CN101746515A - 缠绕带装置 - Google Patents

缠绕带装置 Download PDF

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Publication number
CN101746515A
CN101746515A CN200910246349A CN200910246349A CN101746515A CN 101746515 A CN101746515 A CN 101746515A CN 200910246349 A CN200910246349 A CN 200910246349A CN 200910246349 A CN200910246349 A CN 200910246349A CN 101746515 A CN101746515 A CN 101746515A
Authority
CN
China
Prior art keywords
chip element
accepting groove
chip parts
adsorbed
absorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910246349A
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English (en)
Chinese (zh)
Inventor
南浦清隆
富泽喜男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Instruments Co Ltd
Original Assignee
Hitachi High Tech Instruments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Instruments Co Ltd filed Critical Hitachi High Tech Instruments Co Ltd
Publication of CN101746515A publication Critical patent/CN101746515A/zh
Pending legal-status Critical Current

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CN200910246349A 2008-11-28 2009-11-27 缠绕带装置 Pending CN101746515A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008305721A JP2010126242A (ja) 2008-11-28 2008-11-28 テーピング装置
JP305721/08 2008-11-28

Publications (1)

Publication Number Publication Date
CN101746515A true CN101746515A (zh) 2010-06-23

Family

ID=42326897

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910246349A Pending CN101746515A (zh) 2008-11-28 2009-11-27 缠绕带装置

Country Status (2)

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JP (1) JP2010126242A (ja)
CN (1) CN101746515A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103376260A (zh) * 2012-04-27 2013-10-30 韩美半导体株式会社 半导体封装检查设备及使用该设备的半导体封装检查方法
CN106062509A (zh) * 2013-11-20 2016-10-26 联达科技设备私人有限公司 用于选择性地检验部件侧壁的装置和方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5803034B1 (ja) * 2014-11-05 2015-11-04 アキム株式会社 搬送装置、搬送方法
JP5828180B1 (ja) * 2014-11-05 2015-12-02 アキム株式会社 外観検査付搬送装置、外観検査付搬送方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959898A (en) * 1990-05-22 1990-10-02 Emhart Industries, Inc. Surface mount machine with lead coplanarity verifier
JP2001228098A (ja) * 2000-02-14 2001-08-24 Sony Corp 検査・テーピング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103376260A (zh) * 2012-04-27 2013-10-30 韩美半导体株式会社 半导体封装检查设备及使用该设备的半导体封装检查方法
CN106062509A (zh) * 2013-11-20 2016-10-26 联达科技设备私人有限公司 用于选择性地检验部件侧壁的装置和方法

Also Published As

Publication number Publication date
JP2010126242A (ja) 2010-06-10

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Open date: 20100623