度、在不同的温度下,表示如表1
上面的测定是通过用该物料在玻璃上成一膜用手滑动并估计该材料的粘度。
该油墨介质是一种丙烯酸树脂,最好为甲基丙烯酸树脂。我们发现供良好的贴合、粘着及灼烧性能的合适的树脂为甲基丙烯酸丁酯和甲基丙烯酸甲酯,最好其分子量范围控制在约20-30,000。进一步地,为了提高转印件的软度或柔韧性,特别是用于成型器皿的贴合,最好是包括一种增塑剂,诸如:邻苯二甲酸二辛酯或邻苯二甲酸二甲基环己酯。
该面层可以是丙烯酸或纤维素的酯。我们发现乙基纤维素是一种合适的成膜树脂,它在熔融时变粘以及在冷却时很快地变硬。这也需要在该方法有效操作时有在一种诸如:砂糖乙酸异丁酸酯作为相容的增粘剂。
按本发明在制备的转印件时,可以采用已知技术的陶瓷转印件的方法和技术。例如:图案层可以通过各种不同材料的筛网形成筛网印刷,诸如120目(每平方英寸)的钢网或460目的合成纤维网(相应代表47和181线/厘米)。典型地,作为玻璃的最主要的施彩是用300目(公制180目)钢网以及作为陶瓷的最主要的施彩是用305目(公制120)的合成纤维网。
根据本发明供转印件用的油墨配方,可以应用标准的釉:介质的比例,其中釉可以是一种和颜料或其它有色物料混合以及玻璃成透明玻璃料的混合物。典型地,作为玻璃基材的最主要的施彩,可以用从250至300份(重量)的釉和100份(重量)的介质,对于陶瓷基材的施彩可以用从150到250份(重量)的釉和100份(重量)的介质,虽然特殊的釉诸如:云母釉,在这种情况下,可用较低的数量,例如:50份比100份的介质,其界限由釉受较低水平的不透明性能和在较高水平的印花流变性所控制。该不同的比例用作代表性的基材涉及到灼烧的要求,玻璃釉中包括玻璃料,它包含较高比例的铅,与陶瓷釉比较,具有较低的灼烧温度。由于玻璃釉是较致密的产物,因此为了维持玻璃料在油墨中的体积比例就需要较高的重量浓度。
按本发明的转印件可应用于陶瓷或玻璃器皿或其它耐热基材诸如氧化铝上,采用诸如:Service(Enginees)Limited的HR200Decalcomania    Application    Machine,或Netzsch的移画印花法使用的热贴机器。典型地,该滚筒保持100-130℃温度以及把真空压板或基板加热保持在70-100℃温度,这取决于图案层的尺寸,滚筒和器皿的形状以及滚筒材料的类型。典型地,滚筒在器皿上停留约半秒钟以保证满足图案层对器皿的粘着。可以理解,该温度和停留时间可随本发明的特殊的转印件的要求不同而不同。
本发明包括陶瓷转印件,并随后贴合于器皿物件或其它基材的场合,该基材经灼烧烧去有机组份,使玻璃组份熔合并把图案粘结在基材上。较佳地,在灼烧初期,该油墨具有充分的粘性以避免图案层中的任何的脱落或其它引起破裂的发展或其它烧结的缺陷。在图案层下面的任何转移到基材上的残留的蜡,同时在烧结阶段被烧去。
本发明以实施例的方式说明作为图案层和面层的印刷介质以作参考,均以重量份数表示:如(表2)
上述印刷介质配方,当把轴分散形成油墨用筛网印刷在转印件衬纸上例如在HR4000释放纸(Brittains)上并覆上面层配方的筛网印刷层,根据本发明制得的转印件以及它用于器皿上,如说明在释放纸、印花滚筒和器皿之间给出不同的粘性,以保证发生顺利的转印操作,并显示出满意的没有裂痕、气泡、折皱或其它外表的不足的烧结性能。
在图1以实施例方式表示本发明的转印件,图1中,转印件包括衬纸1、释放层2、图案层3和面层4。弹性转印滚筒为5,在上述位置的转印件容易地和图案层及面层从衬纸接触和移去。
图中可见到面层铺展超出图案的界限以提供边界部分4A、4B和4C,它们是和释放层2接触的。
印刷介质:
H74    介质    (BASF)    45
80661    介质    (Degussa)    45
G4246    粘着剂    (Blythe    Colours)    10
面层:
乙基纤维素    N50(Hercules)    10
砂糖异丁基乙酯    (Eastman)    10
Clairsol    330    〕    40
苯乙酸乙酯    〕    溶剂    24
戊烷    〕    16
温度    粘性
℃    油墨介质    油墨    面层
55    稍    无    稍
75    粘    无    粘
100    粘    稍    粘
130    粘    稍    微

