CN101752311B - 功率mos晶体管与肖特基二极管的集成方法及结构 - Google Patents
功率mos晶体管与肖特基二极管的集成方法及结构 Download PDFInfo
- Publication number
- CN101752311B CN101752311B CN2008100441263A CN200810044126A CN101752311B CN 101752311 B CN101752311 B CN 101752311B CN 2008100441263 A CN2008100441263 A CN 2008100441263A CN 200810044126 A CN200810044126 A CN 200810044126A CN 101752311 B CN101752311 B CN 101752311B
- Authority
- CN
- China
- Prior art keywords
- contact hole
- mos transistor
- power mos
- schottky diode
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100441263A CN101752311B (zh) | 2008-12-17 | 2008-12-17 | 功率mos晶体管与肖特基二极管的集成方法及结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100441263A CN101752311B (zh) | 2008-12-17 | 2008-12-17 | 功率mos晶体管与肖特基二极管的集成方法及结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101752311A CN101752311A (zh) | 2010-06-23 |
CN101752311B true CN101752311B (zh) | 2012-04-18 |
Family
ID=42479039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100441263A Active CN101752311B (zh) | 2008-12-17 | 2008-12-17 | 功率mos晶体管与肖特基二极管的集成方法及结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101752311B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102569207A (zh) * | 2010-12-27 | 2012-07-11 | 上海华虹Nec电子有限公司 | 超级结mosfet中集成肖特基二极管的方法 |
CN102610523B (zh) * | 2011-01-19 | 2015-02-04 | 上海华虹宏力半导体制造有限公司 | 在超级结mosfet中集成肖特基二极管的方法 |
CN103633088B (zh) * | 2012-08-15 | 2016-06-08 | 上海华虹宏力半导体制造有限公司 | 低正向压降快恢复时间的功率二极管的制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1468449A (zh) * | 2000-10-06 | 2004-01-14 | 通用半导体公司 | 内含沟道型肖特基整流器的沟道型dmos晶体管 |
CN101051613A (zh) * | 2007-04-29 | 2007-10-10 | 济南晶恒有限责任公司 | 一种功率肖特基器件势垒方法 |
US7436022B2 (en) * | 2005-02-11 | 2008-10-14 | Alpha & Omega Semiconductors, Ltd. | Enhancing Schottky breakdown voltage (BV) without affecting an integrated MOSFET-Schottky device layout |
-
2008
- 2008-12-17 CN CN2008100441263A patent/CN101752311B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1468449A (zh) * | 2000-10-06 | 2004-01-14 | 通用半导体公司 | 内含沟道型肖特基整流器的沟道型dmos晶体管 |
CN100334731C (zh) * | 2000-10-06 | 2007-08-29 | 通用半导体公司 | 内含沟道型肖特基整流器的沟道型dmos晶体管 |
US7436022B2 (en) * | 2005-02-11 | 2008-10-14 | Alpha & Omega Semiconductors, Ltd. | Enhancing Schottky breakdown voltage (BV) without affecting an integrated MOSFET-Schottky device layout |
CN101051613A (zh) * | 2007-04-29 | 2007-10-10 | 济南晶恒有限责任公司 | 一种功率肖特基器件势垒方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101752311A (zh) | 2010-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101055842B (zh) | 半导体装置的制造方法 | |
CN106206735B (zh) | Mosfet及其制造方法 | |
US8492221B2 (en) | Method for fabricating power semiconductor device with super junction structure | |
CN103890922A (zh) | 制造半导体器件的方法 | |
JP2006114834A (ja) | 半導体装置 | |
CN101752311B (zh) | 功率mos晶体管与肖特基二极管的集成方法及结构 | |
CN102074478A (zh) | 一种沟槽式mos的制造工艺方法 | |
CN102104068A (zh) | 功率mos晶体管的结构及其制备方法 | |
CN104465391A (zh) | 半导体器件的制造方法 | |
TW527730B (en) | Semiconductor memory device and manufacturing method thereof | |
KR101530579B1 (ko) | 반도체 소자 및 이의 제조 방법 | |
CN102110687B (zh) | 沟槽mos器件 | |
JP4676708B2 (ja) | 半導体装置の製造方法 | |
CN105097543A (zh) | 一种沟槽型vdmos器件及其制造方法 | |
JP2011066158A (ja) | 半導体装置およびその製造方法 | |
CN104916686A (zh) | 一种vdmos器件及其制造方法 | |
CN104810288A (zh) | 一种dmos器件的制造方法 | |
KR100906557B1 (ko) | 반도체소자 및 그 제조방법 | |
CN105655253B (zh) | 半导体结构及其形成方法 | |
TWI529944B (zh) | 高介電金屬閘極技術中用於無嵌入式矽鍺之改進的矽化物形成而自p型場效電晶體源極汲極區之通道矽鍺的移除 | |
CN112038237A (zh) | 一种沟槽mosfet的制造方法 | |
CN105845614A (zh) | 半导体器件及其制作方法 | |
CN114068673B (zh) | 超结沟槽栅mosfet及制造方法 | |
CN102110614B (zh) | 高k金属栅mos晶体管的制造方法 | |
CN103187287B (zh) | 一种沟槽半导体分立器件的制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131216 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131216 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |