CN101746515A - 缠绕带装置 - Google Patents
缠绕带装置 Download PDFInfo
- Publication number
- CN101746515A CN101746515A CN200910246349A CN200910246349A CN101746515A CN 101746515 A CN101746515 A CN 101746515A CN 200910246349 A CN200910246349 A CN 200910246349A CN 200910246349 A CN200910246349 A CN 200910246349A CN 101746515 A CN101746515 A CN 101746515A
- Authority
- CN
- China
- Prior art keywords
- chip element
- accepting groove
- chip parts
- adsorbed
- absorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008305721A JP2010126242A (ja) | 2008-11-28 | 2008-11-28 | テーピング装置 |
JP305721/08 | 2008-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101746515A true CN101746515A (zh) | 2010-06-23 |
Family
ID=42326897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910246349A Pending CN101746515A (zh) | 2008-11-28 | 2009-11-27 | 缠绕带装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2010126242A (ja) |
CN (1) | CN101746515A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103376260A (zh) * | 2012-04-27 | 2013-10-30 | 韩美半导体株式会社 | 半导体封装检查设备及使用该设备的半导体封装检查方法 |
CN106062509A (zh) * | 2013-11-20 | 2016-10-26 | 联达科技设备私人有限公司 | 用于选择性地检验部件侧壁的装置和方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5803034B1 (ja) * | 2014-11-05 | 2015-11-04 | アキム株式会社 | 搬送装置、搬送方法 |
JP5828180B1 (ja) * | 2014-11-05 | 2015-12-02 | アキム株式会社 | 外観検査付搬送装置、外観検査付搬送方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4959898A (en) * | 1990-05-22 | 1990-10-02 | Emhart Industries, Inc. | Surface mount machine with lead coplanarity verifier |
JP2001228098A (ja) * | 2000-02-14 | 2001-08-24 | Sony Corp | 検査・テーピング装置 |
-
2008
- 2008-11-28 JP JP2008305721A patent/JP2010126242A/ja active Pending
-
2009
- 2009-11-27 CN CN200910246349A patent/CN101746515A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103376260A (zh) * | 2012-04-27 | 2013-10-30 | 韩美半导体株式会社 | 半导体封装检查设备及使用该设备的半导体封装检查方法 |
CN106062509A (zh) * | 2013-11-20 | 2016-10-26 | 联达科技设备私人有限公司 | 用于选择性地检验部件侧壁的装置和方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2010126242A (ja) | 2010-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100623 |