Claims (10)

1、一种用于自动贴合装置的转印件,它包括:
(A)衬纸;
(B)释放层;
(C)图案层;以及
(D)铺展范围超过图案层的面层,其特征在于所述的面层(D)由可热激活的粘着剂形成,以及所述的图案层(C)由具有可热激活的粘着性能的介质的油墨形成,当激活时,油墨和面层(D)露出的较低的表面区域对释放层(B)比面层(D)的上表面对转印滚筒具有较低的粘着率但对器皿的表面具较高的粘着率,以使图案层(C)可以从衬纸上分离到滚筒上,再由滚筒到达器皿。
2、如权利要求1所述的移印件,其特征在于所述的图案层包括陶瓷釉。
3、如权利要求1或2所述的转印件,其特征在于面层和图案层各自在不同的温度达到最大的粘着性。
4、如权利要求1至2所述的转印件,其特征在于所述的面层包括丙烯酸树脂或纤维树脂。
5、如权利要求1或2所述的转印件,其特征在于所述的图案层包括丙烯酸树脂。
6、如权利要求5所述的转印件,其特征在于所述的树脂包括甲基丙烯酸丁酯和甲基丙烯酸甲酯的共聚体,并且其分子量大致在20,000至30,000范围。
7、如权利要求1或2或5的转印件,其特征在于所述的图案层由包括颜料或其它染色物料和玻璃或透明玻璃料如琅玳和一种介质形成,其中釉对介质的重量比例为250-300∶100作为玻璃基质的施彩或以150-250∶100作为陶瓷基质的施彩。
8、一种用转印件自动贴合图案于器皿制品表面的方法,所述的转印件包括:
(A)衬纸;
(B)释放层;
(C)图案层;以及
(D)面层、面层其铺展范围超过图案层以提供面层的边界的露出部分,该方法包括转移件和加热的压板贴合熔化释放层(B),促使热的印花滚筒和面层(D)接触,移去包住所述面层(D)和图案层(C)的印花滚筒,促使滚筒包住的所述的层和器皿物件的表面接触,并移去滚筒,借此,所述的图案层(C)由滚筒转印至器皿上,其特征在于通过使热的印花滚筒和转印件的面层(D)接触以活化面层(D)的粘着性能,移去包住所述面层(D)和图案层(C)的印花滚筒,促使滚筒包住的所述的层和器皿物件的表面接触,并移去滚筒,该面层(D)对印花滚筒的粘着率小于面层边缘部分对器皿的粘着率,于是,所述的层由滚筒转印至器皿上。
9、如权利要求8所述的方法,其特征在于压板加热至70-100℃温度范围以及滚筒加热至100-130℃温度范围。
10、如权利要求8或9所述的方法,其特征在于所述的图案层(C)为陶瓷釉。
CN88100545A 1987-01-30 1988-01-30 自动贴合转印件 Expired CN1017790B (zh)

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EP0276965A1 (en) 1988-08-03
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US5069954A (en) 1991-12-03
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DE3870267D1 (de) 1992-05-27
JPS63260499A (ja) 1988-10-27
KR880008889A (ko) 1988-09-13

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